CN214592636U

CN214592636U - Low-hardness high-heat-conductivity gel

Info

Publication number: CN214592636U
Application number: CN202120837508.2U
Authority: CN
Inventors: 张宇强
Original assignee: Shenzhen Leizidun New Material Co ltd
Current assignee: Shenzhen Leizidun New Material Co ltd
Priority date: 2021-04-22
Filing date: 2021-04-22
Publication date: 2021-11-02
Anticipated expiration: 2031-04-22

Abstract

The utility model discloses a high heat conduction gel of low rigidity, including first heat conduction gel layer (1) and second heat conduction gel layer (2), set up heat dissipation layer (3) of one deck fretwork between first heat conduction gel layer (1) and second heat conduction gel layer (2), heat dissipation layer (3) are honeycomb hollow out construction, and honeycomb hollow out construction's one end is connected with first heat conduction gel layer (1) integral type, and honeycomb hollow out construction's the other end is connected with second heat conduction gel layer (2) integral type. The utility model discloses a heat conduction gel is through increasing honeycomb heat dissipation layer for certain tensile ability has between electronic motherboard and the radiator, prevents the pine of heat conduction face and takes off, gives off the air with the heat through hollow out construction fast simultaneously, and heat-sinking capability increases, simultaneously the utility model discloses laminating electronic product that can be fine makes its contact surface more, and heat-absorbing capacity is better.

Description

Low-hardness high-heat-conductivity gel

Technical Field

The utility model relates to a heat conduction gel, concretely relates to low rigidity high heat conduction gel.

Background

When the electronic product is used, in order to increase the heat dissipation capacity, the heat conducting gel is arranged between the electronic product and the heat radiator, and the heat is absorbed by the heat conducting gel and then is conducted to the heat radiator for heat dissipation. However, the existing devices have many mobile devices, such as portable handheld devices and the like, and when in use, a large vibration force is generated, and since the heat-conducting gel is difficult to stretch for a large distance, if an electronic motherboard inside an electronic product is displaced, the heat-conducting gel is inevitably separated from the heat sink, which causes heat dissipation interruption; in addition, a large number of electronic components can be installed on the electronic mainboard of the electronic product, so that a plurality of hollowed-out positions are generated in the middle of the electronic components, the heat-conducting gel cannot well stretch into the hollowed-out areas, the contact surface of the heat-conducting gel with the electronic mainboard of the electronic product is reduced, the binding surface is small, and the heat dissipation performance is poor.

Disclosure of Invention

The utility model aims to solve the technical problem that a low rigidity high heat conduction gel through increasing honeycomb heat dissipation layer for certain tensile ability has between electron mainboard and the radiator, prevents the pine of heat conduction surface and takes off, can increase simultaneously and electron mainboard between area of contact, increase the heat absorption ability.

The utility model discloses a realize through following technical scheme: the utility model provides a low rigidity high heat conduction gel, includes first heat conduction gel layer and second heat conduction gel layer, set up the heat dissipation layer of one deck fretwork between first heat conduction gel layer and the second heat conduction gel layer, the heat dissipation layer is honeycomb hollow out construction, and honeycomb hollow out construction's one end and first heat conduction gel layer integral type are connected, and honeycomb hollow out construction's the other end and second heat conduction gel layer integral type are connected, first heat conduction gel layer is kept away from heat dissipation layer one side and is provided with more than one activity heat conduction pole, all forms a clearance chamber between activity heat conduction pole and the activity heat conduction pole, and activity heat conduction pole one end and first heat conduction gel layer contact, other end and electronic product surface contact.

As a preferred technical scheme, more than one heat dissipation holes are formed in the first heat conduction gel layer, the heat dissipation hole array is formed by the more than one heat dissipation holes, and one end of the movable heat conduction rod is inserted into the heat dissipation holes.

As the preferred technical scheme, the movable heat conducting rod comprises a heat conducting part and an inserting part, and the inserting part is telescopically arranged on the heat radiating hole.

Preferably, the insertion part and the heat dissipation hole are tightly assembled.

Preferably, the outer wall surface of the insertion part is provided with more than one protruding part.

The utility model has the advantages that: the utility model discloses a heat conduction gel is through increasing honeycomb heat dissipation layer for certain tensile ability has between electronic motherboard and the radiator, prevents the pine of heat conduction face and takes off, gives off the air with the heat through hollow out construction fast simultaneously, and heat-sinking capability increases, simultaneously the utility model discloses laminating electronic product that can be fine makes its contact surface more, and heat-absorbing capacity is better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic end view of a first thermally conductive gel layer of the present invention;

fig. 3 is a schematic structural view of the movable heat conducting rod of the present invention.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The use of terms herein such as "upper," "above," "lower," "below," and the like in describing relative spatial positions is for the purpose of facilitating description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1 and 2, the utility model discloses a high heat conduction gel of low rigidity, including first heat conduction gel layer 1 and second heat conduction gel layer 2, set up heat dissipation layer 3 of one deck fretwork between first heat conduction gel layer 1 and the second heat conduction gel layer 2, heat dissipation layer 3 is honeycomb hollow out construction, and honeycomb hollow out construction's one end is connected with first heat conduction gel layer 1 integral type, and honeycomb hollow out construction's the other end is connected with second heat conduction gel layer 2 integral type, first heat conduction gel layer 1 is kept away from heat dissipation layer one side and is provided with the more than one activity heat conduction pole, all forms a clearance chamber between activity heat conduction pole and the activity heat conduction pole, activity heat conduction pole one end and the contact of first heat conduction gel layer 1, the other end and electronic product surface contact.

Wherein, the first heat-conducting gel layer 1 is provided with more than one heat dissipation holes 6, the more than one heat dissipation holes 6 form a heat dissipation hole array, and one end of the movable heat-conducting rod is inserted into the heat dissipation holes 6. According to the actual use demand, the material of activity heat conduction pole in the radiating hole is adjusted in the plug.

As shown in fig. 3, the movable heat conducting rod includes a heat conducting portion 4 and an inserting portion 41, and the inserting portion 41 is telescopically mounted in the heat dissipating hole; the inserting part 41 and the heat dissipation hole 6 are tightly assembled, the inserting part can be inserted into the heat dissipation hole in a telescopic mode, the distance of the inserting part extending out of the heat dissipation hole can be pulled out according to actual needs, and therefore the heat conducting part can be in contact with the electronic main board all the time, the attaching area is increased, and the heat conducting capacity is further increased.

In this embodiment, the outer wall surface of the insertion portion 41 is provided with more than one protrusion portion to increase the contact friction force between the heat dissipation hole and the heat dissipation hole.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. A low-hardness high-thermal conductivity gel is characterized in that: including first heat conduction gel layer (1) and second heat conduction gel layer (2), set up heat dissipation layer (3) of one deck fretwork between first heat conduction gel layer (1) and second heat conduction gel layer (2), heat dissipation layer (3) are honeycomb hollow out construction, and honeycomb hollow out construction's one end and first heat conduction gel layer (1) integral type are connected, and honeycomb hollow out construction's the other end and second heat conduction gel layer (2) integral type are connected, first heat conduction gel layer (1) is kept away from heat dissipation layer one side and is provided with the more than one activity heat conduction pole, all forms a clearance chamber between activity heat conduction pole and the activity heat conduction pole, and activity heat conduction pole one end contacts with first heat conduction gel layer (1), and the other end and electronic product surface contact.

2. The low-hardness high-thermal-conductivity gel according to claim 1, wherein: more than one heat dissipation hole (6) is formed in the first heat conduction gel layer (1), the heat dissipation hole array is formed by the more than one heat dissipation holes (6), and one end of the movable heat conduction rod is inserted into the heat dissipation holes (6).

3. The low-hardness high-thermal-conductivity gel according to claim 1, wherein: the movable heat conducting rod comprises a heat conducting part (4) and an inserting part (41), and the inserting part (41) is telescopically arranged on the heat radiating hole.

4. The low-hardness high-thermal-conductivity gel according to claim 3, wherein: the inserting part (41) and the heat dissipation hole (6) are tightly assembled.

5. The low-hardness high-thermal-conductivity gel according to claim 4, wherein: the outer wall surface of the insertion part (41) is provided with more than one convex part.