CN214519255U - Silicon chip grinds machine thickness measuring device - Google Patents

Abstract

The utility model relates to a silicon chip processing technology field just discloses a silicon chip grinds machine thickness measuring device, including the polisher mesa, polisher mesa top is provided with down the mill, the mill top is equipped with the runner stone down, the round hole has been seted up on the runner stone, the inside plectane that is equipped with of round hole, the plectane passes through bearing and round hole swing joint, the fixed worm wheel that has cup jointed in plectane top edge, worm wheel one side is provided with operating means, the mounting hole has been seted up on the plectane, the mounting hole sets up and is close to the edge on the plectane surface, the plectane top is equipped with the fixed plate, the spacing groove has been seted up to the fixed plate top surface. This silicon chip grinds machine thickness measuring device can drive the worm through twisting the knob and rotate, and then drives the plectane through the worm wheel and rotate, is favorable to adjusting the position of electrode, and then matches the movement track at different specification silicon chip centers, has improved the suitability, adjusts the precision height, convenient operation.

Description

Silicon chip grinds machine thickness measuring device

Technical Field

The utility model relates to a silicon chip processing technology field specifically is a silicon chip grinds machine thickness measuring device.

Background

The processing of silicon wafers involves a plurality of steps, and copper contamination is avoided in the processing of silicon wafers because copper diffuses rapidly in silicon at normal temperature and easily contaminates the silicon wafers. The grinding and polishing of the silicon wafer is an important ring in the silicon wafer processing, and the specific mode is that the silicon wafer is placed on a lower grinding disc of a grinding machine, and an upper grinding disc is controlled to move downwards and rotate to realize grinding and polishing. In the grinding of the silicon wafer, the thickness of the silicon wafer needs to be strictly monitored, a dynamic grinding controller is generally arranged on a grinding machine, and a thickness monitoring probe and an electrode are arranged on an upper grinding disc, so that the thickness can be monitored in real time.

According to actual installation requirements, an electrode needs to be installed on a movement track of the center of a silicon wafer to be measured, but the existing electrode is generally fixedly installed at one point, so that the applicability is insufficient, and when the specifications of the silicon wafer to be measured are different, the electrode is not located on the movement track of the center of the silicon wafer any more, so that the measured data is inaccurate.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a silicon chip is thickness measuring device for grinder, it is strong to possess the suitability, is convenient for maintain the advantage such as, has solved according to actual installation demand, and the electrode need be installed on the movement track at the silicon chip center that awaits measuring, but the general fixed mounting of present electrode is in a bit, and the suitability is not enough, and when the specification of the silicon chip that awaits measuring is different, the electrode no longer is located the movement track at silicon chip center, causes the problem that measured data is out of alignment.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silicon chip grinds machine thickness measuring device, includes the polisher mesa, polisher mesa top is provided with down the mill, the mill top is equipped with the runner stone down, the round hole has been seted up on the runner stone, the inside plectane that is equipped with of round hole, the plectane passes through bearing and round hole swing joint, the fixed worm wheel that has cup jointed in plectane top edge, worm wheel one side is provided with operating means, the mounting hole has been seted up on the plectane, the mounting hole sets up and is close to the edge on the plectane surface, the plectane top is equipped with the fixed plate, the spacing groove has been seted up to the fixed plate top surface, the fixed plate passes through stop device and is connected with the plectane, fixedly connected with electrode on the fixed plate, the electrode bottom extends to in the mounting hole, electrode top fixedly connected with probe.

Preferably, the operating device comprises a worm, the worm is meshed with a worm wheel, two bearing seats are fixedly mounted on the worm, the bearing seats are fixedly connected with the circular plate upper grinding disc, and one end of the worm is fixedly connected with a knob.

Preferably, the top of the upper grinding disc is fixedly connected with a sleeve box, the top end of the sleeve box is fixedly connected with a guide rod, a converter is fixedly mounted inside the sleeve box, a first cable and a second cable are fixedly connected to the converter, the first cable penetrates through the sleeve box and is connected with the probe, and the second cable sequentially penetrates through the sleeve box and the guide rod and extends to the outside of the guide rod.

Preferably, stop device includes the base plate, the base plate passes through pivot and plectane swing joint, the base plate top is provided with the spacer pin, the base plate is run through and extends to the spacing inslot to the spacer pin bottom, the extension spring has been cup jointed on the spacer pin, the extension spring both ends respectively with spacer pin and base plate fixed connection.

Preferably, the electrode is preferably made of a conductive ceramic material, and the electrode may also be made of an overweight silicon-doped rod material.

Compared with the prior art, the utility model provides a silicon chip is thickness measuring device for grinder possesses following beneficial effect:

1. this silicon chip grinds machine thickness measuring device can drive the worm through twisting the knob and rotate, and then drives the plectane through the worm wheel and rotate, is favorable to adjusting the position of electrode, and then matches the movement track at different specification silicon chip centers, has improved the suitability, adjusts the precision height, convenient operation.

2. This silicon chip grinds machine thickness measuring device through setting up stop device, can make the spacer pin break away from the spacing groove on the fixed plate after the pulling spacer pin, then can demolish fixed plate and electrode after rotating the base plate, is favorable to clearing up maintenance to electrode and mounting hole, through setting up the electrode into conductive ceramic material or super heavy doping silicon rod material, compares the electrode of copper product among the prior art, has avoided the pollution to the silicon chip.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the operation device of the present invention;

FIG. 3 is an enlarged view of the portion A of FIG. 1 according to the present invention;

fig. 4 is a schematic structural diagram of the substrate of the present invention.

Wherein: 1. a sander table; 2. a lower grinding disc; 3. an upper grinding disc; 4. a circular plate; 5. a worm gear; 6. mounting holes; 7. a fixing plate; 8. a limiting groove; 9. an electrode; 10. a probe; 11. a worm; 12. a bearing seat; 13. a knob; 14. a kit; 15. a guide bar; 16. a converter; 17. a substrate; 18. a spacing pin; 19. a tension spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a thickness measuring device for a silicon wafer grinding machine comprises a grinding machine table-board 1, a lower grinding disc 2 is arranged on the top of the grinding machine table-board 1, an upper grinding disc 3 is arranged on the top of the lower grinding disc 2, a sleeve box 14 is fixedly connected to the top of the upper grinding disc 3, a guide rod 15 is fixedly connected to the top end of the sleeve box 14, a converter 16 is fixedly arranged inside the sleeve box 14, a first cable and a second cable are fixedly connected to the converter 16, the first cable penetrates through the sleeve box 14 and is connected with a probe 10, the second cable sequentially penetrates through the sleeve box 14 and the guide rod 15 and extends to the outside of the guide rod 15, in practical application, a dynamic grinding controller is fixedly arranged on the silicon wafer grinding equipment, the second cable is connected with the dynamic grinding controller, the measurement principle of the dynamic grinding controller is the prior art, no redundant description is given here, a circular hole is formed in the upper grinding disc 3, a circular plate 4 is arranged inside the circular hole, the circular plate 4 is movably connected with the circular hole through a bearing, the circular plate 4 and the upper grinding disc 3 are made of the same material in practical application, the bottom surface of the circular plate 4 is flush with the bottom surface of the upper grinding disc 3 in height, the top edge of the circular plate 4 is fixedly sleeved with the worm wheel 5, one side of the worm wheel 5 is provided with an operating device, the operating device comprises a worm 11, the worm 11 is meshed with the worm wheel 5, two bearing seats 12 are fixedly installed on the worm 11, the bearing seats 12 are fixedly connected with the upper grinding disc 3 of the circular plate 4, one end of the worm 11 is fixedly connected with a knob 13, the circular plate 4 can be rotated conveniently through the knob 13, the position of the electrode 9 can be adjusted, the worm wheel 5 and the worm 11 have self-locking characteristics by default in transmission, the turning phenomenon can not occur in the grinding process, the circular plate 4 is provided with an installation hole 6, the installation hole 6 is arranged on the surface of the circular plate 4 close to the edge, the top of the circular plate 4 is provided with a fixing plate 7, the top surface of the fixing plate 7 is provided with a limiting groove 8, the fixing plate 7 is connected with the circular plate 4 through a limiting device, the limiting device comprises a base plate 17, the base plate 17 is movably connected with the circular plate 4 through a rotating shaft, a limiting pin 18 is arranged at the top of the base plate 17, the bottom end of the limiting pin 18 penetrates through the base plate 17 and extends into the limiting groove 8, a tension spring 19 is sleeved on the limiting pin 18, two ends of the tension spring 19 are respectively fixedly connected with the limiting pin 18 and the base plate 17, the limiting pin 18 can press the fixing plate 7 downwards through the tension force of the tension spring 19, so that the fixing of the fixing plate 7 is realized, the fixing plate 7 and the electrode 9 can be disassembled by rotating the base plate 17 after the limiting pin 18 is moved upwards, the operation is convenient, the electrode 9 and the mounting hole 6 are convenient to clean and maintain, the electrode 9 is fixedly connected with the fixing plate 7, the electrode 9 is preferentially made of a conductive ceramic material, the electrode 9 can also be made of an overweight silicon-doped rod material, and part of the electrode 9 in the prior art is made of the overweight silicon-doped rod material, the potential danger of silicon wafer pollution is caused, the electrode 9 made of conductive ceramic materials or overweight silicon-doped bar materials can prevent the copper pollution phenomenon, the bottom end of the electrode 9 extends into the mounting hole 6, and the top end of the electrode 9 is fixedly connected with the probe 10.

