CN214580689U

CN214580689U - Lamp fitting

Info

Publication number: CN214580689U
Application number: CN202121013443.6U
Authority: CN
Inventors: 胡光辉
Original assignee: Opple Lighting Co Ltd; Suzhou Op Lighting Co Ltd
Current assignee: Opple Lighting Co Ltd; Suzhou Op Lighting Co Ltd
Priority date: 2021-05-12
Filing date: 2021-05-12
Publication date: 2021-11-02
Anticipated expiration: 2031-05-12

Abstract

The application discloses lamps and lanterns, lamps and lanterns include casing and lighting module, wherein lighting module includes optical element, diffusion component and photovoltaic module, wherein the diffusion component with the photovoltaic module is fixed integrated in optical element is last, optical element is fixed in the holding intracavity. The lamp can solve the problems that the existing lamp faces a complex machining process and high cost, and simultaneously has the advantages of simple shape, good heat dissipation, high safety and the like.

Description

Lamp fitting

Technical Field

The present application relates to a lighting device, and more particularly, to a lamp.

Background

The down lamp is used as a basic lighting lamp, and the market demand is huge. At present, the main structure of down lamp body has all plastics, plastics + metal and all metals several kinds. With the progress of technology and the requirement of cost reduction and the popularity of simple styles, the integrated simple down lamp is popular in the market.

At present, an integrated all-plastic material cylinder lamp appears, an all-metal split type down lamp is also on the market, and a metal piece mostly adopts aluminum die casting or aluminum stamping and turning, but the processing is complex and the cost is higher.

Meanwhile, the positioning and connection among the elements in the down lamp are generally realized by adopting additional positioning pieces (such as positioning screws). Due to the fact that the number of elements in the existing down lamp is large, and extra positioning pieces are needed to pass through connection among the elements. Therefore, the problems that the existing down lamp is complex in assembling process and high in production cost are caused.

However, the simpler the assembly structure of the lamp is, the lower the safety of the product is, and the more likely the metal housing is to be charged. Therefore, how to solve the problems of complex assembly process and high production cost of the down lamp and also avoid the electrification of the metal shell is a technical problem to be solved urgently in the field.

Therefore, it is desirable to provide a lamp to solve the above technical problems.

Disclosure of Invention

The main aim at of this application provides a lamps and lanterns, can solve the complicated and higher problem of cost of processing technology that current lamps and lanterns face, and this application lamps and lanterns still have advantages such as the molding is brief, the heat dissipation is good and the security is high concurrently simultaneously.

Other objects and advantages of the present application will be further understood from the technical features disclosed in the present application.

In order to achieve the above object, according to an aspect of the present application, there is provided a lamp including:

a housing having an accommodating chamber;

the lighting module is inserted into the accommodating cavity and comprises an optical element, a diffusion element and a photoelectric module which are connected together in a non-detachable mode, wherein the diffusion element and the photoelectric module are fixedly integrated on the optical element, and the optical element is fixed in the accommodating cavity.

In some embodiments, the optical element is a reflector, a lens, or a unitary element fixedly integrated by the reflector and the lens.

In some embodiments, the optical element is assembled in the accommodating cavity by a snap connection, a screw connection, a magnetic connection, a hot melt connection, an interference fit, a welding or an adhesive bonding.

Furthermore, the outer side wall of the optical element is connected with the inner side wall of the accommodating cavity in a buckling mode.

In some embodiments, one of a protrusion and a card slot is provided on a side of the housing facing the optical element, and the other of the protrusion and the card slot is provided on a side of the optical element facing the housing, and the optical element and the housing are connected together by the protrusion and the card slot being engaged.

In some embodiments, the diffusing element and the optical element are assembled and connected together by at least one of heat fusion, interference fit, and adhesive bonding.

In some embodiments, the optoelectronic module and the optical element are assembled and connected together by at least one of heat fusion, interference fit and adhesive bonding.

