CN214544959U - Positioning mechanism for electroplating processing of circuit board - Google Patents
Positioning mechanism for electroplating processing of circuit board Download PDFInfo
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- CN214544959U CN214544959U CN202120150471.6U CN202120150471U CN214544959U CN 214544959 U CN214544959 U CN 214544959U CN 202120150471 U CN202120150471 U CN 202120150471U CN 214544959 U CN214544959 U CN 214544959U
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- circuit board
- positioning mechanism
- frame
- support frame
- fixedly connected
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Abstract
The utility model provides a positioning mechanism for circuit board electroplating process belongs to circuit board positioning mechanism technical field, and this positioning mechanism for circuit board electroplating process includes the locating frame, the last fixed surface of locating frame is connected with electric putter, electric putter keeps away from the one end fixedly connected with mount of locating frame, the equal fixedly connected with fixed column in both sides of mount lower surface, the one end fixedly connected with support frame of mount is kept away from to the fixed column, the lower fixed surface of support frame is connected with the clamp plate, the surface of support frame has cup jointed the spacing collar. This positioning mechanism for circuit board electroplating process, when needs fix the circuit board, the staff can place the circuit board inside the standing groove earlier, then starts electric putter, then electric putter can drive the mount downstream, then can make the four corners of clamp plate and circuit board contact, can fix the circuit board, easy operation and fixed firm.
Description
Technical Field
The utility model belongs to the technical field of circuit board positioning mechanism, concretely relates to positioning mechanism is used in circuit board electroplating process.
Background
The printed circuit board is an important component of various electronic products, and functions of the electronic products are realized through the printed circuit board. Electroplating is an indispensable part in the manufacturing process of the circuit board, and the circuit board is firstly positioned and fixed in the electroplating process.
The traditional circuit board positioning and fixing steps are complex, the circuit board is not fixed firmly, the circuit board is easy to deform and damage, and the circuit boards with different thicknesses cannot be fixed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a positioning mechanism for circuit board electroplating process aims at solving among the prior art circuit board location fixed step comparatively complicated, and is fixed insecure to the circuit board, easily makes the circuit board produce and warp and damage to can not satisfy the problem of fixing to the circuit board of different thickness.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a positioning mechanism for circuit board electroplating process, includes the posting, the last fixed surface of posting is connected with electric putter, electric putter keeps away from the one end fixedly connected with mount of posting, the equal fixedly connected with fixed column in both sides of mount lower surface, the one end fixedly connected with support frame of mount is kept away from to the fixed column, the lower fixed surface of support frame is connected with the clamp plate, the spacing collar has been cup jointed to the surface of support frame, one side fixedly connected with limit baffle of spacing collar, spacing collar and support frame carry out fixed connection through positioning bolt.
In order to make this a circuit board positioning mechanism for electroplate processing reach the fixed more firm purpose of locating frame, conduct the utility model relates to an it is preferred, the equal fixedly connected with mounting panel in both sides of locating frame, the mounting hole has been seted up to the upper surface of mounting panel, the inside of mounting hole is provided with fixing bolt.
In order to make this a circuit board positioning mechanism for electroplate processing reach the purpose of being convenient for fix a position the circuit board, as the utility model relates to an it is preferred, the standing groove has been seted up to the upper surface of posting, the inside of standing groove is provided with the circuit board.
In order to make this a circuit board positioning mechanism for electroplate processing reach the better purpose of support frame supporting effect, conduct the utility model relates to an it is preferred, the appearance of support frame is the U font.
In order to make this a circuit board positioning mechanism for electroplate processing reach the fixed more firm purpose of circuit board, conduct the utility model relates to an it is preferred, the quantity of clamp plate is four, just the appearance of clamp plate is circular.
In order to make this a positioning mechanism for circuit board electroplating process reach the spacing collar of being convenient for and carry out the purpose that the position was fixed, as the utility model relates to an it is preferred, the locating hole has been seted up in the front of support frame.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this positioning mechanism for circuit board electroplating process sets up through the cooperation between locating frame, electric putter, mount, fixed column, support frame, clamp plate, standing groove and the circuit board, when needs fix the circuit board, the staff can place the circuit board inside the standing groove earlier, then starts electric putter, then electric putter can drive the mount downstream, then can make the four corners of clamp plate and circuit board contact, can fix the circuit board, easy operation and fixed firm.
