CN214592702U - 5G mobile phone motherboard SMT pressfitting carrier - Google Patents

5G mobile phone motherboard SMT pressfitting carrier Download PDF

Info

Publication number
CN214592702U
CN214592702U CN202120219096.6U CN202120219096U CN214592702U CN 214592702 U CN214592702 U CN 214592702U CN 202120219096 U CN202120219096 U CN 202120219096U CN 214592702 U CN214592702 U CN 214592702U
Authority
CN
China
Prior art keywords
pressing block
steel ball
smt
connecting rod
briquetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202120219096.6U
Other languages
Chinese (zh)
Inventor
李俊武
吴志生
周浪
安健强
钟旺
徐建国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN MINGCHUANG ELECTRONIC TECHNOLOGY CO LTD
Original Assignee
KUNSHAN MINGCHUANG ELECTRONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN MINGCHUANG ELECTRONIC TECHNOLOGY CO LTD filed Critical KUNSHAN MINGCHUANG ELECTRONIC TECHNOLOGY CO LTD
Priority to CN202120219096.6U priority Critical patent/CN214592702U/en
Application granted granted Critical
Publication of CN214592702U publication Critical patent/CN214592702U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Mounting, Exchange, And Manufacturing Of Dies (AREA)

Abstract

The utility model relates to a 5G mobile phone motherboard SMT pressfitting carrier, which is applied to the technical field of SMT pressfitting carriers and comprises an upper die and a lower die, wherein a stand column is fixed on the lower die along the position vertical to the upper surface of the lower die, the upper end of the stand column is rotatably connected with a strip-shaped press block, and the upper die is provided with a through hole as large as the press block; after the briquetting passes in the through-hole, rotate the briquetting, the briquetting is contradicted at the upper surface of last mould, wear to be equipped with the connecting rod of T shape along the axial of stand on the stand, the upper end fixed connection of briquetting and connecting rod, inlay along the direction of perpendicular to stand on the lower mould and be equipped with the thread bush, be equipped with spring and steel ball in the thread bush, steel ball and connecting rod butt, the connecting rod is seted up with the spacing hole of steel ball complex, rotates when the briquetting rotates spacing hole and steel ball butt joint, the spring pushes away the cooperation of steel ball in spacing hole. The utility model discloses the effect of mould and lower mould on the quick assembly disassembly has.

