CN214505455U - Automatic forming machine for transistor - Google Patents

Abstract

The utility model discloses an automatic forming machine of transistor, include: a feeding unit; a molding unit; a shearing unit; a transition section is arranged between the discharge side of the feeding unit and the turntable, and a material pushing assembly for pushing the transistor into the limited groove is arranged on the transition section; and a material shifting component which pushes out the transistor which does not fall into the limiting groove is arranged above the turntable at the position matched with the material pushing component. The utility model provides an automatic forming machine of transistor is through setting up the matched with on current automatic forming machine of transistor and dialling the material subassembly for it pushes away the material back each time, all dials the material through dialling the material subassembly to its surface and cleans, will fall into the not meeting the requirement of injecing the trench position and sweep out, solves the limited problem of its later stage processing product yield.

Description

Automatic forming machine for transistor

Technical Field

The utility model relates to an electronic components's scale production technical field especially relates to an automatic make-up machine of transistor.

Background

A transistor (transistor) is a solid state semiconductor element that can be used for amplification, switching, voltage regulation, signal modulation, and many other functions. The transistor is used as a variable switch, and controls the current flowing out based on the input voltage, so the transistor can be used as a current switch, unlike the common mechanical switches (such as Relay, switch), the transistor is controlled by an electrical signal, and the switching speed can be very fast, the switching speed in a laboratory can reach more than 100GHz, while the current transistor is a horizontal package, which needs to be bent manually by using a pincette after the pin is cut by using a pin cutter, and the structure of the formed transistor 33 is shown in FIG. 3.

In the prior art, automatic bending of the pins is realized by adopting an automatic transistor forming machine, but the pins are limited by partial structure of the transistors (one end of each transistor is of an arc-shaped structure), so that after the transistors are fed by adopting the conventional feeding, the problem that the transistors are not matched with the limiting grooves in place (namely, the arc-shaped surfaces face upwards, and the transistors cannot fall into the limiting grooves completely) can be caused, and the processing yield in the later period is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages which will be described later.

To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided an automatic transistor forming machine including:

a base on which a table is provided;

the feeding unit is matched with one side of the workbench;

at least one forming unit arranged at the periphery of the workbench;

a shearing unit disposed at a downstream side of the molding unit;

wherein the work table is configured to include:

a circular turntable, on which a plurality of limiting grooves for accommodating transistors are arranged;

the pedestal is matched with the turntable, a notch for discharging is arranged on the pedestal, and a material collecting box matched with the notch is arranged in the pedestal;

a transition section is arranged between the discharge side of the feeding unit and the turntable, and a material pushing assembly for pushing the transistor into the limited groove is arranged on the transition section;

and a material shifting component which pushes out the transistor which does not fall into the limiting groove is arranged above the turntable at the position matched with the material pushing component.

Preferably, the feeding unit is configured to comprise a vibrating feed tray and a conveyor belt cooperating with an output side thereof;

the conveying belt is configured to be provided with an open section at one side matched with the feeding disc, and a contraction section matched with the transistor is arranged at the side matched with the rotary disc;

the outer edges of the open section and the contraction section are respectively provided with a baffle plate for limiting the transistor.

Preferably, the molding unit is configured to include:

the fixed die matched with the turntable is configured to comprise a base and a sliding die matched with the base, and a forming surface matched with the transistor pin forming structure is arranged on the upward surface of the sliding die;

a movable mold arranged above the turntable and matched with the fixed mold;

wherein, a sunk groove for accommodating the sliding die is arranged in the base, and a first sliding groove matched with the sunk groove is arranged on the opposite side of the sunk groove;

sliding columns matched with the first sliding grooves are respectively arranged on two sides of the sliding die, and sliding balls with the diameters larger than those of the sliding columns are arranged on the end parts of the sliding columns;

a second sliding groove matched with the sliding ball is arranged in the first sliding groove;

and one side of the sliding die, which is far away from the turntable, is provided with a cam transmission assembly or a first telescopic mechanism which is matched with the cam transmission assembly or the first telescopic mechanism.

Preferably, the cam transmission assembly or the first telescopic mechanism is arranged on the base through a matched mounting seat;

the inner part of the base is in transmission connection with the bottom of the mounting seat through a second telescopic mechanism matched with the base, and a switch for switching the working state of the telescopic mechanism is arranged on the surface of the base;

and a first power mechanism in transmission connection with the cam component is arranged on the mounting seat.

Preferably, the pushing assembly is configured to include an electric push rod and a pushing plate matched with the electric push rod;

the kick-out assembly is configured to include:

the power output end of the second power mechanism is connected with a rotating shaft;

the bottom surface of the kick-out plate arranged at the free end of the rotating shaft is matched to be parallel to the surface of the rotating disc and is spaced by a preset distance;

the base is provided with the hopper with switch-off plate matched with in breach department, and it is connected with the vibration dish transmission through matched with transmission assembly.

The utility model discloses at least, include following beneficial effect: one of which, the utility model discloses a set up the matched with on current automatic make-up machine of transistor and dial the material subassembly for it pushes away the material back each time, all dials the material through dialling the material subassembly and cleans its surface, will fall into the not meeting the requirement of restricted trench position and sweep out, solves the limited problem of its later stage processing product yield.

And secondly, the utility model discloses a structure to the shaping unit is injectd for its fashioned sliding tray can be replaced as required, guarantees that an equipment can process the structure of different pins, has better adaptability.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

Drawings

FIG. 1 is a schematic diagram of an automatic transistor forming machine according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of a fixed mold according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a transistor after formation.

Detailed Description

The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.

It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

It should be noted that in the description of the present invention, the terms indicating the orientation or the positional relationship are based on the orientation or the positional relationship shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the indicated device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, such as "connected," which may be a fixed connection, a detachable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or a connection between two elements, and those skilled in the art will understand the specific meaning of the terms in the present invention in a specific context.

Furthermore, in the present disclosure, unless explicitly stated or limited otherwise, a first feature may be "on" or "under" a second feature in direct contact with the first and second features, or in indirect contact with the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Fig. 1 shows an implementation form of an automatic forming machine for transistors according to the present invention, which includes:

a base 1 on which a table is provided;

a feeding unit 2 matched with one side of the worktable and used for feeding the semi-finished product of the transistor to the worktable for processing;

at least one molding unit 3 arranged at the periphery of the workbench and used for molding pins of the transistor;

the shearing unit 4 is arranged at the downstream side of the molding unit and is used for shearing the molded pins, and the shearing operation can be completed by adopting a matched shearing die or a shearing surface matched with the pin structure through a cutter arranged at the upper end;

wherein the work table is configured to include:

a circular turntable 5, on which a plurality of limiting grooves 6 capable of accommodating transistors are arranged, for fixing the transistors and simultaneously conveying the transistors to a working position where a forming unit and a shearing unit are located in a rotating manner for forming and shearing;

a pedestal 7 matched with the turntable is provided with a notch 8 for discharging, a material collecting box 9 matched with the notch is arranged in the pedestal, and the notch has the function that after the transistor is completely processed, the transistor reaches the notch under the action of the turntable and falls into the material collecting box, so that the whole forming process is completed;

in the structure, after the transistor conveyed by the feeding unit is conveyed to the transition section, the transistor is pushed into the limited groove of the turntable through the matched pushing assembly to complete the conveying of the transistor;

the material stirring component 12 which pushes out the transistor which does not fall into the limited groove is arranged above the rotary disc at the position matched with the material pushing component, in the structure, when one side of the transistor has an arc-shaped structure, after the material is pushed every time, the material stirring operation is completed through the material stirring component, the transistor which does not fall into the limited groove completely can push out the current limited groove of the rotary disc under the action of the material stirring component, the problem that the yield is low due to the fact that the structure position is not proper in the later stage forming process is prevented, and certainly, if the transistor adopts a regular rectangular structure, the material stirring component does not perform any operation.

In another example, as shown in fig. 1, the feed unit is configured to include a vibrating feed plate 13 and a conveyor belt cooperating with the output side thereof, in which a single uninterrupted, but spaced continuous feed is performed by the vibrating feed plate, while the conveyor belt functions to convey the materials one by one in the direction of the turntable;

wherein the conveyor belt is configured with an open section 14 at the side matched with the feeding disc, and a contraction section 15 matched with the transistor is arranged at the side matched with the turntable, in the structure, the fed material is guided and transmitted by the open section, and is shaped during transmission, so that the transmission direction of the material can be limited according to the width of the contraction section, and the transmission direction of the material is ensured to be matched with the feeding direction;

the outer edges of the open section and the contraction section are respectively provided with a baffle 16 for limiting the transistor, in the structure, the position of the transistor is limited through the action of the baffle, the transistor is prevented from sliding out of the transmission belt in the transmission process, the stability of transmission is ensured, in actual operation, a matched camera can be arranged on the transmission belt according to requirements to detect the transmission direction of the transistor, and when the transmission direction of the transistor is not matched with a preset angle, the position of the transistor can be adjusted through a turnover mechanism or a mechanical arm.

As shown in fig. 1-2, in another example, the molding unit is configured to include:

a fixed die 17 matched with the turntable, which is configured to include a base 18 and a sliding die 19 matched with the base, and the upward side of the sliding die is provided with a molding surface matched with the transistor pin molding structure;

a movable die (not shown) arranged above the turntable and matched with the fixed die, wherein in the structure, the base is fixedly connected with the base, the sliding die is matched with the turntable, so that when the limiting groove rotates to the position of the sliding die, pins are placed on the surface of the sliding die through the change of the position of the sliding die, and further when the reciprocating movable die is pressed down, the pins are molded through another molding surface which is arranged on the movable die and matched with the sliding die, the movable die moves upwards after molding, and the sliding die retracts to complete one-step molding operation;

wherein, a sunk groove 20 for accommodating the sliding die is arranged in the base, and a first sliding groove 21 matched with the sunk groove is arranged on the opposite side of the sunk groove;

two sides of the sliding die are respectively provided with a sliding column 22 matched with the first sliding chute, and the end part of each sliding column is provided with a sliding ball 23 with the diameter larger than that of the sliding column;

the sliding die is limited by the sinking groove, so that the sliding die and the sliding die have certain interference, meanwhile, the sliding die is matched with the first sliding groove by the sliding columns protruding out of two ends of the sliding die, the stability of the sliding die and the sliding die in motion is ensured, the spatial interference of the sliding die and the sliding die is further limited by the matching of the sliding ball and the second sliding groove, the sliding smoothness of the sliding die is ensured, and the large diameter of the sliding ball is arranged, so that the stability of the sliding die and the sliding die in work is better, deviation cannot occur, and the processing precision of the sliding die and the sliding die are ensured;

the side of the sliding die, which is far away from the rotating disc, is provided with a cam transmission assembly 25 or a first telescopic mechanism which is matched with the cam transmission assembly, in the structure, through the structural design of the cam transmission assembly, only part of the cam assembly is in contact with the sliding die when being placed for a circle, so that the sliding groove is pushed out to complete the matching with the movable die when in contact, furthermore, in order to ensure that the cam assembly returns to the initial position when being separated, an elastic element can be arranged between the bottom of the sliding die and the base, so that the cam returns to the initial position when not being in contact with the sliding die, and similarly, one side of the sliding die can be provided with a first telescopic mechanism (an air cylinder or a screw rod sleeve) which is matched with the sliding die, so that the sliding die is sent to a designated position or returned to the initial position according to requirements.

In another example, as shown in fig. 1, the cam gear assembly or first telescoping mechanism is mounted to the base by a mating mounting block 26;

the interior of the base is in transmission connection with the bottom of the mounting base through a second telescopic mechanism (not shown) matched with the base, and a switch 27 for switching the working state of the telescopic mechanism is arranged on the surface of the base, namely the spatial position of the mounting base and the cam transmission assembly or the first telescopic mechanism is adjusted by controlling the second telescopic mechanism to be in the working state through the switch;

the cam module sliding die is characterized in that a first power mechanism (not shown) in transmission connection with the cam module is arranged on the mounting seat, in the structure, the position of the cam transmission module or the first telescopic mechanism is limited through the mounting seat, the space height of the cam transmission module or the first telescopic mechanism is matched with the sliding die during working, when the sliding die needs to be replaced, the position of the mounting seat and the position of the first telescopic mechanism are adjusted downwards through the second telescopic mechanism, the sliding die is taken into the base, and the sliding die is taken out of the base to be replaced, so that the cam module sliding die has better adaptability.

In another example, as shown in fig. 1, the pushing assembly is configured to include an electric push rod 28 and a pushing plate 29 coupled thereto;

the kick-out assembly is configured to include:

a second power mechanism 30, the power output end of which is connected with a rotating shaft (not shown);

a kick-out plate 31 provided at the free end of the rotary shaft, the bottom surface of which is fitted to be parallel to the surface of the turntable and spaced apart by a predetermined distance;

the base is provided with hopper 32 matched with the kickoff plate at the breach, it is connected with the vibration dish transmission through matched with transmission subassembly (not shown), in this kind of scheme, when the changeover portion has the material, drive the kickoff plate through electric putter and push the transistor of changeover portion to the limited groove in, and the kickoff plate is used for when one side of transistor has the cambered surface, drive pivot, the kickoff plate rotation through second power unit (motor), sweep the transistor into the hopper, then reply to the initial position of kickoff plate, and the transistor that gets into in the hopper passes through matched with transmission band, vertical lifting mechanism returns to the vibration dish, carry out secondary operation, guarantee the yield of equipment processing, in actual operation, kickoff plate and kickoff plate can have certain radian to prescribe a limit to the driven position of advancing of transistor.

The above embodiments are merely illustrative of a preferred embodiment, but not limiting. When the utility model is implemented, the proper replacement and/or modification can be carried out according to the requirements of users.

The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.

While embodiments of the invention have been disclosed above, it is not intended to be limited to the applications listed in the specification and the examples. It can be applicable to various and be fit for the utility model discloses a field completely. Additional modifications will readily occur to those skilled in the art. The invention is therefore not to be limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims (5)

1. An automatic forming machine for transistors, comprising:

a base on which a table is provided;

the feeding unit is matched with one side of the workbench;

at least one forming unit arranged at the periphery of the workbench;

a shearing unit disposed at a downstream side of the molding unit;

wherein the work table is configured to include:

a circular turntable, on which a plurality of limiting grooves for accommodating transistors are arranged;

the pedestal is matched with the turntable, a notch for discharging is arranged on the pedestal, and a material collecting box matched with the notch is arranged in the pedestal;

a transition section is arranged between the discharge side of the feeding unit and the turntable, and a material pushing assembly for pushing the transistor into the limited groove is arranged on the transition section;

and a material shifting component which pushes out the transistor which does not fall into the limiting groove is arranged above the turntable at the position matched with the material pushing component.

2. The automatic transistor molding machine according to claim 1, wherein the feeding unit is configured to include a vibrating feeding plate and a conveyor belt engaged with an output side thereof;

the conveying belt is configured to be provided with an open section at one side matched with the feeding disc, and a contraction section matched with the transistor is arranged at the side matched with the rotary disc;

the outer edges of the open section and the contraction section are respectively provided with a baffle plate for limiting the transistor.

3. The automatic transistor molding machine according to claim 1, wherein the molding unit is configured to include:

the fixed die matched with the turntable is configured to comprise a base and a sliding die matched with the base, and a forming surface matched with the transistor pin forming structure is arranged on the upward surface of the sliding die;

a movable mold arranged above the turntable and matched with the fixed mold;

wherein, a sunk groove for accommodating the sliding die is arranged in the base, and a first sliding groove matched with the sunk groove is arranged on the opposite side of the sunk groove;

sliding columns matched with the first sliding grooves are respectively arranged on two sides of the sliding die, and sliding balls with the diameters larger than those of the sliding columns are arranged on the end parts of the sliding columns;

a second sliding groove matched with the sliding ball is arranged in the first sliding groove;

and one side of the sliding die, which is far away from the turntable, is provided with a cam transmission assembly or a first telescopic mechanism which is matched with the cam transmission assembly or the first telescopic mechanism.

4. The machine of claim 3, wherein the cam assembly or the first telescoping mechanism is mounted on the base by a mating mounting seat;

the inner part of the base is in transmission connection with the bottom of the mounting seat through a second telescopic mechanism matched with the base, and a switch for switching the working state of the telescopic mechanism is arranged on the surface of the base;

and a first power mechanism in transmission connection with the cam component is arranged on the mounting seat.

5. The automatic transistor forming machine of claim 1, wherein the pusher assembly is configured to include an electric pusher and a pusher plate coupled thereto;

the kick-out assembly is configured to include:

the power output end of the second power mechanism is connected with a rotating shaft;

the bottom surface of the kick-out plate arranged at the free end of the rotating shaft is matched to be parallel to the surface of the rotating disc and is spaced by a preset distance;

the base is provided with the hopper with switch-off plate matched with in breach department, and it is connected with the vibration dish transmission through matched with transmission assembly.

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