CN214588780U - Wafer transfer device - Google Patents
Wafer transfer device Download PDFInfo
- Publication number
- CN214588780U CN214588780U CN202120696719.9U CN202120696719U CN214588780U CN 214588780 U CN214588780 U CN 214588780U CN 202120696719 U CN202120696719 U CN 202120696719U CN 214588780 U CN214588780 U CN 214588780U
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- lifting
- deflection
- component
- wafer
- supporting
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- 235000012431 wafers Nutrition 0.000 claims abstract description 71
- 238000009434 installation Methods 0.000 claims abstract description 13
- 230000033001 locomotion Effects 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer transfer device, including supporting assembly subassembly, the lift adjustment subassembly, the lift drive subassembly, the adjustment subassembly deflects, the subassembly is snatched to deflection drive subassembly and lamellar body, installation space has among the supporting assembly subassembly, the lift adjustment subassembly is installed in the supporting assembly subassembly, the lift drive subassembly is installed in the supporting assembly subassembly, and link up with the lift adjustment subassembly, the adjustment subassembly that deflects is installed in the adjustment subassembly that goes up and down, the drive subassembly that deflects is installed in the adjustment subassembly that goes up and down, and link up with the adjustment subassembly that deflects, the lamellar body snatchs the unit mount in the adjustment subassembly that deflects. The wafer body grabbing assembly comprises a pair of grabbing arms and wafer body grabs, the wafer body grabs can be in mutual relay fit, the range of operation required by each wafer body grabs is smaller, more transferring modes can be formed in a matched mode, the wafer body grabbing assembly is more flexible to use, and the wafer body grabbing assembly is beneficial to improving the transferring efficiency of wafers.
Description
Technical Field
The utility model relates to a semiconductor production equipment especially relates to a wafer transfer device.
Background
The production and fabrication of wafers are very precise processing techniques, and generally require a wafer transfer device to perform operations such as transportation and transfer. The commonly used transfer device adopts a single-arm structure, and has a large deflection angle in the transfer process, thereby influencing the operation stability, being easy to generate collision damage and having low transfer efficiency. Therefore, it is necessary to optimize the structure of the wafer transfer device to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wafer transfer device to promote the transport efficiency of wafer.
The utility model discloses a solve the technical scheme that its technical problem adopted and be:
a wafer transfer device includes:
a bearing assembly having an installation space therein;
the lifting adjusting component is arranged in the supporting assembly component and can do lifting motion in the supporting assembly component;
the lifting driving component is arranged in the supporting assembly component, is connected with the lifting adjusting component and drives the lifting adjusting component to move;
the deflection adjusting component is arranged in the lifting adjusting component, can lift along with the lifting adjusting component and can do deflection motion in the lifting adjusting component;
the deflection driving component is arranged in the lifting adjusting component, can lift along with the lifting component, is connected with the deflection adjusting component, and drives the deflection adjusting component to move;
the wafer grabbing component is arranged in the deflection adjusting component and can lift and deflect along with the deflection adjusting component, and the wafer grabbing component is used for grabbing and transferring wafers.
Further, the bearing assembly includes:
a support floor;
a top support plate located above the bottom support plate;
the sheet grabbing component comprises a supporting side plate, a lifting adjusting component, a lifting driving component, a deflection adjusting component and a deflection driving component, wherein the supporting side plate is positioned between a supporting bottom plate and a supporting top plate, two ends of the supporting side plate are respectively connected with the supporting bottom plate and the supporting top plate, an installation space is formed among the supporting bottom plate, the supporting top plate and the supporting side plate in an enclosing mode, the lifting adjusting component, the lifting driving component, the deflection adjusting component and the deflection driving component are positioned in the installation space, and the sheet grabbing component is positioned outside the installation space.
Further, the lift adjustment assembly includes:
the lifting guide rail is vertically arranged, and two ends of the lifting guide rail are respectively connected with the supporting bottom plate and the supporting top plate;
the lifting frame body is arranged on the lifting guide rail through a sliding structure and can lift along the lifting guide rail, and the deflection adjusting assembly and the deflection driving assembly are arranged on the lifting frame body.
Further, the lift drive assembly includes:
the lifting motor is arranged on the supporting bottom plate, a power output shaft of the lifting motor is connected with the lifting frame body through a transmission structure, and the lifting frame body is driven by the lifting motor to lift along the lifting guide rail.
Further, the yaw adjustment assembly includes:
the bottom of the deflection cylinder is arranged on the lifting frame body through a rotating structure, the deflection cylinder can lift along with the lifting frame body and deflect on the lifting frame body, the top of the deflection cylinder extends out of the supporting top plate, and the sheet body grabbing assembly is arranged at the top of the deflection cylinder body.
Further, the yaw drive assembly includes:
the deflection motor is arranged on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection motor is connected with the deflection cylinder body through a transmission structure, and the deflection motor drives the deflection cylinder body to deflect.
Further, the subassembly is snatched to the lamellar body includes:
the grabbing arms are provided with a pair, and each grabbing arm is respectively arranged at the top of the deflection cylinder body and can lift and deflect along with the deflection cylinder body;
the wafer body grippers are arranged in a pair and are respectively installed at the tail ends of the grabbing arms, the wafer body grippers grab the wafer, and the grabbing arms drive the wafer body grippers carrying the wafer to move. The wafer picking and placing device can simultaneously pick and place wafers, full automation in the wafer detection and transportation process is realized, the control action process is controlled by the industrial controller, different motion control instructions are issued to each element through analysis and processing of input signals, and coordinated motion among all the components is completed.
In one embodiment of the present invention, the grabbing arm is formed by combining a plurality of arm rods, and can perform stretching and deflecting movements to expand the movement range of the sheet body grabbing hand;
in an embodiment of the present invention, the sheet body gripper adopts a vacuum adsorption structure.
The utility model has the advantages that:
the wafer transfer device adopts the connection of the lifting adjusting component and the deflection adjusting component, so that the whole wafer grabbing component can lift and deflect together with the deflection adjusting component, the moving range of the wafer grabbing component is larger, the wafer grabbing component comprises a pair of grabbing arms and wafer grabs, the wafer grabs can be in mutual relay matching, the range of operation required by each wafer gripper is smaller, more transfer modes can be formed in a matching way, the use is more flexible, and the transfer efficiency of wafers is favorably improved.
Drawings
Fig. 1 is a schematic structural view of a wafer transfer apparatus according to the present invention;
FIG. 2 is a schematic side view of the wafer transfer device;
fig. 3 is a schematic cross-sectional view of the sheet grasping assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1-3, the wafer transferring device of the present invention comprises a supporting assembly, a lifting adjustment assembly, a lifting driving assembly, a deflection adjustment assembly, a deflection driving assembly and a sheet grabbing assembly, wherein the supporting assembly has an installation space, the lifting adjustment assembly is installed in the supporting assembly and can perform lifting motion in the supporting assembly, the lifting driving assembly is installed in the supporting assembly and connected to the lifting adjustment assembly, the lifting driving assembly drives the lifting adjustment assembly to move, the deflection adjustment assembly is installed in the lifting adjustment assembly and can perform lifting motion along with the lifting adjustment assembly and can perform deflection motion in the lifting adjustment assembly, the deflection driving assembly is installed in the lifting adjustment assembly and can perform lifting motion along with the lifting assembly and connected to the deflection adjustment assembly, and the deflection driving assembly drives the deflection adjustment assembly to move, the wafer body grabbing component is arranged in the deflection adjusting component and can lift and deflect along with the deflection adjusting component, and the wafer body grabbing component is used for grabbing and transferring a wafer. In this embodiment, the supporting and assembling assembly includes a supporting bottom plate 110, a supporting top plate 120 and a supporting side plate 130, the supporting top plate is located above the supporting bottom plate, the supporting side plate is located between the supporting bottom plate and the supporting top plate, and two ends of the supporting side plate are respectively connected with the supporting bottom plate and the supporting top plate, an installation space is formed between the supporting bottom plate, the supporting top plate and the supporting side plate in an enclosing manner, the lifting adjusting assembly, the lifting driving assembly, the deflection adjusting assembly and the deflection driving assembly are located inside the installation space, and the sheet grabbing assembly is located outside the installation space. In this embodiment, the lifting adjusting assembly includes a lifting guide rail 210 and a lifting frame body 220, the lifting guide rail is vertically disposed, two ends of the lifting guide rail are respectively connected with the supporting bottom plate and the supporting top plate, the lifting frame body is installed on the lifting guide rail through a sliding structure, the lifting guide rail can be lifted, and the deflection adjusting assembly and the deflection driving assembly are installed on the lifting frame body. In this embodiment, the lifting driving assembly includes a lifting motor 310, the lifting motor is installed on the supporting base plate, and a power output shaft thereof is connected to the lifting frame body through a transmission structure, and the lifting motor drives the lifting frame body to lift along the lifting guide rail. In this embodiment, the deflection adjusting assembly includes a deflection cylinder 410, which is mounted at the bottom thereof to the elevator body through a rotating structure, can be lifted together with the elevator body, and can be deflected on the elevator body, and has a top portion protruding from the supporting top plate, and a sheet catching assembly is mounted at the top of the deflection cylinder. In this embodiment, the deflection driving assembly includes a deflection motor 510, the deflection motor is installed on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection driving assembly is connected with the deflection cylinder body through a transmission structure, the deflection cylinder body is driven by the deflection motor to deflect, and the transmission structure can be a screw transmission structure and the like. In this embodiment, the wafer grabbing component comprises a grabbing arm 610 and a wafer grabbing hand 620, the grabbing arm is provided with a pair of grabbing arms, each grabbing arm is respectively installed at the top of the deflection barrel and can lift and deflect along with the deflection barrel, the wafer grabbing hand is provided with a pair of grabbing arms and is respectively installed at the tail ends of the grabbing arms, the wafer is grabbed by the wafer grabbing hand, and the grabbing arms drive the wafer grabbing hand carrying the wafer to move. In this embodiment, the grabbing arm is formed by combining two arm rods, which can perform stretching and deflecting motions to expand the motion range of the sheet body grabbing hand, and the arm rods are driven to operate by a servo motor 630 arranged in the arm rods; in this embodiment, the lamellar body tongs adopt the vacuum adsorption structure. The wafer transfer device adopts the connection of the lifting adjusting component and the deflection adjusting component, so that the whole wafer grabbing component can lift and deflect together with the deflection adjusting component, the moving range of the wafer grabbing component is larger, the wafer grabbing component comprises a pair of grabbing arms and wafer grabs, the wafer grabs can be in mutual relay matching, the range of operation required by each wafer gripper is smaller, more transfer modes can be formed in a matching way, the use is more flexible, and the transfer efficiency of wafers is favorably improved.