Description

5G mobile phone motherboard SMT pressfitting carrier
Technical Field
The utility model relates to a SMT pressfitting carrier technical field, more specifically say, it relates to a 5G mobile phone motherboard SMT pressfitting carrier.
Background
Since the 21 st century, the electronic information product manufacturing industry in China has rapidly increased at a rate of 20% or more each year. Especially, the cell-phone tells the development, to current 5G cell-phone, relates to various circuits on the 5G cell-phone mainboard, and very complicacy, especially the laminating of flexible circuit board need use SMT pressfitting carrier.
Chinese patent that the publication number is CN207252035U discloses an SMT frock carrier, including installation base and carrier, the installation base is located the bottom of carrier, both sides all are seted up flutedly around the installation base, the top four corners of installation base all imbeds and has the carrier reference column, the locating hole with carrier reference column looks adaptation is all seted up in the four corners of carrier, the top embedding of installation base has the middle part stop cock, set up the spacing hole with middle part stop cock looks adaptation on the carrier, the SMT embedded groove has evenly been seted up at the top of carrier.
Above-mentioned SMT frock carrier, when using, base and carrier need be dismantled, and pressfitting work is accomplished between base and carrier, need design the SMT pressfitting carrier of being convenient for quick dismantlement to this kind of condition.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a 5G mobile phone motherboard SMT pressfitting carrier, its advantage is, utilizes the length and the width difference of briquetting for after the briquetting rotated certain angle, go up mould and lower mould and can't throw off, only when briquetting and through-hole overlap completely, go up mould and lower mould and just can throw off, make and go up the dismouting that mould and lower mould can be quick.
The above technical purpose of the present invention can be achieved by the following technical solutions: an SMT pressing carrier for a 5G mobile phone mainboard comprises an upper die and a lower die, wherein an upright post is fixed on the lower die along a position vertical to the upper surface of the lower die, a strip-shaped pressing block is rotatably connected to the upper end of the upright post, and a through hole as large as the pressing block is formed in the upper die; and after the pressing block passes through the through hole, the pressing block is rotated and is abutted against the upper surface of the upper die.
Further setting: the upright post is provided with a T-shaped connecting rod in an axial penetrating manner along the upright post, and the pressing block is fixedly connected with the upper end of the connecting rod.
Further setting: the lower die is embedded with a threaded sleeve along the direction perpendicular to the upright column, a spring and a steel ball are arranged in the threaded sleeve, the steel ball is abutted against a connecting rod, the connecting rod is provided with a limiting hole matched with the steel ball, and when the pressing block is rotated to rotate to the limiting hole to be in butt joint with the steel ball, the spring pushes the steel ball to be matched in the limiting hole.
Further setting: the number of the upright columns and the four pressing blocks are four, and the upright columns and the pressing blocks are uniformly distributed on the lower die.
Further setting: the surface of the pressing block, which is in contact with the upper die, is provided with a wedge surface, and the upper surface of the upper die is fixed with a wedge block for guiding the pressing block to rotate.
Further setting: last surface mounting of going up the mould has the dog, works as when the briquetting contradicts the dog, the briquetting stall, all inlay on the one side that dog and briquetting butt joint each other and be equipped with magnet.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the length and width difference of the pressing block are utilized, so that after the pressing block rotates for a certain angle, the pressing block is abutted to the upper surface of the upper die, the upper die and the lower die cannot be separated, only when the pressing block and the through hole are completely overlapped, the upper die and the lower die can be separated, and the upper die and the lower die can be disassembled and assembled only by rotating the pressing block for 90 degrees in the whole process, so that the upper die and the lower die can be quickly disassembled and assembled;
2. because the number of the press blocks is four, only when all the press blocks are overlapped with the through holes, the press blocks can pass through the respective through holes, the upper die and the lower die can be attached, and the press blocks can rotate, so that all the press blocks are difficult to ensure to be corresponding to the respective through holes; the spring pushes the steel ball to enable the steel ball to be abutted against the connecting rod, when the pressing block is overlapped with the through hole, the steel ball is abutted against the limiting hole, the elastic force of the spring needs to be overcome when the connecting rod rotates, the pressing block is prevented from rotating, and the upper die and the lower die can be rapidly assembled together;
3. the wedge surface and the wedge block play a pre-tightening role;
4. the magnet is arranged to prevent the pressing block from rotating, and the upper die and the lower die are guaranteed to be separated from each other in the process of being locked together.
Drawings
FIG. 1 is a schematic view of the structure of the upper mold and the lower mold of the present embodiment after clamping;
FIG. 2 is a schematic view of the upper and lower molds of the present embodiment after being separated;
FIG. 3 is a schematic structural view of the lower die, the press block and the pillar of the present embodiment;
FIG. 4 is a schematic structural view of the present embodiment;
fig. 5 is a schematic structural view of the connecting rod, the steel ball, the spring and the threaded sleeve of the embodiment.
In the figure: 11. an upper die; 12. a lower die; 13. a through hole; 21. a column; 22. a connecting rod; 23. briquetting; 24. steel balls; 25. a spring; 26. a threaded sleeve; 27. a limiting hole; 31. a wedge block; 32. a magnet; 33. and a stop block.
Detailed Description
The present invention will be further described with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example (b): referring to fig. 1-4, a 5G mobile phone motherboard SMT press-fit carrier includes an upper die 11 and a lower die 12, a vertical column 21 is fixed on the lower die 12 along a position perpendicular to the upper surface of the lower die 12, a strip-shaped press block 23 is rotatably connected to the upper end of the vertical column 21, and a through hole 13 having a size equal to that of the press block 23 is formed in the upper die 11; after the pressing block 23 passes through the through hole 13, the pressing block 23 is rotated, and the pressing block 23 abuts against the upper surface of the upper die 11. Utilize the length and the width difference of briquetting 23 for briquetting 23 rotates certain angle after, briquetting 23 will contradict like this at the upper surface of last mould 11, go up mould 11 and lower mould 12 and can't throw off, only when briquetting 23 and through-hole 13 overlap completely, go up mould 11 and lower mould 12 and just can throw off, and whole in-process only needs to rotate 90 degrees with briquetting 23 and just can realize the dismouting of going up mould 11 and lower mould 12, makes the dismouting that goes up mould 11 and lower mould 12 can be quick.
Referring to fig. 1 to 4, four columns 21 and four compacts 23 are uniformly arranged on the lower mold 12. A T-shaped connecting rod 22 penetrates through the upright post 21 along the axial direction of the upright post 21, and a pressing block 23 is fixedly connected with the upper end of the connecting rod 22. A threaded sleeve 26 is embedded on the lower die 12 along the direction perpendicular to the upright post 21, a spring 25 and a steel ball 24 are arranged in the threaded sleeve 26, the steel ball 24 is abutted against the connecting rod 22, a limiting hole 27 matched with the steel ball 24 is formed in the connecting rod 22, and when the rotating pressing block 23 rotates to enable the limiting hole 27 to be abutted against the steel ball 24, the spring 25 pushes the steel ball 24 to be matched in the limiting hole 27.
Referring to fig. 2 to 5, since there are four pressing blocks 23, only when all the pressing blocks 23 coincide with the through holes 13, the pressing blocks 23 can pass through the respective through holes 13, the upper die 11 and the lower die 12 can be attached, and the pressing blocks 23 can rotate, it is difficult to ensure that all the pressing blocks 23 correspond to the respective through holes 13; the spring 25 pushes the steel ball 24 to enable the steel ball 24 to abut against the connecting rod 22, when the pressing block 23 is overlapped with the through hole 13, the steel ball 24 is abutted to the limiting hole 27, the connecting rod 22 rotates to overcome the elastic force of the spring 25, the pressing block 23 is prevented from rotating, and the pressing block 23 cannot shake in the assembling process of the upper die 11 and the lower die 12 and always keeps the overlapped state with the through hole 13. When the upper die 11 and the lower die 12 are assembled, the pressing block 23 is manually driven to rotate.
Referring to fig. 2-5, a wedge surface is formed on a surface of the pressing block 23 contacting the upper die 11, and a wedge 31 for guiding the pressing block 23 to rotate is fixed on an upper surface of the upper die 11. After the pressing block 23 rotates, the wedge surface contacts with the surface of the wedge 31, so that pre-tightening force can be applied to the upper die 11, and a gap between the upper die 11 and the lower die 12 is prevented.
Referring to fig. 2 to 5, a stopper 33 is fixed to the upper surface of the upper mold 11, when the pressing block 23 abuts against the stopper 33, the pressing block 23 stops rotating, and magnets 32 are embedded in the abutting surfaces of the stopper 33 and the pressing block 23. When the pressing block 23 rotates 90 degrees after passing through the through hole 13, the magnet 32 on the pressing block 23 is attached to the magnet 32 on the stopper 33, so that the pressing block 23 can rotate reversely by overcoming the attraction of the magnet 32, and the position of the pressing block 23 cannot be changed in the process of attaching the upper die 11 and the lower die 12.
The implementation principle of the above embodiment is as follows: firstly adjusting all the pressing blocks 23 to enable all the pressing blocks 23 to be overlapped with the through holes 13, rotating the pressing blocks 23 after the upper die 11 and the lower die 12 are attached, enabling the lower surfaces of the pressing blocks 23 to be abutted against the upper surface of the upper die 11, and fixing the upper die 11 and the lower die 12 together; when the upper die 11 and the lower die 12 need to be disassembled, the pressing block 23 is rotated reversely, so that the pressing block 23 and the through hole 13 are overlapped, and the upper die 11 and the lower die 12 can be separated.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.

Claims (6)

1. The utility model provides a 5G mobile phone motherboard SMT pressfitting carrier, includes mould (11) and lower mould (12), its characterized in that: an upright post (21) is fixed on the lower die (12) along a position vertical to the upper surface of the lower die (12), a strip-shaped pressing block (23) is rotatably connected to the upper end of the upright post (21), and a through hole (13) with the same size as the pressing block (23) is formed in the upper die (11); after the pressing block (23) penetrates through the through hole (13), the pressing block (23) is rotated, and the pressing block (23) abuts against the upper surface of the upper die (11).
2. The 5G mobile phone motherboard SMT lamination carrier of claim 1, wherein: the vertical column (21) is provided with a T-shaped connecting rod (22) in a penetrating manner along the axial direction of the vertical column (21), and the pressing block (23) is fixedly connected with the upper end of the connecting rod (22).
3. The 5G mobile phone motherboard SMT lamination carrier of claim 2, wherein: the lower die (12) is provided with a threaded sleeve (26) in an embedded mode along the direction perpendicular to an upright post (21), the threaded sleeve (26) is internally provided with a spring (25) and a steel ball (24), the steel ball (24) is abutted to a connecting rod (22), the connecting rod (22) is provided with a limiting hole (27) matched with the steel ball (24), the pressing block (23) is rotated to enable the limiting hole (27) to be in butt joint with the steel ball (24), and the spring (25) pushes the steel ball (24) to be matched with the limiting hole (27).
4. The 5G mobile phone motherboard SMT lamination carrier of claim 1, wherein: the four upright columns (21) and the four pressing blocks (23) are uniformly distributed on the lower die (12).
5. The 5G mobile phone motherboard SMT lamination carrier of claim 1, wherein: a wedge surface is arranged on the surface of the pressing block (23) which is in contact with the upper die (11), and a wedge block (31) used for guiding the pressing block (23) to rotate is fixed on the upper surface of the upper die (11).
6. The 5G mobile phone motherboard SMT lamination carrier of claim 1, wherein: go up last surface mounting of mould (11) and have dog (33), work as briquetting (23) are contradicted when dog (33), briquetting (23) stall, all inlay on the one side that dog (33) and briquetting (23) dock each other and be equipped with magnet (32).
CN202120219096.6U 2021-01-26 2021-01-26 5G mobile phone motherboard SMT pressfitting carrier Expired - Fee Related CN214592702U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120219096.6U CN214592702U (en) 2021-01-26 2021-01-26 5G mobile phone motherboard SMT pressfitting carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120219096.6U CN214592702U (en) 2021-01-26 2021-01-26 5G mobile phone motherboard SMT pressfitting carrier

Publications (1)

Publication Number Publication Date
CN214592702U true CN214592702U (en) 2021-11-02

Family

ID=78371608

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120219096.6U Expired - Fee Related CN214592702U (en) 2021-01-26 2021-01-26 5G mobile phone motherboard SMT pressfitting carrier

Country Status (1)

Country Link
CN (1) CN214592702U (en)

Similar Documents

Publication Publication Date Title
US20140353897A1 (en) Jig for securing thimble
CN206850633U (en) A kind of magneto magnetic shoe assembly tooling
US9449748B2 (en) Rotatable supporting assembly
US10225968B1 (en) Fixture to enable positioning of SMT components
CN214592702U (en) 5G mobile phone motherboard SMT pressfitting carrier
CN209998411U (en) Caterpillar track link clamp and caterpillar track link manufacturing tool
CN102105024A (en) Soft pin support jig
CN102711377A (en) Circuit board for transmitting high current
CN203279369U (en) Assembling positioning jig for mobile phone main board
CN213277783U (en) Magnetic direction finder for magnetic steel
CN2925017Y (en) Positioning piece for circuit board and circuit board positioning mechanism with same
CN212564001U (en) Bearing clamp spring
CN219227965U (en) Tool for flexible circuit board production
CN203445169U (en) Projector, external battery thereof and external battery shell
CN215417362U (en) Interactive LED display screen capable of being adjusted through voice control
CN204321922U (en) A kind of repeated positioning device of car model assembling
CN210777520U (en) Hidden type mat label equipment
CN209991175U (en) Holographic 3D bore hole advertisement machine convenient to installation
CN106852019B (en) A kind of compression bar crossed on furnace carrier
CN206451864U (en) A kind of unitor
CN206185730U (en) Mobile phone clamp
CN201919244U (en) Circuit board supporting device
CN111300093A (en) Press fit jig
CN217049591U (en) Radium-shine turnover tool in many caves of single mode
CN205864746U (en) Self-centering apparatus

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211102

CF01 Termination of patent right due to non-payment of annual fee