CN214540691U

CN214540691U - Radiator fan of dislocation design and server thereof

Info

Publication number: CN214540691U
Application number: CN202120774395.6U
Authority: CN
Inventors: 聂爱君
Original assignee: Shenzhen Guoxin Hengyun Information Security Co Ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co Ltd
Priority date: 2021-04-15
Filing date: 2021-04-15
Publication date: 2021-10-29
Anticipated expiration: 2031-04-15

Abstract

The utility model provides a radiator fan of dislocation design and server thereof, radiator fan of dislocation design includes: the heat dissipation fan module comprises a bottom plate, side plates, a dislocation support and a heat dissipation fan module, wherein the dislocation support comprises at least one stepped feature support, the heat dissipation fan module passes through the stepped feature support and is arranged above the bottom plate in a dislocation mode, and the side plates are arranged on two sides of the heat dissipation fan module. The utility model discloses can utilize vertical space to realize the installation of radiator fan module to the utmost extent, and still increase its installation and the convenient degree when dismantling through the dislocation design, be convenient for the assembly and the later maintenance of product, the flexibility is high; the utility model discloses effectively improve the assembly efficiency and the stability ability of product, accorded with modern design concept and requirement, promoted the design quality and the humanized design degree of product.

Description

Radiator fan of dislocation design and server thereof

Technical Field

The utility model relates to a radiator fan especially relates to a radiator fan that can carry out the dislocation design in rational utilization space to a server including this dislocation design's radiator fan is related to.

Background

The existing server is widely applied, the requirements on data calculation amount and processing capacity are high, the number of CPU modules, PCIE modules and the like which need to be carried in the server is large, the price is high, the heat productivity is large, in different application environments, the heat dissipation requirements are different due to different performances and devices, the number of required heat dissipation fans is different, if each heat dissipation fan of the server is independently installed and connected, the assembly and later maintenance of products are complicated, and the workload and the cost are increased; furthermore, internal space and size requirements for the server may also be limited.

Disclosure of Invention

The utility model aims to solve the technical problem that a need provide one kind can the rational utilization space, the assembly and the later maintenance of the product of being convenient for to improve the assembly efficiency of product and the radiator fan of the dislocation design of stability ability, on this basis, still further related to the server including this dislocation design's radiator fan.

To this end, the utility model provides a radiator fan of dislocation design, include: the heat dissipation fan module comprises a bottom plate, side plates, a dislocation support and a heat dissipation fan module, wherein the dislocation support comprises at least one stepped feature support, the heat dissipation fan module passes through the stepped feature support and is arranged above the bottom plate in a dislocation mode, and the side plates are arranged on two sides of the heat dissipation fan module.

The utility model discloses a further improvement lies in, the radiator fan module includes module support and radiator fan, radiator fan set up in the module support.

The utility model discloses a further improvement lies in, be provided with first fan module spout and second fan module spout on the inner wall of curb plate, the outside of module support be provided with first fan module spout and the corresponding first spacing post of second fan module spout.

The utility model discloses a further improvement lies in, the inner wall of module support is provided with the radiator fan spout, radiator fan's the frame outside be provided with the spacing post of second that the radiator fan spout corresponds, radiator fan passes through spacing post of second and radiator fan spout install extremely in the module support.

The utility model discloses a further improvement lies in, the both sides top of module support is provided with the screens press piece, the screens press piece is kept away from one side of radiator fan is provided with the screens bellying, be provided with on the curb plate with the trompil that the screens bellying corresponds mutually.

The utility model discloses a further improvement lies in, the overhead gage of dislocation support is provided with keeps away the vacancy, keep away the vacancy the position with radiator fan in the radiator fan module position is corresponding.

The utility model discloses a further improvement lies in, the dislocation support all is provided with the fan power supply platelet in the side bottom of every layer radiator fan module, radiator fan's lower extreme is provided with the fan connector in the radiator fan module, the fan connector insert extremely on the fan power supply platelet.

The utility model discloses a further improvement lies in, the curb plate outer wall of dislocation support both sides still is provided with the collateral branch frame, the dislocation support passes through the collateral branch frame is connected with the quick-witted case of server.

The utility model discloses a further improvement lies in, the radiator fan module includes two at least radiator fan that set up side by side, radiator fan passes through the damping connecting piece and installs in radiator fan's frame.

The utility model also provides a server, included quick-witted case, mainboard and as above the radiator fan of dislocation design, the radiator fan of dislocation design set up in quick-witted incasement, and with the mainboard electricity is connected.

