CN214506046U

CN214506046U - Miniaturized high-power chip

Info

Publication number: CN214506046U
Application number: CN202120578383.6U
Authority: CN
Inventors: 芮建保; 潘昊; 韦春雷
Original assignee: WUXI LUMISOURCE TECHNOLOGIES CO LTD
Current assignee: WUXI LUMISOURCE TECHNOLOGIES CO LTD
Priority date: 2021-03-22
Filing date: 2021-03-22
Publication date: 2021-10-26
Anticipated expiration: 2031-03-22

Abstract

The utility model discloses a miniaturized high-power chip, including mount pad and the chip module of fixed connection on the mount pad, a serial communication port, the chip module includes a plurality of group connection heat sink and the chip group of fixed connection on heat sink on the mount pad, the chip group includes the positive negative pole series connection's of a plurality of groups chip unit, the chip unit includes base and the chip body of fixed connection on the base, the chip body passes through base fixed connection on heat sink, positive negative pole both ends difference fixedly connected with positive conducting strip and the negative pole conducting strip of the outside edge of chip group, heat sink demountable connection is on the mount pad, the utility model has the advantages of rational in infrastructure, be convenient for installation and dismantlement promote maintenance efficiency.

Description

Miniaturized high-power chip

Technical Field

The utility model belongs to the technical field of the chip package, concretely relates to miniaturized high-power chip.

Background

The semiconductor pumped solid laser is a new laser which is developed internationally fastest in recent years and has wide application, and the semiconductor laser which outputs fixed wavelength replaces a traditional krypton lamp or xenon lamp to pump a laser crystal, so that the semiconductor pumped solid laser is brand-new in development and is called as a second-generation laser. The laser is also a second-generation novel solid laser with low power consumption, reliable performance, long service life and good output beam quality, and has unique application prospect in high-tech fields such as space communication, optical fiber communication, atmospheric research, environmental science, medical instruments, optical image processing, laser printers and the like.

In prior art, often weld a plurality of chipsets together earlier and constitute the chip module, then with chip module lug weld on heat sink, in case some one of them chipset breaks down, owing to be wholly be welded connection, so need all dismantle all chip units get off, could overhaul, the step is too loaded down with trivial details, influences maintenance efficiency.

Therefore, in view of the above technical problems, it is necessary to provide a miniaturized high-power chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a miniaturized high-power chip to solve the problem among the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a miniaturized high-power chip, includes mount pad and the chip module of fixed connection on the mount pad, the chip module includes that a plurality of group connect on the mount pad heat sink with the chipset of fixed connection on heat sink, the chipset includes the positive negative pole series connection's of a plurality of groups chip unit, the chip unit includes base and the chip body of fixed connection on the base, the chip body passes through base fixed connection on heat sink, the positive negative pole both ends of the outside edge of chipset are positive conducting strip and negative pole conducting strip of fixedly connected with respectively, heat sink demountable connection is on the mount pad.

As an optimal technical scheme of the utility model, fixedly connected with collets between base and the heat sink, the base passes through the collets welding on the heat sink, the collets are insulating ceramic block.

As an optimal technical scheme of the utility model, heat sink passes through screw threaded connection on the mount pad.

As an optimal technical scheme of the utility model, heat sink both ends are provided with an electricity electrode of drawing respectively, and respectively with anodal conducting strip and negative pole conducting strip welded connection.

As an optimized technical scheme of the utility model, the electricity leading electrode passes through screw fixed connection on heat sink.

As an optimized technical scheme of the utility model, be provided with insulating gasket between screw and the electricity electrode that draws.

As an optimal technical scheme of the utility model, heat sink both ends are provided with and are used for placing the standing groove that draws electric electrode and insulating gasket.

Compared with the prior art, the beneficial effects of the utility model are that: constitute the chip module on respective heat sink through many group's chip group welding, and pass heat sink threaded connection on the mount pad through the screw, thereby in case chip module's somewhere finds the trouble, only need with the chipset of trouble department and the screw of heat sink department unscrew, alright dismantle the trouble department, and change new chipset and heat sink, the installation of screwing of reuse screw, thereby reach the effect of quick maintenance, it is rational in infrastructure to have, be convenient for installation and dismantlement, promote maintenance efficiency's advantage.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

FIG. 2 is a schematic diagram of a connection structure between a chip set and a heat sink according to an embodiment of the present application;

fig. 3 is an enlarged view at a in fig. 2.

In the figure: 1. a mounting seat; 2. a chip module; 3. a heat sink; 4. a chip unit; 5. a base; 6. a chip body; 7. a positive electrode conductive sheet; 8. a negative electrode conductive sheet; 9. an insulating block; 10. a charging electrode; 11. welding flux; 12. a screw; 13. an insulating spacer; 14. and (6) placing the groove.

Detailed Description

The present invention will be described in detail below with reference to embodiments shown in the drawings. However, the present invention is not limited to the embodiments, and the structural, method, or functional changes made by those skilled in the art according to the embodiments are all included in the scope of the present invention.

As shown in fig. 1-3, a miniaturized high-power chip, including mount pad 1 and chip module 2 of fixed connection on mount pad 1, chip module 2 includes a plurality of group connection heat sink 3 and the chipset of fixed connection on heat sink 3 on mount pad 1, the chipset includes the positive negative pole series connection's of a plurality of groups chip unit 4, chip unit 4 includes base 5 and chip body 6 of fixed connection on base 5, chip body 6 passes through base 5 fixed connection on heat sink 3, the positive negative pole both ends of the outside edge of chipset are fixedly connected with anodal conducting strip 7 and negative pole conducting strip 8 respectively, heat sink 3 demountable connection is on mount pad 1.

