CN214620169U - Cold and hot water supply system for producing silicon wafers - Google Patents
Cold and hot water supply system for producing silicon wafers Download PDFInfo
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- CN214620169U CN214620169U CN202120007130.3U CN202120007130U CN214620169U CN 214620169 U CN214620169 U CN 214620169U CN 202120007130 U CN202120007130 U CN 202120007130U CN 214620169 U CN214620169 U CN 214620169U
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Abstract
A cold and hot water supply system for producing silicon wafers comprises a water supplementing system, a primary refrigeration system, a high-temperature water supply pipeline and a chilled water supply pipeline, wherein the primary refrigeration system comprises a primary condenser, a first electronic expansion valve, a primary evaporator, a first compressor and a first oil-water separator which are sequentially connected; the freezing water return pipe is communicated with the first-stage evaporator, and the water outlet end of the first-stage evaporator is communicated with the silicon wafer cutting system through a freezing water supply pipeline. The utility model discloses utilize the heat heating normal atmospheric temperature circulating water that the condenser emitted for high temperature supplies water, utilizes the evaporimeter to absorb the temperature that the heat process reduced normal atmospheric temperature water, is used for freezing water supply, and water supply system is more energy-conserving, and the water temperature accords with the standard more.
Description
Technical Field
The utility model relates to a water supply system especially relates to a production is cold and hot water supply system for silicon chip.
Background
The water for the silicon wafer cleaning machine and the water for the silicon wafer cutting machine used for producing the silicon wafers are respectively hot water and cold water. The existing hot water for the silicon wafer cleaning machine and the cold water for the silicon wafer cutting machine need to use special heat sources and cold sources, for example, hot water and cold water are respectively provided for cleaning and cutting the silicon wafer through an electric heating system and an electric refrigerating system. The heating system and the refrigerating system both use electric energy as energy sources, and consume electricity bidirectionally, so that the resource consumption is overlarge, and the production cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an overcome prior art drawback, provide a production is cold and hot water supply system for silicon chip, normal atmospheric temperature water utilizes two loop circulation to be connected with cold and hot water recovery unit, and the heat heating normal atmospheric temperature circulating water that the make full use of condenser emitted for high temperature water supply utilizes the evaporimeter to absorb the temperature that the thermal process reduces normal atmospheric temperature water, is used for freezing water supply, and water supply system is more energy-conserving, and the water temperature accords with the standard more.
The utility model provides a technical scheme that its technical problem adopted is:
a cold and hot water supply system for producing silicon wafers comprises a water supplementing system, a primary refrigeration system, a high-temperature water supply pipeline and a chilled water supply pipeline, wherein the primary refrigeration system comprises a primary condenser, a first electronic expansion valve, a primary evaporator, a first compressor and a first oil-water separator which are sequentially connected, a liquid outlet of the first oil-water separator is connected with a refrigeration medium inlet of the primary condenser, the water supplementing system comprises a low-temperature water supplementing pipe and a freezing water return pipe, a water outlet end of the low-temperature water supplementing pipe is arranged in the primary condenser, and a water outlet end of the primary condenser is connected with a silicon wafer cleaning system through the high-temperature water supply pipeline; one end of the freezing water return pipe is connected with municipal water, the other end of the freezing water return pipe is communicated into the primary evaporator, and the water outlet end of the primary evaporator is communicated with the silicon wafer cutting system through the freezing water supply pipeline.
According to the cold and hot water supply system for producing the silicon wafers, the water supply system is additionally provided with the secondary refrigeration system, the secondary refrigeration system comprises the secondary condenser, the second electronic expansion valve, the secondary evaporator, the second compressor and the second oil-water separator which are sequentially connected, the connection relation of all the components in the secondary refrigeration system is the same as that of all the components in the primary refrigeration system, the water outlet of the primary condenser is connected with the water inlet of the secondary condenser through a pipeline, the high-temperature water outlet of the secondary condenser is connected with the silicon wafer cleaning system through the high-temperature water supply pipeline, the water outlet of the primary evaporator is connected with the water inlet of the secondary evaporator through a pipeline, and the low-temperature water outlet of the secondary evaporator is communicated with the silicon wafer cutting system through the chilled water supply pipeline.