When the silicon wafer polisher is used, when silicon wafers of different specifications are polished, the knob 13 is screwed to drive the worm 11 to rotate, the worm 11 rotates to drive the worm wheel 5 to rotate so as to drive the circular plate 4 to rotate, the circular plate 4 rotates to drive the surface-mounted probe 10 and the electrode 9 in the mounting hole 6 to move, and the electrode 9 rotates along with the circular plate 4 so as to adjust the distance between the electrode 9 and the center of the upper rotary disc and further adapt to the movement tracks of the centers of the silicon wafers of different specifications during polishing;

when electrode 9 and mounting hole 6 need to be cleaned up and maintained, upwards pull spacer pin 18 earlier, can drive spacer pin 18 and move up and break away from spacing groove 8, then rotate base plate 17 and remove base plate 17 from fixed plate 7 top, finally can upwards take out fixed plate 7, realize the dismantlement to fixed plate 7 and electrode 9.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a silicon chip grinds machine thickness measuring device, includes polisher mesa (1), its characterized in that: the top of the grinding machine table board (1) is provided with a lower grinding disc (2), the top of the lower grinding disc (2) is provided with an upper grinding disc (3), the upper grinding disc (3) is provided with a round hole, a circular plate (4) is arranged inside the round hole, the circular plate (4) is movably connected with the round hole through a bearing, the top edge of the circular plate (4) is fixedly sleeved with a worm wheel (5), one side of the worm wheel (5) is provided with an operating device, the circular plate (4) is provided with a mounting hole (6), the mounting hole (6) is arranged on the surface of the circular plate (4) close to the edge, the top of the circular plate (4) is provided with a fixing plate (7), the top surface of the fixing plate (7) is provided with a limiting groove (8), the fixing plate (7) is connected with the circular plate (4) through a limiting device, the fixing plate (7) is fixedly connected with an electrode (9), and the bottom end of the electrode (9) extends into the mounting hole (6), the top end of the electrode (9) is fixedly connected with a probe (10).

2. The thickness measuring device for the silicon wafer grinding machine according to claim 1, characterized in that: the operating device comprises a worm (11), the worm (11) is meshed with a worm wheel (5), two bearing blocks (12) are fixedly mounted on the worm (11), the bearing blocks (12) are fixedly connected with a circular plate (4) upper grinding disc (3), and one end of the worm (11) is fixedly connected with a knob (13).

3. The thickness measuring device for the silicon wafer grinding machine according to claim 1, characterized in that: go up mill (3) top fixedly connected with cover box (14), cover box (14) top fixedly connected with guide arm (15), the inside fixed mounting of cover box (14) has converter (16), fixedly connected with first cable and second cable on converter (16), first cable runs through cover box (14) and is connected with probe (10), the second cable runs through cover box (14) and guide arm (15) in proper order and extends to guide arm (15) outside.

4. The thickness measuring device for the silicon wafer grinding machine according to claim 1, characterized in that: stop device includes base plate (17), base plate (17) are through pivot and plectane (4) swing joint, base plate (17) top is provided with spacer pin (18), spacer pin (18) bottom is run through base plate (17) and is extended to in spacing groove (8), extension spring (19) have been cup jointed on spacer pin (18), extension spring (19) both ends respectively with spacer pin (18) and base plate (17) fixed connection.

5. The thickness measuring device for the silicon wafer grinding machine according to claim 1, characterized in that: the electrode (9) is preferably made of a conductive ceramic material, and the electrode (9) can also be made of an overweight silicon-doped bar material.

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