2. This positioning mechanism for circuit board electroplating process, through the support frame, the locating frame, the clamp plate, the spacing collar, cooperation setting between limit baffle and the positioning bolt, the staff can unscrew positioning bolt, then slide the spacing collar, then the interval of adjustable limit baffle and clamp plate, according to limit baffle's position, then the height that steerable clamp plate descends, thereby the device can press from both sides tightly the circuit board of different thickness, because the position of adjusting limit baffle in advance, then the condition of too big circuit board crush can not appear exerting oneself under the clamp plate with the in-process, guarantee the integrality of circuit board.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the right view axis structure of the present invention;
FIG. 2 is a schematic view of the left view axis structure of the present invention;
fig. 3 is a schematic sectional structure of the present invention;
fig. 4 is a schematic view of an axial structure of the middle support frame of the present invention;
fig. 5 is an enlarged schematic structural diagram of a position a in fig. 4 according to the present invention.
In the figure: 1. a positioning frame; 2. an electric push rod; 3. a fixed mount; 4. fixing a column; 5. a support frame; 6. pressing a plate; 7. a limiting ring; 8. a limit baffle; 9. positioning the bolt; 10. mounting a plate; 11. mounting holes; 12. fixing the bolt; 13. a placement groove; 14. a circuit board; 15. and (7) positioning the holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a positioning mechanism for electroplating process of circuit board, including locating frame 1, the last fixed surface of locating frame 1 is connected with electric putter 2, electric putter 2 keeps away from the one end fixedly connected with mount 3 of locating frame 1, the equal fixedly connected with fixed column 4 in both sides of 3 lower surfaces of mount, the one end fixedly connected with support frame 5 of mount 3 is kept away from to fixed column 4, the lower fixed surface of support frame 5 is connected with clamp plate 6, spacing collar 7 has been cup jointed to the surface of support frame 5, one side fixedly connected with limit baffle 8 of spacing collar 7, spacing collar 7 carries out fixed connection through positioning bolt 9 with support frame 5.
In the embodiment of the present invention, through the matching arrangement between the positioning frame 1, the electric push rod 2, the fixing frame 3, the fixing column 4, the supporting frame 5, the pressing plate 6, the placing groove 13 and the circuit board 14, when the circuit board 14 needs to be fixed, a worker can first place the circuit board 14 inside the placing groove 13, then start the electric push rod 2, the electric push rod 2 will drive the fixing frame 3 to move downwards, so that the pressing plate 6 can contact with four corners of the circuit board 14, and the circuit board 14 can be fixed, the operation is simple and the fixation is firm, through the matching arrangement between the supporting frame 5, the positioning frame 1, the pressing plate 6, the limiting ring 7, the limiting baffle 8 and the positioning bolt 9, the worker can unscrew the positioning bolt 9, then slide the limiting ring 7, the distance between the limiting baffle 8 and the pressing plate can be adjusted, according to the position of the limiting baffle 8, the height of the pressing plate 6 can be controlled to descend, therefore, the device can clamp circuit boards 14 with different thicknesses, and due to the fact that the position of the limiting baffle 8 is adjusted in advance, the circuit boards 14 cannot be crushed by excessive force in the pressing process of the pressing plate 6, and the completeness of the circuit boards 14 is guaranteed.
Specifically, the mounting plate 10 is fixedly connected to two sides of the positioning frame 1, the mounting hole 11 is formed in the upper surface of the mounting plate 10, and the fixing bolt 12 is arranged inside the mounting hole 11.
In this embodiment: the positioning frame 1 can be fixed more firmly by the arrangement of the fixing bolt 12 and the mounting plate 10.
Specifically, a placement groove 13 is formed in the upper surface of the positioning frame 1, and a circuit board 14 is disposed inside the placement groove 13.
In this embodiment: positioning of the wiring board 14 is facilitated by the provision of the placement groove 13.
Specifically, the supporting frame 5 is U-shaped.
In this embodiment: through the setting of support frame 5, can make support frame 5 support effect better.
Specifically, the number of the pressing plates 6 is four, and the pressing plates 6 are circular in shape.
In this embodiment: by the arrangement of the pressing plate 6, the circuit board 14 can be fixed more firmly.
Specifically, the front surface of the support frame 5 is provided with a positioning hole 15.
In this embodiment: the limiting ring 7 is convenient to position through the arrangement of the positioning hole 15.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
The utility model discloses a theory of operation and use flow: when the positioning mechanism for electroplating processing of the circuit board is used, a worker can firstly place the circuit board 14 in the placing groove 13, then the electric push rod 2 is started, the electric push rod 2 can drive the fixing frame 3 to move downwards, the pressing plate 6 can be in contact with four corners of the circuit board 14, the circuit board 14 can be fixed, the operation is simple, the fixing is firm, the distance between the limiting baffle 8 and the pressing plate can be adjusted by arranging the supporting frame 5, the positioning frame 1, the pressing plate 6, the limiting ring 7, the limiting baffle 8 and the positioning bolt 9 in a matched mode, the worker can unscrew the positioning bolt 9 and then slide the limiting ring 7, the descending height of the pressing plate 6 can be controlled according to the position of the limiting baffle 8, therefore, the device can clamp the circuit boards 14 with different thicknesses, and due to the fact that the position of the limiting baffle 8 is adjusted in advance, the situation that the circuit board 14 is crushed by excessive force in the pressing plate 6 can not occur in the process, ensuring the integrity of the wiring board 14.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a positioning mechanism for circuit board electroplating process, includes positioning frame (1), its characterized in that: the upper surface fixed connection of locating frame (1) has electric putter (2), the one end fixedly connected with mount (3) of locating frame (1) is kept away from electric putter (2), the equal fixedly connected with fixed column (4) in both sides of mount (3) lower surface, the one end fixedly connected with support frame (5) of mount (3) are kept away from fixed column (4), the lower fixed surface of support frame (5) is connected with clamp plate (6), spacing collar (7) has been cup jointed to the surface of support frame (5), one side fixedly connected with limit baffle (8) of spacing collar (7), fixed connection is carried out through positioning bolt (9) with support frame (5) spacing collar (7).
2. The positioning mechanism for the electroplating processing of the circuit board according to claim 1, characterized in that: the locating frame is characterized in that mounting plates (10) are fixedly connected to the two sides of the locating frame (1), mounting holes (11) are formed in the upper surface of each mounting plate (10), and fixing bolts (12) are arranged inside the mounting holes (11).
3. The positioning mechanism for the electroplating processing of the circuit board according to claim 1, characterized in that: a placing groove (13) is formed in the upper surface of the positioning frame (1), and a circuit board (14) is arranged in the placing groove (13).
4. The positioning mechanism for the electroplating processing of the circuit board according to claim 1, characterized in that: the supporting frame (5) is U-shaped in appearance.
5. The positioning mechanism for the electroplating processing of the circuit board according to claim 1, characterized in that: the number of the pressing plates (6) is four, and the shape of each pressing plate (6) is circular.
6. The positioning mechanism for the electroplating processing of the circuit board according to claim 1, characterized in that: the front surface of the support frame (5) is provided with a positioning hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120150471.6U CN214544959U (en) | 2021-01-20 | 2021-01-20 | Positioning mechanism for electroplating processing of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120150471.6U CN214544959U (en) | 2021-01-20 | 2021-01-20 | Positioning mechanism for electroplating processing of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214544959U true CN214544959U (en) | 2021-10-29 |
Family
ID=78311443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120150471.6U Active CN214544959U (en) | 2021-01-20 | 2021-01-20 | Positioning mechanism for electroplating processing of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214544959U (en) |
-
2021
- 2021-01-20 CN CN202120150471.6U patent/CN214544959U/en active Active
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