Above-mentioned cold and hot water supply system for producing silicon chip, water supply system still includes plate heat exchanger ware and mixed water tank, low temperature moisturizing pipe one end is connected with municipal water, the other end with plate heat exchanger connects, the warp warm water behind the plate heat exchanger heat transfer gets into mixed water tank, mixed water tank delivery port pass through the circulating pump with the one-level condenser intercommunication.
Above-mentioned cold and hot water supply system for production silicon chip, plate heat exchanger is including the one-level plate heat exchanger and the second grade plate heat exchanger that the series connection set up, low temperature moisturizing pipe with the first water inlet of one-level plate heat exchanger is connected, the first delivery port of one-level plate heat exchanger with the first water inlet of second grade plate heat exchanger is connected, the first delivery port of second grade plate heat exchanger with mixed water tank connects.
According to the cold and hot water supply system for producing the silicon wafers, the high-temperature water supply pipeline further comprises a branch which is respectively connected with the second water inlet of the first-stage plate type heat exchanger and the second water inlet of the second-stage plate type heat exchanger, and the second water outlet of the first-stage plate type heat exchanger and the second water outlet of the second-stage plate type heat exchanger are both connected with the mixed water tank.
The utility model has the advantages that: the utility model discloses in the condenser with water charging system's outlet pipe way distribution in refrigerating system, utilize the water in the heat heating pipeline that the refrigerant condensation emits in the condenser, high temperature water after the heat absorption provides silicon chip cleaning system, and freezing return water pipeline distributes in the evaporimeter, the refrigerant evaporates the heat of absorbing freezing return water pipeline normal water in the evaporimeter, the refrigerated water after the cooling provides silicon chip cutting system, entire system circulation function, the normal atmospheric temperature water heating for the city pipe network rises and heat the freezing process and all need not additionally to utilize special electric energy as the energy source, the electric energy has been practiced thrift, and only can accomplish through one set of refrigerating system with the cooling with the water intensification, the energy consumption of production has been reduced. The two-stage condenser and the two-stage evaporator are arranged, so that the temperature of high-temperature water is ensured to be stabilized at 50 ℃, and the temperature of chilled water is stabilized at 10 ℃. Part of high-temperature water in the high-temperature water supply pipeline enters the plate heat exchanger in the water supplementing system again, so that the water supplementing temperature difference is reduced, the working efficiency of the plate heat exchanger is improved, and energy is saved.
Drawings
The present invention will be further explained with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of the structure of the water supply system of the present invention.
In the figure: 1. a water replenishing system; 1-1, a low-temperature water replenishing pipe; 1-2, freezing a water return pipe; 1-3, plate heat exchanger; 1-31, a primary plate heat exchanger; 1-32, a second-level plate heat exchanger; 1-4, a mixed water tank; 2. a primary refrigeration system; 2-1, a first-stage condenser; 2-2, a first electronic expansion valve; 2-3, a first-stage evaporator; 2-4, a first compressor; 2-5, a first oil-water separator; 3. a high-temperature water supply pipeline; 4. a chilled water supply line; 5. A silicon wafer cleaning system; 6. a silicon wafer cutting system; 7. a secondary refrigeration system; 7-1, a secondary condenser; 7-2, a second electronic expansion valve; 7-3, a secondary evaporator; 7-4, a second compressor; 7-5, a second oil-water separator; 8. and a circulating pump.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1, the utility model relates to a cold and hot water supply system for producing silicon wafers, the water supply system includes water charging system 1, one-level refrigerating system 2, second-level refrigerating system 7, high temperature water supply pipeline 3 and chilled water supply pipeline 4, the one-level refrigerating system 2 includes one-level condenser 2-1, first electronic expansion valve 2-2, one-level evaporator 2-3, first compressor 2-4 and first oil-water separator 2-5 that connect gradually, the liquid outlet of the first oil-water separator 2-5 is connected with the refrigerant inlet of the one-level condenser 2-1, refrigerant circulates in the one-level refrigerating system 2, refrigerant is compressed into high temperature and high pressure gas by the first compressor, enters the one-level condenser after being separated by the first oil-water separator 2-5 to discharge heat condensation, the condensed medium-temperature high-pressure liquid is throttled by a first electronic expansion valve to become low-temperature low-pressure liquid, the low-temperature low-pressure liquid enters a first-stage evaporator, the low-temperature low-pressure liquid is evaporated into low-temperature low-pressure steam after heat absorption, the low-temperature low-pressure steam enters a first compressor again and flows circularly, and the working medium flowing change process in a second-stage refrigerating system 7 is the same as that in a first-stage refrigerating system; the water supplementing system 1 comprises a low-temperature water supplementing pipe 1-1, a freezing water return pipe 1-2 plate type heat exchanger 1-3 and a mixed water tank 1-4, one end of the low-temperature water supplementing pipe 1-1 is connected with municipal water, the other end of the low-temperature water supplementing pipe is connected with the plate type heat exchanger 1-3, warm water subjected to heat exchange by the plate type heat exchanger 1-3 enters the mixed water tank 1-4, a water outlet of the mixed water tank 1-4 is communicated with the primary condenser 2-1 through a circulating pump 8, a water outlet end of a pipeline of the low-temperature water supplementing pipe 1-1 is arranged in the primary condenser 2-1, the secondary refrigerating system 7 comprises a secondary condenser 7-1, a second electronic expansion valve 7-2, a secondary evaporator 7-3, a second compressor 7-4 and a second oil-water separator 7-5 which are sequentially connected, the connection relation of all parts in the secondary refrigeration system 7 is the same as that of all parts in the primary refrigeration system 2, the water outlet of the primary condenser 2-1 is connected with the water inlet of the secondary condenser 7-1 through a pipeline, the high-temperature water outlet of the secondary condenser 7-1 is connected with the silicon wafer cleaning system 5 through the high-temperature water supply pipeline 3, and low-temperature water in the pipeline absorbs heat emitted by the primary condenser and the secondary condenser to heat up and supply water for the silicon wafer cleaning system; one end of the freezing water return pipe 1-2 is connected with municipal water, the other end of the freezing water return pipe is communicated into the primary evaporator 2-3, a water outlet of the primary evaporator 2-3 is connected with a water inlet of the secondary evaporator 7-3 through a pipeline, a low-temperature water outlet of the secondary evaporator 7-3 is communicated with the silicon wafer cutting system 6 through the freezing water supply pipeline 4, water in the freezing water return pipe is cooled by absorbing heat of the primary evaporator and the secondary evaporator, and the cooled freezing water is supplied to the silicon wafer cutting system.
The plate heat exchanger 1-3 comprises a primary plate heat exchanger 1-31 and a secondary plate heat exchanger 1-32 which are connected in series, the low-temperature water replenishing pipe 1-1 is connected with a first water inlet of the primary plate heat exchanger 1-31, a first water outlet of the primary plate heat exchanger 1-31 is connected with a first water inlet of the secondary plate heat exchanger 1-32, and a first water outlet of the secondary plate heat exchanger 1-32 is connected with the mixed water tank 1-4.
The high-temperature water supply pipeline 3 further comprises a branch which is respectively connected with the second water inlets of the first-stage plate heat exchangers 1-31 and the second water inlets of the second-stage plate heat exchangers 1-32, and the second water outlets of the first-stage plate heat exchangers 1-31 and the second water outlets of the second-stage plate heat exchangers 1-32 are respectively connected with the mixed water tank 1-4.
The working process is as follows: the low-temperature water used for the urban pipe network respectively comprises a low-temperature water supplementing pipe 1-1 and a freezing water return pipe 1-2, the low-temperature water enters a water supply system, the low-temperature water in the low-temperature water supplementing pipe sequentially enters a mixed water tank after passing through a first-stage plate heat exchanger and a second-stage plate heat exchanger for heat exchange, the low-temperature water sequentially enters a first-stage condenser and a second-stage condenser through a circulating pump, the high-temperature water supply pipeline 3 supplies the high-temperature water after absorbing heat and heating to a silicon wafer cleaning system 5, and the freezing water return in the freezing water supply pipeline is supplied to a silicon wafer cutting system after sequentially passing through a first-stage evaporator and a second-stage evaporator for heat absorption and cooling.