Compared with the prior art, the beneficial effects of the utility model reside in that: the radiator fan module passes through cascaded characteristic support dislocation set in the top of bottom plate, the curb plate set up in the both sides of radiator fan module, such structural design can utilize the vertically space to realize by the at utmost the installation of radiator fan module to still increase its installation and convenient degree when dismantling through the dislocation design, the assembly and the later maintenance of the product of being convenient for have improved production efficiency, and the assembly flexibility is high, and in addition, still improved the assembly efficiency and the stability can of product effectively through further optimization structural design, accord with modern design concept and requirement, promoted the design quality and the humanized design degree of product.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of the present invention before a cooling fan module is installed;

fig. 2 is an exploded schematic view of a cooling fan module according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of an embodiment of the present invention including two cooling fan modules;

fig. 4 is a schematic perspective view of a single cooling fan module according to an embodiment of the present invention;

fig. 5 is a schematic perspective view of a single heat dissipation fan at another angle according to an embodiment of the present invention;

fig. 6 is an enlarged schematic view of a partial structure of a module holder according to an embodiment of the present invention;

fig. 7 is a schematic cross-sectional view of an embodiment of the present invention;

fig. 8 is a schematic structural view of the heat dissipation fan module according to an embodiment of the present invention after being installed;

fig. 9 is a schematic structural diagram of a chassis of a server according to an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 8, this embodiment provides a heat dissipation fan with a staggered design, which includes: bottom plate 1, curb plate 2, dislocation support 3 and radiator fan module 4, dislocation support 3 includes at least one cascaded characteristic support 31, radiator fan module 4 passes through cascaded characteristic support 31 dislocation set up in the top of bottom plate 1, curb plate 2 set up in radiator fan module 4's both sides.

In this embodiment, the bottom plate 1 is a bottom plate of a frame body of the heat dissipation fan with the staggered design, the side plates 2 are side baffles at two sides of the heat dissipation fan module 4, the staggered support 3 is a support for realizing the staggered arrangement of the heat dissipation fan module 4, and the staggered support 3 preferably comprises a plurality of symmetrical hollowed-out windows 34, so that the fixing effect is realized conveniently, and the heat dissipation effect is also ensured; the staggered support 3 includes at least one stepped feature support 31, the stepped feature support 31 refers to a stepped support structure, and each step in the stepped feature support 31 can be provided with one layer of the cooling fan module 4, so the present embodiment is not limited to the double-layer cooling fan module 4, and can be set according to actual needs, for example, a 4U chassis is provided with the double-layer cooling fan module 4, and a 6U chassis is provided with the three-layer cooling fan module 4, the drawings of the present embodiment take the double-layer cooling fan module 4 as an example, and the structural design principles of the three-layer cooling fan module 4 are the same.

In this embodiment, preferably, at least two layers of the heat dissipation fan modules 4 are sequentially installed from bottom to top according to the steps of the dislocation bracket 3, so that the at least two layers of the heat dissipation fan modules 4 can be installed above the bottom plate; when the radiator fan module 4 is disassembled, the radiator fan module 4 of each layer is preferably taken out from top to bottom in sequence, so that the disassembly is reasonably realized by fully utilizing the stepped structure, and the radiator fan modules 4 on different layers are prevented from shielding to influence the disassembly.

As shown in fig. 1, a first fan module sliding groove 21 and a second fan module sliding groove 22 are disposed on an inner wall of the side plate 2, the first fan module sliding groove 21 is a groove structure for inserting the bottom heat dissipation fan module 4, and the second fan module sliding groove 22 is a groove structure for inserting the upper heat dissipation fan module 4; as shown in fig. 2, the heat dissipation fan module 4 includes a module bracket 41 and a heat dissipation fan 42, the heat dissipation fan 42 is disposed in the module bracket 41, and the module bracket 41 is a fan module bracket structure for mounting and dismounting the heat dissipation fan 42; a first limiting column 411 corresponding to the first fan module sliding groove 21 and the second fan module sliding groove 22 is arranged on the outer side of the module bracket 41, and the first limiting column 411 is of a stand column structure which is inserted into the first fan module sliding groove 21 and the second fan module sliding groove 22, so that the rapid installation, limiting and disassembly are facilitated; when the heat dissipation fan module 4 is installed, firstly, the heat dissipation fan module 4 is inserted into the first fan module sliding groove 21 through the first limiting column 411 so as to be installed on the bottom plate 1, and a bottom heat dissipation fan module 4 is formed; then, the heat dissipation fan module 4 is inserted into the second fan module sliding slot 22 through the first limiting column 411 so as to be mounted to the stepped feature bracket 31 of the offset bracket 3, thereby forming a heat dissipation fan module 4 on the upper layer, as shown in fig. 7.

As shown in fig. 2 to 4, in the present embodiment, at least two heat dissipation fans 42 are installed in parallel in the module bracket 41, preferably, two heat dissipation fans 42 are installed in the same module bracket 41 to form a dual-fan heat dissipation module, so that the heat dissipation fan module 4 including two heat dissipation fans 42 is obtained as an independent fan assembly, which can improve the assembly efficiency and ensure the flexibility and reliability of the product, and fig. 2 and 3 are schematic structural diagrams of two such heat dissipation fan modules 4. As shown in fig. 1 and fig. 2, in this embodiment, a side plate 2 is disposed between two adjacent heat dissipation fan modules 4, and both sides of the side plate 2 are preferably provided with the first fan module sliding groove 21 and the second fan module sliding groove 22, so as to meet the assembly requirement of each heat dissipation fan module 4.

Preferably, as shown in fig. 5 and 6, in this embodiment, the top portions of the first fan module sliding groove 21 and the second fan module sliding groove 22 are preferably flared inlets with a wide top and a narrow bottom, and the flared inlets refer to an opening structure with a wide top and a narrow bottom.

Similarly, the top of the chute 412 of the cooling fan in this embodiment is also preferably a trumpet-shaped introduction port with a wide top and a narrow bottom, and the bottoms of the first limiting column 411 and the second limiting column 421 are preferably arc-shaped structures, so that the convenience and flexibility of assembly can be further increased.

As shown in fig. 2 and fig. 5, in this embodiment, a heat dissipation fan sliding groove 412 is preferably formed on an inner wall of the module bracket 41, the heat dissipation fan sliding groove 412 is a groove structure for assembling the heat dissipation fan 42, a second limiting column 421 corresponding to the heat dissipation fan sliding groove 412 is disposed on an outer side of a frame of the heat dissipation fan 42, the heat dissipation fan 42 is installed in the module bracket 41 through the second limiting column 421 and the heat dissipation fan sliding groove 412, and the second limiting column 421 is a column structure for realizing insertion on an outer side of the heat dissipation fan 42.

As shown in fig. 2 to 4, in this embodiment, the top of the module holder 41 is provided with a locking pressing member 413, the locking pressing member 413 is an elastic pressing member, a locking protrusion 414 is disposed on a side of the locking pressing member 413 away from the heat dissipation fan 42, and the locking protrusion 414 is a protrusion member for realizing locking; the side plate 2 is provided with an opening 23 corresponding to the clamping convex part 414; when the cooling fan module 4 is assembled, the locking protrusion 414 is locked into the opening 23.

As shown in fig. 1 and 4, in this embodiment, when the heat dissipation fan 42 is mounted in the module holder 41, the locking pressing piece 413 cannot be pressed inward, and the locking action between the side plate 2 and the module holder 41 is realized by the engagement between the opening 23 and the locking protrusion 414, so as to ensure the stability and reliability of the structure; after the heat dissipation fan 42 is drawn out, there is enough space inside the module holder 41 so that the position-locking pressing piece 413 can be pressed inward, thereby separating the module holder 41 from the side plate 2. By means of the ingenious structural design, the fan assembly can be assembled quickly and flexibly, disassembly, maintenance and replacement can be well achieved, the universality of the fan assembly is enhanced, the research and development period of the product is shortened, the material sharing performance is effectively improved, and the material cost is reduced.

Preferably, in this embodiment, when mounting, the heat dissipation fan 42 is first assembled into the module bracket 41 to obtain an assembled heat dissipation fan module 4, as shown in fig. 3 and 4, and then the assembled heat dissipation fan module 4 is assembled above the bottom plate 1, as shown in fig. 8; when disassembling, the heat dissipation fan 42 is firstly pulled out from the module holder 41, and then the position-locking pressing piece 413 of the module holder 41 is pressed inward, so that the position-locking protrusion 414 is separated from the opening 23, and then the module holder 41 is pulled out.

As shown in fig. 1 and 8, the top baffle of the dislocation bracket 3 of the present embodiment is provided with a space-avoiding portion 32, the position of the space-avoiding portion 32 corresponds to the position of the heat dissipation fan 42 in the heat dissipation fan module 4, so as to reserve a space-avoiding position, and enable the insertion of a finger or a clamping device, so as to clamp two sides of the heat dissipation fan 42 and draw out the heat dissipation fan, and at the same time, provide a space-avoiding position for the fan connector 43 when the heat dissipation fan module 4 is inserted, thereby increasing the convenience of disassembly and maintenance without additional disassembling and assembling tools.

As shown in fig. 1 and 9, in the present embodiment, the fan power supply small plate 33 is disposed at the bottom of the side edge of each layer of the heat dissipation fan module 4 of the dislocation bracket 3, a fan connector 43 is disposed at the lower end of the heat dissipation fan 42 in the heat dissipation fan module 4, and the fan connector 43 is inserted into the fan power supply small plate 33, so as to implement the electrical interface insertion and connection of the heat dissipation fan 42, ensure power supply, simplify the connection relationship, and ensure the stability and reliability of the product.