In some embodiments, the optical element and the diffusing element together form a closed package, and the optoelectronic module is packaged in the package.

In some embodiments, the optical element has a reflection bottom plate mounting bottom plate, reflection side walls surrounding the reflection bottom plate mounting bottom plate, a containing cavity enclosed by the reflection bottom plate mounting bottom plate and the reflection side walls, and a light outlet facing the reflection bottom plate mounting bottom plate;

the photoelectric module is arranged in the accommodating cavity and attached to the reflection bottom plate mounting bottom plate, and the diffusion element seals the light outlet.

In some embodiments, the back of the optoelectronic module serves as the mounting plate and is welded integrally with the reflective sidewall.

In some embodiments, the optical element has a hollow truncated cone shape, and an outer diameter of the optical element gradually increases from the mounting substrate to the reflective element.

In some embodiments, the diffusing member is in the form of a plate having an inner horizontal surface facing the inner surface of the optical member and an outer horizontal surface facing outward, the inner horizontal surface and the outer horizontal surface being disposed opposite each other.

In some embodiments, at the light exit end, a stepped surface is provided on an inner circumferential surface of the optical element, the stepped surface being in locating engagement with the diffuser element.

In some embodiments, a side of the optical element facing the cavity bottom of the accommodating cavity is provided with a lead channel, and the lead channel is communicated with the optical element;

and the lead of the photoelectric module for connecting an external power supply extends out of the shell through the lead channel.

In some embodiments, a through hole corresponding to the lead channel is arranged at the bottom of the accommodating cavity, and the lead channel extends into the through hole.

In some embodiments, the housing has:

the main body part comprises a bottom wall for enclosing the accommodating cavity and a side wall arranged around the edge of the bottom wall; and the number of the first and second groups,

and a face ring part connected to the main body part.

In some embodiments, the housing has a mounting portion disposed on the body portion;

the lamp further comprises a clamp spring arranged on the mounting portion.

In some embodiments, the housing is an integrally formed metal member.

Compared with the prior art, the lamp has the advantages that the photoelectric module and the diffusion element are arranged on the optical element, so that the three lighting modules are assembled into the integrated module, the structure of the lamp is modularized, and the assembly and production difficulty of the lamp can be reduced; meanwhile, an insulating shell capable of packaging the whole lighting module is formed by the diffusion element and the optical element, so that the insulativity and the reliability of the lighting module can be improved; through adopting the mode of hot melt with photovoltaic module and diffusion component to connect in on the optical element, further realize the assembly of illumination module and casing through the buckle connection of optical element lateral wall and holding intracavity lateral wall, therefore need not extra setting element between each component of lamps and lanterns, consequently connect simple and conveniently between the interior component of whole lamps and lanterns, the assembly cost of whole lamps and lanterns is also low.

Moreover, the shell is made of an integrally formed metal component, so that the heat dissipation effect of the whole lamp can be improved, and the production efficiency can be improved. Furthermore, a reliable insulating, non-detachable lighting module is thus formed. Cost, reliability, optical effect. In addition, this application lamps and lanterns still have the simple and brief and advantage such as the heat dissipation is good concurrently of molding.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic assembled state diagram of a lamp according to a preferred embodiment of the present application.

Fig. 2 is a first schematic diagram illustrating an explosion state of a lamp according to a preferred embodiment of the present application.

Fig. 3 is a schematic diagram of an explosion state of a lamp according to the preferred embodiment of the present application.

FIG. 4 is a cross-sectional view of a luminaire consistent with a preferred embodiment of the present application.

Fig. 5 is a schematic diagram illustrating an exploded state of a lighting module according to a preferred embodiment of the present application.

The reference numbers in the above figures are as follows:

100 housing 200 lighting module

300 mount 110 body portion

120-surface ring part 130 mounting part

101 accommodating cavity 102 first buckling part

103 through hole 104 opening

111 bottom wall 112 side wall

210 optical element 220 diffuser element

230 photoelectric module 240 lead

211 mounting end 212 light-emitting end

213 mounting base plate 214 reflective sidewall

201 second bayonet part 202 lead channel

215 hot melting column 216 step surface

241 lead sheath 2100 containing cavity

Detailed Description

The following description of the embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. In the present application, directional terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc. refer to directions of the attached drawings only. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. Moreover, the embodiments described in the detailed description are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 is a schematic assembled state diagram of a lamp according to a preferred embodiment of the present application. Fig. 2 is a first schematic diagram illustrating an explosion state of a lamp according to a preferred embodiment of the present application. Fig. 3 is a schematic diagram of an explosion state of a lamp according to the preferred embodiment of the present application. FIG. 4 is a cross-sectional view of a lamp according to a preferred embodiment of the present application. Fig. 5 is a schematic diagram illustrating an exploded state of a lighting module according to a preferred embodiment of the present application. Wherein fig. 2 and 3 are taken from different viewing angles, respectively.

As shown in fig. 1 to 5, the present application provides a lamp, which includes a housing 100 having a receiving cavity 101 and a lighting module 200 inserted into the receiving cavity 101.

As shown in fig. 5, the lighting module 200 includes an optical element 210, a diffusing element 220, and an optoelectronic module 230 that are non-detachably connected together, wherein the diffusing element 220 and the optoelectronic module 230 are fixedly integrated in the optical element 210, and the optical element 210 is fixed in the accommodating cavity 101.

By non-removable is meant that the removal is only destructive, not by recoverable removal. The non-detachable assembly mode can be a hot melting fixing mode, a welding mode or an adhesive fixing mode.

In the present embodiment, the optical element 210 is a reflector. In other embodiments, the optical element 210 may be a lens, or may be an integral element fixedly integrated by a reflector and a lens.

In a preferred embodiment, the optical element 210 is snap-connected to the inner sidewall of the receiving cavity 101, so as to fix the whole lighting module 200 to the housing 100. In other embodiments, the lighting module 200 can be further mounted on the housing 100 by a screw connection, a magnetic connection, a thermal connection, an interference fit, a welding or an adhesive.

In the scheme of this application, through with diffusion element 220, photovoltaic module 230 and optical element 210 are integrated into illumination module 200, can regard three kinds as a whole, adopt integrated into one piece's casing 100 simultaneously, and then can obtain the modular structure lamps and lanterns that only include illumination module 200 and casing 100, when the assembly, with illumination module 200 as a whole fill in or insert in casing 100 can, thereby reduced the part quantity that needs the location installation, simplify the assembly process of lamps and lanterns, reduce the processing degree of difficulty, improve assembly efficiency.

At present, under the new safety standard, the panel of the current most of integrated down lamps adopts the mounting mode that can dismantle and install to be determined as unqualified. In the lamp of the present application, the lighting module 200 better meets the national safety standard and meets the requirement of market safety and sampling inspection.

Particularly, the lighting module 200 that this application embodiment provided has non-detachable structure, and the installation of conveniently changing, lighting module 200 can provide unified standard interface as the optoelectronic module of a standard type, can carry out the quick replacement of outward appearance and the fast switch-over of article type. The lighting module 200 can be quickly installed in the casing 100, and the casing 100 can be an embedded down lamp, a ceiling-mounted down lamp or a suspended lamp according to requirements. The shape of the housing 100 is not limited in this embodiment, and may be a horn-shaped housing 100 as shown in fig. 3. In other embodiments, the housing 100 may be a straight cylindrical lamp body, or may be a lamp body with other shapes.

In addition, because the housing 100 is an integrally formed member, and meanwhile, because the lighting module 200 is connected to the inner side wall of the accommodating cavity 101 through the optical element 210 in a snap-fit manner, no additional positioning element is required between the elements of the lighting module 200, so that the number of the elements in the lamp is small, the connection between the elements is simple and convenient, the assembly difficulty is reduced, and the manufacturing cost of the whole lamp is low.

As shown in fig. 1, 2 and 3, the housing 100 has a receiving cavity 101. In specific implementation, the accommodating cavity 101 is used for accommodating the lighting module 200, and the lighting module 200 can be directly inserted into the accommodating cavity 101 from the notch of the accommodating cavity 101 for assembly.

Specifically, the housing 100 is a metal housing. The housing 100 may be an integrally formed metal member, so that the problem of complicated processing of the metal split type down lamp can be reduced. In particular, the housing 100 may be made of a heat conductive metal material such as aluminum, which has high heat conductivity. In particular implementation, the housing 100 may be obtained by integral stamping.

Referring to fig. 1 to 4, the housing 100 includes a main body 110, a face ring 120, and a mounting portion 130.

Referring to fig. 1, the main body 110 has a bottom wall 111 enclosing the accommodating cavity 101 and a side wall 112 surrounding an edge of the bottom wall 111, wherein the bottom wall 111 is a cavity bottom of the accommodating cavity 101.

In a preferred embodiment, in order to facilitate the wiring, a through hole 103 is formed on the bottom of the accommodating cavity 101, i.e. the bottom wall 111.

Referring to fig. 1, fig. 2 and fig. 3, an opening 104 is disposed on the bottom wall 111, and the opening 104 penetrates through the bottom wall 111. Therefore, the main body 110 has a barrel shape with both ends open as a whole.

With continued reference to fig. 1 to fig. 3, in the present embodiment, the size of the opening 104 is smaller than the size of the notch of the accommodating cavity 101. Therefore, the main body 110 has a barrel shape with both ends open as a whole.

Referring to fig. 2 and fig. 3, the face ring portion 120 is an annular shielding outer edge formed by extending a side of the main body portion 110 away from the bottom of the accommodating cavity 101. After the lighting fixture is installed on the installation base, the surface ring part 120 can shield the installation hole formed on the installation base, so that the attractiveness of the installed lighting fixture is improved, and the user experience is further improved. Of course, in some other embodiments, the face ring portion 120 may also be configured for lamp body 1 mounting.

Referring to fig. 2 and 3, the mounting portion 130 is connected to the housing 100 for mounting the clamp spring 300. For a description of the circlip 300, please refer to the following, which is not described herein.

Referring to fig. 1, the mounting portion 130 is formed of an additional sidewall disposed on the sidewall 112. For example, the additional sidewall is formed with a mounting finger and a T-shaped groove for positioning the clip spring 300.

Referring to fig. 1 to 4, after the assembly is completed, the side wall 112 and the bottom wall 111 of the housing 100 are respectively in contact with the optical element 210, so that heat generated by the lighting module 200 can be dissipated, and the influence on the service quality and the service life of the lighting module 200 due to an over-high temperature in the housing 100 can be avoided.

Therefore, in the lamp of the present application, the heat dissipation effect of the lamp can be improved by using the metal shell 100, and the service life and the lighting effect of the lamp can be further improved.

With reference to fig. 4 and fig. 5, the lighting module 200 is inserted into the accommodating cavity 101, and the whole lighting module 200 is fixed in the accommodating cavity 101 by the optical element 210.

In this scheme, the lighting module has assembled through optical element with the lamps and lanterns shell. Due to the arrangement, the structure of the lamp is simplified, and meanwhile, the assembly and production difficulty of the lamp is reduced.

As shown in fig. 1, 2 and 3, the illumination module 200 includes an optical element 210, a diffusing element 220 and an optoelectronic module 230. The optical element 210 is made of a reflective plastic, and a part of the light emitted by the optoelectronic module 230 enters the diffusing element 220 after being reflected by the inner surface of the optical element 210, so that the utilization rate of the light emitted by the optoelectronic module 230 is increased.

As shown in fig. 4 and 5, the optical element 210 has opposite mounting ends 211 and light exit ends 212. The mounting end 211 is a closed end, and the light-emitting end 212 is open.

To achieve the closure of the mounting end 211, a mounting base plate 213 can be provided at the mounting end 211, wherein the optoelectronic module is arranged on the mounting base plate 213. In other embodiments, the photovoltaic module may also be directly used as the mounting base 213.

As shown in fig. 4 and 5, in the present embodiment, the optical element 210 has a receiving cavity 2100 and a light emitting end 212 communicating with the receiving cavity 2100.

Referring to fig. 1, fig. 2 and fig. 3, in this embodiment, the optical element 210 is in a hollow truncated cone shape as a whole, and the optical element 210 includes a mounting bottom plate 213 and a reflective sidewall 214, the reflective sidewall 214 is disposed along an edge of the mounting bottom plate 213, the mounting bottom plate 213 and the reflective sidewall 214 together form the receiving cavity 2100 and the light emitting end 212, and the light emitting end 212 corresponds to the mounting bottom plate 213. In other words, the reflective sidewall 214 encloses a cavity with two open ends, the mounting bottom plate 213 seals one open end of the reflective sidewall 214, and the other open end of the reflective sidewall 214 forms the light emitting end 212, thereby forming the receiving cavity 2100 and the light emitting end 212.

Further, the reflecting sidewall 214 has a hollow truncated cone shape, and an outer diameter of the reflecting sidewall 214 gradually increases from the mounting base plate 213 to the light exit end 212. At this time, an included angle between the mounting base plate 213 and the reflective sidewall 214 is greater than 90 degrees, and an inner diameter of the reflective sidewall 214 gradually increases from the mounting base plate 213 to the light exit end 212.

In this embodiment, the inner surface of the reflective sidewall 214 is planar. Of course, in other embodiments, the inner surface of the reflective sidewall 214 can be configured as a paraboloid with different arc intervals according to the desired reflection angle.

Referring to fig. 2, in order to electrically connect the optoelectronic module 230 to an external power source, a lead channel 202 is disposed on a side of the optical element 210 facing the receiving cavity 101, allowing a lead between the optoelectronic module 230 and the external power source to pass through for guiding the lead, and achieving the purpose of pressing the lead and preventing the lead from being pulled.

In a preferred embodiment, the mounting base plate 213 is provided with a lead channel 202, and the lead channel 202 penetrates through the thickness of the mounting base plate 213 to allow a lead wire between the optoelectronic module 230 and an external power source to pass through.

Further, the lead channel 202 protrudes from the outer surface of the mounting base plate 213 (i.e., the surface of the mounting base plate 213 away from the accommodating cavity), so that the lead can be led out of the housing 100, thereby preventing the lead from contacting the housing 100, and improving the reliability and insulation of the lamp.

Referring to fig. 1, when the lighting module 200 is assembled in the housing 100, the lead channel 202 extends into the through hole 103 and further protrudes to be flush with the through hole 103 or flush with the through hole 103. The arrangement is that, on one hand, the lead wire is separated from the shell 100 by the lead channel 202, so that the lead wire is prevented from contacting the shell 100, and the metal shell is prevented from being electrified; on the other hand, referring to fig. 1 and fig. 3, the corresponding relationship between the lead channel 202 and the through hole 103 (referring to fig. 1 and fig. 3) can enable the lighting module 200 and the housing 100 to be aligned more quickly during assembly.

Referring to fig. 1 and fig. 4, in order to realize the snap connection, a first snap portion 102 for performing the snap connection with the optical element 210 is disposed on a side of the housing 100 facing the optical element 210, and correspondingly, a second snap portion 201 for performing the snap connection is disposed on a side of the optical element 210 facing the housing 100. Moreover, the second latching portion 201 cooperates with the first latching portion 102 for assembling the optical element 210 and the housing 100.

With reference to fig. 1 and fig. 4, in the present embodiment, the first locking portion 102 is disposed on the sidewall 112 of the main body portion 110, and the second locking portion 201 is disposed on the reflective sidewall 214 of the optical element 210.

With reference to fig. 1 and fig. 4, in the present embodiment, the first locking portion 102 may be a protrusion or a groove disposed on a side wall, and correspondingly, the second locking portion 201 is a corresponding groove or a protrusion disposed on the reflective side wall 214 of the optical element 210.

In this embodiment, the first fastening portion 102 is a groove, and the second fastening portion 201 is a protrusion. Of course, in other embodiments, the first locking portion 102 may be a protrusion, and the second locking portion 201 may be a groove.

Referring to fig. 5, a heat-fusible column 215 is disposed on a surface of the mounting base plate 213 facing the receiving cavity 2100. The heat-melting column 215 is used for assembling, positioning and heat-melting fixing the photovoltaic module 230 and the mounting base plate 213.

When mounting, the heat-fusible column 215 of the mounting base plate 213 is first inserted through the through hole of the photovoltaic module 230. The rear portion of the heat-fusible column 215 is then heated by heat-fusing, so that the mounting base plate 213 is fixed to the photovoltaic module 230 through the heat-fusible column 215.

In particular, in order to improve the insulation reliability of the lighting module, the optical element may be made of an insulating material. Such as a plastic optical element.

In the present embodiment, the optical element 210 is an integrally molded component. However, the optical element 210 is not limited thereto.

In other embodiments, the back surface of the optoelectronic module 230 may also be used as the mounting base 213 of the optical element 210, and then the optoelectronic module 230 is directly welded to the reflective sidewall 214. Generally, the mounting base plate 213 may be a part of the whole structure of the optical element 210, or may be a separate component welded to the optical element 210, or may use the back surface of the optoelectronic module 230 as the mounting base plate 213, which is more beneficial to the light-weight design of the lighting module 200.

Referring to fig. 1, 2, 4 and 5, the diffusing element 220 is disposed at the light-emitting end 212 of the optical element 210, and the diffusing element 220 is fixed on the optical element 210.

Further, the diffusing element 220 can seal the light exit end 212 of the optical element 210. Referring to fig. 1 and fig. 2, in this case, the diffusing element 220 and the optical element 210 together form a closed package 10, and the package 10 can encapsulate the entire optoelectronic module 230, so as to obtain a reliable-insulated lighting module 200.

Since the package case 10 is closed, the package case 10 can cover the whole lighting module 200. With such an arrangement, the lighting module 200 can be prevented from contacting the housing 100, the packaging effect and reliability of the lighting module 200 can be improved, and the assembling steps and the assembling difficulty of the lamp can be reduced.

In order to improve the insulation performance of the lighting module 200 and prevent the housing from being charged, the package 10 may be an insulating package. It should be noted that the insulation and the sealing performance of the package 10 do not affect the arrangement of the connecting wires or cables of the lighting modules 200, for example, the wires can pass through the aforementioned wire channels, and certainly, the wires can pass through the wire holes, the wire threading holes, or other structures for routing wires.

Referring to fig. 4 and 5, in a preferred embodiment, at the light exit end 212 of the optical element 210, the inner surface of the optical element 210 has a section of circumferentially extending stepped surface 216, the diffusing element 220 is disposed at the stepped surface 216, and the diffusing element 220 is in form-fit with the stepped surface 216 to facilitate alignment and installation of the diffusing element 220.

The present application is not limited to the non-removable connection between the diffusing element 220 and the optical element 210. In this embodiment, the diffusing element 220 is fixed to the optical element 210 by heat fusion. On one hand, the hot melting fixation has the advantages of low processing cost, high reliability and the like, and on the other hand, the insulating shell can obtain higher optical effect. In particular, ultrasonic heat melting can be adopted. In assembly, the diffusion member 220 is placed at the stepped surface 216, and then the stepped surface 216 is fixed to the diffusion member 220 by using a thermal fusion method.

Of course, in other embodiments, the diffusing element 220 and the optical element 210 may be connected by snapping or welding. Of course, the diffusing element 220 and the optical element 210 may be assembled by other methods, such as an interference fit or an adhesive combination, which is not limited herein.

Referring to fig. 4, the diffusion element 220 is a flat plate, i.e., the diffusion element is implemented as a diffusion plate. The diffusing element 220 has an inner and an outer oppositely disposed horizontal plane, wherein the inner horizontal plane faces the inner surface of the optical element as a light incident plane. The outer horizontal surface faces outward as a light emitting surface.

In this embodiment, the light incident surface and the light emitting surface of the diffusion plate are both flat surfaces, but the present application is not limited thereto. In specific implementation, the uniform illumination of the lamp can be realized by setting the dispersion angle of the diffusion plate. Different light distributions can be obtained step by step from small to large dispersion angles, such as batwing (8 degrees), inverted triangle (15 degrees) and drop-shaped light distribution (20 degrees).

Referring to fig. 2 and fig. 3, the optoelectronic module 230 is fixedly received in the receiving cavity 2100 of the optical element 210, and the optoelectronic module 230 corresponds to the light-emitting end 212. At this time, the photovoltaic module 230 is fixedly disposed within the insulating case, and the photovoltaic module 230 is disposed corresponding to the diffusion member 220.

Referring to fig. 4 and 5, the optoelectronic module 230 is fixed on a side of the mounting base plate 213 facing the light-emitting end 212. The optoelectronic module 230 may be fixed on the mounting base plate 213 by heat fusion, so as to reduce the manufacturing cost and improve the reliability of the lighting module 200.

In this embodiment, a non-detachable connection manner between the optoelectronic module 230 and the optical element 210 is not limited, and other non-detachable connections (e.g., thermal fusion) may be used besides the connection manner (e.g., non-detachable connection) provided in this embodiment, for example, the optoelectronic module 230 and the optical element 210 are embedded to form an interference fit to form a non-detachable connection, or form a non-detachable connection by an adhesive bonding manner.

In particular, the optoelectronic module 230 may be an optoelectronic integrated board. The photoelectric integrated board comprises a power panel and an LED light source arranged on the power panel, wherein the power panel is fixed on one side of the mounting bottom plate 213 facing to the light-emitting end 212, and the LED light source is arranged on one side of the power panel facing to the light-emitting end 212. Wherein the power panel can be an FPC substrate.

As shown in fig. 1, 2 and 3, the lighting module 200 further includes a wire 240, the wire 240 is used for electrically connecting the optoelectronic module 230 with an external power source, and the wire 240 can pass through the lead channel 202.

Referring to fig. 1, fig. 2 and fig. 3, in the present embodiment, one end of the wire 240 is connected to the optoelectronic module 230, and the other end of the wire 240 passes through the lead channel 202 and out of the package 10 and the housing 100.

Referring to fig. 1, 2 and 3, a wire sheath 241 is sleeved on the wire 240 near one end of the optoelectronic module 230, and the wire channel allows the wire 240 to pass through. That is, after the assembly is completed, the wire sheath 241 and the wires sleeved in the wire sheath 241 are all passed through by the lead channel.

With continued reference to fig. 4 and 5, the lamp further includes a plurality of clamp springs 300, where the clamp springs 300 are used to mount the lamp on a mounting base, and the mounting base may be a ceiling. Of course, other methods are possible, and this application is not limited thereto.

As shown in fig. 1 and 2, the circlip 300 includes an extension 320 and an elastic part 310 connected together. The elastic part 310 is used for connecting the clamp spring 300 with the housing 100, and meanwhile, the elastic part 310 can provide resilience for the extension part 320, and the extension part 320 is used for connecting with a mounting base, so that the mounting of the lighting fixture is realized.

As shown in fig. 1, 2 and 5, the elastic portion 310 is sleeved on the mounting finger of the mounting portion 130 and is limited by a positioning structure extending in front of the elastic portion.

In this embodiment, the positioning structure is a single wire metal. In other embodiments, the locating structure may be a closed rectangle.

In order to make the connection between the lamp body and the mounting base more stable and reliable, in another optional embodiment, the number of the clamp springs 300 may be at least two, and at least the clamp springs 300 are symmetrically arranged. The number of the circlips 300 may be at least two, and the at least two mounting portions 130 are disposed in one-to-one correspondence with the at least two circlips 300. In this scheme, the quantity of installation department 130 is more, and then can install more jump rings 300 to improve lamps and lanterns and installation foundation's joint strength, and then make lamps and lanterns and installation foundation be connected more stably, reliably.

As shown in fig. 1, 2 and 4, the latch spring 300 is torsionally held on the mounting portion 130, and the latch spring 300 has a clamping position abutting against the mounting base and a release position separated from the mounting base with respect to the mounting base.

The present application is described in detail above, and the principle and the implementation of the present application are explained by applying specific examples, and the description of the above examples is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A light fixture, comprising:

a housing having an accommodating chamber;

2. The lamp of claim 1, wherein the optical element is a reflector, a lens, or a unitary element fixedly integrated by the reflector and the lens.

3. The lamp according to claim 1, wherein the optical element is assembled in the accommodating cavity by a snap connection, a screw connection, a magnetic connection, a thermal fusion connection, an interference fit, a welding or an adhesive bonding.

4. A lamp as set forth in claim 3, wherein one of a projection and a card slot is provided on a side of the housing facing the optical element, and the other of the projection and the card slot is provided on a side of the optical element facing the housing, the optical element and the housing being connected together by the projection and the card slot cooperating.

5. The lamp of claim 1 wherein said diffusing element is assembled with said optical element by at least one of heat staking, interference fit, and adhesive bonding.

6. The luminaire of claim 1, wherein the optoelectronic module and the optical element are assembled together by at least one of heat staking, interference fit, and adhesive bonding.

7. A lamp as recited in claim 1, wherein said optical element and said diffusing element together form a closed enclosure, said optoelectronic module being enclosed within said enclosure.

8. The luminaire of claim 7, wherein the optical element comprises:

the mounting end is provided with a mounting bottom plate, and the photoelectric module is arranged on the mounting bottom plate, or the photoelectric module is used as the mounting bottom plate and is welded with the optical element into a whole;

and the light-emitting end is in an opening shape, and the diffusion element seals the light-emitting end.

9. The lamp of claim 8, wherein the optical element has a hollow truncated cone shape, and wherein an outer diameter of the optical element gradually increases from the mounting end to the light exit end.

10. The lamp of claim 7 wherein said diffuser element is planar and has oppositely disposed inner and outer horizontal surfaces, wherein said inner horizontal surface faces an inner surface of said optical element and said outer horizontal surface faces outwardly.

11. The lamp of claim 8 wherein a stepped surface is provided on an inner circumferential surface of the optical element at the light exit end, the stepped surface being in locating engagement with the diffuser element.

12. The lamp as claimed in claim 1, wherein a side of the optical element facing the bottom of the accommodating cavity is provided with a lead channel, and the lead channel is communicated with the optical element;

13. The lamp as claimed in claim 12, wherein the bottom of the receiving cavity is provided with a through hole corresponding to the lead channel, and the lead channel extends into the through hole.

14. The luminaire of claim 1, wherein the housing has:

and a face ring part connected to the main body part.

15. The lamp of claim 14, wherein the housing has a mounting portion disposed on the body portion;

the lamp further comprises a clamp spring arranged on the mounting portion.

16. The lamp of claim 1, wherein the housing is an integrally formed metal member.