CN214540664U

CN214540664U - Packaging structure for computer electronic component

Info

Publication number: CN214540664U
Application number: CN202121129639.1U
Authority: CN
Inventors: 陈平; 蒋朝阳
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-10-29
Anticipated expiration: 2031-05-25

Abstract

The utility model provides a packaging structure for computer electronic components belongs to electronic components and parts storage facilities technical field to solve packaging structure stability not enough, and use packaging structure dismouting electronic components problem convenient inadequately, including the box, the box passes through straining device and cover connection, and the cover plate bottom is provided with the multiunit installation section of thick bamboo, all is provided with damping spring B in the multiunit installation section of thick bamboo, is provided with the encapsulation check in the box, has seted up multiunit mounting groove and multiunit locked groove on the encapsulation check respectively, and the multiunit installation section of thick bamboo corresponds with the multiunit mounting groove respectively, is provided with two sets of placement module in the encapsulation check, and two sets of placement module both ends all are provided with two sets of installation mechanism; through damping spring A and damping spring B's mutually supporting, increased this neotype stability, through installation mechanism and straining device's setting, the switch operation of apron is easy, can automatic fixation electronic components after covering the apron for electronic components's dismouting is more convenient.

Description

Packaging structure for computer electronic component

Technical Field

The utility model belongs to the technical field of electronic components deposits equipment, more specifically say, in particular to an encapsulation construction for computer electronic components.

Background

The computer is a product of scientific and technological development, is generally popularized globally at the present stage, can calculate some precise numerical values at a high speed, and can also automatically process a large amount of data according to program operation, wherein the precise numerical values are realized by matching the functions of some electronic components inside the computer, but the electronic components of the computer are difficult to manufacture, are easy to malfunction and damage after being collided with each other, and especially in some transportation processes, if some protective measures are not adopted to expose the electronic components, the loss which is difficult to estimate can be caused, so that an encapsulation structure is needed to place the electronic components of the computer.

As in application No.: in the CN201820651609.9 new practical patent, a set of package structure for computer electronic components includes a base, a package body, a heat dissipation substrate, a top cover, a fixing tube, etc. the contact area between the electronic components and the air is increased by the cooling fins distributed circumferentially, so as to achieve the heat dissipation effect, the through holes formed on the cooling fins can cool the cooling fins when the air passes through the through holes, thereby improving the heat dissipation effect, and the first rubber block and the second rubber block are adhered to the two ends of the chute by strong glue to achieve the damping effect;

but on this is novel place the mounting panel with electronic components, the mounting panel slides in the spout, when the device received the collision, in the direct conduction of power to mounting panel, the block rubber through the powerful glue bonding drops easily, and the unable transfer of power that the vibrations were brought can cause the damage to electronic components equally, and the stability of installation is not enough, and this neotype use is convenient inadequately, and the dismouting to electric components is too loaded down with trivial details.

In view of the above, research and improvement are made on the existing structure and defects, and a package structure for computer electronic components is provided to achieve the purpose of higher practical value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a packaging structure for computer electronic components to it is not enough to solve packaging structure stability, and convenient problem inadequately when using packaging structure dismouting electronic components.

The utility model relates to a packaging structure's for computer electronic components purpose and efficiency are reached by following concrete technological means:

the utility model provides an encapsulation structure for computer electronic components, the power distribution box comprises a box body, the box passes through straining mechanism and cover connection, the apron bottom is provided with a multiunit installation section of thick bamboo, the multiunit all be provided with damping spring B in the installation section of thick bamboo, be provided with the encapsulation check in the box, multiunit mounting groove and multiunit locked groove have been seted up respectively on the encapsulation check, the multiunit the installation section of thick bamboo respectively with the multiunit the mounting groove is corresponding, be provided with two sets of subassemblies of placing in the encapsulation check, it is two sets of place the subassembly both ends and all be provided with two sets of installation mechanism.

Furthermore, the fastening mechanism comprises two groups of clamping blocks and two groups of buckling plates, the two groups of clamping blocks are arranged on two sides of the box body respectively, supports are arranged on two sides of the cover plate respectively, the two groups of buckling plates are arranged on the two groups of supports respectively in a sleeved mode, and the buckling plates are clamped on the clamping blocks.

Furthermore, the placing assembly comprises two groups of partition plates, a ventilating plate is arranged between the two groups of partition plates, connecting rods are arranged at two ends of each partition plate and are respectively clamped in two of the mounting grooves, and a damping spring A is arranged at the bottom end of each connecting rod.

Further, installation mechanism includes the telescopic link, the telescopic link is worn to establish in the encapsulation check, telescopic link one end is provided with splint, the cover is equipped with expanding spring on the telescopic link, the splint card is established two sets of between the baffle, be provided with positioning mechanism on the telescopic link.

Further, positioning mechanism includes the locking piece, the locking piece is worn to establish in the locked groove, the locking piece bottom is provided with reset spring, be provided with the stopper on the telescopic link, the telescopic link is worn to establish in the locking piece.

Furthermore, a non-slip mat is arranged on the clamping plate, the non-slip mat is made of rubber, and a pull ring is arranged at one end of the telescopic rod.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. on placing the air-permeable plate with electronic components, because the separation setting of baffle, and air-permeable plate do not contact with the encapsulation check bottom surface, increased the area of contact of electronic components and air to heat dissipation that can be better.

2. The connecting rod card at baffle both ends is established in the mounting groove, and when the apron lock was on the box, the connecting rod passed through damping spring A and damping spring B extrusion at the mounting groove middle part, when the box received the collision and takes place vibrations, the gas permeable plate can take place to rock, unloads the power through damping spring A and damping spring B to can effectual protection electronic components, increased this neotype stability.

3. Through installation mechanism's setting, place back on the ventilating plate when electronic components, when covering the apron, the apron bottom promotes the locking piece downstream, the locking piece reachs an allocation position when the apron is covered tightly, the stopper on the telescopic link can pass the locking piece, setting through expanding spring, splint can press from both sides tight electronic components, thereby can effectively fix electronic components, when needs take out electronic components, open the apron, the pulling telescopic link makes behind the stopper break away from the locking piece, the setting that the locking piece passes through reset spring then can bounce, the telescopic link is because the stopper sets up then can't pass the locking piece, thereby the position of telescopic link has been restricted, splint no longer fix electronic components, can take out it, and the use is simple and convenient.

Drawings

Fig. 1 is a perspective view of the present invention, which is used for the packaging structure of computer electronic components.

Fig. 2 is an exploded view of the package structure for the electronic components of the computer according to the present invention.

Fig. 3 is a schematic structural diagram of the middle cover plate of the present invention.

Fig. 4 is a schematic structural diagram of the middle box body of the present invention.

Fig. 5 is a partial schematic structural diagram of the present invention.

Fig. 6 is a schematic structural diagram of the mounting mechanism of the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a box body; 2. a cover plate; 3. buckling the plate; 4. a partition plate; 5. a damping spring A; 6. packaging grids; 7. locking the groove; 8. mounting grooves; 9. a clamping block; 10. a gas permeable plate; 11. a non-slip mat; 12. a splint; 13. a tension spring; 14. a telescopic rod; 15. a locking block; 16. mounting the cylinder; 17. a support; 18. a damping spring B; 19. a connecting rod; 20. a pull ring; 21. a return spring; 22. and a limiting block.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 6:

the utility model provides a packaging structure for computer electronic components, including box 1, box 1 is connected with apron 2 through straining mechanism, places electronic components and covers apron 2 again in the box 1 and can accomplish the encapsulation.

The 2 bottoms of apron are provided with a multiunit installation section of thick bamboo 16, all are provided with damping spring B18 in the multiunit installation section of thick bamboo 16, are provided with encapsulation check 6 in the box 1, have seted up multiunit mounting groove 8 and multiunit locked groove 7 on the encapsulation check 6 respectively, and multiunit installation section of thick bamboo 16 is corresponding with multiunit mounting groove 8 respectively, and when covering apron 2, damping spring B18 can penetrate in the mounting groove 8.

Two groups of placing components are arranged in the packaging grid 6, and two groups of mounting mechanisms are arranged at two ends of the two groups of placing components; the shock absorbing spring B18 presses the placement member to transmit the force generated by the shock from the placement member.

The fastening mechanism comprises two groups of clamping blocks 9 and two groups of buckling plates 3, the two groups of clamping blocks 9 are respectively arranged on two sides of the box body 1, two sides of the cover plate 2 are respectively provided with a support seat 17, the two groups of buckling plates 3 are respectively sleeved on the two groups of support seats 17, and the buckling plates 3 are clamped on the clamping blocks 9; after the cover plate 2 is covered, the buckling plate 3 is pressed to extrude the clamping block 9 to deform, so that the clamping block 9 is buckled to realize buckling, and the cover plate 2 needs to be taken down, and the buckling plate 3 needs to be moved to be separated from the clamping block 9.

Wherein, place the subassembly and include two sets of baffles 4, be provided with air-permeable plate 10 between two sets of baffles 4, electronic components places on air-permeable plate 10, increases the area of contact of electronic components and air to play radiating effect.

The two ends of the partition board 4 are respectively provided with a connecting rod 19, the two groups of connecting rods 19 are respectively clamped in two of the mounting grooves 8, and the bottom ends of the connecting rods 19 are provided with damping springs A5; when apron 2 lock was on box 1, damping spring B18 and damping spring A5 extruded connecting rod 19 at 8 middle parts of mounting groove to make baffle 4 and air-permeable plate 10 unsettled, when box 1 received the collision, baffle 4 took place to rock and unloaded the power through damping spring B18 and damping spring A5, stability when having increased electronic components installation.

The mounting mechanism comprises an expansion link 14, the expansion link 14 penetrates through the packaging grid 6, one end of the expansion link 14 is provided with a clamping plate 12, an expansion spring 13 is sleeved on the expansion link 14, and the clamping plate 12 is clamped between the two groups of partition plates 4; the clamping plate 12 clamps the electronic component by the expansion spring 13, thereby fixing the position thereof.

The telescopic rod 14 is provided with a positioning mechanism, the positioning mechanism comprises a locking block 15, the locking block 15 is arranged in the locking groove 7 in a penetrating mode, the bottom end of the locking block 15 is provided with a return spring 21, the telescopic rod 14 is provided with a limiting block 22, and the telescopic rod 14 is arranged in the locking block 15 in a penetrating mode; when the cover plate 2 is covered, the cover plate 2 pushes the locking block 15 to move downwards, and the limiting block 22 can penetrate through the locking block 15 after the locking block 15 reaches a certain position, so that the clamping plate 12 clamps the electronic component.

When electronic components need to be taken out, the cover plate 2 is opened, the telescopic rod 14 is pulled, when the limiting block 22 is separated from the locking block 15, the locking block 15 can be upwards bounced through the arrangement of the reset spring 21, the telescopic rod 14 cannot penetrate through the locking block 15 under the limitation of the limiting block 22, and therefore the telescopic rod 14 is positioned.

Wherein, be provided with slipmat 11 on splint 12, slipmat 11 is the rubber material, through the setting of slipmat 11, avoids locking piece 15 direct and electronic components contact and cause the damage to it, and has increased the frictional force between splint 12 and the electronic components for splint 12 press from both sides tightly more firm.

One end of the telescopic rod 14 is provided with a pull ring 20, which brings convenience for a user to pull the telescopic rod 14.

The specific use mode and function of the embodiment are as follows:

when the utility model is used, the electronic components are firstly placed on the air permeable plate 10 between the two partition plates 4, and the contact area between the electronic components and the air is increased through the suspended arrangement of the partition plates 4 and the arrangement of the air permeable plate 10, so that the heat dissipation can be better realized; after the electronic component is placed, the upper cover plate 2 is covered, the damping spring B18 is clamped into the mounting groove 8, the connecting rod 19 is extruded in the middle of the mounting groove 8 through the damping spring A5 and the damping spring B18, when the box body 1 receives collision and vibrates, the ventilating plate 10 can shake, and the force is removed through the damping spring A5 and the damping spring B18;

in the process of closing the cover plate 2, the bottom of the cover plate 2 pushes the locking block 15 to move downwards, when the cover plate 2 is tightly covered, the locking block 15 reaches a certain position, the limiting block 22 on the telescopic rod 14 can penetrate through the locking block 15, the clamping plate 12 can clamp the electronic component through the arrangement of the telescopic spring 13, so that the electronic component can be effectively fixed, and finally the clamping plate 3 is pressed to extrude the clamping block 9 to deform, so that the clamping plate is buckled on the clamping block 9 to fix the cover plate 2;

when electronic components need to be taken out, the buckle plate 3 is moved to be separated from the clamping block 9, the cover plate 2 is opened, the pull ring 20 is pulled to separate the limiting block 22 on the telescopic rod 14 from the locking block 15 after the cover plate 2 is taken down, the locking block 15 can be bounced through the setting of the reset spring 21, the telescopic rod 14 cannot penetrate through the locking block 15 due to the setting of the limiting block 22, the position of the telescopic rod 14 is limited, and the electronic components are not fixed by the clamp plate 12, so that the electronic components can be taken out.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A packaging structure for computer electronic components, characterized in that: including box (1), box (1) is connected with apron (2) through straining mechanism, apron (2) bottom is provided with multiunit installation section of thick bamboo (16), the multiunit all be provided with damping spring B (18) in installation section of thick bamboo (16), be provided with encapsulation check (6) in box (1), multiunit mounting groove (8) and multiunit locked groove (7), multiunit have been seted up on encapsulation check (6) respectively installation section of thick bamboo (16) respectively with the multiunit mounting groove (8) are corresponding, it places the subassembly, two sets of to be provided with two sets of in encapsulation check (6) places the subassembly, and is two sets of place the subassembly both ends and all be provided with two sets of installation mechanism.

2. A package structure for a computer electronic component as claimed in claim 1, wherein: the fastening mechanism comprises two groups of clamping blocks (9) and two groups of buckling plates (3), the clamping blocks (9) are arranged on two sides of the box body (1) respectively, supporting seats (17) are arranged on two sides of the cover plate (2), the buckling plates (3) are arranged on the supporting seats (17) in a sleeved mode respectively, and the buckling plates (3) are clamped on the clamping blocks (9).

3. A package structure for a computer electronic component as claimed in claim 1, wherein: the placing assembly comprises two groups of partition plates (4), a ventilating plate (10) is arranged between the two groups of partition plates (4), connecting rods (19) are arranged at two ends of each partition plate (4), the two groups of connecting rods (19) are respectively clamped in the two mounting grooves (8), and damping springs A (5) are arranged at the bottom ends of the connecting rods (19).

4. A package structure for a computer electronic component as claimed in claim 3, wherein: installation mechanism includes telescopic link (14), telescopic link (14) are worn to establish in encapsulation check (6), telescopic link (14) one end is provided with splint (12), the cover is equipped with expanding spring (13) on telescopic link (14), splint (12) card is established two sets of between baffle (4), be provided with positioning mechanism on telescopic link (14).

5. A package structure for a computer electronic component as claimed in claim 4, wherein: positioning mechanism includes locking piece (15), locking piece (15) are worn to establish in locked groove (7), locking piece (15) bottom is provided with reset spring (21), be provided with stopper (22) on telescopic link (14), telescopic link (14) are worn to establish in locking piece (15).

6. A package structure for a computer electronic component as claimed in claim 4, wherein: be provided with slipmat (11) on splint (12), slipmat (11) are the rubber material, telescopic link (14) one end is provided with pull ring (20).