Preferably, the heat sink 3 is screwed on the mounting base 1 by screws 12, and the screws 12 have the effect of facilitating mounting and dismounting.

Wherein, fixedly connected with collets 9 between base 5 and the heat sink 3, base 5 passes through collets 9 welding on heat sink 3, play the effect of isolating current on chip unit 4 on base 5 and heat sink 3 through collets 9 and come, collets 9 are insulating ceramic block, utilize insulating ceramic's good insulating properties, this insulating ceramic block still has good heat conductivity simultaneously, has also played the radiating effect to chip unit 4.

Wherein, the two ends of the heat sink 3 are respectively provided with an electric leading electrode 10, and are respectively fixedly connected with the anode conducting strip 7 and the cathode conducting strip 8, and the electric leading electrode 10 and the conducting electrode adopt a mode of secondary welding of a welding flux 11, so that the stress on a soldering lug can be released, and the reliability of the module is improved.

The leading electrode 10 is fixedly connected to the heat sink 3 through a screw 12, and one end of the screw 12 sequentially penetrates through the leading electrode 10 and the heat sink 3 and is in threaded connection with the mounting base 1, so that the effect of fixedly connecting the leading electrode 10 to the heat sink 3 is achieved.

An insulating gasket 13 is arranged between the screw 12 and the electricity leading electrode 10, and the insulating gasket 13 plays a role of organizing the current on the electricity leading electrode 10 to pass through the screw 12 and also plays a role of protecting the electricity leading electrode 10 when the screw 12 is screwed.

Wherein, the two ends of the heat sink 3 are provided with the placing grooves 14 for placing the electricity leading electrode 10 and the insulating gasket 13, which has the effect of limiting the positions of the electricity leading electrode 10 and the insulating gasket 13.

The packaging process of the present invention will be explained in detail below:

firstly, the chip unit 4 and the base 5 are welded and connected, then a plurality of groups of welded chip units 4 and the positive and negative poles of the base 5 are stacked in series to form a chip group, and the chip group is welded on the heat sink 3, in order to achieve the effect of insulation, the chip group is firstly welded on the insulation block 9, then the insulation block 9 is welded on the heat sink 3, thereby achieving the effect of welding the chip group on the heat sink 3, then, the two ends of the chip group are respectively welded with the anode conducting strip 7 and the cathode conducting strip 8, in order to release the stress of the welding position and increase the reliability of the chip module 2, the two ends of the heat sink 3 are respectively fixedly connected with an electricity leading electrode 10 through a screw 12, the anode conducting strip 7 and the cathode conducting strip 8 are respectively welded on the electricity leading electrode 10, and finally, the chip group and the heat sink 3 are placed together to form the chip module 2 and are connected to the mounting seat 1 through the screws 12 on the respective heat sink 3 in a threaded manner.

To sum up, the beneficial effects of the utility model are that: constitute the chip module on respective heat sink through many group's chip group welding, and pass heat sink threaded connection on the mount pad through the screw, thereby in case chip module's somewhere finds the trouble, only need with the chipset of trouble department and the screw of heat sink department unscrew, alright dismantle the trouble department, and change new chipset and heat sink, the installation of screwing of reuse screw, thereby reach the effect of quick maintenance, it is rational in infrastructure to have, be convenient for installation and dismantlement, promote maintenance efficiency's advantage.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a miniaturized high-power chip, includes mount pad (1) and chip module (2) of fixed connection on mount pad (1), its characterized in that, chip module (2) include a plurality of groups connect on mount pad (1) heat sink (3) and the chipset of fixed connection on heat sink (3), the chipset includes positive negative pole series connection's of a plurality of groups chip unit (4), chip unit (4) include base (5) and chip body (6) of fixed connection on base (5), chip body (6) are through base (5) fixed connection on heat sink (3), the positive negative pole both ends of outside edge of chipset are fixedly connected with anodal conducting strip (7) and negative pole conducting strip (8) respectively, heat sink (3) can be dismantled and connect on mount pad (1).

2. A miniaturized high power chip according to claim 1, characterized in that: the heat sink is characterized in that an insulating block (9) is fixedly connected between the base (5) and the heat sink (3), the base (5) is welded on the heat sink (3) through the insulating block (9), and the insulating block (9) is an insulating ceramic block.

3. A miniaturized high power chip according to claim 1, characterized in that: the heat sink (3) is in threaded connection with the mounting base (1) through a screw (12).

4. A miniaturized high power chip according to claim 1, characterized in that: and two ends of the heat sink (3) are respectively provided with an electric leading electrode (10) which is respectively connected with the positive conducting strip (7) and the negative conducting strip (8) in a welding way.

5. A miniaturized high-power chip according to claim 4, characterized in that: the electricity leading electrode (10) is fixedly connected to the heat sink (3) through a screw (12).

6. A miniaturized high power chip according to claim 5, characterized in that: an insulating gasket (13) is arranged between the screw (12) and the electricity leading electrode (10).

7. A miniaturized high power chip according to claim 6, characterized in that: and two ends of the heat sink (3) are provided with placing grooves (14) for placing the electricity leading electrodes (10) and the insulating gaskets (13).