CN214507474U - Multilayer impedance circuit board - Google Patents
Multilayer impedance circuit board Download PDFInfo
- Publication number
- CN214507474U CN214507474U CN202120671889.1U CN202120671889U CN214507474U CN 214507474 U CN214507474 U CN 214507474U CN 202120671889 U CN202120671889 U CN 202120671889U CN 214507474 U CN214507474 U CN 214507474U
- Authority
- CN
- China
- Prior art keywords
- impedance
- circuit board
- board
- placing groove
- shading cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004744 fabric Substances 0.000 claims abstract description 38
- 238000013016 damping Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 230000008595 infiltration Effects 0.000 abstract description 4
- 238000001764 infiltration Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012720 thermal barrier coating Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a multilayer impedance circuit board, including first impedance board, the equal fixed mounting in position of middle both sides has first friction pad on the first impedance board, first impedance board has the second impedance board through connecting bolt movable mounting, the middle fixed position who leans on the upside on the first impedance board installs the information frame, lean on the position in middle to set up first standing groove on the first impedance board. The utility model discloses can carry out effectual protection to the circuit board through the setting of first impedance board and second impedance board, avoid the circuit board because the collision damages, can also protect the circuit board through the setting of first shading cloth and second shading cloth simultaneously, avoid the direct injection of highlight, in the meantime, the setting of first damping circle and second damping circle can increase the leakproofness, avoid liquid infiltration, at last during circuit board working, thermal-insulated effect can effectually be played to the circuit board to thermal-insulated coating, avoid circuit board high temperature.
Description
Technical Field
The utility model relates to a circuit board correlation field specifically is a multilayer impedance circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board may be referred to as a printed wiring board or a printed circuit board;
however, the existing circuit board has crude protection conditions, so that the circuit board is easily damaged, and meanwhile, the circuit board cannot be effectively insulated, so that the temperature of the circuit board is too high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer impedance circuit board to the protective condition who provides in solving above-mentioned background is simple and crude, simultaneously can't effectual thermal-insulated problem.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer impedance circuit board comprises a first impedance plate, wherein first friction pads are fixedly arranged at positions close to two sides in the middle of the first impedance plate, a second impedance plate is movably arranged on the first impedance plate through a connecting bolt, an information frame is fixedly arranged at a position close to the upper side in the middle of the first impedance plate, a first placing groove is formed in the position close to the middle of the first impedance plate, first shading cloth is movably arranged in the first placing groove, a second connecting magnetic strip is movably arranged in the first placing groove through a first connecting magnetic strip, first damping rings are fixedly arranged at positions close to the periphery of the bottom of the first impedance plate, second friction pads are fixedly arranged at positions close to two sides in the middle of the bottom of the second impedance plate, a second placing groove is formed in the position close to the middle of the bottom of the second impedance plate, and second shading cloth is movably arranged in the second placing groove, the second standing groove is connected magnetic stripe movable mounting through the third and is had the fourth connection vocabulary entry, second impedance board top is by position fixed mounting all around has the second damping circle, the second impedance board top has been seted up by the position in the middle of leaning on, the inside fixed mounting in second standing groove has the second rubber pad, movable mounting has the circuit board main part on the second rubber pad, circuit board main part coats and is stamped thermal-insulated coating, first standing groove has been seted up by the position in the middle of first impedance board bottom, the inside fixed mounting in first standing groove has the third rubber pad.
Preferably, the first impedance plate is rectangular, the second impedance plate is rectangular, and the length of the second impedance plate is consistent with the length of the first impedance plate.
Preferably, the first placing groove is rectangular, the second placing groove is rectangular, and the length of the second placing groove is consistent with that of the first placing groove.
Preferably, the first shading cloth is rectangular, the second shading cloth is rectangular, the length of the second shading cloth is consistent with that of the first shading cloth, and the length of the first shading cloth is smaller than that of the first placing groove.
Preferably, the circuit board main body is rectangular, and the length of the circuit board main body is smaller than that of the first shading cloth.
Preferentially, first friction pad sets up quantity and is two, and two first friction pad symmetries set up, first friction pad is the rectangle, second friction pad sets up quantity and is two, and two second friction pad symmetries set up, the second friction pad is the rectangle, the length of second friction pad is unanimous with the length of first friction pad.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses can carry out effectual protection to the circuit board through the setting of first impedance board and second impedance board, avoid the circuit board because the collision damages, can also protect the circuit board through the setting of first shading cloth and second shading cloth simultaneously, avoid the direct injection of highlight, in the meantime, the setting of first damping circle and second damping circle can increase the leakproofness, avoid liquid infiltration, at last during circuit board working, thermal-insulated effect can effectually be played to the circuit board to thermal-insulated coating, avoid circuit board high temperature.
