CN216291932U - A heat dissipation protection device for BMS lithium battery management system - Google Patents
A heat dissipation protection device for BMS lithium battery management system Download PDFInfo
- Publication number
- CN216291932U CN216291932U CN202122280037.2U CN202122280037U CN216291932U CN 216291932 U CN216291932 U CN 216291932U CN 202122280037 U CN202122280037 U CN 202122280037U CN 216291932 U CN216291932 U CN 216291932U
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- Prior art keywords
- circuit board
- heat dissipation
- aluminum
- bus
- converges
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 109
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052744 lithium Inorganic materials 0.000 title claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 130
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 130
- 230000001681 protective effect Effects 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation protection device for a BMS lithium battery management system, which comprises: the heat dissipation protective housing, PCB mainboard, the circuit board unit that converges, MOS pipe unit, the heat dissipation aluminum sheet unit that converges and the heat dissipation aluminum plate that converges, the PCB mainboard sets up in the inside of heat dissipation protective housing, the circuit board unit that converges is vertical to be set up on the PCB mainboard, MOS pipe unit is fixed in on the circuit board unit that converges, the heat dissipation aluminum sheet unit that converges sets up on the circuit board unit that converges, the heat dissipation aluminum plate lid that converges fits the top of the heat dissipation aluminum sheet unit that converges, the both sides of heat dissipation protective housing are provided with the heat dissipation through-hole, the upper surface of heat dissipation protective housing is provided with heat gathering aluminum plate. The utility model adopts the structural design of the vertical type confluence radiating aluminum sheet, and compared with the traditional tiled patch type structure, the current passing through each confluence circuit board and the confluence radiating aluminum sheet is more uniformly distributed, and the utility model has good radiating and conducting effects and strong practicability.
Description
Technical Field
The utility model relates to the technical field of heat dissipation protection, in particular to a heat dissipation protection device for a BMS lithium battery management system.
Background
Along with the continuous development of society and scientific level's continuous progress, the lithium cell is widely used in each field as new forms of energy material, BMS lithium battery management system is a system that is often used for the lithium cell, it passes through the electric current great, for better operation, it need adopt heat dissipation protection device to shunt and dispel the heat, the circuit board that converges that is used for BMS lithium battery management system's heat dissipation protection device now often adopts traditional tiling paster mode direct mount on the PCB mainboard, it is great with PCB mainboard contact surface to converge circuit board, tiled mounting means heat dispersion is poor like this, a large amount of heat can't discharge the shell outside fast, reduce spare part's life, cause spare part to damage easily, the practicality is poor.
Therefore, a heat dissipation protection device for a BMS lithium battery management system is urgently needed in the market to solve the problem.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides the heat dissipation protection device for the BMS lithium battery management system, which adopts the structural design of the vertical type confluence heat dissipation aluminum sheet, and compared with the traditional tiled patch type structure, the current passing through each confluence circuit board and the confluence heat dissipation aluminum sheet is more uniformly distributed, and the heat dissipation and the electric conduction effects are good.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a heat dissipation protection device for a BMS lithium battery management system, comprising: the heat dissipation protective housing, PCB mainboard, the circuit board unit that converges, MOS pipe unit, the heat dissipation aluminum sheet unit that converges and the heat dissipation aluminum plate that converges, the PCB mainboard sets up in the inside of heat dissipation protective housing, the circuit board unit that converges is vertical to be set up on the PCB mainboard, MOS pipe unit is fixed in on the circuit board unit that converges, the heat dissipation aluminum sheet unit that converges sets up on the circuit board unit that converges, the heat dissipation aluminum plate lid that converges fits the top of the heat dissipation aluminum sheet unit that converges, the both sides of heat dissipation protective housing are provided with the heat dissipation through-hole, the upper surface of heat dissipation protective housing is provided with heat gathering aluminum plate.
As a further elaboration of the above technical solution:
in the above technical solution, the bus circuit board unit includes a first bus circuit board, a second bus circuit board, a third bus circuit board, a fourth bus circuit board, a fifth bus circuit board and a sixth bus circuit board, the first bus circuit board, the second bus circuit board, the third bus circuit board, the fourth bus circuit board, the fifth bus circuit board and the sixth bus circuit board have the same shape and the same size, and the first bus circuit board, the second bus circuit board, the third bus circuit board, the fourth bus circuit board, the fifth bus circuit board and the sixth bus circuit board are arranged on the PCB main board side by side at equal intervals.
In the above technical scheme, the MOS tube unit includes a first MOS tube group, a second MOS tube group, a third MOS tube group, a fourth MOS tube group, a fifth MOS tube group and a sixth MOS tube group, the first MOS tube group, the second MOS tube group, the third MOS tube group, the fourth MOS tube group, the fifth MOS tube group and the sixth MOS tube group are respectively arranged on the first conflux circuit board, the second conflux circuit board, the third conflux circuit board, the fourth conflux circuit board, the fifth conflux circuit board and the sixth conflux circuit board in a one-to-one correspondence manner, each MOS tube group includes nine MOS tubes of the same shape and size, and the nine MOS tubes are arranged on the conflux circuit board side by side at equal intervals.
In the above technical solution, the converging heat dissipation aluminum sheet unit includes a first converging heat dissipation aluminum sheet, a second converging heat dissipation aluminum sheet, a third converging heat dissipation aluminum sheet, a fourth converging heat dissipation aluminum sheet, a fifth converging heat dissipation aluminum sheet, and a sixth converging heat dissipation aluminum sheet, wherein the first converging heat dissipation aluminum sheet, the second converging heat dissipation aluminum sheet, the third converging heat dissipation aluminum sheet, the fourth converging heat dissipation aluminum sheet, the fifth converging heat dissipation aluminum sheet, and the sixth converging heat dissipation aluminum sheet are respectively disposed above the first converging circuit board, the second converging circuit board, the third converging circuit board, the fourth converging circuit board, the fifth converging circuit board, and the sixth converging circuit board in a one-to-one correspondence manner.
In the above technical solution, the conflux heat-dissipating aluminum plate covers above the first conflux heat-dissipating aluminum plate, the second conflux heat-dissipating aluminum plate, the third conflux heat-dissipating aluminum plate, the fourth conflux heat-dissipating aluminum plate, the fifth conflux heat-dissipating aluminum plate and the sixth conflux heat-dissipating aluminum plate.
In the above technical scheme, be provided with fixing hole on the heat dissipation aluminum plate converges, the heat dissipation aluminum plate converges is fixed in the first heat dissipation aluminum sheet that converges, the second heat dissipation aluminum sheet that converges, the third heat dissipation aluminum sheet that converges, the fourth heat dissipation aluminum sheet that converges, the fifth heat dissipation aluminum sheet that converges and the sixth heat dissipation aluminum sheet that converges through fixing hole.
In the above technical scheme, still include the red copper nut, the one end of PCB mainboard is provided with negative pole input port, the other end of PCB mainboard is provided with negative pole output port, the red copper nut includes first red copper nut and the red copper nut of second, first red copper nut sets up in negative pole input port department, the red copper nut of second sets up in negative pole output port department.
In the above technical scheme, the heat dissipation protective housing is of a step-shaped structure, the heat dissipation protective housing comprises a heat dissipation protective side cover and a heat dissipation protective upper cover, the heat dissipation protective upper cover covers the heat dissipation protective side cover, and the heat dissipation through holes are formed in two sides of the heat dissipation protective side cover.
In the above technical scheme, the level of heat dissipation protection upper cover is less than the level of heat dissipation protection side cap highest department, gather hot aluminum plate lid fit heat dissipation protection upper cover department and gather hot aluminum plate's level and the level of heat dissipation protection side cap highest department are located same horizontal plane.
In the technical scheme, the PCB main control board, the confluence circuit board unit, the MOS tube unit and the circuit of the confluence heat dissipation aluminum sheet unit are communicated with each other through the confluence heat dissipation aluminum sheet.
In the above technical scheme, the heat dissipation aluminum plate that converges sets up heat conduction silica gel, the heat dissipation aluminum plate that converges guides the heat to heat dissipation protection upper cover and gather hot aluminum plate department through heat conduction silica gel.
Compared with the prior art, the utility model has the advantages of obvious advantages and beneficial effects, particularly, the structure is novel, the design is reasonable, compared with the traditional tiled patch type structure design, the space between the PCB mainboard and each confluence radiating aluminum plate is enlarged by adopting the structural design of the vertical confluence radiating aluminum plate, so that the radiating space is enlarged, the currents passing through each confluence radiating aluminum plate and each confluence radiating aluminum plate are also more uniformly distributed, the radiating and conducting effects are good, meanwhile, the heat in the radiating protective shell is respectively discharged from the radiating through holes by adopting the structural design of the radiating through holes, the confluence radiating aluminum plates and the heat collecting aluminum plates, and the heat is transferred and collected to the heat collecting aluminum plates by the radiating and confluence aluminum plates, so that the heat speed in the protective shell is accelerated, the radiating efficiency is improved, and the practicability is strong.
To more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions attained thereby, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments:
drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a schematic structural diagram of the bus circuit board unit, the MOS tube unit and the bus heat dissipation aluminum sheet unit.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
As shown in fig. 1 to 3, a heat dissipation protection device for a BMS lithium battery management system includes: heat dissipation protecting sheathing 1, PCB mainboard 2, the circuit board unit 3 that converges, MOS pipe unit 4, the heat dissipation aluminum sheet unit 5 that converges and the heat dissipation aluminum plate 6 that converges, PCB mainboard 2 sets up in heat dissipation protecting sheathing 1's inside, the circuit board unit 3 that converges vertically sets up on PCB mainboard 2, MOS pipe unit 4 is fixed in on the circuit board unit 3 that converges, the heat dissipation aluminum sheet unit 5 that converges sets up on the circuit board unit 3 that converges, the heat dissipation aluminum sheet 6 lid that converges fits the top of the heat dissipation aluminum sheet unit 5 that converges, the both sides of heat dissipation protecting sheathing 1 are provided with heat dissipation through-hole 11, the upper surface of heat dissipation protecting sheathing 1 is provided with and gathers hot aluminum plate 12.
As a further improvement of the present invention, the bus circuit board unit 3 includes a first bus circuit board 31, a second bus circuit board 32, a third bus circuit board 33, a fourth bus circuit board 34, a fifth bus circuit board 35 and a sixth bus circuit board 36, the first bus circuit board 31, the second bus circuit board 32, the third bus circuit board 33, the fourth bus circuit board 34, the fifth bus circuit board 35 and the sixth bus circuit board 36 have the same shape and the same size, and the first bus circuit board 31, the second bus circuit board 32, the third bus circuit board 33, the fourth bus circuit board 34, the fifth bus circuit board 35 and the sixth bus circuit board 36 are arranged on the PCB main board 2 side by side at equal intervals.
As a further improvement of the present invention, the MOS tube unit 4 includes a first MOS tube group 41, a second MOS tube group 42, a third MOS tube group 43, a fourth MOS tube group 44, a fifth MOS tube group 45, and a sixth MOS tube group 46, the first MOS tube group 41, the second MOS tube group 42, the third MOS tube group 43, the fourth MOS tube group 44, the fifth MOS tube group 45, and the sixth MOS tube group 46 are respectively disposed on the first bus circuit board 31, the second bus circuit board 32, the third bus circuit board 33, the fourth bus circuit board 34, the fifth bus circuit board 35, and the sixth bus circuit board 36 in a one-to-one correspondence manner, each of the MOS tube groups includes nine MOS tubes 411 having the same shape and size, and the nine MOS tubes 411 are disposed on the bus circuit board in parallel at equal intervals.
As a further improvement of the present invention, the confluent aluminum heat sink sheet unit 5 includes a first confluent aluminum heat sink sheet 51, a second confluent aluminum heat sink sheet 52, a third confluent aluminum heat sink sheet 53, a fourth confluent aluminum heat sink sheet 54, a fifth confluent aluminum heat sink sheet 55 and a sixth confluent aluminum heat sink sheet 56, wherein the first confluent aluminum heat sink sheet 51, the second confluent aluminum heat sink sheet 52, the third confluent aluminum heat sink sheet 53, the fourth confluent aluminum heat sink sheet 54, the fifth confluent aluminum heat sink sheet 55 and the sixth confluent aluminum heat sink sheet 56 are respectively and correspondingly arranged above the first confluent circuit board 31, the second confluent circuit board 32, the third confluent circuit board 33, the fourth confluent circuit board 34, the fifth confluent circuit board 35 and the sixth confluent circuit board 36.
As a further improvement of the present invention, the confluent heat-dissipating aluminum plate 6 covers the first confluent heat-dissipating aluminum plate 51, the second confluent heat-dissipating aluminum plate 52, the third confluent heat-dissipating aluminum plate 53, the fourth confluent heat-dissipating aluminum plate 54, the fifth confluent heat-dissipating aluminum plate 55 and the sixth confluent heat-dissipating aluminum plate 56.
As a further improvement of the present invention, the confluent heat dissipating aluminum plate 6 is provided with a fixing through hole 61, and the confluent heat dissipating aluminum plate 6 is fixed above the first confluent heat dissipating aluminum plate 51, the second confluent heat dissipating aluminum plate 52, the third confluent heat dissipating aluminum plate 53, the fourth confluent heat dissipating aluminum plate 54, the fifth confluent heat dissipating aluminum plate 55 and the sixth confluent heat dissipating aluminum plate 56 through the fixing through hole 61.
As a further improvement of the present invention, the present invention further includes a red copper nut 7, one end of the PCB main board 2 is provided with a negative input port 21, the other end of the PCB main board 2 is provided with a negative output port 22, the red copper nut 7 includes a first red copper nut 71 and a second red copper nut 72, the first red copper nut 71 is disposed at the negative input port 21, and the second red copper nut 72 is disposed at the negative output port 22.
As a further improvement of the present invention, the heat dissipation protective housing 1 is in a step-like structure, the heat dissipation protective housing 1 includes a heat dissipation protective side cover 13 and a heat dissipation protective upper cover 14, the heat dissipation protective upper cover 14 covers the heat dissipation protective side cover 13, and the heat dissipation through holes 11 are disposed on two sides of the heat dissipation protective side cover 13.
As a further improvement of the present invention, the level of the heat dissipation protection upper cover 14 is lower than the level of the highest position of the heat dissipation protection side cover 13, the heat collecting aluminum plate 12 covers the heat dissipation protection upper cover 14, and the level of the heat collecting aluminum plate 12 and the level of the highest position of the heat dissipation protection side cover 13 are located on the same horizontal plane.
As a further improvement of the utility model, the current of the PCB main control board 2, the bus circuit board unit 3, the MOS tube unit 4 and the bus aluminum heat dissipation sheet unit 5 are circulated by the bus aluminum heat dissipation sheet 6.
As a further improvement of the present invention, the heat-conducting silica gel is disposed on the conflux heat-dissipating aluminum plate 6, and the conflux heat-dissipating aluminum plate 6 guides heat to the heat-dissipating protection upper cover 14 and the heat-collecting aluminum plate 12 through the heat-conducting silica gel.
The above embodiments are merely exemplary embodiments of the present invention, and not intended to limit the present invention, so that any modifications, equivalents, improvements, etc. made in the above embodiments according to the present invention are within the scope of the present invention.
Claims (10)
1. A heat dissipation protection device for BMS lithium battery management system, its characterized in that, it includes: the heat dissipation protective housing, PCB mainboard, the circuit board unit that converges, MOS pipe unit, the heat dissipation aluminum sheet unit that converges and the heat dissipation aluminum plate that converges, the PCB mainboard sets up in the inside of heat dissipation protective housing, the circuit board unit that converges is vertical to be set up on the PCB mainboard, MOS pipe unit is fixed in on the circuit board unit that converges, the heat dissipation aluminum sheet unit that converges sets up on the circuit board unit that converges, the heat dissipation aluminum plate lid that converges fits the top of the heat dissipation aluminum sheet unit that converges, the both sides of heat dissipation protective housing are provided with the heat dissipation through-hole, the upper surface of heat dissipation protective housing is provided with heat gathering aluminum plate.
2. The heat dissipation protection device for a BMS lithium battery management system according to claim 1, wherein the bus circuit board unit includes a first bus circuit board, a second bus circuit board, a third bus circuit board, a fourth bus circuit board, a fifth bus circuit board and a sixth bus circuit board, the first bus circuit board, the second bus circuit board, the third bus circuit board, the fourth bus circuit board, the fifth bus circuit board and the sixth bus circuit board have the same shape and the same size, and the first bus circuit board, the second bus circuit board, the third bus circuit board, the fourth bus circuit board, the fifth bus circuit board and the sixth bus circuit board are disposed on the PCB main board side by side at equal intervals.
3. The thermal protection device of claim 2, wherein the MOS transistor unit comprises a first MOS transistor group, a second MOS transistor group, a third MOS transistor group, a fourth MOS transistor group, a fifth MOS transistor group and a sixth MOS transistor group, the first MOS transistor group, the second MOS transistor group, the third MOS transistor group, the fourth MOS transistor group, the fifth MOS transistor group and the sixth MOS transistor group are respectively disposed on the first bus circuit board, the second bus circuit board, the third bus circuit board, the fourth bus circuit board, the fifth bus circuit board and the sixth bus circuit board in a one-to-one correspondence manner, each MOS transistor group comprises nine MOS transistors with the same shape and size, and the nine MOS transistors are disposed on the bus circuit board in parallel at equal intervals.
4. The thermal protection device of claim 2, wherein the aluminum bus-bars plate unit comprises a first aluminum bus-bars plate, a second aluminum bus-bars plate, a third aluminum bus-bars plate, a fourth aluminum bus-bars plate, a fifth aluminum bus-bars plate and a sixth aluminum bus-bars plate, and the first aluminum bus-bars plate, the second aluminum bus-bars plate, the third aluminum bus-bars plate, the fourth aluminum bus-bars plate, the fifth aluminum bus-bars plate and the sixth aluminum bus-bars plate are respectively disposed above the first circuit board, the second circuit board, the third circuit board, the fourth circuit board, the fifth circuit board and the sixth circuit board in a one-to-one correspondence manner.
5. The thermal protection device of claim 4, wherein the aluminum confluent plate covers over the first, second, third, fourth, fifth and sixth confluent aluminum plates.
6. The thermal protection device for the BMS lithium battery management system of claim 4, wherein the confluent aluminum heat sink plate is provided with fixing through holes, and the confluent aluminum heat sink plate is fixed above the first, second, third, fourth, fifth and sixth confluent aluminum heat sink plates through the fixing through holes.
7. The thermal protection device for a BMS lithium battery management system of claim 1, further comprising a red copper nut, one end of the PCB main board is provided with a negative input port, the other end of the PCB main board is provided with a negative output port, the red copper nut comprises a first red copper nut and a second red copper nut, the first red copper nut is disposed at the negative input port, and the second red copper nut is disposed at the negative output port.
8. The thermal protection device of claim 1, wherein the thermal protection housing has a step-like structure, and comprises a thermal protection side cover and a thermal protection top cover, the thermal protection top cover covers the thermal protection side cover, and the thermal through holes are disposed on two sides of the thermal protection side cover.
9. The thermal protection device of claim 8, wherein the thermal protection upper cover has a lower level than the highest level of the thermal protection side cover, the thermal aluminum plate covers the thermal protection upper cover, and the thermal aluminum plate has a level at the same level as the highest level of the thermal protection side cover.
10. The thermal protection device of claim 9, wherein the heat-conducting silica gel is disposed on the aluminum plate for collecting heat, and the aluminum plate for collecting heat guides heat to the upper cover for thermal protection and the aluminum plate for collecting heat through the heat-conducting silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122280037.2U CN216291932U (en) | 2021-09-18 | 2021-09-18 | A heat dissipation protection device for BMS lithium battery management system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122280037.2U CN216291932U (en) | 2021-09-18 | 2021-09-18 | A heat dissipation protection device for BMS lithium battery management system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216291932U true CN216291932U (en) | 2022-04-12 |
Family
ID=81065338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122280037.2U Expired - Fee Related CN216291932U (en) | 2021-09-18 | 2021-09-18 | A heat dissipation protection device for BMS lithium battery management system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216291932U (en) |
-
2021
- 2021-09-18 CN CN202122280037.2U patent/CN216291932U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220412 |
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| CF01 | Termination of patent right due to non-payment of annual fee |