CN214521188U

CN214521188U - Cutting device is used in semiconductor chip processing

Info

Publication number: CN214521188U
Application number: CN202022675564.9U
Authority: CN
Inventors: 刘家铭; 苏华庭; 吴灿煌
Original assignee: Hefei Core Semiconductor Co Ltd
Current assignee: Hefei Core Semiconductor Co Ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-10-29
Anticipated expiration: 2030-11-18

Abstract

The utility model relates to a semiconductor chip technical field just discloses a cutting device is used in semiconductor chip processing, the on-line screen storage device comprises a base, the notch has been seted up at the top of base, two fixed plates of top fixedly connected with of base, the top fixed mounting of base has servo motor, two one side swing joint that the fixed plate is relative has the lead screw, the top of base is provided with the sliding seat. This cutting device is used in semiconductor chip processing, through the standing groove, a fixed base, the activity hole, the gag lever post, the dog, a spring, a pressing plate, spacing hole, the screw, mutually support between screw rod and the rubber pad, thereby can fix semiconductor chip in the inside of standing groove, clockwise rotation knob, drive the screw rod at the inside downstream of screw, thereby make the bottom of rubber pad and semiconductor chip's top overlap joint, thereby can fix semiconductor chip's simultaneously all around through four screw rods, make fixed even, and improved fixed effect.

Description

Cutting device is used in semiconductor chip processing

Technical Field

The utility model relates to a semiconductor chip technical field specifically is a cutting device is used in semiconductor chip processing.

Background

A semiconductor integrated circuit is formed by "integrating" active elements such as transistors and diodes and passive elements such as resistors and capacitors on a single semiconductor chip according to a predetermined circuit, thereby performing a specific circuit or system function.

When the semiconductor chip is processed and cut, the semiconductor chip needs to be fixed firstly, and when the existing cutting device is used for fixing the semiconductor chip, the chip is easily damaged due to uneven stress on the chip, so that the product is unqualified, and the processing efficiency is influenced, so that the problem needs to be solved by the cutting device for processing the semiconductor chip.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a cutting device is used in semiconductor chip processing possesses and is convenient for fix semiconductor chip, avoids producing advantages such as damage to semiconductor chip, has solved and has made the chip atress inhomogeneous easily and cause the damage to the chip, causes the product unqualified to influence machining efficiency's problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cutting device is used in semiconductor chip processing, includes the base, the notch has been seted up at the top of base, two fixed plates of top fixedly connected with of base, the top fixed mounting of base has servo motor, two one side swing joint that the fixed plate is relative has the lead screw, the top of base is provided with the sliding seat, the screw hole that runs through around the inside of sliding seat is seted up, the top fixed mounting of sliding seat has the motor, the top fixedly connected with protecting crust of sliding seat, the inside swing joint of protecting crust has the cutting wheel, the right side fixedly connected with framework of protecting crust, the inside of framework is provided with drive mechanism.

The semiconductor chip package structure is characterized in that a placing groove is formed in the top of the base, a semiconductor chip is arranged inside the placing groove, a fixing seat is fixedly connected to the top of the base, a movable hole which penetrates through the fixing seat is formed in the fixing seat, a limiting rod is inserted into the movable hole in a movable mode, a stop block is fixedly connected to the front end of the limiting rod, a spring is fixedly connected to the rear side of the stop block, a pressing plate is movably connected to the top of the base, a limiting hole is formed in the front side of the pressing plate, a screw hole which penetrates through the pressing plate from top to bottom is formed in the pressing plate, a screw is connected to the inner thread of the screw hole in a threaded mode, a rubber pad is movably connected to the bottom end of the screw, and a knob is fixedly connected to the top end of the screw.

Preferably, two one side fixedly connected with guide bar that the fixed plate is relative, the guiding hole that runs through around the inside of sliding seat is seted up, the guide bar is pegged graft with the inside interaction of guiding hole, the lead screw is connected with the inside screw thread of screw hole.

Preferably, the front of the base is provided with a collecting tank, the inside of the collecting tank is movably inserted with the collecting tank, the front of the collecting tank is fixedly connected with a handle, the collecting tank is communicated with the notch, and the collecting tank is positioned under the notch.

