CN214505481U - Split type photovoltaic large-current module - Google Patents
Split type photovoltaic large-current module Download PDFInfo
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- CN214505481U CN214505481U CN202120431900.7U CN202120431900U CN214505481U CN 214505481 U CN214505481 U CN 214505481U CN 202120431900 U CN202120431900 U CN 202120431900U CN 214505481 U CN214505481 U CN 214505481U
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- frame
- mounting part
- chip mounting
- heat dissipation
- current module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
Split type photovoltaic heavy current module. The split type photovoltaic large-current module capable of improving the heat dissipation performance and the installation convenience is provided. The chip package comprises a first frame, a second frame, a plastic package body and a pair of chips; the end part of the second frame is provided with a first chip mounting part and a second chip mounting part which are matched with the pair of chips; a heat dissipation opening is formed between the first chip mounting part and the second chip mounting part; the pair of chips are electrically connected with the first frame through jumper wires respectively and are packaged through the plastic package body; the plastic package body is provided with a notch matched with the heat dissipation port. The heat dissipation opening is T-shaped. The utility model has the characteristics of heat dispersion is high, the simple installation and reduce cost etc.
Description
Technical Field
The utility model relates to a bypass diode especially relates to split type photovoltaic heavy current module's institutional advancement.
Background
The photovoltaic bypass diode is arranged in the junction box, so that the assembly can be protected from being damaged when a facula effect occurs, and when the diode is started, the short-circuit current (Isc) of the assembly flows in the forward direction of the diode, and the diode can generate temperature rise. In the early stage, when the power of the component is small (200W-300W), the conventional diode can meet the temperature rise condition (the junction temperature Tj of the diode is less than or equal to 200 ℃), but in order to realize the flat-price network connection as soon as possible, high-power components (400 plus 500W) are provided by large component manufacturers, so that the power consumption cost is reduced. The module diode has advantages such as the electric capacity is strong, good heat dissipation, has satisfied the condition of heavy current well, but when the electric current continues to increase, the module product mainly exists at present, in order to pass through more heavy current, can adopt the design of two chips to shunt, and the calorific capacity of two chips is wrapped up by same plastic-sealed body, and the heat production stack phenomenon.
SUMMERY OF THE UTILITY MODEL
The utility model provides an above problem, provide an improve split type photovoltaic heavy current module of heat dispersion and installation convenience.
The technical scheme of the utility model is that: the split type photovoltaic large-current module comprises a first frame, a second frame, a plastic package body and a pair of chips; the end part of the second frame is provided with a first chip mounting part and a second chip mounting part which are matched with the pair of chips;
a heat dissipation opening is formed between the first chip mounting part and the second chip mounting part;
the pair of chips are electrically connected with the first frame through jumper wires respectively and are packaged through the plastic package body;
the plastic package body is provided with a notch matched with the heat dissipation port.
The heat dissipation opening is T-shaped.
The opening is of a rectangular structure.
And a positive pole mark is arranged on the second frame.
And a negative pole mark is arranged on the first frame.
The utility model comprises a first frame, a second frame, a plastic package body and a pair of chips; the end part of the second frame is provided with a first chip mounting part and a second chip mounting part which are matched with the pair of chips; a heat dissipation opening is formed between the first chip mounting part and the second chip mounting part; the plastic package body at the chip part adopts a partial split design, and the roots are still connected together, so that the requirements of TUV authentication can be met, two heating sources can be isolated, the influence degree is greatly reduced, and the heat dissipation performance of the whole product is improved; meanwhile, the opening in the middle of the plastic package body reduces the using amount of plastic package materials and the cost of the product. The utility model has the characteristics of heat dispersion is high, the simple installation and reduce cost etc.
Drawings
Figure 1 is a structural schematic diagram of the first appearance of the utility model,
figure 2 is a structural schematic diagram of the second appearance of the utility model,
FIG. 3 is a schematic side view of the package of FIG. 2;
in the figure, 1 is a first frame, 2 is a second frame, 21 is a heat dissipation port, 3 is a plastic package body, 31 is a notch, 4 is a chip, 5 is a positive pole mark, and 6 is a negative pole mark.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
As shown in fig. 1-3, the split photovoltaic high-current module of the present invention includes a first frame 1, a second frame 2, a plastic package body 3 and a pair of chips 4; a first chip mounting part and a second chip mounting part which are matched with the pair of chips 4 are arranged at the end part of the second frame 2;
a heat dissipation opening 21 is formed between the first chip mounting part and the second chip mounting part;
the pair of chips 4 are electrically connected with the first frame 1 through jumper wires respectively and are packaged through the plastic package body 3;
the plastic package body 3 is provided with a notch 31 matched with the heat dissipation opening 21.
The heat dissipation opening 21 is T-shaped.
The gap 31 is of a rectangular structure.
And a positive pole mark 5 is arranged on the second frame 2.
And a negative pole mark 6 is arranged on the first frame 1.
The plastic package body 3 at the chip 4 part adopts a partial split design, the root part is still connected together, the requirements of TUV authentication can be met, two heating sources (the chip 4) can be isolated, the influence degree is greatly reduced, and the heat radiation performance of the whole product is improved; meanwhile, the opening 31 in the middle of the plastic package body 3 reduces the consumption of plastic package materials and the cost of the product. The heat dissipation cost and the installation problem that heavy current module product faced are solved better.
The notch 31 of the plastic package body 3 is designed towards the positive pole direction, so that the situation that the positive pole and the negative pole are reversely arranged is further effectively prevented.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
Claims (5)
1. The split type photovoltaic large-current module comprises a first frame, a second frame, a plastic package body and a pair of chips; the chip packaging structure is characterized in that a first chip mounting part and a second chip mounting part which are matched with a pair of chips are arranged at the end parts of the second frame;
a heat dissipation opening is formed between the first chip mounting part and the second chip mounting part;
the pair of chips are electrically connected with the first frame through jumper wires respectively and are packaged through the plastic package body;
the plastic package body is provided with a notch matched with the heat dissipation port.
2. The split photovoltaic high-current module of claim 1, wherein the heat dissipation opening is T-shaped.
3. The split photovoltaic high-current module as claimed in claim 1, wherein the gap has a rectangular structure.
4. The split type photovoltaic large-current module as claimed in claim 1, wherein the second frame is provided with a positive mark.
5. The split photovoltaic high-current module as claimed in claim 1, wherein the first frame is provided with a negative pole mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120431900.7U CN214505481U (en) | 2021-02-26 | 2021-02-26 | Split type photovoltaic large-current module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120431900.7U CN214505481U (en) | 2021-02-26 | 2021-02-26 | Split type photovoltaic large-current module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214505481U true CN214505481U (en) | 2021-10-26 |
Family
ID=78226165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120431900.7U Active CN214505481U (en) | 2021-02-26 | 2021-02-26 | Split type photovoltaic large-current module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214505481U (en) |
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2021
- 2021-02-26 CN CN202120431900.7U patent/CN214505481U/en active Active
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