CN214626816U

CN214626816U - 3MSVG power unit device

Info

Publication number: CN214626816U
Application number: CN202120868028.2U
Authority: CN
Inventors: 缪晋诚; 李军; 陆继文; 石伟; 其他发明人请求不公开姓名
Original assignee: ANHUI YOUSAI TECHNOLOGY CO LTD
Current assignee: ANHUI YOUSAI TECHNOLOGY CO LTD
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2021-11-05
Anticipated expiration: 2031-04-25

Abstract

The utility model discloses a 3MSVG power unit device, including casing, support electric capacity, IGBT module, power unit module, voltage-sharing resistor, backup pad, it installs to support electric capacity backup pad upper end, the IGBT module is installed support electric capacity upper end front side, radiator module is installed to IGBT module rear side, the casing is installed to the backup pad upper end left and right sides, casing one side is close to the radiator module installation department has seted up the wind channel entry, voltage-sharing resistor installs and is close to inside the casing of wind channel entry one side, power unit module installs support electric capacity lower part front side. The utility model discloses a set up novel wind channel at IGBT module rear side, improved 3MSVG power unit device's heat-sinking capability, reduce the power unit volume under the condition of maintaining power unit power.

Description

3MSVG power unit device

Technical Field

The utility model relates to a power transmission and transformation equipment technical field especially relates to a 3MSVG power unit device.

Background

SVG is the most advanced reactive compensation technology at present, and it no longer adopts large-capacity capacitor and inductor devices, but realizes the conversion of reactive energy through the high-frequency switch of the high-power electronic device. The basic principle is that a voltage source inverter is connected in parallel to a power grid through a reactor or a transformer, and the required reactive power is quickly absorbed or sent out by adjusting the amplitude and the phase of the output voltage at the alternating current side of the inverter, so that the purpose of quickly compensating the reactive power of the system without pole difference is realized. With the development of power electronic technology, the application of the SVG is more and more extensive, the device capacity is gradually enlarged, and inconvenience is brought to the application of the SVG.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. For this reason, an object of the utility model is to provide a 3MSVG power unit device, with the direct and IGBT module installation of thermal module, compact structure is convenient for dispel the heat to the IGBT module to adopt the inline fin, improved the heat-sinking capability of device, thereby reduce the power unit volume under the condition of maintaining power unit power.

According to the utility model provides a 3MSVG power unit device, including casing, support electric capacity, IGBT module, power unit module, voltage-sharing resistor, backup pad, it installs to support electric capacity backup pad upper end, the IGBT module is installed support electric capacity upper end front side, radiator module is installed to IGBT module rear side, the casing is installed to the backup pad upper end left and right sides, casing one side is close to the radiator module installation department has seted up the wind channel entry, voltage-sharing resistor installs and is close to inside the casing of wind channel entry one side, the power unit module is installed support electric capacity lower part front side.

Preferably, the heat dissipation module comprises an air duct back plate and a heat dissipation fin, the heat dissipation fin is installed on the rear side of the IGBT module, the air duct back plate is installed on the rear side of the heat dissipation fin, and an air duct outlet is formed in one side, far away from the air duct inlet, of the air duct back plate.

Preferably, the positive electrode and the negative electrode of the support capacitor and the positive electrode and the negative electrode of the IGBT module are connected through laminated copper bars.

Preferably, a handle is mounted on a side of the housing away from the support capacitor.

Preferably, the heat sink is an inline heat sink.

Preferably, the support capacitor is a thin film capacitor.

Preferably, the support capacitor is connected with the power unit module through a screw.

The utility model provides a beneficial effect is: the heat dissipation module is directly installed with the IGBT module, the structure is compact, the heat dissipation of the IGBT module is facilitated, the direct-discharge type radiating fins are adopted, the heat dissipation capacity of the device is improved, the size of a power unit is reduced under the condition that the power of the power unit is maintained, and the application of the SVG module, which is high in pressure and is obtained by superposing the outputs of a plurality of power units, is convenient.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is an exploded view of a 3MSVG power cell device according to the present invention;

fig. 2 is an assembly schematic diagram of a 3MSVG power unit device according to the present invention.

In the figure: the power unit comprises a shell 1, a laminated copper bar 2, a support capacitor 3, an IGBT module 4, an air duct back plate 5, a heat radiating fin 6, an air duct inlet 7, a handle 8, a power unit module 9, a voltage equalizing resistor 10 and a support plate 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a 3MSVG power unit device comprises a shell 1, a support capacitor 3, an IGBT module 4, a power unit module 9, a voltage-sharing resistor 10 and a support plate 11, wherein the support capacitor 3 is a thin-film capacitor, the support capacitor 3 is installed at the upper end of the support plate 11, the IGBT module 4 is installed at the front side of the upper end of the support capacitor 3, a heat dissipation module is installed at the rear side of the IGBT module 4, the shell 1 is installed at the left side and the right side of the upper end of the support plate 11, an air duct inlet 7 is formed at a position, close to the installation position of the heat dissipation module, on one side of the shell 1, the voltage-sharing resistor 10 is installed inside the shell 1 at a position, close to the air duct inlet 7, and the power unit module 9 is installed at the front side of the lower part of the support capacitor 3 and connected through a screw; the heat dissipation module comprises an air duct back plate 5 and radiating fins 6, the radiating fins 6 are straight radiating fins, the radiating fins 6 are arranged on the rear side of the IGBT module 4, the air duct back plate 5 is arranged on the rear side of the radiating fins 6, and an air duct outlet is formed in one side, far away from an air duct inlet 7, of the air duct back plate 5; the positive electrode and the negative electrode of the support capacitor 3 and the positive electrode and the negative electrode of the IGBT module 4 are connected through the laminated copper bar 2; a handle 8 is arranged on the side of the casing 1 far away from the supporting capacitor 3.

The power unit module 9 has a fault detection function, can detect the overcurrent of the IGBT, the overvoltage of the voltage at the direct current side and the overtemperature of the power unit, and realizes the most direct protection of the unit, and the IGBT module 4 is a core device of a self-phase-change bridge circuit and converts the voltage at the direct current side into the output voltage with the same frequency as the power grid at the alternating current side by controlling the on-off of the IGBT. The support capacitor 3 provides a dc voltage support for the dc side of the power cell module 9. The heat dissipation module is used for timely distributing heat of the IGBT in work to guarantee normal work of the IGBT, the heat fins 6 absorb heat generated by the IGBT module 4 in work, gas enters through the air duct inlet 7 and is guided out of the air duct outlet through the heat dissipation fins 6, and therefore the purpose of heat dissipation is achieved.

In conclusion, the heat dissipation module is directly installed with the IGBT module, the structure is compact, the heat dissipation of the IGBT module is facilitated, the direct-discharge type heat dissipation fins are adopted, the heat dissipation capacity of the device is improved, the size of the power unit is reduced under the condition that the power of the power unit is maintained, and convenience is brought to application of the SVG module, wherein the SVG module obtains high voltage by superposing the outputs of a plurality of power units.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A 3MSVG power cell apparatus, characterized in that: including casing, support electric capacity, IGBT module, power unit module, equalizer resistor, backup pad, it installs to support electric capacity the backup pad upper end, the IGBT module is installed support electric capacity upper end front side, heat radiation module is installed to IGBT module rear side, the casing is installed to the backup pad upper end left and right sides, casing one side is close to heat radiation module installation department has seted up the wind channel entry, equalizer resistor installs and is being close to inside the casing of wind channel entry one side, power unit module installs support electric capacity lower part front side.

2. A 3MSVG power cell device according to claim 1, wherein: the heat dissipation module comprises an air duct back plate and a heat dissipation fin, the heat dissipation fin is arranged on the rear side of the IGBT module, the air duct back plate is arranged on the rear side of the heat dissipation fin, and an air duct outlet is formed in one side, far away from the air duct inlet, of the air duct back plate.

3. A 3MSVG power cell device according to claim 1, wherein: and the positive electrode and the negative electrode of the supporting capacitor and the positive electrode and the negative electrode of the IGBT module are connected through laminated copper bars.

4. A 3MSVG power cell device according to claim 1, wherein: and a handle is arranged on one side of the shell, which is far away from the support capacitor.

5. A 3MSVG power cell device according to claim 2, wherein: the radiating fins are straight radiating fins.

6. A 3MSVG power cell device according to claim 1, wherein: the supporting capacitor is a thin film capacitor.

7. A 3MSVG power cell device according to claim 1, wherein: the supporting capacitor is connected with the power unit module through a screw rod.