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally placed when the products of the present invention are used, or orientations or positional relationships that are conventionally understood by those skilled in the art, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the designated devices or elements must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be further noted that, unless explicitly stated or limited otherwise, the terms "disposed" and "connected" are to be interpreted broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Claims (7)
1. A wafer transfer device, comprising:
a bearing assembly having an installation space therein;
the lifting adjusting component is arranged in the supporting assembly component and can do lifting motion in the supporting assembly component;
the lifting driving component is arranged in the supporting assembly component, is connected with the lifting adjusting component and drives the lifting adjusting component to move;
the deflection adjusting component is arranged in the lifting adjusting component, can lift along with the lifting adjusting component and can do deflection motion in the lifting adjusting component;
the deflection driving component is arranged in the lifting adjusting component, can lift along with the lifting component, is connected with the deflection adjusting component, and drives the deflection adjusting component to move;
the wafer grabbing component is arranged in the deflection adjusting component and can lift and deflect along with the deflection adjusting component, and the wafer grabbing component is used for grabbing and transferring wafers.
2. The wafer transfer device as claimed in claim 1, wherein the support assembly comprises:
a support floor;
a top support plate located above the bottom support plate;
the sheet grabbing component comprises a supporting side plate, a lifting adjusting component, a lifting driving component, a deflection adjusting component and a deflection driving component, wherein the supporting side plate is positioned between a supporting bottom plate and a supporting top plate, two ends of the supporting side plate are respectively connected with the supporting bottom plate and the supporting top plate, an installation space is formed among the supporting bottom plate, the supporting top plate and the supporting side plate in an enclosing mode, the lifting adjusting component, the lifting driving component, the deflection adjusting component and the deflection driving component are positioned in the installation space, and the sheet grabbing component is positioned outside the installation space.
3. The wafer transfer device as claimed in claim 2, wherein the elevation adjustment assembly comprises:
the lifting guide rail is vertically arranged, and two ends of the lifting guide rail are respectively connected with the supporting bottom plate and the supporting top plate;
the lifting frame body is arranged on the lifting guide rail through a sliding structure and can lift along the lifting guide rail, and the deflection adjusting assembly and the deflection driving assembly are arranged on the lifting frame body.
4. The wafer transfer device as claimed in claim 3, wherein the elevating driving unit comprises:
the lifting motor is arranged on the supporting bottom plate, a power output shaft of the lifting motor is connected with the lifting frame body through a transmission structure, and the lifting frame body is driven by the lifting motor to lift along the lifting guide rail.
5. The wafer transfer device as claimed in claim 3, wherein the deflection adjusting assembly comprises:
the bottom of the deflection cylinder is arranged on the lifting frame body through a rotating structure, the deflection cylinder can lift along with the lifting frame body and deflect on the lifting frame body, the top of the deflection cylinder extends out of the supporting top plate, and the sheet body grabbing assembly is arranged at the top of the deflection cylinder body.
6. The wafer transfer device as claimed in claim 5, wherein the deflection driving unit comprises:
the deflection motor is arranged on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection motor is connected with the deflection cylinder body through a transmission structure, and the deflection motor drives the deflection cylinder body to deflect.
7. The wafer transfer device as claimed in claim 5, wherein the sheet grasping assembly comprises:
the grabbing arms are provided with a pair, and each grabbing arm is respectively arranged at the top of the deflection cylinder body and can lift and deflect along with the deflection cylinder body;
the wafer body grippers are arranged in a pair and are respectively installed at the tail ends of the grabbing arms, the wafer body grippers grab the wafer, and the grabbing arms drive the wafer body grippers carrying the wafer to move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120696719.9U CN214588780U (en) | 2021-04-07 | 2021-04-07 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120696719.9U CN214588780U (en) | 2021-04-07 | 2021-04-07 | Wafer transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214588780U true CN214588780U (en) | 2021-11-02 |
Family
ID=78323332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120696719.9U Expired - Fee Related CN214588780U (en) | 2021-04-07 | 2021-04-07 | Wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214588780U (en) |
-
2021
- 2021-04-07 CN CN202120696719.9U patent/CN214588780U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220907 Address after: 201611 zone F, building 1, No. 120, Rongjiang Road, Songjiang District, Shanghai Patentee after: SHANGHAI BESTITY SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 314100 No.18 Guigu 2nd Road, Luoxing street, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: Jiaxing Weituo Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211102 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |