CN214538039U - Polishing solution ratio monitoring device - Google Patents
Polishing solution ratio monitoring device Download PDFInfo
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- CN214538039U CN214538039U CN202120679972.3U CN202120679972U CN214538039U CN 214538039 U CN214538039 U CN 214538039U CN 202120679972 U CN202120679972 U CN 202120679972U CN 214538039 U CN214538039 U CN 214538039U
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Abstract
The utility model relates to a polishing solution ratio monitoring devices belongs to polishing solution ratio equipment technical field, including the stock solution bucket, stock solution bucket one side be equipped with the pure water bucket, stock solution bucket one side be equipped with the blending tank, blending tank and pure water bucket between, be equipped with the ratio bucket in advance between blending tank and stock solution bucket, the ratio of advance between bucket and pure water bucket, all be equipped with the ratio pipe between the ratio bucket of advance and stock solution bucket, the ratio pipe on be equipped with flow sensor, the flow sensor side be equipped with the pneumatic ball valve of ratio pipe looks flange formula pipeline intercommunication, the ratio bucket side of advance be equipped with the PH detector that is linked together with the ratio bucket of advance, blending tank and the ratio bucket between be equipped with the liquid suction pipe. The device has the characteristics of simple structure, good stability, real-time proportioning monitoring and convenient operation. The planarization efficiency of the polysilicon and the removal effect of the polishing residues are improved.
Description
Technical Field
The utility model relates to a polishing solution ratio equipment technical field, concretely relates to polishing solution ratio monitoring devices.
Background
The surface polishing treatment of silicon wafers is one of the important processes in the semiconductor manufacturing process. The polished surface of the silicon wafer is as flat as a mirror surface, and the requirements of micro-nano device preparation are met.
At present, the traditional silicon wafer polishing is a process of coarse, medium and fine polishing by using polishing solution, and the polishing solution consists of abrasive particles and chemical solution (such as acid). The silicon wafer is placed on a rotating table, and is pressed on the surface of the rotating silicon wafer by a polishing head for polishing, which is commonly called chemical mechanical polishing.
Most of the existing equipment is imported from Japan, and unstable liquid proportioning of the polishing liquid proportioning device is one of the biggest defects.
Disclosure of Invention
The utility model discloses there is poor stability among the main prior art of solution, lack the not convenient not enough of ratio monitoring and operation, provides a polishing solution ratio monitoring devices, and it has simple structure, the characteristics of stability good, real-time ratio monitoring and simple operation. The planarization efficiency of the polysilicon and the removal effect of the polishing residues are improved.
The above technical problem of the present invention can be solved by the following technical solutions:
the utility model provides a polishing solution ratio monitoring devices, includes the stock solution bucket, stock solution bucket one side be equipped with the pure water bucket, stock solution bucket one side be equipped with the blending tank, blending tank and pure water bucket between, be equipped with the ratio bucket in advance between blending tank and stock solution bucket, the ratio of advance between bucket and pure water bucket, all be equipped with the ratio pipe between the ratio bucket of advance and stock solution bucket, the ratio pipe on be equipped with flow sensor, the flow sensor side be equipped with the pneumatic ball valve of ratio pipe looks flange formula pipeline intercommunication, the ratio of advance bucket side be equipped with the PH detector that the ratio bucket of advance is linked together, blending tank and the ratio bucket of advance between be equipped with the liquid suction pipe.
Preferably, the pure water barrel is provided with a water supply pump, and a water supply pipe is arranged between the water supply pump and the pure water barrel. The raw liquid barrel is provided with a liquid feeding pump, and a liquid feeding pipe is arranged between the liquid feeding pump and the raw liquid barrel. The lower part of the mixing barrel is provided with a liquid outlet pump communicated with the mixing barrel phase pipeline.
Preferably, valves are arranged between the water feeding pump and the water feeding pipe, between the liquid feeding pump and the liquid feeding pipe and on the side edge of the liquid outlet pump.
Preferably, transition flange connecting pipes are arranged between the valve and the water pump and between the valve and the liquid pump.
Preferably, the liquid pumping pipe is provided with a liquid pumping pump which is in threaded sleeve connection with the liquid pumping pipe.
The utility model discloses can reach following effect:
the utility model provides a polishing solution ratio monitoring devices compares with prior art, has simple structure, stable good, the characteristics of real-time ratio monitoring and simple operation. The planarization efficiency of the polysilicon and the removal effect of the polishing residues are improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the device comprises a water feeding pump 1, a pure water barrel 2, a water feeding pipe 3, a liquid feeding pipe 4, a valve 5, a transition flange connecting pipe 6, a liquid feeding pump 7, a raw liquid barrel 8, a proportioning pipe 9, a pneumatic ball valve 10, a flow sensor 11, a mixing barrel 12, a liquid outlet pump 13, a liquid extracting pipe 14, a liquid extracting pump 15, a pre-proportioning barrel 16 and a PH detector 17.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
Example (b): as shown in fig. 1, a polishing liquid ratio monitoring device includes a raw liquid barrel 8, a liquid feeding pump 7 is disposed on the raw liquid barrel 8, and a liquid feeding pipe 4 is disposed between the liquid feeding pump 7 and the raw liquid barrel 8. One side end of the raw liquid barrel 8 is provided with a pure water barrel 2, the pure water barrel 2 is provided with a water supply pump 1, and a water supply pipe 3 is arranged between the water supply pump 1 and the pure water barrel 2. One side end of the raw liquid barrel 8 is provided with a mixing barrel 12, and the lower part of the mixing barrel 12 is provided with a liquid outlet pump 13 communicated with the phase pipeline of the mixing barrel 12. Valves 5 are arranged between the water feeding pump 1 and the water feeding pipe 3, between the liquid feeding pump 7 and the liquid feeding pipe 4 and on the side edge of the liquid outlet pump 13. Transition flange connecting pipes 6 are arranged between the valve 5 and the water feeding pump 1 and between the valve 5 and the liquid feeding pump 7. A pre-proportioning barrel 16 is arranged between the mixing barrel 12 and the pure water barrel 2 and between the mixing barrel 12 and the raw liquid barrel 8, proportioning pipes 9 are arranged between the pre-proportioning barrel 16 and the pure water barrel 2 and between the pre-proportioning barrel 16 and the raw liquid barrel 8, a flow sensor 11 is arranged on the proportioning pipe 9, a pneumatic ball valve 10 communicated with the proportioning pipe 9 through a flange type pipeline is arranged at the side end of the flow sensor 11, a PH detector 17 communicated with the pre-proportioning barrel 16 is arranged at the side edge of the pre-proportioning barrel 16, and a liquid pumping pipe 14 is arranged between the mixing barrel 12 and the pre-proportioning barrel 16. The liquid pumping pipe 14 is provided with a liquid pumping pump 15 which is in threaded sleeve connection with the liquid pumping pipe 14.
To sum up, this polishing solution ratio monitoring devices has simple structure, stability is good, real-time ratio monitoring and simple operation's characteristics. The planarization efficiency of the polysilicon and the removal effect of the polishing residues are improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without deviating from the basic characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
In conclusion, the above description is only the specific embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any person skilled in the art can make changes or modifications within the scope of the present invention.
Claims (5)
1. The utility model provides a polishing solution ratio monitoring devices which characterized in that: comprises a raw liquid barrel (8), a pure water barrel (2) is arranged at one side end of the raw liquid barrel (8), a mixing barrel (12) is arranged at one side end of the raw liquid barrel (8), pre-proportioning barrels (16) are arranged between the mixing barrel (12) and the pure water barrel (2) and between the mixing barrel (12) and the raw liquid barrel (8), proportioning pipes (9) are respectively arranged between the pre-proportioning barrel (16) and the pure water barrel (2) and between the pre-proportioning barrel (16) and the stock solution barrel (8), a flow sensor (11) is arranged on the proportioning pipe (9), a pneumatic ball valve (10) communicated with the proportioning pipe (9) through a flange type pipeline is arranged at the side end of the flow sensor (11), a PH detector (17) communicated with the pre-mixing ratio barrel (16) is arranged at the side edge of the pre-mixing ratio barrel (16), a liquid extracting pipe (14) is arranged between the mixing barrel (12) and the pre-proportioning barrel (16).
2. The device for monitoring the mixture ratio of the polishing solution according to claim 1, wherein: a water supply pump (1) is arranged on the pure water barrel (2), and a water supply pipe (3) is arranged between the water supply pump (1) and the pure water barrel (2); a liquid feeding pump (7) is arranged on the raw liquid barrel (8), and a liquid feeding pipe (4) is arranged between the liquid feeding pump (7) and the raw liquid barrel (8); the lower part of the mixing barrel (12) is provided with a liquid outlet pump (13) communicated with the phase pipeline of the mixing barrel (12).
3. The device for monitoring the mixture ratio of the polishing solution according to claim 2, wherein: valves (5) are arranged between the water feeding pump (1) and the water feeding pipe (3), between the liquid feeding pump (7) and the liquid feeding pipe (4) and on the side edge of the liquid outlet pump (13).
4. The device for monitoring the mixture ratio of the polishing solution according to claim 3, wherein: transition flange connecting pipes (6) are arranged between the valve (5) and the water feeding pump (1) and between the valve (5) and the liquid feeding pump (7).
5. The device for monitoring the mixture ratio of the polishing solution according to claim 1, wherein: the liquid pumping pipe (14) is provided with a liquid pumping pump (15) which is in threaded sleeve joint with the liquid pumping pipe (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120679972.3U CN214538039U (en) | 2021-04-02 | 2021-04-02 | Polishing solution ratio monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120679972.3U CN214538039U (en) | 2021-04-02 | 2021-04-02 | Polishing solution ratio monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214538039U true CN214538039U (en) | 2021-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120679972.3U Active CN214538039U (en) | 2021-04-02 | 2021-04-02 | Polishing solution ratio monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214538039U (en) |
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2021
- 2021-04-02 CN CN202120679972.3U patent/CN214538039U/en active Active
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