CN214586974U

CN214586974U - High temperature resistant RFID tag

Info

Publication number: CN214586974U
Application number: CN202120049279.8U
Authority: CN
Inventors: 邱荣虎; 黄继; 廖小林
Original assignee: Hongfujin Precision Electronics Chengdu Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Electronics Chengdu Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2021-01-09
Filing date: 2021-01-09
Publication date: 2021-11-02
Anticipated expiration: 2031-01-09

Abstract

The application provides a high temperature resistant RFID label, including RFID chip, insulating layer, encapsulation box and upper cover, the upper cover with encapsulation box interconnect is in order to inject sealed accommodation space, the RFID chip holding in the accommodation space, the insulating layer holding in just cladding in the accommodation space the RFID chip. The RFID tag provided by the application can be used at higher temperature.

Description

High temperature resistant RFID tag

Technical Field

The application belongs to the technical field of RFID tags, and particularly relates to a high-temperature-resistant RFID tag.

Background

The RFID is a non-contact automatic identification technology, which automatically identifies a target object and obtains related data through a radio frequency signal, and the identification process does not need manual intervention. The RFID working principle is as follows: when the RFID tag enters a magnetic field, receiving a radio frequency signal sent by the reader, and sending product information stored in a chip by virtue of energy obtained by induction current or actively sending a signal with a certain frequency; the information is read and decoded by the interpreter and then sent to the central information system for relevant data processing. The chip has a data storage function, and the central information system can realize the operations of tracing management of product quality, automatic selection of a processing path and the like according to the product information sent by the label.

However, since the existing RFID tag cannot withstand a high temperature (e.g., 280 ℃), the RFID tag cannot be used in a high temperature environment.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides an RFID tag that can be used at higher temperatures.

The application provides a high temperature resistant RFID label, including RFID chip, insulating layer, encapsulation box and upper cover, the upper cover with encapsulation box interconnect is in order to inject sealed accommodation space, the RFID chip holding in the accommodation space, the insulating layer holding in just cladding in the accommodation space the RFID chip.

In some embodiments, the RFID chip includes a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, the first surface or the second surface facing the upper cover, and the insulation layer includes a first insulation portion provided to the first surface.

In some embodiments, the insulation layer further comprises a second insulation portion disposed on the second surface.

In some embodiments, the insulation layer further comprises a third insulation portion disposed at the side surface.

In some embodiments, the thermal insulating layer has pores having a diameter of 18 μm to 25 μm.

In some embodiments, the material of the enclosure is synthetic stone.

In some embodiments, the packaging box comprises a bottom and a side wall connected with the bottom, an opening is formed on one side of the side wall far away from the bottom, the upper cover comprises a covering part and a flange part connected with the covering part, the covering part covers the opening, and the flange part is attached to the inner side of the side wall.

In some embodiments, the second insulating portion is disposed inside the flange portion.

In some embodiments, the RFID tag further comprises an adhesive layer disposed between the sidewall and the closure.

In some embodiments, the adhesive layer is made of silicone rubber.

In this application the insulating layer cladding the RFID chip, just the encapsulation box with the upper cover encapsulates jointly the RFID chip and the insulating layer makes the RFID label has better thermal-insulated effect, thereby makes the RFID label can use in higher temperature (this application the RFID label can use under the high temperature condition that exceeds 280 ℃).

Drawings

Fig. 1 is a schematic structural diagram of an RFID tag provided in some embodiments of the present application.

Fig. 2 is an exploded view of the RFID tag shown in fig. 1.

Fig. 3 is an exploded view of the RFID tag shown in fig. 1 in another orientation.

Fig. 4 is a cross-sectional view of the RFID tag shown in fig. 1 taken along the direction IV-IV.

Description of the main elements

RFID tag 100

RFID chip 10

First surface 101

Second surface 102

Side surface 103

Insulation layer 20

First heat insulation part 201

Second insulating part 202

Third insulating part 203

Packaging box 30

Bottom 301

Side wall 302

Accommodating space 31

Opening 32

Upper cover 40

Covering part 401

Flange portion 402

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.

Referring to fig. 1 and fig. 2, some embodiments of the present application provide a high temperature resistant RFID tag 100, where the RFID tag 100 includes an RFID chip 10, a thermal insulation layer 20, a packaging box 30, and an upper cover 40.

Referring to fig. 3, the RFID chip 10 includes a first surface 101, a second surface 102 opposite to the first surface 101, and a side surface 103 connecting the first surface 101 and the second surface 102. The first surface 101 or the second surface 102 faces the upper cover 40. In this embodiment, the second surface 102 faces the upper cover 40. The RFID chip 10 may be used to store product information.

Referring to FIG. 2, in some embodiments, the composition of the thermal barrier layer 20 may include SiO₂And SiC and the like. In some embodiments, the thermal insulation layer 20 may also include an anti-infrared radiation material. In some embodiments, the anti-infrared radiation material may be silicon carbide, zirconium silicate, and the like. The anti-infrared radiation material is used for reflecting infrared rays to prevent the RFID chip 10 from being radiated by external infrared rays.

