CN214504141U

CN214504141U - Chip atomic clock

Info

Publication number: CN214504141U
Application number: CN202120513267.6U
Authority: CN
Inventors: 刘瑞元; 王鑫; 宋亚飞; 梁小芃
Original assignee: Beijing Huaxintai Science And Technologies Corp ltd
Current assignee: Beijing Huaxintai Science And Technologies Corp ltd
Priority date: 2021-03-11
Filing date: 2021-03-11
Publication date: 2021-10-26
Anticipated expiration: 2031-03-11

Abstract

The application provides a chip atomic clock, and belongs to the technical field of communication. The chip atomic clock comprises: the circuit board is arranged in the shielding shell; wherein the circuit board comprises a plurality of rigid circuit boards; the plurality of rigid circuit boards comprise a bottom board and a plurality of side boards, and circuit modules required by the chip atomic clock are printed on the bottom board and the side boards respectively; the physical packaging module is arranged on the bottom plate, the side plates are connected with the bottom plate and are located on one side of the bottom plate, the side plates are provided with the physical packaging module, and included angles are formed between the side plates and the bottom plate. Therefore, the circuit board of the chip atomic clock can be changed from the existing planar layout to the three-dimensional layout, so that the volume of the chip atomic clock is greatly reduced.

Description

Chip atomic clock

Technical Field

The utility model belongs to the technical field of communication, concretely relates to chip atomic clock.

Background

The chip atomic clock can meet the performance requirements of low-power-consumption guard, high-precision timekeeping and short message time delay, and therefore, the chip atomic clock can be applied to the fields of satellite navigation receivers, aerospace communication systems, surface naval vessels, individual radio stations and the like.

However, the existing chip atomic clock is generally large in size, so that the existing chip atomic clock cannot be applied to a terminal with a small size due to the size, and the application scene of the chip atomic clock is limited.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a chip atomic clock is provided to it is great to solve current chip atomic clock volume, leads to using the limited problem of scene.

In a first aspect, an embodiment of the present application provides a chip atomic clock, where the chip atomic clock includes: the circuit board is arranged in the shielding shell;

wherein the circuit board comprises a plurality of rigid circuit boards;

the plurality of rigid circuit boards comprise a bottom board and a plurality of side boards, and circuit modules required by the chip atomic clock are printed on the bottom board and the side boards respectively;

the physical packaging module is arranged on the bottom plate, the side plates are connected with the bottom plate and are located on one side of the bottom plate, the side plates are provided with the physical packaging module, and included angles are formed between the side plates and the bottom plate.

Optionally, the circuit board further comprises a plurality of flexible circuit boards;

each of the plurality of side plates is connected to the bottom plate through one of the flexible circuit boards.

Optionally, the bottom plate includes a first side, a second side, a third side and a fourth side that are connected in sequence, the plurality of flexible circuit boards include a first flexible circuit board, a second flexible circuit board, a third flexible circuit board and a fourth flexible circuit board, and the plurality of side plates include the first side plate, the second side plate, the third side plate and the fourth side plate;

the first side plate is flexibly connected with the first side edge through the first flexible circuit board, the second side plate is flexibly connected with the second side edge through the second flexible circuit board, the third side plate is flexibly connected with the third side edge through the third flexible circuit board, and the fourth side plate is flexibly connected with the fourth side edge through the fourth flexible circuit board.

Optionally, the first side plate, the second side plate, the third side plate and the fourth side plate are all arranged at the same included angle with the bottom plate.

Optionally, the first side plate, the second side plate, the third side plate and the fourth side plate are all perpendicular to the bottom plate.

Optionally, heights of the first side plate, the second side plate, the third side plate, and the fourth side plate to the bottom plate are all less than or equal to a height of the physical packaging module.

Optionally, any two adjacent side plates of the first side plate, the second side plate, the third side plate and the fourth side plate are fixedly connected by soldering tin.

Optionally, the first side board is printed with a main control circuit module, the second side board is printed with a microwave synthesis circuit module, the third side board is printed with a digital-to-analog conversion circuit module, and the fourth side board is printed with a filter amplification circuit;

the bottom plate is printed with a first interface circuit communicated with the main control circuit module, a second interface circuit communicated with the microwave synthesis circuit module, a third interface circuit communicated with the digital-to-analog conversion circuit module and a fourth interface circuit communicated with the filtering amplification circuit module.

Optionally, the chip atomic clock further includes: a connector assembly;

the connector is arranged on the bottom plate, and one end of the connector extends out of the shielding shell.

Optionally, the connector comprises a plurality of connectors, and the plurality of connectors are all arranged perpendicular to the bottom plate.

