CN214621217U

CN214621217U - Half-bridge push-pull flow z-axis film gyroscope

Info

Publication number: CN214621217U
Application number: CN202121104379.2U
Authority: CN
Inventors: 朴林华; 李备; 王灯山
Original assignee: Beijing Information Science and Technology University
Current assignee: Beijing Information Science and Technology University
Priority date: 2021-05-21
Filing date: 2021-05-21
Publication date: 2021-11-05
Anticipated expiration: 2031-05-21

Abstract

The utility model discloses a half-bridge push-pull flow z-axis film gyroscope, which comprises a sensitive layer and a cover plate, wherein the upper surface of the sensitive layer is provided with a pair of heaters, a pair of thermistors, a pair of balance resistors and an isolation resistor; the power-on mode of the heater is periodic push-pull power-on; the cover plate is etched with a groove and is hermetically connected with the upper surface of the sensitive layer. The utility model discloses miniature thermal current top does not have solid sensitive quality piece, advantages such as anti-vibration and impact. Compared with the micro inertial sensor with other working principles, the utility model adopts the half-bridge push-pull flow, and is characterized in that the sensitivity is 2 times of that of a single working arm, and the utility model adopts the push-pull heat flow, so that the response speed is high and the stability is good; the half-bridge is adopted, the resistance value of the balance resistor is hundreds of times of that of the thermistor, impedance matching is facilitated when the voltage signal is further amplified, interference is prevented, and anti-interference performance is high.

Description

Half-bridge push-pull flow z-axis film gyroscope

Technical Field

The utility model belongs to the technical field of the technique that utilizes the sensitive physical detection of brother's power deflection heat current to move body angular velocity attitude parameter and specifically relates to a half-bridge type push-pull flows z axle film top belongs to the inertia measurement field.

Background

The Micro inertial sensor manufactured by using Micro-Electro-Mechanical-System (MEMS) technology has the advantages of mass production, low cost, small volume, low power consumption and the like, and is an ideal product of the future medium and low precision Micro inertial sensors. The gyroscope and the accelerometer are core inertial sensors for measuring and controlling the motion attitude of the carrier, and the gyroscope is a sensor sensitive to angular velocity, angular acceleration and other angular parameters. The traditional micro gyroscope (micromechanical gyroscope) is a micro rate gyroscope based on the principle of the Coriolis effect existing when a high-frequency vibrating mass is driven to rotate by a base, and micro-electronics and a micro machine are combined. The solid mass block in the gyro sensitive element needs to be suspended and vibrated through a mechanical elastic body, is easy to damage under slightly high acceleration impact, and simultaneously needs vacuum packaging for reducing damping, has complex process and can generate fatigue damage and vibration noise when working for a long time. The micro fluid inertia device is a novel device for measuring input acceleration and angular velocity by detecting the flow field offset of fluid in a closed cavity. Because the movable part and the suspension system in the traditional miniature gyro are not provided, the high overload can be resisted; the sensitive mass of the gas sensor is gas, and the mass is almost zero, so the response time is short and the service life is long; due to the simple structure, the application requirement of low cost can be met. The micro fluid gyroscope is an angular velocity sensor which utilizes the deflection of an air flow sensitive body in a closed cavity under the action of Goldson force and senses the deflection quantity caused by angular velocity by a thermistor (hot wire). At present, the market has higher and higher requirements on the capability of the micro inertial gyroscope to adapt to severe and harsh environments, and compared with the traditional micro mechanical vibration gyroscope, the micro fluid gyroscope has higher market competitiveness and very wide application prospect due to the advantages of extremely high vibration resistance and impact resistance, low cost and the like.

The micro fluid gyroscopes based on MEMS technology can be broadly classified into four types, namely micro fluidic gyroscopes, ECF (electro-coupled fluid) fluid gyroscopes, micro thermal convection gyroscopes and micro thermal flow gyroscopes. The Chinese patent is a miniature four-channel circulating flow type three-axis silicon jet gyro (patent application number: 201510385582.4), which belongs to the miniature jet gyro, the piezoelectric sheet in the sensitive element of the miniature jet gyro increases the processing difficulty and the cost, and the volume of the miniature jet gyro is difficult to further reduce on the premise of keeping the flow rate. ECF fluid gyroscopes are relatively large (40mm x 60mm x 7mm) and are difficult to commercialize in large volumes and at low cost because of the high kilovoltage required to form the liquid jet. The miniature thermal convection gyro cannot work without a gravity field, and the sensitivity is low. The above-described microfluidic gyros have their own inherent disadvantages that make them difficult to be the low-cost choice for commercial microfluidic gyros. The micro heat flow gyro (also called thermal expansion gyro) is a new micro fluid gyro which is proposed in recent years, a voltage-free electric sheet is arranged in a sensitive element, high voltage is not needed, the micro fluid gyro can be used in a gravity-free environment, the sensitivity of the micro fluid gyro is moderate, the micro fluid gyro is between the micro fluid gyro and the micro heat convection gyro, and meanwhile, the micro fluid gyro has the advantages of simple structure and processing technology, extremely low cost, high reliability and excellent vibration and impact resistance, so that the micro fluid gyro can compete with a capacitive micro mechanical vibration gyro in the micro gyroscope market with low precision and low price.

The sensitive working principle of the micro heat flow gyroscope is that a heater is electrified to generate heat, gas around the heater is heated to form gas thermal diffusion, an air flow sensitive body moving along a certain direction is generated, and when an angular velocity is input, the air flow sensitive body deflects under the action of a Coriolis force to change a bridge arm resistor (generally composed of a thermistor) of a Wheatstone bridge, so that bridge unbalanced voltage in direct proportion to the input angular velocity is output. In chinese patents 201410140298.6 and 201210130318.2, the main components in the sensor sensing element, i.e., the heater and the thermistor, are both in a suspended cantilever beam structure, and first, since the heater and the thermistor are both suspended above the cavity, after the cavity releasing structure is etched, the heater and the thermistor may be deformed or even broken by stress, the yield is low, and the warp deformation may generate an asymmetric gas flow field under the condition of no angular velocity input, thereby causing an angular velocity detection error. Secondly, the extraction circuit and the sensitive element chip of the sensor are separated, the extraction circuit needs to be manufactured additionally, and the extraction circuit and the sensitive element are not integrated on one chip, so that the integration level is not high, and the sensor is large in size. Thirdly, if the resistors in the four-arm bridge in the discrete device are not in the same temperature field, the temperature coefficients of the resistors are different, which easily causes temperature drift and affects the accuracy of the sensor, thereby limiting the application field of the sensor. Therefore, how to overcome the above problems becomes a technical problem that needs to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a half-bridge push-pull flows z axle film top to solve the technical problem who exists among the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a half-bridge push-pull flow z-axis film gyroscope, which comprises a sensitive layer and a cover plate, wherein,

the upper surface of the sensitive layer is provided with a pair of heaters, a pair of thermistors, a pair of balance resistors and an isolating resistor;

defining the placing direction of the isolation resistor as a Y direction, the direction vertical to the placing direction of the isolation resistor as an X direction, and the height direction of the sensitive layer as a Z direction; the arrangement directions of the heater and the thermistor are parallel to the Y direction and are used for detecting the angular speed of the Z axis;

the thermistor and the balance resistor for detecting the angular velocity of the Z axis are arranged on two sides of the upper surface of the sensitive layer in the X direction, and the pair of heaters are respectively arranged on two sides of the upper surface of the sensitive layer in the Y direction;

the heater is powered on in a periodic push-pull mode, namely one working period of the heater comprises pulse voltage excitation time and power-off interval time;

and the cover plate is etched with a groove and is hermetically connected with the upper surface of the sensitive layer.

As a further technical scheme, each pair of heaters is driven by two square wave signals with the same frequency, the phase difference is 90 degrees, and the pulse duty ratio is 50%.

As a further technical scheme, the distance from the upper surface of the sensitive layer to the top of the groove on the cover plate is the height of the gas medium working cavity, and the height is 200-1000 μm.

As a further technical scheme, the height of the heater and the thermistor on the upper surface of the sensitive layer is 15-20 μm.

As a further technical scheme, the lengths of the heater and the thermistor are consistent and are 1/6-1/5 of the width of the whole sensitive layer.

As a further technical scheme, the heaters are all made of TaN material resistance wires with high temperature coefficients.

As a further technical scheme, the thermistors are all formed by n-type heavily doped GaAs material resistance wires.

As a further technical scheme, the isolation resistor is composed of Si with the height of 25-30 μm₃N₄A resistive line of material.

As a further technical solution, the balancing resistor does not participate in the deflection of the sensitive airflow, and the resistance value of the balancing resistor is 100 times that of the thermistor.

A method for processing a half-bridge push-pull flow z-axis film gyroscope comprises the following specific process flows:

the method comprises the following steps: preparation of doping Density of 10 on GaAs wafer¹⁸cm^-3N of (A) to (B)⁺The GaAs epitaxial layer is etched to form an upper surface thermistor and a balance resistor;

step two: sputtering a TaN layer as an upper surface heater;

step three: sputtering Ti/Au/Ti respectively to form

Thick pads and sensitive resistance lines;

step four: deposited by chemical vapor deposition (PECVD)

Thick Si₃N₄Preparing an isolation resistor;

step five: the upper cover plate and the sensitive layer are bonded through a bonding process, so that the working environment of the gas medium is sealed;

step six: and packaging the processed structure to form the half-bridge push-pull flow z-axis film gyroscope.

Adopt above-mentioned technical scheme, the utility model discloses following beneficial effect has:

1. the gyroscope inherits the advantages of no solid sensitive mass block, vibration and impact resistance and the like of the micro heat flow gyroscope, and the sensitive element of the gyroscope has no cantilever beam structure, simple process, high yield of the sensitive element and low cost.

2. The four-arm bridge in the extraction circuit in the sensitive element in the film type micro-mechanical heat flow gyroscope is realized on one chip, and the four-arm bridge is manufactured in the same structure and the same process, so that the dispersion degree of the resistance of the bridge arms of the bridge is small, the resistors with the same temperature coefficient are very easy to manufacture, and the temperature drift caused by the difference of the temperature coefficient and the temperature gradient can not be caused because each bridge arm of the bridge is in the same temperature field.

3. The utility model discloses in two thermistors that the resistance is the same constitute half equal arm electric bridge as the balance resistance (non-operating resistance) that working resistance and two other resistances are the same, two work arms all participate in the deflection of sensitive hot gas flow, sensitivity is the twice of single work arm, has improved top sensitivity greatly.

4. The push-pull type heat flow is adopted, the heat flow state is changed quickly, the heat flow velocity is large, the air flow state is stable, the corresponding speed is high, the sensitivity of the gyroscope is high, and the stability is good.

5. The resistance value of the balance resistor is hundreds times of that of the thermistor, which is beneficial to impedance matching when the voltage signal is further amplified and prevents interference.

6. The utility model discloses a technology and integrated circuit technology compatibility have the potentiality of high integration level.

7. Because the sensitive mass of the sensor does not contain a solid mass block, compared with micro inertial sensors with other working principles, the sensor has the advantages of large impact resistance, simple structure, extremely low cost and high reliability.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic three-dimensional structure diagram of a sensitive layer provided by an embodiment of the present invention;

fig. 2 is a schematic three-dimensional structure diagram of a cover plate according to an embodiment of the present invention;

fig. 3 is a top view of a sensitive layer provided by an embodiment of the present invention;

FIG. 4 is a sectional view taken along line A-A of FIG. 3;

fig. 5 is a working schematic diagram provided by the embodiment of the present invention;

fig. 6 is a schematic structural diagram of a heater according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a thermistor according to an embodiment of the present invention;

FIG. 8 is a flow chart of a manufacturing process of a half-bridge push-pull z-axis thin film gyroscope according to an embodiment of the present invention;

icon: 1-sensitive layer, 2-cover plate, 3-cover plate groove, 4-heater, 5-heater, 6-thermistor, 7-thermistor, 8-balance resistor, 9-balance resistor, 10-isolation resistor, 11-TaN material resistor block, 12-TaN material resistor block, 13-Si resistor₃N₄A material resistance block and a 14-n type heavily doped GaAs material resistance block.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.

As shown in fig. 1 to 5, the present embodiment provides a half-bridge push-pull z-axis thin film gyroscope, which comprises a sensitive layer 1 and a cover plate 2, wherein,

the upper surface of the sensitive layer 1 is provided with a pair of heaters, a pair of thermistors, a pair of balance resistors and an isolation resistor;

defining the placing direction of the upper surface isolation resistor 10 as a Y direction, the direction vertical to the placing direction as an X direction, and the height direction of the sensitive layer 1 as a Z direction; the arrangement directions of the heater and the thermistor are parallel to the Y direction and are used for detecting the angular speed of the Z axis;

a thermistor 6 and a thermistor 7 for detecting the angular velocity of the Z axis, a balance resistor 8 and a balance resistor 9 are arranged on two sides of the upper surface X direction of the sensitive layer, a heater 4 and a heater 5 are arranged on two sides of the upper surface Y direction of the sensitive layer, and the heater 4 and the heater 5 are parallel to the thermistor 6 and the thermistor 7;

the electrifying mode of the thermistor is constant current;

and a cover plate groove 3 is etched on the cover plate 2 and is hermetically connected with the upper surface of the sensitive layer 1.

In this embodiment, as a further technical solution, each pair of the heaters is driven by two square wave signals with the same frequency, the phase difference is 90 degrees, and the pulse duty ratio is 50%. The heater is alternately electrified to generate Joule heat, and releases heat to the surrounding gas to carry out heat diffusion and form heat flow. The square wave signals applied to the heaters heat alternately, thus forming a push-pull type heat flow between each pair of heaters. The push-pull type heat flow has the advantages of large flow rate, stable airflow state, high gyro sensitivity and good stability. The square wave signal drives the heater to work and is divided into two stages, in the first stage, the heater 4 is electrified for heating, the heater 5 is not electrified, and hot air flow in the direction orthogonal to the heater 4 is generated. In the second stage, the heater 5 is energized to heat, the heater 4 is not energized, and hot air flow in the direction orthogonal to the heater 5 and opposite to the first stage is generated. The continuous operation of the heaters in both stages will constitute a push-pull type of hot gas flow. Two

thermistors

6 and 7 with the same resistance value and two balance resistors 8 and 9 with the same resistance value form a half-equal-arm Wheatstone bridge, the

thermistors

6 and 7 are used as working bridge arms to participate in the deflection of sensitive airflow, and the balance resistors 8 and 9 do not participate in the deflection of the sensitive airflow, so that a half-bridge push-pull flow z-axis film gyroscope is formed. The resistance values of the balance resistors 8 and 9 are 100 times of the resistance values of the

thermistors

6 and 7, so that the sensitivity of the unbalanced voltage of the bridge and the impedance matching when the voltage signal is further amplified are improved, and the interference is prevented. The working principle of the Z-axis heat flow gyroscope is explained by taking the first stage as an example. If the angular velocity Ω Z is input in the Z-axis direction, the heat flow generated by the heater 4 and the heat flow generated by the heater 5 reach the two relatively

parallel thermistors

6 and 7 in opposite directions in the XOY plane due to Coriolis force (Coriolis force) principle, and opposite heating effects are generated in the plane formed by the thermistors, and a temperature difference proportional to the input angular velocity Ω Z is generated in the two relatively

parallel thermistors

6 and 7. The temperature difference generated by the input angular velocity is converted into a voltage unbalance voltage delta Vout which is in direct proportion to the angular velocity omega Z through the change of the resistance value of the bridge arm of the Wheatstone bridge and is output, so that the angular velocity in the Z-axis direction is sensed. The two bridge arms as working arms participate in the deflection of the sensitive hot air flow, the sensitivity is twice of that of a single working arm, and the sensitivity of the gyroscope is greatly improved.

In this embodiment, as a further technical solution, the distance from the upper surface of the sensitive layer 1 to the top of the groove on the cover plate 2 is the height of the gas medium working cavity, and the height is 200 μm to 1000 μm.

In this embodiment, as a further technical solution, the height of the heater and the thermistor on the upper surface of the sensitive layer 1 is 15 μm to 20 μm.

In this embodiment, as a further technical solution, the lengths of the heater and the thermistor are the same, and are 1/6 to 1/5 of the width of the whole sensitive layer.

In this embodiment, as a further technical solution, the distance between the heater and the thermistor for detecting the angular velocity in the Z-axis direction is 1/4 to 1/3 of the length of the heater.

In this embodiment, as a further technical solution, the heaters are made of resistive wires of TaN material with high temperature coefficient, as shown in fig. 6-7. The thermistors are all made of n-type heavily-doped GaAs material resistorsA wire. Wherein, the heater comprises 2 symmetrical TaN material resistance blocks 11, 12 and 1 Si₃N₄A resistive mass of material 13. The TaN material resistance block 11 is composed of 4 series-connected resistors, and each resistor is specifically realized in the form of 3 parallel TaN material resistance lines with high temperature coefficients. By designing the TaN material resistance wire in this way, the heater can generate more heat, thereby being beneficial to improving the sensitivity of gyro detection. The thermistor is a resistor block 14 of n-type heavily doped GaAs material. Wherein the n-type heavily doped GaAs material resistive block 14 is formed by 5 n-type heavily doped GaAs material resistive lines connected in series. By designing the GaAs material resistance wire in such a way, the thermistor can obtain larger voltage signal output, thereby being beneficial to improving the sensitivity of gyro detection.

As shown in fig. 8, the half-bridge push-pull z-axis thin film gyroscope of the present invention can be prepared by using GaAs-MMIC technology, and the specific process flow is as follows:

step (a): preparation of doping Density of 10 on GaAs wafer¹⁸cm^-3N of (A) to (B)⁺And etching the GaAs epitaxial layer to form the upper surface thermistor and the balance resistor.

Step (b): a sputtered TaN (tantalum nitride) layer acts as the top surface heater.

Step (c): sputtering Ti/Au/Ti respectively to form

Thick pads and sensitive resistance lines.

Step (d): deposited by chemical vapor deposition (PECVD)

Thick Si₃N₄And preparing the isolation resistor.

A step (e): and the upper cover plate is bonded with the sensitive layer through a bonding process, so that the working environment of the gas medium is sealed.

Step (f): and packaging the processed structure to form the half-bridge push-pull flow z-axis film gyroscope.

To sum up, the utility model discloses it does not have solid proof mass piece to have inherited miniature heat flow top, advantages such as anti-vibration and impact, does not have the cantilever beam structure among this kind of half bridge type push-pull flow z axle film top sensing element, simple process, the sensing element yield is high, actual with low costs. Four-arm electric bridges in an extraction circuit in a sensitive element in the film type micro-mechanical heat flow gyroscope are all realized on one chip, and the temperature drift caused by different temperature coefficients and temperature gradients can not be caused by the same structure and the same process manufacturing. Meanwhile, due to the adoption of the push-pull heat flow, the heat flow state is changed quickly, the heat flow velocity is large, the air flow state is stable, the corresponding speed is high, the sensitivity of the gyroscope is high, the gyroscope is twice that of a single working arm, and the stability is good. The resistance value of the balance resistor is hundreds times of that of the thermistor, which is beneficial to impedance matching when the voltage signal is further amplified and prevents interference. The utility model discloses a technology and integrated circuit technology compatibility have the potentiality of high integration level. Because the sensitive mass of the sensor does not contain a solid mass block, compared with micro inertial sensors with other working principles, the sensor has the advantages of large impact resistance, simple structure, extremely low cost and high reliability.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A half-bridge push-pull flow z-axis film gyroscope is characterized by comprising a sensitive layer and a cover plate, wherein,

2. The half-bridge push-pull z-axis membrane gyroscope of claim 1, wherein each pair of heaters is driven by two square wave signals of the same frequency, with a phase difference of 90 degrees and a pulse duty cycle of 50%.

3. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein the distance from the upper surface of the sensitive layer to the top of the groove on the cover plate is the height of the gas medium working cavity, and the height is 200 μm to 1000 μm 1.

4. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein the heater and thermistor height on the upper surface of the sensing layer is 15 μm to 20 μm.

5. The half-bridge push-pull z-axis membrane gyroscope of claim 1, wherein the heater and the thermistor have the same length, and are 1/6-1/5 of the width of the whole sensing layer.

6. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein each heater comprises 4 series-connected "resistive blocks" each consisting of 3 parallel resistive lines of TaN material with high temperature coefficient.

7. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein the thermistors are each formed by 5 n-type heavily doped GaAs material resistor lines connected in series.

8. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein the balancing resistor does not participate in the deflection of the sensitive airflow and has a resistance value 100 times that of the thermistor.

9. The half-bridge push-pull z-axis thin film gyroscope of claim 1, wherein the isolation resistors do not participate in the deflection of the sense airflow and are formed from 1 piece of Si₃N₄A resistive line of material.