Claims (5)
1. The utility model provides a production is cold hot water supply system for silicon chip which characterized in that: the water supply system comprises a water supplementing system (1), a primary refrigeration system (2), a high-temperature water supply pipeline (3) and a chilled water supply pipeline (4), wherein the primary refrigeration system (2) comprises a primary condenser (2-1), a first electronic expansion valve (2-2), a primary evaporator (2-3), a first compressor (2-4) and a first oil-water separator (2-5) which are sequentially connected, a liquid outlet of the first oil-water separator (2-5) is connected with a refrigeration medium inlet of the primary condenser (2-1), the water supplementing system (1) comprises a low-temperature water supplementing pipe (1-1) and a freezing water return pipe (1-2), a water outlet end of the low-temperature water supplementing pipe (1-1) is arranged in the primary condenser (2-1), and a water outlet end of the primary condenser (2-1) passes through the high-temperature water supply pipeline (3) and a silicon wafer supply pipeline (4) The cleaning system (5) is connected; one end of the freezing water return pipe (1-2) is connected with municipal water, the other end of the freezing water return pipe is communicated into the primary evaporator (2-3), and the water outlet end of the primary evaporator (2-3) is communicated with the silicon wafer cutting system (6) through the freezing water supply pipeline (4).
2. The system of claim 1, wherein: the water supply system is additionally provided with a secondary refrigeration system (7), the secondary refrigeration system (7) comprises a secondary condenser (7-1), a second electronic expansion valve (7-2), a secondary evaporator (7-3), a second compressor (7-4) and a second oil-water separator (7-5) which are sequentially connected, the connection relation of all the components in the secondary refrigeration system (7) is the same as that of all the components in the primary refrigeration system (2), the water outlet of the primary condenser (2-1) is connected with the water inlet of the secondary condenser (7-1) through a pipeline, the high-temperature water outlet of the secondary condenser (7-1) is connected with the silicon wafer cleaning system (5) through the high-temperature water supply pipeline (3), the water outlet of the primary evaporator (2-3) is connected with the water inlet of the secondary evaporator (7-3) through a pipeline, and a low-temperature water outlet of the secondary evaporator (7-3) is communicated with the silicon wafer cutting system (6) through the chilled water supply pipeline (4).
3. The system of claim 2, wherein: the water supplementing system (1) further comprises a plate type heat exchanger (1-3) and a mixed water tank (1-4), one end of the low-temperature water supplementing pipe (1-1) is connected with municipal water, the other end of the low-temperature water supplementing pipe is connected with the plate type heat exchanger (1-3), warm water after heat exchange of the plate type heat exchanger (1-3) enters the mixed water tank (1-4), and a water outlet of the mixed water tank (1-4) is communicated with the primary condenser (2-1) through a circulating pump (8).
4. The system of claim 3, wherein: the plate heat exchanger (1-3) comprises a first-stage plate heat exchanger (1-31) and a second-stage plate heat exchanger (1-32) which are connected in series, the low-temperature water replenishing pipe (1-1) is connected with a first water inlet of the first-stage plate heat exchanger (1-31), a first water outlet of the first-stage plate heat exchanger (1-31) is connected with a first water inlet of the second-stage plate heat exchanger (1-32), and a first water outlet of the second-stage plate heat exchanger (1-32) is connected with the mixed water tank (1-4).
5. The system of claim 4, wherein: the high-temperature water supply pipeline (3) further comprises a branch which is respectively connected with the second water inlets of the first-stage plate heat exchangers (1-31) and the second water inlets of the second-stage plate heat exchangers (1-32), and the second water outlets of the first-stage plate heat exchangers (1-31) and the second water outlets of the second-stage plate heat exchangers (1-32) are respectively connected with the mixed water tank (1-4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120007130.3U CN214620169U (en) | 2021-01-04 | 2021-01-04 | Cold and hot water supply system for producing silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120007130.3U CN214620169U (en) | 2021-01-04 | 2021-01-04 | Cold and hot water supply system for producing silicon wafers |
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| Publication Number | Publication Date |
|---|---|
| CN214620169U true CN214620169U (en) | 2021-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120007130.3U Active CN214620169U (en) | 2021-01-04 | 2021-01-04 | Cold and hot water supply system for producing silicon wafers |
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| Country | Link |
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| CN (1) | CN214620169U (en) |
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2021
- 2021-01-04 CN CN202120007130.3U patent/CN214620169U/en active Active
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