As shown in fig. 8, in this embodiment, side brackets 5 are further disposed on outer walls of the side plates 2 at both sides of the offset bracket 3, and the offset bracket 3 is connected to a chassis 6 of the server through the side brackets 5 so as to fix the offset heat dissipation fan. As shown in fig. 2 to 4, the heat dissipation fan module 4 of the present embodiment includes at least two heat dissipation fans 42 arranged in parallel, so as to improve the assembly efficiency through a modular design; the heat dissipation fan 42 is installed in the frame of the heat dissipation fan 42 through a vibration reduction connecting piece 44, and the vibration reduction connecting piece 44 may be preferably a vibration reduction silicone nail, so as to further increase the vibration reduction effect and improve the humanized design degree of the product.

As shown in fig. 9, this example further provides a server, which includes a chassis 6, a motherboard 7, and the heat dissipation fan with the staggered design, where the heat dissipation fan with the staggered design is disposed in the chassis 6 and electrically connected to the motherboard 7, and more specifically, the heat dissipation fan with the staggered design has a fan power supply platelet 33 connected to the motherboard 7 to achieve electrical connection, and the connection mode is simple and the path is short.

In conclusion, in the present embodiment, the heat dissipation fan module 4 is disposed above the bottom plate 1 in a staggered manner through the stepped feature support 31, and the side plates 2 are disposed on two sides of the heat dissipation fan module 4, so that the structure design can utilize the vertical space to the maximum extent to achieve the installation of the heat dissipation fan module 4, and the convenience in installation and disassembly is further increased through the staggered design, so that the assembly and later maintenance of the product are facilitated, the production efficiency is improved, the assembly flexibility is high, in addition, the assembly efficiency and the stability of the product are effectively improved through various further optimized structure designs, the modern design concept and requirements are met, and the design quality and the humanized design degree of the product are improved.

The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims

1. The utility model provides a radiator fan of dislocation design which characterized in that includes: the heat dissipation fan module comprises a bottom plate, side plates, a dislocation support and a heat dissipation fan module, wherein the dislocation support comprises at least one stepped feature support, the heat dissipation fan module passes through the stepped feature support and is arranged above the bottom plate in a dislocation mode, and the side plates are arranged on two sides of the heat dissipation fan module.

2. The staggered heat dissipation fan of claim 1, wherein the heat dissipation fan module comprises a module support and a heat dissipation fan, and the heat dissipation fan is disposed in the module support.

3. The heat dissipation fan with staggered design according to claim 2, wherein the inner wall of the side plate is provided with a first fan module sliding groove and a second fan module sliding groove, and the outer side of the module bracket is provided with a first limiting column corresponding to the first fan module sliding groove and the second fan module sliding groove.

4. The heat dissipation fan with staggered design according to claim 2, wherein a heat dissipation fan sliding groove is formed in an inner wall of the module bracket, a second limiting post corresponding to the heat dissipation fan sliding groove is arranged on an outer side of a frame of the heat dissipation fan, and the heat dissipation fan is installed in the module bracket through the second limiting post and the heat dissipation fan sliding groove.

5. The heat dissipation fan with staggered design according to claim 2, wherein the top of the module holder is provided with a positioning pressing member, the positioning pressing member is provided with a positioning protrusion on a side thereof away from the heat dissipation fan, and the side plate is provided with an opening corresponding to the positioning protrusion.

6. The heat dissipation fan with staggered design according to any one of claims 1 to 5, wherein the top baffle of the staggered support is provided with a space avoiding position, and the position of the space avoiding position corresponds to the position of the heat dissipation fan in the heat dissipation fan module.

7. The heat dissipating fan with staggered design according to any one of claims 1 to 5, wherein the staggered support frame is provided with a fan power supply small plate at the bottom of the side edge of each layer of heat dissipating fan module, and the lower end of the heat dissipating fan in the heat dissipating fan module is provided with a fan connector which is inserted into the fan power supply small plate.

8. The cooling fan with staggered design according to any one of claims 1 to 5, wherein side brackets are further arranged on the outer walls of the side plates on both sides of the staggered bracket, and the staggered bracket is connected with the chassis of the server through the side brackets.

9. The cooling fan with staggered design according to any one of claims 1 to 5, wherein the cooling fan module comprises at least two cooling fans arranged in parallel, and the cooling fans are installed in a frame of the cooling fans through vibration damping connectors.

10. A server, comprising a chassis, a motherboard, and the cooling fan with staggered design according to any one of claims 1 to 9, wherein the cooling fan with staggered design is disposed in the chassis and electrically connected to the motherboard.