The thermal insulation layer 20 has air holes. In some embodiments, the pores have a diameter of 18 μm to 25 μm. The air holes are beneficial to heat dissipation inside the heat insulation layer 20, and local over-high temperature of the heat insulation layer 20 is prevented, so that the service life of the heat insulation layer 20 is prolonged.

In some embodiments, the thermal conductivity of the thermal insulating layer 20 at 50 ℃ is 0.018W/(m · K), the thermal conductivity of the thermal insulating layer 20 at 200 ℃ is 0.021W/(m · K), the thermal conductivity of the thermal insulating layer 20 at 400 ℃ is 0.024W/(m · K), the thermal conductivity of the thermal insulating layer 20 at 600 ℃ is 0.028W/(m · K), and the thermal conductivity of the thermal insulating layer 20 at 800 ℃ is 0.035W/(m · K).

In some embodiments, the insulating layer 20 is gray in color.

In some embodiments, the thermal insulating layer 20 has a melting point greater than 1200 ℃.

In some embodiments, the maximum service temperature of the thermal insulation layer 20 is 950 ℃.

In some embodiments, the density of the insulation layer 20 is 230 ± 10% Kg/m³。

In some embodiments, the thermal insulation layer 20 has a specific heat capacity of 0.8KJ/(kg · K).

In some embodiments, the thermal insulating layer 20 has a compressive strength of 0.5Mpa when compressed 10% by volume.

In some embodiments, the thermal insulation layer 20 has a linear shrinkage of less than 2% at 850 ℃.

Referring to fig. 4, in some embodiments, the insulation layer 20 includes a first insulation portion 201, a second insulation portion 202, and a third insulation portion 203. The first insulating portion 201 is disposed on the first surface 101, the second insulating portion 202 is disposed on the second surface 102, and the third insulating portion 203 is disposed on the side surface 103. The first thermal insulation portion 201, the second thermal insulation portion 202 and the third thermal insulation portion 203 together completely wrap the RFID chip 10, so that the RFID chip 10 can be used in a high-temperature environment.

Referring to fig. 3 and 4, the enclosure 30 and the upper cover 40 are connected to each other to define a sealed accommodating space 31. The RFID chip 10 is accommodated in the accommodating space 31, and the thermal insulation layer 20 is accommodated in the accommodating space 31 and covers the RFID chip 10. The enclosure 30 comprises a bottom 301 and a sidewall 302 connecting the bottom 301, wherein an opening 32 is formed on a side of the sidewall 302 remote from the bottom 301. In some embodiments, the material of the enclosure 30 is synthetic stone. The enclosure 30 has a thermal insulation function.

In some embodiments, the cover 40 includes a cover portion 401 and a flange portion 402 connected to the cover portion 401. The covering portion 401 covers the opening 32, and the flange portion 402 is attached to the inner side of the side wall 302. The second heat insulating portion 202 is provided inside the flange portion 402.

In some embodiments, the RFID tag 100 further includes an adhesive layer (not shown). The adhesive layer is disposed between the sidewall 302 and the cover portion 401. In some embodiments, the adhesive layer is made of silicone rubber. The adhesive layer is used for adhering and fixing the packaging box 30 and the upper cover 40 and preventing external heat from entering the packaging box 30.

The thermal insulation layer 20 covers the RFID chip 10, and the packaging box 30 and the upper cover 40 jointly package the RFID chip 10 and the thermal insulation layer 20, so that the RFID tag 100 has a good thermal insulation effect, and the RFID tag 100 can be used at a high temperature (the RFID tag 100 of the present application can be used at a high temperature exceeding 280 ℃).

The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.

Claims

1. The high-temperature-resistant RFID tag is characterized by comprising an RFID chip, a heat insulation layer, a packaging box and an upper cover, wherein the upper cover and the packaging box are connected with each other to limit a sealed accommodating space, the RFID chip is accommodated in the accommodating space, and the heat insulation layer is accommodated in the accommodating space and wraps the RFID chip.

2. The RFID tag of claim 1, wherein the RFID chip comprises a first surface, a second surface opposite the first surface, and a side connecting the first surface and the second surface, the first surface or the second surface facing the upper cover, the insulation layer comprising a first insulation portion disposed on the first surface.

3. The RFID tag of claim 2, wherein the insulation layer further comprises a second insulation portion disposed on the second surface.

4. The RFID tag of claim 3, wherein the insulation layer further comprises a third insulation portion disposed on the side surface.

5. The RFID tag of claim 1, wherein the insulation layer has air holes having a diameter of 18 μ ι η to 25 μ ι η.

6. The RFID tag of claim 1, wherein the enclosure is made of synthetic stone.

7. The RFID tag according to claim 3, wherein the packaging box comprises a bottom and a side wall connected with the bottom, an opening is formed on one side of the side wall away from the bottom, the upper cover comprises a covering part and a flange part connected with the covering part, the covering part covers the opening, and the flange part is attached to the inner side of the side wall.

8. The RFID tag of claim 7, wherein the second insulating portion is disposed inside the flange portion.

9. The RFID tag of claim 7, further comprising an adhesive layer disposed between the sidewall and the cover.

10. The RFID tag of claim 9, wherein the adhesive layer is silicone rubber.