Preferably, the output end of the servo motor is fixedly connected with the rear end of the screw rod, and the bottom of the cutting wheel is located inside the notch.

Preferably, one end of the spring, which is far away from the stop block, is fixedly connected with the front surface of the fixing seat, and the spring is movably sleeved with the limiting rod.

Preferably, the position of the pressing plate corresponds to the position of the placing groove, one end of the limiting rod, far away from the stop block, is movably inserted into the limiting hole, and the bottom of the rubber pad is in lap joint with the top of the semiconductor chip.

Compared with the prior art, the utility model provides a cutting device is used in semiconductor chip processing possesses following beneficial effect:

1. this cutting device is used in semiconductor chip processing, through the standing groove, a fixed base, the activity hole, the gag lever post, the dog, a spring, a pressing plate, spacing hole, the screw, mutually support between screw rod and the rubber pad, thereby can fix semiconductor chip in the inside of standing groove, clockwise rotation knob, drive the screw rod at the inside downstream of screw, thereby make the bottom of rubber pad and semiconductor chip's top overlap joint, thereby can fix semiconductor chip's simultaneously all around through four screw rods, make fixed even, and improved fixed effect.

2. This cutting device is used in semiconductor chip processing through mutually supporting between notch, collecting vat and the collecting box to when making the cutting wheel to cut semiconductor chip, produced dust and piece fall to the inside of collecting vat from the notch, and carry out the inside of collecting box, thereby can effectively collect dust and piece, avoid polluted environment.

Drawings

FIG. 1 is a front sectional view of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is an enlarged view of the structure A of FIG. 1 according to the present invention;

FIG. 4 is a sectional view of the side structure of the cover plate of the present invention;

fig. 5 is a sectional view of the housing structure of the present invention.

Wherein: 1. a base; 2. a notch; 3. a fixing plate; 4. a servo motor; 5. a screw rod; 6. a movable seat; 7. a threaded hole; 8. a guide bar; 9. a guide hole; 10. a motor; 11. a protective shell; 12. a cutting wheel; 13. a frame body; 14. a transmission mechanism; 15. a placement groove; 16. a semiconductor chip; 17. a fixed seat; 18. a movable hole; 19. a limiting rod; 20. a stopper; 21. a spring; 22. pressing a plate; 23. a limiting hole; 24. a screw hole; 25. a screw; 26. a rubber pad; 27. a knob; 28. collecting tank; 29. and a collection box.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a cutting device for processing a semiconductor chip comprises a base 1, a notch 2 is formed in the top of the base 1, two fixing plates 3 are fixedly connected to the top of the base 1, the two fixing plates 3 are both positioned on the right side of the notch 2, a servo motor 4 is fixedly mounted on the top of the base 1, an output end of the servo motor 4 penetrates through the rear side of the rear fixing plate 3 and extends into the rear fixing plate 3, a lead screw 5 is movably connected to one side of the two fixing plates 3 opposite to each other, a movable seat 6 is arranged on the top of the base 1, the bottom of the movable seat 6 is in lap joint with the top of the base 1, a threaded hole 7 penetrating through the movable seat 6 from front to back is formed in the movable seat 6, a guide rod 8 is fixedly connected to one side of the two fixing plates 3 opposite to each other, a guide hole 9 penetrating through the movable seat 6 from front to back is formed in the movable seat 6, and the guide rods 8 and the guide holes 9 are two, the guide rod 8 is interactively inserted in the guide hole 9, so that the movable seat 6 can be limited, the movable seat 6 is prevented from rotating on the lead screw 5, the lead screw 5 is connected with the internal thread of the threaded hole 7, the motor 10 is fixedly arranged at the top of the movable seat 6, the top of the movable seat 6 is fixedly connected with the protective shell 11, the protective shell 11 is movably connected with the cutting wheel 12 in the inner part, the inside of the cutting wheel 12 is provided with a rotating shaft, the cutting wheel 12 is driven to rotate by the rotation of the rotating shaft, the two ends of the rotating shaft are movably connected with the inner walls of the left side and the right side of the protective shell 11, the output end of the servo motor 4 is fixedly connected with the rear end of the lead screw 5, the electric lead screw 5 can rotate clockwise and anticlockwise by the servo motor 4, the movable seat 6 can be driven to move on the lead screw 5, the bottom of the cutting wheel 12 is positioned in the notch 2, the right side of the protective shell 11 is fixedly connected with the frame body 13, the left side of framework 13 and the right side fixed connection of protecting crust 11, the inside of framework 13 is provided with drive mechanism 14, drive mechanism 14 includes the action wheel, from driving wheel and drive belt, the action wheel passes through the drive belt transmission with following the driving wheel and connects, and the output and the action wheel fixed connection of motor 10, the right-hand member that gets the pivot on the cutting wheel 12 and from driving wheel fixed connection, thereby can drive the action wheel through the motor and rotate, and drive under the effect of drive belt and rotate from the driving wheel, thereby make cutting wheel 12 take place to rotate in the inside of protecting crust 11.

The top of the base 1 is provided with a placing groove 15, the placing groove 15 is communicated with the notch 2, the placing groove 15 is positioned on the left side of the notch 2, a semiconductor chip 16 is arranged inside the placing groove 15, the semiconductor chip 16 is matched with the placing groove 15, the right side of the semiconductor chip 16 is positioned inside the notch 2, the right side of the semiconductor chip 16 corresponds to the position of the cutting wheel 12, the top of the base 1 is fixedly connected with a fixed seat 17, the fixed seat 17 is positioned on the left side of the notch 2, the fixed seat 17 is internally provided with a front and back through movable hole 18, the number of the movable holes 18 is two, a limit rod 19 is movably inserted inside the movable hole 18, the front end of the limit rod 19 is fixedly connected with a stop 20, the rear side of the stop 20 is fixedly connected with the front ends of the two limit rods 19, the rear side of the stop 20 is fixedly connected with a spring 21, the number of the springs 21 is two, one end of the spring 21, which is far away from the stop 20, is fixedly connected with the front side of the fixed seat 17, the spring 21 is movably sleeved with the limiting rod 19, the top of the base 1 is movably connected with a pressing plate 22, the pressing plate 22 is movably connected with the base 1 through a hinge, the front side of the pressing plate 22 is provided with two limiting holes 23, the pressing plate 22 is internally provided with screw holes 24 which vertically penetrate through, the number of the screw holes 24 is four, the four screw holes 24 are uniformly distributed around the pressing plate 22, the screw holes 24 are internally and threadedly connected with screw rods 25, the bottom end of each screw rod 25 is movably connected with a rubber pad 26, the damage to the semiconductor chip 16 can be reduced by arranging the rubber pads 26, the position of the pressing plate 22 corresponds to the position of the placing groove 15, one end of the limiting rod 19, far away from the stop block 20, is movably inserted into the limiting holes 23, the bottom of the rubber pad 26 is overlapped with the top of the semiconductor chip 16, the top end of the screw rod 25 is fixedly connected with a knob 27, the knob 27 is rotated clockwise to drive the screw rods 25 to move downwards in the screw holes 24, and drive rubber pad 26 together downstream, thereby make the bottom of rubber pad 26 and semiconductor chip 16's top overlap joint, thereby can fix semiconductor chip 16 in the inside of standing groove 15, collecting vat 28 has been seted up on the front of base 1, collecting vat 28's inside activity is pegged graft and is had collecting box 29, the positive fixedly connected with handle of collecting box 29, be convenient for take out collecting box 29 from the inside of collecting vat 28 through the handle, collecting vat 28 communicates with notch 2 each other, collecting vat 28 is located notch 2 under, set up collecting box 29 through the inside at collecting vat 28, thereby can collect the piece that produces when cutting semiconductor chip 16, reduce the pollution that causes the environment.

When the semiconductor chip cutting device is used, the stopper 20 is pulled forwards, the spring 21 extends, the limiting rod 19 is driven to move forwards together, one end, far away from the stopper 20, of the limiting rod 19 moves out of the limiting hole 23, the pressing plate 22 can rotate upwards, the semiconductor chip 16 is placed inside the placing groove 15, the right side of the semiconductor chip 16 is located inside the notch 2 and corresponds to the position of the cutting wheel 12, the bottom of the semiconductor chip 16 is overlapped with the inner bottom wall of the placing groove 15, the pressing plate 22 rotates downwards, the bottom of the pressing plate 22 is overlapped with the top of the base 1, the limiting rod 19 is inserted into the limiting hole 23 through mutual matching between the stopper 20 and the spring 21, the pressing plate 22 and the fixing seat 17 can be fixed, and the pressing plate 22 is prevented from rotating on the base 1, and make clamp plate 22 fixed with base 1, then clockwise rotation four knobs 27, thereby can drive four screw rods 25 and at the inside downstream of screw 24, thereby make four rubber pads 26 also downstream, and make the bottom of rubber pad 26 and semiconductor chip 16's top overlap joint, thereby can carry out the pressfitting fixed to four position of semiconductor chip 16, prevent that semiconductor chip 16 from taking place the skew in the inside of standing groove 15, then open servo motor 4 and motor 10, and drive cutting wheel 12 through motor 10 and take place to rotate, and servo motor 4 drives lead screw 5 and rotates, and make movable seat 6 carry out the back-and-forth movement on lead screw 5, thereby realize cutting semiconductor chip 16.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor chip processing is with cutting device, includes base (1), its characterized in that: the cutting machine is characterized in that a notch (2) is formed in the top of the base (1), two fixing plates (3) are fixedly connected to the top of the base (1), a servo motor (4) is fixedly mounted on the top of the base (1), a lead screw (5) is movably connected to one side, opposite to the two fixing plates (3), of the base, a movable seat (6) is arranged on the top of the base (1), a threaded hole (7) which penetrates through the movable seat (6) from front to back is formed in the movable seat, a motor (10) is fixedly mounted on the top of the movable seat (6), a protective shell (11) is fixedly connected to the top of the movable seat (6), a cutting wheel (12) is movably connected to the inside of the protective shell (11), a frame body (13) is fixedly connected to the right side of the protective shell (11), and a transmission mechanism (14) is arranged inside the frame body (13);

the semiconductor chip packaging structure is characterized in that a placing groove (15) is formed in the top of the base (1), a semiconductor chip (16) is arranged inside the placing groove (15), a fixing seat (17) is fixedly connected to the top of the base (1), a movable hole (18) which penetrates through the fixing seat (17) in the front and back direction is formed in the fixing seat (17), a limiting rod (19) is movably inserted into the movable hole (18), a stop block (20) is fixedly connected to the front end of the limiting rod (19), a spring (21) is fixedly connected to the rear side of the stop block (20), a pressing plate (22) is movably connected to the top of the base (1), a limiting hole (23) is formed in the front side of the pressing plate (22), a screw hole (24) which penetrates through the pressing plate from top to bottom is formed in the pressing plate (22), a screw hole (24) which penetrates through the screw hole (24) up and down is connected to the screw rod (25) through internal threads, and a rubber pad (26) is movably connected to the bottom end of the screw rod (25), the top end of the screw rod (25) is fixedly connected with a knob (27).

2. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: two one side fixedly connected with guide bar (8) that fixed plate (3) is relative, guiding hole (9) that run through around the inside of sliding seat (6) is seted up, guide bar (8) are pegged graft with the inside interaction of guiding hole (9), the inside threaded connection of lead screw (5) and screw hole (7).

3. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: the collecting tank is characterized in that a collecting tank (28) is arranged on the front side of the base (1), a collecting tank (29) is movably inserted in the collecting tank (28), a handle is fixedly connected to the front side of the collecting tank (29), the collecting tank (28) is communicated with the notch (2), and the collecting tank (28) is located under the notch (2).

4. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: the output end of the servo motor (4) is fixedly connected with the rear end of the screw rod (5), and the bottom of the cutting wheel (12) is located inside the notch (2).

5. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: one end, far away from the stop block (20), of the spring (21) is fixedly connected with the front face of the fixing seat (17), and the spring (21) is movably sleeved with the limiting rod (19).

6. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: the position of the pressing plate (22) corresponds to the position of the placing groove (15), one end, far away from the stop block (20), of the limiting rod (19) is movably inserted into the limiting hole (23), and the bottom of the rubber pad (26) is overlapped with the top of the semiconductor chip (16).