Drawings
FIG. 1 is a front view of the structure of the present invention;
fig. 2 is an internal structure view of the first placing groove of the present invention;
fig. 3 is a bottom structure view of the first shade cloth of the present invention;
FIG. 4 is a view showing the structure of the present invention;
FIG. 5 is an internal structure view of the second placing groove of the present invention
Fig. 6 is a bottom structure view of the second light-shielding cloth of the present invention;
fig. 7 is a side view of the structure of the present invention;
fig. 8 is a structural view of the circuit board main body of the present invention;
fig. 9 is a partial three-dimensional structural view of the first impedance plate of the present invention.
In the figure: 1. a first impedance plate; 2. a first friction pad; 3. a connecting bolt; 4. an information frame; 5. a first placing groove; 6. a first shade cloth; 7. the first connecting magnetic strip; 8. a second connecting magnetic strip; 9. a first damping ring; 10. a second impedance plate; 11. a second friction pad; 12. a second placing groove; 13. a second light-shielding cloth; 14. the third is connected with the magnetic stripe; 15. a fourth connecting entry; 16. a second damping ring; 17. a second placement groove; 18. a second rubber pad; 19. a circuit board main body; 20. a thermal barrier coating; 21. a first placement groove; 22. and a third rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides the following technical solutions: a multilayer impedance circuit board comprises a first impedance board 1, wherein first friction pads 2 are fixedly arranged at positions close to two sides in the middle of the first impedance board 1, a second impedance board 10 is movably arranged on the first impedance board 1 through a connecting bolt 3, an information frame 4 is fixedly arranged at a position close to the upper side in the middle of the first impedance board 1, a first placing groove 5 is arranged at a position close to the middle of the first impedance board 1, first shading cloth 6 is movably arranged in the first placing groove 5, a second connecting magnetic strip 8 is movably arranged in the first placing groove 5 through a first connecting magnetic strip 7, first damping rings 9 are fixedly arranged at positions close to the periphery of the bottom of the first impedance board 1, second friction pads 11 are fixedly arranged at positions close to two sides in the middle of the bottom of the second impedance board 10, a second placing groove 12 is arranged at a position close to the middle of the bottom of the second impedance board 10, and second shading cloth 13 is movably arranged in the second placing groove 12, second standing groove 12 has fourth connection vocabulary 15 through 14 movable mounting of third connection magnetic stripe, second impedance board 10 top is by position fixed mounting all around has second damping circle 16, second impedance board 10 top has seted up second standing groove 17 by middle position, the inside fixed mounting of second standing groove 17 has second rubber pad 18, movable mounting has circuit board main part 19 on the second rubber pad 18, circuit board main part 19 coats and is stamped thermal-insulated coating 20, first standing groove 21 has been seted up to position in the middle of leaning on in first impedance board 1 bottom, the inside fixed mounting of first standing groove 21 has third rubber pad 22.
The utility model discloses in: the first impedance board 1 is rectangular, the second impedance board 10 is rectangular, the length of the second impedance board 10 is consistent with that of the first impedance board 1, and the first impedance board 1 can support part of the arrangement.
The utility model discloses in: the first placing groove 5 is rectangular, the second placing groove 12 is rectangular, the length of the second placing groove 12 is consistent with that of the first placing groove 5, and the first placing groove 5 can place part of the arrangement.
The utility model discloses in: first shading cloth 6 is the rectangle, and second shading cloth 13 is the rectangle, and the length of second shading cloth 13 is unanimous with the length of first shading cloth 6, and the length of first shading cloth 6 is less than the length of first standing groove 5, and second shading cloth 13 can cover the highlight.
The utility model discloses in: the circuit board main body 19 is rectangular, the length of the circuit board main body 19 is smaller than that of the first shading cloth 6, and the first shading cloth 6 can cover strong light.
The utility model discloses in: the number of the first friction pads 2 is two, the two first friction pads 2 are symmetrically arranged, the first friction pads 2 are rectangular, the number of the second friction pads 11 is two, the two second friction pads 11 are symmetrically arranged, the second friction pads 11 are rectangular, the length of the second friction pads 11 is consistent with that of the first friction pads 2, and the first friction pads 2 and the second friction pads 11 can provide friction.
The working principle is as follows: before using, can place the circuit board between first impedance board 1 and second impedance board 10, in the meantime, can carry out effectual protection to the circuit board through the setting of first impedance board 1 and second impedance board 10, avoid the circuit board to damage because of the collision, simultaneously can also protect the circuit board through the setting of first shading cloth 6 and second shading cloth 13, avoid the direct projection of highlight, simultaneously, the setting of first damping circle 9 and second damping circle 16 can increase the leakproofness, avoid the liquid infiltration, finally, in the circuit board during operation, thermal-insulated effect can effectually be played to the circuit board to thermal-insulated coating 20, avoid the circuit board high temperature, the security is improved, after accomplishing above steps, can accomplish work.
In summary, the following steps: the utility model discloses can carry out effectual protection to the circuit board through the setting of first impedance board 1 and second impedance board 10, avoid the circuit board because the collision damages, can also protect the circuit board through the setting of first shading cloth 6 and second shading cloth 13 simultaneously, avoid the direct injection of highlight, in the meantime, the setting of first damping circle 9 and second damping circle 16 can increase the leakproofness, avoid liquid infiltration, at last in circuit board during operation, thermal-insulated effect can effectually be played to the circuit board to thermal-insulated coating 20, avoid circuit board high temperature.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A multilayer impedance circuit board comprising a first impedance board (1), characterized in that: the device comprises a first impedance plate (1), wherein first friction pads (2) are fixedly mounted in the middle of the first impedance plate (1) by the positions on two sides, a second impedance plate (10) is movably mounted in the first impedance plate (1) by connecting bolts (3), an information frame (4) is fixedly mounted in the middle of the first impedance plate (1) by the position on the upper side, a first placing groove (5) is formed in the first impedance plate (1) by the position on the middle, first shading cloth (6) is movably mounted in the first placing groove (5), a second connecting magnetic strip (8) is movably mounted in the first placing groove (5) by a first connecting magnetic strip (7), first damping rings (9) are fixedly mounted in the bottom of the first impedance plate (1) by the positions on the periphery, and second friction pads (11) are fixedly mounted in the middle of the bottom of the second impedance plate (10) by the positions on two sides, the bottom of the second impedance plate (10) is provided with a second placing groove (12) close to the middle, the inside of the second placing groove (12) is movably provided with a second shading cloth (13), the second placing groove (12) is movably provided with a fourth connecting entry (15) through a third connecting magnetic strip (14), the top of the second impedance plate (10) is fixedly provided with a second damping ring (16) close to the periphery, the top of the second impedance plate (10) is provided with a second placing groove (17) close to the middle, the inside of the second placing groove (17) is fixedly provided with a second rubber pad (18), the second rubber pad (18) is movably provided with a circuit board main body (19), the circuit board main body (19) is covered with a heat insulation coating (20), the bottom of the first impedance plate (1) is provided with a first placing groove (21) close to the middle, and a third rubber pad (22) is fixedly arranged in the first accommodating groove (21).
2. A multilayer impedance circuit board of claim 1, wherein: the first impedance board (1) is rectangular, the second impedance board (10) is rectangular, and the length of the second impedance board (10) is consistent with that of the first impedance board (1).
3. A multilayer impedance circuit board of claim 1, wherein: the first placing groove (5) is rectangular, the second placing groove (12) is rectangular, and the length of the second placing groove (12) is consistent with that of the first placing groove (5).
4. A multilayer impedance circuit board of claim 1, wherein: the first shading cloth (6) is rectangular, the second shading cloth (13) is rectangular, the length of the second shading cloth (13) is consistent with that of the first shading cloth (6), and the length of the first shading cloth (6) is smaller than that of the first placing groove (5).
5. A multilayer impedance circuit board of claim 1, wherein: the circuit board main body (19) is rectangular, and the length of the circuit board main body (19) is smaller than that of the first shading cloth (6).
6. A multilayer impedance circuit board of claim 1, wherein: first friction pad (2) set up quantity and be two, and two first friction pads (2) symmetry sets up, first friction pad (2) are the rectangle, second friction pad (11) set up quantity and be two, and two second friction pads (11) symmetry sets up, second friction pad (11) are the rectangle, the length of second friction pad (11) is unanimous with the length of first friction pad (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671889.1U CN214507474U (en) | 2021-04-01 | 2021-04-01 | Multilayer impedance circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671889.1U CN214507474U (en) | 2021-04-01 | 2021-04-01 | Multilayer impedance circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214507474U true CN214507474U (en) | 2021-10-26 |
Family
ID=78199997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120671889.1U Expired - Fee Related CN214507474U (en) | 2021-04-01 | 2021-04-01 | Multilayer impedance circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214507474U (en) |
-
2021
- 2021-04-01 CN CN202120671889.1U patent/CN214507474U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211026 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |