CN214620465U

CN214620465U - Silicon wafer drying device and silicon wafer drying box

Info

Publication number: CN214620465U
Application number: CN202120680385.6U
Authority: CN
Inventors: 胡建平; 吴光; 纪兴兴; 王红磊
Original assignee: Zing Semiconductor Corp
Current assignee: Zing Semiconductor Corp
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2021-11-05
Anticipated expiration: 2031-04-02

Abstract

The utility model provides a silicon wafer drying device and a silicon wafer drying box, wherein the silicon wafer drying device comprises a base, a clamping jaw platform, a clamping jaw and an air blowing pipeline, and the clamping jaw platform and the air blowing pipeline are both arranged on the base; the clamping jaw table can be close to and far away from the blowing pipeline; the clamping jaw is used for clamping a silicon wafer and is detachably arranged on the clamping jaw table; the air blowing pipeline is used for being connected with an air source so as to blow air to the silicon wafer. The silicon wafer drying box comprises the silicon wafer drying device. The utility model provides a silicon chip drying device convenient operation can realize that the silicon chip is automatic weathers the function, has splendid effect of weathering, is blowing dry in-process silicon chip and is firmly pressed from both sides tightly, can not take place to rock, has avoided the silicon chip to cause the damage risk of breaking even. The utility model provides a silicon chip drying cabinet weathers the silicon chip through in the confined space, but the water vapor centralized processing of production in the box, non-staining operation environment.

Description

Silicon wafer drying device and silicon wafer drying box

Technical Field

The utility model relates to a semiconductor equipment technical field especially relates to a silicon chip drying device and silicon chip drying cabinet.

Background

At present, in the production process, after double-sided polishing of silicon wafers is completed through a polishing process, the silicon wafers are placed into a water box, and based on process control, the silicon wafers are extracted according to batches to be subjected to a blow-drying process so as to blow the surfaces of the silicon wafers dry, and then flatness detection is performed. In the prior art, when a silicon wafer is dried, a polished single silicon wafer is taken out of a water box and placed into a special blowing and measuring box, water drops on the surface of the silicon wafer are dried by using an air gun, and finally the dried silicon wafer is placed into a measuring box and is put into measuring equipment for detection. And after the detection is finished, the silicon wafer needs to be placed back into the water box again.

However, when an operator uses the air gun to blow the silicon wafer, the air gun needs to be moved continuously to change the air blowing direction, the operation difficulty is high, and the silicon wafer is shaken in the box, so that the silicon wafer is easy to damage and even break; meanwhile, the drying effect of the silicon wafer is uncontrollable, and the measurement result is easily interfered; in the process of drying and detecting the silicon wafer, the silicon wafer needs to be transferred for many times, and the mode of manually taking the silicon wafer is transferred, so that uncontrollable pollution is easily caused. In addition, when the silicon wafer is dried by the air gun, water on the surface of the silicon wafer and compressed air sprayed by the air gun form water vapor, so that the clean environment of a dust-free room is polluted.

Therefore, it is necessary to provide a silicon wafer drying apparatus which is easy to operate and has a good drying effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip drying device to solve the silicon chip that exists among the prior art and weather the method and be difficult to guarantee the effect of weathering of silicon chip, disturb the result of measurationing easily, and the operation degree of difficulty is big, and the silicon chip takes place to rock easily and causes the damage to break even and the surrounding environment receives one or more in the pollution scheduling problem easily.

In order to solve the technical problem, the utility model provides a silicon wafer drying device, which comprises a base, a clamping jaw table, a clamping jaw and an air blowing pipeline, wherein the clamping jaw table and the air blowing pipeline are both arranged on the base;

the clamping jaw table can be close to and far away from the blowing pipeline;

the clamping jaw is used for clamping a silicon wafer and is detachably arranged on the clamping jaw table;

the air blowing pipeline is used for being connected with an air source so as to blow air to the silicon wafer.

Optionally, a plurality of air outlets facing the clamping jaw table are arranged on the air blowing pipeline.

Optionally, the clamping jaw platform is connected with the base in a sliding manner, and a sliding rail matched with the clamping jaw platform is arranged on the base.

Optionally, the silicon wafer drying device further comprises a driving member fixed on the base, and the driving member is used for driving the clamping jaw table to approach and depart from the air blowing pipeline.

Optionally, the clamping jaw includes a supporting portion and a clamping portion connected to each other, and an accommodating space for storing the silicon wafer is formed between the supporting portion and the clamping portion.

Optionally, the clamping portion comprises a first clamping portion and at least two second clamping portions, and the first clamping portion can approach and be far away from the second clamping portions.

Optionally, the first clamping portion is connected to the supporting portion through an elastic member.

Optionally, a fastener is arranged at one end, close to the first clamping portion, of the supporting portion, a first fixing plate is arranged on the clamping jaw table and corresponds to the first clamping portion, and a notch matched with the fastener is formed in the first fixing plate.

Optionally, the clamping jaw table is further provided with a second fixing plate which is in one-to-one correspondence with the second clamping portion, and the second fixing plate is used for abutting against the second clamping portion.

The utility model also provides a silicon chip drying cabinet, including box and as above arbitrary silicon chip drying device, silicon chip drying device is located inside the box, just the base is located on the inner wall of box.

Compared with the prior art, the utility model provides a silicon chip drying device and silicon chip drying cabinet have following advantage:

(1) the utility model provides a silicon wafer drying device, which comprises a base, a clamping jaw platform, a clamping jaw and an air blowing pipeline, wherein the clamping jaw platform and the air blowing pipeline are both arranged on the base; the clamping jaw table can be close to and far away from the blowing pipeline; the clamping jaw is used for clamping a silicon wafer and is detachably arranged on the clamping jaw table; the air blowing pipeline is connected with an air source to blow air to the silicon wafer, so that the clamping jaw detachably mounted on the clamping jaw table can be detached to clamp the silicon wafer from the water box, and direct contact between the silicon wafer and an operator is reduced; the clamping jaw table bears the clamping jaws which clamp the silicon wafer and can be close to and far away from the air blowing pipeline, and the silicon wafer continuously passes through the air blowing pipeline connected with the air source in the reciprocating movement process of the clamping jaw table close to and far away from the air blowing pipeline, so that the aim of drying the silicon wafer is fulfilled; after the silicon wafer is dried, the clamping jaw clamping the silicon wafer is detached, and then the silicon wafer is moved into a measuring box through the clamping jaw to prepare for testing. It can be seen that, the utility model provides a silicon chip drying device convenient operation not only can realize that the silicon chip is automatic weathers the function, and has splendid weather effect, can also make the silicon chip quilt weathering the in-process the clamping jaw is firm to press from both sides tightly to can steadily along with the motion of clamping jaw platform can not take place to rock, has avoided the risk of silicon chip damage. Furthermore, adopt the utility model provides an in the overall process that silicon chip drying device implemented the silicon chip and weathers technology, can also avoid silicon chip and operating personnel's direct contact to reduce the hand and get the pollution risk of contact silicon chip.

(2) Because the air blowing pipeline is provided with a plurality of air outlet holes which are arranged towards the clamping jaw table, air flow provided by the air source is discharged from the air outlet holes through the air blowing pipeline, and the silicon wafer which passes through the air blowing pipeline in a reciprocating mode can be effectively dried.

(3) Because silicon chip drying device is still including being fixed in driving piece on the base, the driving piece is used for the drive the clamping jaw platform is close to and keeps away from the air blowing pipeline, from this under the effect of driving piece, the silicon chip of clamping jaw centre gripping can be along with the reciprocating process of clamping jaw platform the air blowing pipeline realizes the automation of silicon chip and weathers the process.

(4) Because the clamping jaw platform with base sliding connection, be equipped with on the base with clamping jaw platform matched with slide rail, from this, through the slide rail can effectively reduce relative frictional force between the clamping jaw platform makes only through one the drive just can be realized to the driving piece the clamping jaw platform does not need powerful the driving piece, has both saved the device cost, has reduced the energy consumption again.

(5) Because the clamping jaw includes supporting part and clamping part that link to each other, the supporting part with form an accommodation space that is used for depositing the silicon chip between the clamping part, from this, through the clamping part can effectively press from both sides tightly and be located the silicon chip in the accommodation space makes the silicon chip can be weathered along with the motion of clamping jaw platform steadily, and can not take place to rock, has avoided the silicon chip to cause the risk of damage or even rupture. Because the clamping part comprises a first clamping part and at least two second clamping parts, the first clamping part can be close to and far away from the second clamping parts, so that the range of the accommodating space is changed to adapt to the size of the silicon wafer through the first clamping part being close to and far away from the second clamping parts, and meanwhile, the first clamping part can be movable to be more beneficial to taking and placing the silicon wafer. In addition, because first clamping part through an elastic component with the supporting part links to each other, from this, through the elastic component can effectively guarantee the clamping degree of clamping jaw centre gripping silicon chip, more is favorable to the silicon chip at the in-process steadiness along with the clamping jaw platform weathers.

(6) Because the supporting part is close to the one end of first clamping part is equipped with a fastener, the clamping jaw bench be equipped with the first fixed plate that first clamping part corresponds the setting, be equipped with on the first fixed plate with the notch that the fastener matches, from this, through the notch can be gone into the fastener so that the clamping jaw is fixed in the clamping jaw bench. In addition, the clamping jaw table is further provided with a second fixing plate which is in one-to-one correspondence with the second clamping part, and the second fixing plate is used for being abutted against the second clamping part, so that the clamping jaw can be effectively fixed on the clamping jaw table through the second fixing plate.

(7) Because the utility model provides a silicon chip drying cabinet includes the box and as above silicon chip drying device, silicon chip drying device is located inside the box, just the base is located on the inner wall of box, consequently, the utility model provides a silicon chip drying cabinet not only includes as above all advantages of silicon chip drying device, can also make the process of drying of silicon chip go on in the inside confined space of box, and but the inside steam that produces of box centralized processing does not influence normal clean environment in dustless room. In addition, the box body is provided with a window which is arranged corresponding to the silicon wafer drying device, the upper cover of the window is provided with a door plate which is matched with the window, and the door plate is connected with the box body, so that the clamping jaw which clamps the silicon wafer is convenient to take and place through the window; through the door plate, when the silicon wafer blow-drying process is carried out, water vapor cannot diffuse into the environment of a dust-free room to cause pollution.

Drawings

Fig. 1 is a front view of a silicon wafer drying apparatus according to an embodiment of the present invention;

fig. 2 is a side view of a silicon wafer drying apparatus according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a clamping jaw according to an embodiment of the present invention;

fig. 4 is a schematic front structural view of a silicon wafer drying oven according to an embodiment of the present invention;

fig. 5 is a schematic side view of a silicon wafer drying oven according to an embodiment of the present invention.

Wherein the reference numbers are as follows:

200-base, 210-clamping jaw table, 211-first fixing plate, 212-second fixing plate, 213-support foot, 214-slide block, 220-blowing pipeline, 220 a-first blowing pipeline, 220 b-second blowing pipeline, 221-air outlet hole, 222-first control switch, 223-third fixing plate, 230-clamping jaw, 231-clamping part, 231 a-first clamping part, 231 b-second clamping part, 232-supporting part, 233-elastic part, 234-fastening part, 240-driving part, 241-partition plate, 242-second control switch, 250-slide rail, 251-first limiting part, 252-second limiting part, 300-box body, 310-door plate, 320-water outlet hole, 330-support, 340-baffle, 400-silicon chip.

Detailed Description

In order to make the objects, advantages and features of the present invention clearer, the silicon wafer drying apparatus provided by the present invention will be described in further detail with reference to fig. 1 to 5. It should be noted that the drawings are simplified and have non-precise ratios, and are only used for convenience and clarity to assist in describing the embodiments of the present invention, and are not used for limiting the implementation of the present invention, so that the present invention has no technical essential significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed by the present invention can cover without affecting the function and the achievable purpose of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.

The utility model discloses a core thought lies in providing a silicon chip drying device and silicon chip drying cabinet to realize that the silicon chip weathers the function automatically, guaranteeing that the silicon chip has under the condition of splendid weather effect, reducing the operation degree of difficulty that weathers the process, not only can make the silicon chip can not take place to rock weathering the in-process, thereby avoid the silicon chip to cause the risk of damage or even rupture, can also reduce the silicon chip and weather the influence of process to the clean environment of dust free chamber.

To achieve the above idea, the present invention provides a silicon wafer drying device, please refer to fig. 1 and fig. 2, wherein fig. 1 schematically shows a front view of the silicon wafer drying device provided by the present invention; fig. 2 schematically shows a side view of the silicon wafer drying apparatus provided by the present invention. As shown in fig. 1 and 2, the silicon wafer drying apparatus includes a base 200, a chuck table 210, a chuck 230, and an air blowing pipeline 220, wherein the chuck table 210 and the air blowing pipeline 220 are both disposed on the base 200; the gripper station 210 is capable of moving closer to and further away from the blow line 220; the clamping jaw 230 is used for clamping a silicon wafer 400, and the clamping jaw 230 is detachably arranged on the clamping jaw table 210; the gas blowing line 220 is used for connecting with a gas source to blow the silicon wafer 400. Therefore, the clamping jaw 230 detachably mounted on the clamping jaw table 210 can be detached to clamp the silicon wafer 400 from the water box, so that direct contact between the silicon wafer 400 and an operator is reduced; the clamping jaw table 210 bears the clamping jaw 230 which clamps the silicon wafer 400 and can be close to and far away from the air blowing pipeline 220, and in the reciprocating movement process that the clamping jaw table 210 is close to and far away from the air blowing pipeline 220, the silicon wafer 400 continuously passes through the air blowing pipeline 220 connected with the air source, so that the aim of drying the silicon wafer 400 is fulfilled; after the wafer 400 is blow-dried, the wafer 400 is ready for testing by removing the chuck 230 holding the wafer 400 and then moving the wafer 400 into a measuring box via the chuck 230. It can be seen that the utility model provides a silicon chip drying device convenient operation not only can realize the automatic function of weathering of silicon chip 400, and has splendid weather effect, can also make silicon chip 400 quilt at the in-process that weathers the clamping jaw 230 is firm pressed from both sides tightly to can steadily along with clamping jaw platform 210 moves, can not take place to rock, has avoided the risk of silicon chip 400 damage. Furthermore, adopt the utility model provides an in-process that silicon chip drying device implemented silicon chip 400 and weathers technology can also avoid silicon chip 400 and operating personnel's direct contact to reduce the hand and get the pollution risk of contact silicon chip 400.

Preferably, the silicon wafer drying apparatus further comprises a driving member 240 fixed to the base 200, wherein the driving member 240 is used for driving the chuck table 210 to move toward and away from the blowing pipeline 220. Therefore, under the action of the driving member 240, the silicon wafer 400 clamped by the clamping jaws 230 can pass through the air blowing pipeline 220 along with the reciprocating of the clamping jaw table 210, and the automatic drying process of the silicon wafer 400 is realized.

Specifically, the air supply is the nitrogen gas source, just the air supply links to each other with first control switch 222, driving piece 240 links to each other with second control switch 242, driving piece 240 is a cylinder, the cylinder is fixed in through a baffle 241 on the base 200, just the cylinder is close to the one end of clamping jaw platform 210 is fixed in on the baffle 241, be equipped with one in the cylinder and pass the baffle 241 with the piston that clamping jaw platform 210 links to each other, thereby under the effect of piston, clamping jaw platform 210 can be close to and keep away from blow gas pipeline 220. In the process of performing the drying process of the silicon wafer 400, the first control switch 222 is first opened to enable the gas source to provide nitrogen gas flow for the blowing pipeline 220, and then the second control switch 242 is opened to enable the air cylinder to drive the clamping jaw table 210 to be close to and far away from the blowing pipeline 220. The power source of the cylinder is preferably compressed gas; the first control switch 222 and the second control switch 242 are preferably knob switches.

