CN214625019U - Device structure containing P-type island - Google Patents

Abstract

The utility model provides a device structure who contains P type island belongs to device structure technical field. The device structure comprising the P-type island comprises a device part and a fixed part. The device part includes substrate layer and oxide layer and metal level, the fixed part includes U-shaped mounting panel and holder, the mounting hole has been seted up in pairs on the U-shaped mounting panel, the holder is provided with two, two the holder all includes sleeve and loop bar and aluminium base heat dissipation splint, two the sleeve is connected to respectively U-shaped mounting panel inner wall both sides, two the loop bar slip cap is located correspondingly respectively the sleeve, two all set up flutedly on the loop bar. The utility model discloses in, the fixed part can be fixed to it carries out quick chucking on the basis that does not damage the device part, and it is quick to be convenient for also dismantle, can also play radiating effect simultaneously at the in-process of chucking to can increase the functionality that the fixed part used.

Description

Device structure containing P-type island

Technical Field

The utility model relates to a device structure field particularly, relates to a device structure who contains P type island.

Background

The device structure containing the P-type island belongs to a MOS (metal oxide semiconductor) structure, and the device structure containing the P-type island in the prior art is usually required to be fixed on a circuit board for use.

However, when the existing device structure including the P-type island is installed on a circuit board, the device structure is usually fixed by adopting fasteners such as bolts, so that the device structure is not convenient to rapidly disassemble and install, and the device structure including the P-type island cannot be rapidly cooled while being installed, so that convenience cannot be brought to the use of the device structure including the P-type island.

SUMMERY OF THE UTILITY MODEL

In order to compensate the above deficiency, the utility model provides a device structure who contains P type island aims at improving the current device structure who contains P type island and lacks the problem that has the mounting structure of heat dissipation function.

The utility model discloses a realize like this:

the utility model provides a device structure who contains P type island, including device part and fixed part.

The device part comprises a substrate layer, an oxide layer and a metal layer, the oxide layer is fixedly connected between the substrate layer and the metal layer, deep grooves are formed in two sides of the upper portion of the substrate layer in a penetrating mode in pairs, the two deep grooves are connected with P-type semiconductor regions, the two P-type semiconductor regions are wrapped by N-shaped semiconductor regions, the fixing part comprises a U-shaped mounting plate and a clamping piece, mounting holes are formed in the U-shaped mounting plate in pairs, the clamping piece comprises two clamping pieces, the two clamping pieces comprise sleeves, sleeve rods and aluminum-based heat dissipation clamping plates, the two sleeves are respectively connected to two sides of the inner wall of the U-shaped mounting plate, the two sleeve rods are respectively sleeved with the corresponding sleeves in a sliding mode, grooves are formed in the two sleeve rods, convex columns are connected in the two grooves in a sliding mode, springs are further connected between the convex columns and the corresponding grooves, the aluminum-based heat dissipation clamp plate comprises a sleeve, aluminum-based heat dissipation clamp plates and a silica gel heat conduction pad, wherein the sleeve is provided with a plurality of inserting holes in pairs, the aluminum-based heat dissipation clamp plates are connected to the outer end of the sleeve rod respectively, the opposite sides of the aluminum-based heat dissipation clamp plates are connected with the silica gel heat conduction pad, and the substrate layer is clamped and fixed by the two aluminum-based heat dissipation clamp plates.

The utility model discloses an in one embodiment, two equal fixedly connected with slider, two on the projection the slide rail with slider looks adaptation is all seted up to the recess inner wall.

In an embodiment of the present invention, two anti-slip rubber sleeves are adhered to the outer wall of each of the two protruding columns, and the two anti-slip rubber sleeves are attached to the inner wall of the insertion hole.

In an embodiment of the present invention, the aluminum-based heat dissipation clamping plate has a U-shaped longitudinal section.

In an embodiment of the present invention, two opposite sides of the silica gel heat conduction pad are attached to the outer wall of the substrate layer.

The utility model discloses an in an embodiment, two aluminium base heat dissipation splint outer wall still equal fixed mounting has the refrigeration piece body.

In an embodiment of the present invention, two of the N-shaped semiconductor regions are respectively connected with a source portion and a drain portion, and the metal layer is connected with a gate portion.

In an embodiment of the present invention, the source portion and the drain portion can be disposed in axial symmetry with respect to the oxide layer and the gate portion, and the oxide layer and the metal layer have the same length and width.

In an embodiment of the present invention, the substrate layer and the N-shaped semiconductor region are all connected with a reinforcing sleeve, and the reinforcing sleeve is provided with three, two, the reinforcing sleeve is respectively connected with the source portion, the drain portion and the gate portion.

In an embodiment of the present invention, a rubber cushion pad is adhered to the bottom of the U-shaped mounting plate, and a through hole matched with the mounting hole is formed through the rubber cushion pad.

The utility model has the advantages that: the utility model discloses a device structure that contains P type island that obtains through above-mentioned design, when using, utilize two mounting holes cooperation external bolt can be installed U-shaped mounting panel to a certain fixed position, U-shaped mounting panel is used for bearing and installs subsequent device part, utilize the rubber buffer pad of U-shaped mounting panel bottom to play the effect of buffering shock attenuation simultaneously, thereby indirectly carry out the anti-pressure or anticollision protection to the device part, when carrying out device part installation, press two projections downwards earlier and make the corresponding spring be in compressed state, thereby make two projections move to the sleeve from the corresponding spliced eye, pull two loop bars outwards certain continuation back from the corresponding sleeve simultaneously, make two projections keep away from originally the spliced eye position of inserting can, go again to connect the device part with one of aluminium base heat dissipation splint inner wall joint, when the two loop bars are continuously pulled outwards and the two convex columns formally reach the next inserting hole, the elastic force of the two springs is released, thereby being capable of rapidly inserting the two convex columns into the new inserting holes, rapidly clamping the substrate layer in the device part on the aluminum-based heat dissipation clamping plate, the installation mode is convenient for the quick assembly and disassembly of the device part, and the device part does not need to be fixed by punching, the device part can not be damaged, and the silica gel heat conducting pad is adhered on the inner wall of the aluminum-based heat radiating clamping plate and can play a role of absorbing heat to the aluminum-based heat radiating clamping plate, have the refrigeration piece body at aluminium base heat dissipation splint outer wall connection, the one side of refrigeration piece body heat absorption is towards aluminium base heat dissipation splint, utilizes this physical stamina of refrigeration piece to carry out release with higher speed with the heat that aluminium base heat dissipation splint absorbed to can cool down the device part fast.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a device including a P-type island according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a part of a device provided by an embodiment of the present invention;

fig. 3 is a schematic diagram of a partially enlarged structure at a-a in fig. 1 according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a fixing portion according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a clamping member according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a partially enlarged structure at a in fig. 5 according to an embodiment of the present invention.

In the figure: 10-a device portion; 110-a substrate layer; 120-oxide layer; 130-a metal layer; 140-a reinforcement sleeve; a 150-P type semiconductor region; a 160-N shaped semiconductor region; 170-source part; 180-drain portion; 190-a gate portion; 20-a stationary portion; 210-a U-shaped mounting plate; 220-a clamp; 221-a sleeve; 222-a loop bar; 223-aluminum-based heat-dissipating clamping plates; 224-a groove; 225-silica gel thermal pad; 226-a cooling fin body; 227-convex column; 228-a plug hole; 229-a spring; 230-mounting holes; 240-rubber cushion.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

Referring to fig. 1, the present invention provides a device structure including a P-type island, which includes a device portion 10 and a fixed portion 20.

The device portion 10 is mainly composed of a substrate layer 110, an oxide layer 120 and a metal layer 130, and belongs to a MOS structure, i.e., a metal oxide semiconductor structure; the fixing portion 20 can be quickly clamped and fixed without damaging the device portion 10, and also can be conveniently and quickly disassembled, and meanwhile, the fixing portion can play a role in heat dissipation in the clamping process, so that the use functionality of the fixing portion 20 can be increased.

Referring to fig. 1 and 2, the device portion 10 includes a substrate layer 110, an oxide layer 120 and a metal layer 130, the oxide layer 120 is fixedly connected between the substrate layer 110 and the metal layer 130, deep trenches are formed in pairs on two sides of the upper portion of the substrate layer 110, and both the deep trenches are connected to a P-type semiconductor region 150, wherein the P-type semiconductor region 150 is a P-type island region. The two P-type semiconductor regions 150 are wrapped by the N-type semiconductor regions 160, the two N-type semiconductor regions 160 are respectively connected to the source portion 170 and the drain portion 180, and the metal layer 130 is connected to the gate portion 190, wherein the source portion 170, the drain portion 180, and the gate portion 190 generally belong to three poles of an MOS, and a voltage between the gate portion 190 and the source portion 170 is required to be greater than a certain value, and the drain portion 180 and the source portion 170 can be conducted.

The source part 170 and the drain part 180 can be arranged in an axisymmetric manner with respect to the oxide layer 120 and the gate part 190, the length and width of the oxide layer 120 are the same as those of the metal layer 130, the substrate layer 110 and the N-shaped semiconductor region 160 are both connected with the reinforcing sleeves 140, three reinforcing sleeves 140 are arranged, the two reinforcing sleeves 140 are respectively connected with the source part 170, the drain part 180 and the gate part 190, wherein the inner wall of the reinforcing sleeve 140 is connected with the source part 170, the drain part 180 and the gate part 190 by using a strong adhesive, and the contact part of the reinforcing sleeve 140 with the substrate layer 110 and the N-shaped semiconductor region 160 can also be fixed by using the strong adhesive.

Referring to fig. 1, 3 and 6, the fixing portion 20 includes a U-shaped mounting plate 210 and a clamping member 220, the U-shaped mounting plate 210 has mounting holes 230 formed in pairs, and the U-shaped mounting plate 210 can be mounted to a fixed position by using the two mounting holes 230 in cooperation with external bolts. Wherein, the bottom of the U-shaped mounting plate 210 is adhered with a rubber buffer 240, the rubber buffer 240 is provided with a through hole matching with the mounting hole 230, and the rubber buffer 240 at the bottom of the U-shaped mounting plate 210 can play a role of buffering and damping, thereby indirectly performing pressure-proof or crash-proof protection on the device part 10.

The holder 220 is provided with two, two holders 220 all include sleeve 221 and loop bar 222 and aluminium base heat dissipation splint 223, two sleeve 221 are respectively through screwed connection to U-shaped mounting panel 210 inner wall both sides, corresponding sleeve 221 is located to two loop bar 222 sliding sleeve respectively, all set up fluted 224 on two loop bar 222, equal sliding connection has projection 227 in two recesses 224, it is concrete, equal fixedly connected with slider on two projection 227, wherein, slider and projection 227 integrated into one piece set up. The slide rail with slider looks adaptation is all seted up to two recess 224 inner walls, and still all welded between projection 227 and the recess 224 that corresponds has spring 229, all runs through in pairs on two sleeves 221 and has seted up spliced eye 228, and wherein, two projection 227 outer walls all pass through the sticky inherent anti-skidding rubber sleeve of powerful, and two anti-skidding rubber sleeves all laminate with spliced eye 228 inner wall, utilize the setting of anti-skidding rubber sleeve to increase the stability that spliced eye 228 and projection 227 are connected.

Two aluminium base heat dissipation splint 223 are respectively through screwed connection to loop bar 222 outer end, two aluminium base heat dissipation splint 223 opposite sides all lead to the pad 225 through the sticky inherent silica gel of powerful, utilize silica gel heat conduction pad 225 can play the effect that the heat absorption leads to aluminium base heat dissipation splint 223, substrate layer 110 is fixed by two aluminium base heat dissipation splint 223 centre grippings, wherein, two aluminium base heat dissipation splint 223's longitudinal section is the setting of U shape, two silica gel heat conduction pad 225 opposite sides hug closely in the outer wall of substrate layer 110, two aluminium base heat dissipation splint 223 outer walls still all fixed mounting have refrigeration piece body 226, the endothermic one side of refrigeration piece body 226 is towards aluminium base heat dissipation splint 223, the concrete structure and the control mode of refrigeration piece body 226 are prior art, give unnecessary here details.

The working principle of the device structure comprising the P-type island is as follows: when the device is used, the U-shaped mounting plate 210 can be mounted to a certain fixed position by matching the two mounting holes 230 with external bolts, the U-shaped mounting plate 210 is used for bearing and mounting the subsequent device part 10, and meanwhile, the rubber buffer 240 at the bottom of the U-shaped mounting plate 210 can play a role in buffering and damping, so that the device part 10 is indirectly protected against pressure or collision, when the device part 10 is mounted, the two convex columns 227 are pressed downwards to enable the corresponding springs 229 to be in a compressed state, so that the two convex columns 227 are moved into the sleeves 221 from the corresponding insertion holes 228, and after the two sleeve rods 222 are pulled outwards from the corresponding sleeves 221 for a certain duration, the two convex columns 227 are far away from the positions of the originally inserted insertion holes 228, and then the device part 10 is clamped with the inner wall of one of the aluminum-based heat dissipation clamping plate 223, when the two loop bars 222 are continuously pulled outwards, and the two convex columns 227 formally reach the next inserting hole 228, the elastic force of the two springs 229 is released, so that the two convex columns 227 can be quickly inserted into the new inserting hole 228, and the substrate layer 110 in the device part 10 can be quickly clamped on the aluminum-based heat-radiating clamp plate 223, the device part 10 can be quickly assembled and disassembled without punching and fixing the device part 10, namely, the device part 10 cannot be damaged, meanwhile, the silica gel heat-conducting pad 225 is adhered to the inner wall of the aluminum-based heat-radiating clamp plate 223, the silica gel heat-conducting pad 225 can play a role of absorbing heat to the aluminum-based heat-radiating clamp plate 223, the outer wall of the aluminum-based heat-radiating clamp plate 223 is connected with a refrigerating fin body 226, one side of the refrigerating fin body 226 absorbing heat faces the aluminum-based heat-radiating clamp plate 223, and the heat absorbed by the aluminum-based heat-radiating clamp plate 223 can be quickly released by the refrigerating fin body 226, therefore, the device portion 10 can be rapidly cooled, the reinforcing sleeve 140 is adhered to the root portions of the source portion 170, the drain portion 180 and the gate portion 190 in the device portion 10, the reinforcing sleeve 140 can play a reinforcing role, and the probability of breakage of the source portion 170, the drain portion 180 and the gate portion 190 in the using process can be reduced.

It should be noted that the specific model specifications of the aluminum-based heat-dissipating clamping plate 223, the refrigerating plate body 226 and the spring 229 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The power supply of the cold plate body 226 and its principle will be clear to those skilled in the art and will not be described in detail here.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A device structure containing a P-type island is characterized by comprising

The device comprises a device part (10), wherein the device part (10) comprises a substrate layer (110), an oxide layer (120) and a metal layer (130), the oxide layer (120) is fixedly connected between the substrate layer (110) and the metal layer (130), deep grooves are formed in two sides of the upper portion of the substrate layer (110) in a penetrating mode in pairs, the two deep grooves are connected with P-type semiconductor regions (150), and N-shaped semiconductor regions (160) are wrapped in the two P-type semiconductor regions (150);

the fixing part (20) comprises a U-shaped mounting plate (210) and two clamping pieces (220), the U-shaped mounting plate (210) is provided with mounting holes (230) in pairs, the two clamping pieces (220) are provided with two clamping pieces (220), each clamping piece (220) comprises a sleeve (221), a loop bar (222) and an aluminum-based heat dissipation clamping plate (223), the two sleeves (221) are respectively connected to two sides of the inner wall of the U-shaped mounting plate (210), the two loop bars (222) are respectively sleeved on the corresponding sleeves (221) in a sliding manner, each loop bar (222) is provided with a groove (224), each groove (224) is connected with a convex column (227) in a sliding manner, a spring (229) is further connected between each convex column (227) and the corresponding groove (224), and each sleeve (221) is provided with a plug hole (228) in pairs in a penetrating manner, two aluminium base heat dissipation splint (223) are connected to respectively loop bar (222) outer end, two aluminium base heat dissipation splint (223) opposite side all is connected with silica gel heat conduction pad (225), substrate layer (110) is by two aluminium base heat dissipation splint (223) centre gripping is fixed.

2. The device structure comprising a P-type island according to claim 1, wherein a slider is fixedly connected to each of the two protruding columns (227), and a sliding rail adapted to the slider is provided on each of the inner walls of the two grooves (224).

3. The device structure comprising a P-type island according to claim 1, wherein anti-slip rubber sleeves are adhered to the outer walls of the two protruding columns (227) and are attached to the inner wall of the inserting hole (228).

4. The device structure containing the P-type island according to claim 1, wherein the longitudinal sections of the two aluminum-based heat-dissipating clamping plates (223) are both U-shaped.

5. A device structure comprising P-type islands according to claim 1, wherein two opposite sides of the silica gel thermal pad (225) are closely attached to the outer wall of the substrate layer (110).

6. The device structure containing the P-type island according to claim 1, wherein a cooling fin body (226) is fixedly mounted on the outer wall of each of the two aluminum-based heat dissipation clamping plates (223).

7. A device structure comprising P-type islands according to claim 1, wherein two of said N-shaped semiconductor regions (160) are connected with a source portion (170) and a drain portion (180), respectively, and said metal layer (130) is connected with a gate portion (190).

8. The device structure comprising the P-type island according to claim 7, wherein the source portion (170) and the drain portion (180) can be axisymmetrically disposed with respect to the oxide layer (120) and the gate portion (190), and the oxide layer (120) and the metal layer (130) have the same length and width.

9. The device structure comprising the P-type island according to claim 7, wherein a reinforcing sleeve (140) is connected to each of the substrate layer (110) and the N-shaped semiconductor region (160), and three reinforcing sleeves (140) are provided, and two reinforcing sleeves (140) are respectively connected to the source portion (170), the drain portion (180) and the gate portion (190).

10. The device structure with the P-type island according to claim 1, wherein a rubber buffer pad (240) is adhered to the bottom of the U-shaped mounting plate (210), and a through hole matched with the mounting hole (230) is formed in the rubber buffer pad (240) in a penetrating manner.

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