Preferably, the clamping jaw table 210 is connected with the base 200 in a sliding manner, and a sliding rail 250 matched with the clamping jaw table 210 is arranged on the base 200. Therefore, the relative friction between the clamping jaw platforms 210 can be effectively reduced through the sliding rail 250, so that the clamping jaw platforms 210 can be driven only through one driving part, such as an air cylinder, the driving part 240 with strong power is not needed, the device cost is saved, and the energy consumption is reduced.

Specifically, the clamping jaw stage 210 includes at least one sliding block 214, and is fixed on the sliding rail 250 through the at least one sliding block 214, and the sliding block 214 is detachably connected to the sliding rail 250. Furthermore, the number of the slide rails 250 is two, four support legs 213 are disposed on the clamping jaw table 210, each support leg 213 is connected to the slide rail 250 through one of the slide blocks 214, and the position of the blowing pipe 220 is located at one end of the slide rail 250 away from the driving member 240.

Preferably, the base 200 is further provided with a first limiting member 251 and a second limiting member 252, the first limiting member 251 and the second limiting member 252 are respectively located at two ends of the slide rail 250, wherein the first limiting member 251 is located at one end of the slide rail 250 close to the blowing pipeline 220. And when the utility model provides a silicon chip drying device includes driving piece 240, and regard the cylinder as driving piece 240, second locating part 252 is located slide rail 250 is close to the one end of cylinder, second locating part 252 with baffle 241 is connected, makes the piston pass the second locating part 252 in order to link to each other with clamping jaw platform 210 when passing baffle 241.

The clamping jaw 230 provided by the present invention is described in detail below with reference to fig. 1 to 3, wherein fig. 3 schematically shows a schematic structural view of the clamping jaw 230 provided by the present invention:

as shown in fig. 1 to 3, the clamping jaw 230 includes a supporting portion 232 and a clamping portion 231 connected to each other, and an accommodating space for storing the silicon wafer 400 is formed between the supporting portion 232 and the clamping portion 231. Therefore, the silicon wafer 400 in the accommodating space can be effectively clamped by the clamping part 231, so that the silicon wafer 400 can be stably dried along with the movement of the clamping jaw table 210 without shaking, and the risk that the silicon wafer 400 is damaged or even broken is avoided.

Preferably, the clamping part 231 includes a first clamping part 231a and at least two second clamping parts 231b, and the first clamping part 231a can approach and separate from the second clamping part 231 b. Therefore, the range of the accommodating space is changed to adapt to the size of the silicon wafer 400 by the first clamping part 231a approaching to and departing from the second clamping part 231b, and meanwhile, the movable first clamping part 231a can be more beneficial to taking and placing the silicon wafer 400. It should be noted that the size of the accommodating space is preferably capable of accommodating 300mm silicon wafers 400, and in some other embodiments, the size of the accommodating space may be changed, so that the accommodating space can accommodate silicon wafers 400 with different sizes.

Preferably, the first clamping portion 231a is connected to the supporting portion 232 through an elastic member 233. Therefore, the clamping degree of the clamping jaw 230 for clamping the silicon wafer 400 can be effectively ensured through the elastic piece 233, and the stability of the silicon wafer 400 in the drying process along with the clamping jaw table 210 is further facilitated.

Preferably, a fastening member 234 is disposed at one end of the supporting portion 232 close to the first clamping portion 231a, a first fixing plate 211 corresponding to the first clamping portion 231a is disposed on the clamping jaw table 210, and a notch matching with the fastening member 234 is disposed on the first fixing plate 211. The fastener 234 can thus be snapped into the recess in order to fix the clamping jaw 230 on the clamping jaw table 210. Furthermore, the recess is provided with a detachable baffle 340, after the fastening member 234 is snapped into the recess, the recess can be closed by the baffle 340, so that the clamping jaw 230 is stably mounted on the clamping jaw table 210, and the baffle 340 and the first fixing plate 211 can be connected by screwing, special bonding or welding.

Preferably, the clamping jaw table 210 is further provided with a second fixing plate 212 corresponding to the second clamping portion 231b, and the second fixing plate 212 is used for abutting against the second clamping portion 231 b. Accordingly, the second fixing plate 212 can more effectively fix the chuck jaws 230 to the chuck jaw stage 210.

It should be noted that, the first fixing plate 211 and the second fixing plate 212 are both fixed on the jaw stage 210 by screws, and in some other embodiments, the connection manner between the first fixing plate 211 and the jaw stage 210 and the connection manner between the second fixing plate 212 and the jaw stage 210 may also be welding, special adhesion, integral molding, or the like.

In particular, the fastening member 234 is an adjustment knob, which includes a knob and a rotating rod connected together, the diameter of the knob is larger than the diameter of the rotating rod, a gap is formed between the knob and the supporting portion 232, the rotating rod is connected to the supporting portion 232 and is used for being clamped into the notch, and in some other embodiments, the gap can be narrowed by rotating the adjustment knob, so that the clamping between the clamping jaws 230 and the clamping jaw table 210 is tighter.

Preferably, the number of the second clamping portions 231b is two, and in this case, the supporting portion 232 has a "Y" shape, that is, the clamping jaw 230 has a two-jaw shape. This arrangement thus provides both an effective saving of material and a secure reliability of the clamping jaw 230.

Preferably, as shown in fig. 1 and 2, the blowing pipe 220 is provided with a plurality of air outlet holes 221 disposed toward the jaw stage 210. Therefore, the air flow provided by the air source is exhausted along the air outlet hole 221 through the air blowing pipeline 220, and the silicon wafer 400 which passes through in a reciprocating mode can be effectively dried.

Specifically, the blowing pipe 220 includes a first blowing pipe 220a and a second blowing pipe 220b, the first blowing pipe 220a and the second blowing pipe 220b are connected to the air source, the first blowing pipe 220a and the second blowing pipe 220b are respectively located on two sides of the plane where the clamping jaws 230 are located and mounted on the clamping jaw table 210, the first blowing pipe 220a and the second blowing pipe 220b are respectively provided with the air blowing holes, and further, the air outlet hole 221 faces the plane where the clamping jaws 230 are located. It should be noted that, in some other embodiments, the first purge line 220a and the second purge line 220b may be respectively connected to a gas source; the first and

second blowing pipes

220a and 220b may be connected to a source of air, and in this case, the first and

second blowing pipes

220a and 220b are preferably connected in a bent manner, so that the first and

second blowing pipes

220a and 220b are located on two sides of the plane of the clamping jaw 230.

Preferably, as shown in fig. 1 and 2, the base 200 further includes a third fixing plate 223 disposed on the base 200, and the first and

second blowing pipes

220a and 220b pass through the third fixing plate 223 to be fixed on the third fixing plate 223, at this time, a certain gap is left between the first blowing pipe 220a and the second blowing pipe 220b, and the gap is greater than the thickness of the clamping jaw 230.

In order to realize the above idea, the present invention further provides a silicon wafer drying box, please refer to fig. 4 and 5, wherein fig. 4 schematically shows a front structural schematic diagram of the silicon wafer drying box provided by the present invention; fig. 5 schematically shows a schematic side structure diagram of the silicon wafer drying oven provided by the present invention. As shown in fig. 4 and 5, the silicon wafer drying cabinet includes a cabinet 300 and the silicon wafer drying apparatus as described above, the silicon wafer drying apparatus is located inside the cabinet 300, and the susceptor 200 is disposed on the inner wall of the cabinet 300. Because the utility model provides a silicon chip drying cabinet includes box 300 and as above silicon chip drying device, silicon chip drying device is located inside box 300, just base 200 is located on the inner wall of box 300, consequently, the utility model provides a silicon chip drying cabinet not only includes as above all advantages of silicon chip drying device, can also make drying process of silicon chip 400 go on in the inside confined space of box 300, and but the inside steam that produces of box 300 centralized processing does not influence normal clean environment in the dustless room.

The base 200 and the inner wall of the housing 300 are integrally formed, in other words, the base 200 is preferably the inner wall of the housing 300.

Preferably, as shown in fig. 4, the box 300 is provided with a window corresponding to the silicon wafer drying device, and the window is covered with a door plate 310 which is matched with the window, and the door plate 310 is connected with the box 300. Thereby facilitating access through the window to the clamping jaw 230 holding the silicon wafer 400; through the door plate 310, when the silicon wafer 400 is dried, water vapor cannot diffuse into the environment of a clean room to cause pollution. Specifically, the door panel 310 can rotate along an end thereof connected to the box 300, preferably, the door panel 310 is connected to the box 300 through a hinge, and a handle is disposed at an end of the door panel 310 away from the hinge.

Specifically, the partition 241 divides the inner cavity of the box 300 into a first space and a second space, the driving member 240 is located in the first space, the slide rail 250, the clamping jaw 230, the clamping jaw table 210 and the blowing pipeline 220 are all located in the second space, and the window is disposed on a side wall of the box 300 corresponding to the second space.

Preferably, as shown in fig. 4, a drain hole 320 is formed on the base 200 to penetrate through the base 200 and the inner wall of the case 300. Thus, the drainage hole 320 facilitates the outflow of the accumulated water in the case 300.

Preferably, as shown in fig. 4 and 5, a bracket 330 is further provided at an end of the case 300 away from the driving member 240. Therefore, the silicon wafer drying box can be supported by the bracket 330 to be vertically placed, and the occupied space of the silicon wafer drying box when the silicon wafer drying box is idle can be effectively reduced. It should be noted that, when the silicon wafer drying box is used, the silicon wafer drying box is laid flat and the end of the box body 300, on which the window is arranged, faces upward, so that accumulated water in the box body 300 can flow out through the drain hole 320 formed in the base 200.

Preferably, as shown in fig. 4, the first control switch 222 and the second control switch 242 are both disposed outside the box 300.

Preferably, as shown in fig. 5, the box 300 is further provided with an access opening, the access opening is provided with a baffle 340 matched with the access opening, and the baffle 340 is detachably connected with the box 300. Specifically, the baffle 340 can rotate along the end connected with the box 300, preferably, the baffle 340 is connected with the box 300 through a hinge, and a handle is arranged at the end, far away from the hinge, of the baffle 340, so that the box 300 can be conveniently opened for maintenance under the condition that the silicon wafer drying device in the box 300 is damaged through the access hole.

To sum up, compare with prior art, the utility model provides a silicon chip drying device has following advantage:

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The silicon wafer drying device is characterized by comprising a base, a clamping jaw table, a clamping jaw and an air blowing pipeline, wherein the clamping jaw table and the air blowing pipeline are arranged on the base;

the clamping jaw table can be close to and far away from the blowing pipeline;

2. The silicon wafer drying apparatus according to claim 1, wherein a plurality of air outlet holes are provided on the air blowing pipeline so as to face the chuck table.

3. The silicon wafer drying device according to claim 1, wherein the chuck table is slidably connected to the base, and the base is provided with a slide rail engaged with the chuck table.

4. The wafer drying apparatus of claim 1, further comprising a driving member fixed to the base for driving the chuck table toward and away from the blow line.

5. The silicon wafer drying apparatus according to claim 1, wherein the clamping jaw comprises a supporting portion and a clamping portion connected to each other, and an accommodating space for storing the silicon wafer is formed between the supporting portion and the clamping portion.

6. The silicon wafer drying apparatus according to claim 5, wherein the clamping portion comprises a first clamping portion and at least two second clamping portions, the first clamping portion being capable of approaching and distancing from the second clamping portions.

7. The silicon wafer drying apparatus as claimed in claim 6, wherein the first clamping portion is connected to the supporting portion by an elastic member.

8. The silicon wafer drying device according to claim 6, wherein a fastening member is disposed at an end of the supporting portion adjacent to the first clamping portion, a first fixing plate corresponding to the first clamping portion is disposed on the clamping jaw stage, and a notch matched with the fastening member is disposed on the first fixing plate.

9. The silicon wafer drying apparatus according to claim 6, wherein the chuck table is further provided with a second fixing plate disposed in one-to-one correspondence with the second clamping portion, and the second fixing plate is adapted to abut against the second clamping portion.

10. A silicon wafer drying box is characterized by comprising a box body and a silicon wafer drying device according to any one of claims 1 to 9, wherein the silicon wafer drying device is positioned in the box body, and the base is arranged on the inner wall of the box body.