In an embodiment of the present application, the chip atomic clock includes: the circuit board is arranged in the shielding shell; wherein the circuit board comprises a plurality of rigid circuit boards; the plurality of rigid circuit boards comprise a bottom board and a plurality of side boards, and circuit modules required by the chip atomic clock are printed on the bottom board and the side boards respectively; the physical packaging module is arranged on the bottom plate, the side plates are connected with the bottom plate and are located on one side of the bottom plate, the side plates are provided with the physical packaging module, and included angles are formed between the side plates and the bottom plate. Through the mode, a larger rigid circuit board printed with circuit modules required by the chip atomic clock can be split into a plurality of smaller rigid circuit boards according to the circuit modules, and the split rigid circuit boards are arranged in a three-dimensional space around the physical packaging module, so that the design of the circuit board of the chip atomic clock is changed from the existing planar layout into the three-dimensional layout, and the volume of the chip atomic clock is greatly reduced.

Drawings

FIG. 1 is a top view of a chip atomic clock provided in an embodiment of the present application;

FIG. 2 is a cross-sectional view of a chip atomic clock provided by an embodiment of the present application;

FIG. 3 is a cross-sectional view of a prior art chip atomic clock;

fig. 4 is a schematic connection relationship diagram of circuit modules according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and fig. 2, fig. 1 is a top view of a chip atomic clock provided in an embodiment of the present application; fig. 2 is a cross-sectional view of a chip atomic clock provided in an embodiment of the present application. As shown in fig. 1 and 2, the chip atomic clock includes: a shield case 100, a circuit board 200 disposed in the shield case 100, and a physical package module 300;

wherein the circuit board 200 includes a plurality of rigid circuit boards 210;

the plurality of rigid circuit boards 210 comprise a bottom plate 211 and a plurality of side plates 212, and circuit modules required by the chip atomic clock are printed on the bottom plate 211 and the side plates 212 respectively;

the physical package module 300 is disposed on the bottom plate 211, the plurality of side plates 212 are connected to the bottom plate 211 and located on a side of the bottom plate 211 where the physical package module 300 is disposed, and an included angle is formed between the plurality of side plates 212 and the bottom plate 211.

Specifically, the physical package module 300 is the most core part of a chip atomic clock, and is used for generating corresponding physical characteristics under the precise control of each circuit module, so as to control the local crystal oscillator frequency. The physical package module 300 needs to include components such as a Vertical Cavity Surface Emitting Laser (VCSEL), a microscopic lens assembly, a Micro-Electro-Mechanical Systems (MEMS), a cesium vapor bubble, an Indium Tin Oxide (ITO) heater, and a photodetector. Therefore, the physical package module 300 needs to occupy a certain space to assemble the components inside the physical package module 300.

The cross-sectional view of the existing chip atomic clock is shown in fig. 3, the physical packaging module is mounted on a larger rigid circuit board, and limited by the size of the rigid circuit board and the height of the physical packaging module, so that a larger residual space exists among the shielding shell of the chip atomic clock, the rigid circuit board and the physical packaging module, and the volume of the chip atomic clock is larger.

In the present application, a large circuit board 200 on which circuit modules required for a chip atomic clock are printed is separated into a plurality of small rigid circuit boards 210 according to each circuit module. The physical packaging module 300 is arranged on one rigid circuit board (namely, the bottom board 211) in the plurality of rigid circuit boards 210, and the other rigid circuit boards (namely, the plurality of side boards 212) and the bottom board 211 are arranged at a certain included angle, so that the plurality of side boards 212 can be arranged in a three-dimensional space around the physical packaging module 300, and the circuit board 200 of the chip atomic clock is changed from the existing planar arrangement into the three-dimensional arrangement, so that the volume of the chip atomic clock is greatly reduced.

It should be noted that the plurality of side plates 212 and the bottom plate 211 may be regular shapes or irregular shapes, and this embodiment is not limited in particular. The plurality of side plates 212 are located at the side of the bottom plate 211 where the physical packaging module 300 is located, and an included angle formed between the side plates and the bottom plate 211 may be any value within a range greater than 0 ° and less than 180 °. The included angle between each side plate 212 and the bottom plate 211 may be equal or unequal, and may be specifically set according to actual needs.

When the included angle between the side plates 212 and the bottom plate 211 is set, the side plates may be fixedly connected by soldering, connectors, or the like, or may be flexibly connected by flexible circuit boards, and the embodiment is not particularly limited.

When a large rigid circuit board 210 printed with circuit modules required by the chip atomic clock is split into a plurality of small rigid circuit boards 210 according to each circuit module, the large rigid circuit board 210 can be split according to the principles of low coupling and high cohesion. That is, it is necessary to ensure that the functions of the circuit modules on each smaller rigid circuit board 210 are as concentrated as possible, and that signals are input and output to and from other smaller rigid circuit boards 210 except for the power ground. In this way, the degree of coupling between the smaller rigid circuit boards 210 is minimized.

Optionally, circuit board 200 further includes a plurality of flexible circuit boards 220;

each of the side plates 212 is connected to the bottom plate 211 through a flexible circuit board 220.

In one embodiment, the circuit board 200 of the chip atomic clock further includes a plurality of flexible circuit boards 220, and each side board 212 may be connected to the bottom board 211 through one flexible circuit board 220. Wherein, the number of the flexible circuit boards 220 is equal to the number of the side plates 212.

Because the flexible circuit board 220 has flexibility, can be rolled or folded for use, and can be conveniently wired and connected in a three-dimensional space, any included angle between the side plate 212 and the bottom plate 211 can be realized. In this way, the included angle between each side plate 212 and the bottom plate 211 can be set according to the size of each side plate 212 and the height of the physical packaging module 300, so as to ensure that the volume of the chip atomic clock is greatly reduced.

Optionally, the bottom plate 211 includes a first side, a second side, a third side and a fourth side that are connected in sequence, the plurality of flexible circuit boards 220 includes a first flexible circuit board, a second flexible circuit board, a third flexible circuit board and a fourth flexible circuit board, and the plurality of side plates 212 includes a first side plate 2121, a second side plate 2122, a third side plate 2123 and a fourth side plate 2124;

the first side plate 2121 is flexibly connected to the first side edge through a first flexible circuit board, the second side plate 2122 is flexibly connected to the second side edge through a second flexible circuit board, the third side plate 2123 is flexibly connected to the third side edge through a third flexible circuit board, and the fourth side plate 2124 is flexibly connected to the fourth side edge through a fourth flexible circuit board.

Specifically, in an embodiment, the bottom plate 211 may be a rigid circuit board having four sides, the number of the side plates 212 and the flexible circuit boards 220 is also four, and each of the side plates 212 may be connected to one side of the bottom plate 211 through one of the flexible circuit boards 220. In this way, the four side plates 212 may be respectively disposed on four sides of the physical package module 300, so as to utilize the remaining space around the physical package module 300, which is beneficial to reducing the volume of the chip atomic clock.

Optionally, the first side plate 2121, the second side plate 2122, the third side plate 2123, and the fourth side plate 2124 are all disposed at the same angle to the bottom plate 211.

In one embodiment, the first side panel 2121, the second side panel 2122, the third side panel 2123, and the fourth side panel 2124 may be disposed at the same included angle with the bottom panel 211, such as at 80 °, 90 °, 100 °, and so on. This is advantageous for achieving uniform fixing of the four side plates 212, such as uniformly fixing the four side plates 212 on the housing of the physical package module 300, or uniformly fixing the four side plates 212 on the inner wall of the shielding shell 100.

Optionally, the first side plate 2121, the second side plate 2122, the third side plate 2123, and the fourth side plate 2124 are all disposed perpendicular to the bottom plate 211.

In an embodiment, the first side plate 2121, the second side plate 2122, the third side plate 2123, and the fourth side plate 2124 may be disposed perpendicular to the bottom plate 211, so that a space for disposing the plurality of side plates 212 may be effectively reduced, and the effect of reducing the volume of the chip atomic clock may be further achieved.

Optionally, the heights of the first side plate 2121, the second side plate 2122, the third side plate 2123, and the fourth side plate 2124 to the bottom plate 211 are all less than or equal to the height of the physical package module 300.

In an embodiment, in the process of dividing the plurality of side plates 212, the size of the side plates 212 may be designed according to the height of the physical packaging module 300, so as to ensure that when the side plates 212 and the bottom plate 211 form an included angle, the vertical height from each side plate 212 to the bottom plate 211 is less than or equal to the height of the physical packaging module 300, thereby avoiding the increase of the height of the chip atomic clock due to the fact that the height from the side plate 212 to the bottom plate 211 is greater than the height of the physical packaging module 300.

Optionally, any adjacent two side plates 212 of the first side plate 2121, the second side plate 2122, the third side plate 2123 and the fourth side plate 2124 are fixedly connected by soldering.

In one embodiment, when each of the side plates 212 is perpendicular to the bottom plate 211, any adjacent two side plates 212 of the side plates 212 may be fixed by soldering in order to fix the side plates 212. Specifically, the edge of each side plate 212 may be grounded by copper plating, and then the copper plating positions of any two adjacent side plates 212 may be soldered. Thus, the fixing problem of each side plate 212 is solved, and the common ground effect of each side plate 212 is realized.

Optionally, referring to fig. 4, fig. 4 is a schematic connection relationship diagram of each circuit module provided in the embodiment of the present application. As shown in fig. 4, a main control circuit module is printed on the first side plate 2121, a microwave synthesis circuit module is printed on the second side plate 2122, a digital-to-analog conversion circuit module is printed on the third side plate 2123, and a filter amplifier circuit is printed on the fourth side plate 2124;

the bottom board 211 is printed with a first interface circuit for communicating with the main control circuit module, a second interface circuit for communicating with the microwave synthesis circuit module, a third interface circuit for communicating with the digital-to-analog conversion circuit module, and a fourth interface circuit for communicating with the filtering amplification circuit module.

Specifically, the main control circuit module includes a single chip, which is used as the brain of the whole chip atomic clock, and is used for determining the working timing of the whole chip atomic clock, communicating with peripheral devices, and performing operation and digital processing on the AD sampling data. The microwave synthesis circuit module includes a Phase-Locked Loop (PLL) chip and a VCO (Voltage Controlled Oscillator) to form a PLL structure, and is configured to generate a 3.4G microwave frequency and provide a radio frequency signal for the physical package module 300. In addition, the single chip microcomputer in the main control circuit module can adjust the multiple of microwave frequency multiplication by changing a register of the phase-locked loop chip, and lock a Coherent Population Trapping (CPT for short) peak. The digital-to-analog conversion circuit module is used for performing analog-to-digital conversion on analog signals acquired and analyzed by the singlechip to obtain high-precision digital signals, and realizing high-precision regulation and control of temperature, magnetic field intensity and the like. The filtering and amplifying circuit module is used for processing signals of the modulated light intensity signals, filtering out other signals except for modulation frequency, amplifying the modulation signals, and improving the signal-to-noise ratio of the first-order differential curve, thereby improving the short-term stability of the atomic clock. The bottom board 211 is printed with a first interface circuit for communicating with the main control circuit module, a second interface circuit for communicating with the microwave synthesis circuit module, a third interface circuit for communicating with the digital-to-analog conversion circuit module, and a fourth interface circuit for communicating with the filter amplification circuit module, thereby realizing communication connection between the circuit modules.

Through the mode, the whole circuit structure of the chip atomic clock can be split into 5 circuit modules, each circuit module can respectively complete respective functions, input signals and output signals can be interacted among the circuit modules, the splitting principle of low coupling and high cohesion is well followed, and the performance of the circuit structure of the chip atomic clock is guaranteed.

With continued reference to FIG. 2, the chip atomic clock further includes: a connector 400;

the connector 400 is disposed on the bottom plate 211, and one end of the connector extends out of the shielding shell 100.

The number of the connectors 400 may be one or more, and may be set according to actual needs. The connector 400 has one end fixed to the bottom plate 211 and the other end extending out of the shield case 100 to be connected to another circuit board outside the shield case 100. The connector 400 can be used not only to fix the chip atomic clock on other circuit boards outside the shielding case 100, but also to realize signal transmission between the chip atomic clock and other circuit boards.

Alternatively, the connector 400 may include a plurality of connectors 400, each of the plurality of connectors 400 being disposed perpendicular to the base plate 211.

In one embodiment, the connection of the chip atomic clock to other circuit boards outside the shielding case 100 can be made more secure by providing a plurality of connectors 400. In addition, the connector 400 is perpendicular to the bottom plate 211, so that the connector 400 is in effective contact with other circuit boards, and the stability of the whole circuit is improved.

The embodiments described above are described with reference to the drawings, and various other forms and embodiments are possible without departing from the principles of the present invention, and therefore, the present invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of components may be exaggerated for clarity. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. The terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, components, and/or components, but do not preclude the presence or addition of one or more other features, integers, components, and/or groups thereof. Unless otherwise indicated, a range of values, when stated, includes the upper and lower limits of the range and any subranges therebetween.

In the foregoing, it is noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations are also within the scope of the present invention.

Claims

1. A chip atomic clock, comprising: the circuit board is arranged in the shielding shell;

wherein the circuit board comprises a plurality of rigid circuit boards;

2. The chip atomic clock of claim 1, wherein the circuit board further comprises a plurality of flexible circuit boards;

3. The chip atomic clock according to claim 2, wherein the bottom plate includes a first side, a second side, a third side, and a fourth side that are connected in sequence, the plurality of flexible circuit boards includes a first flexible circuit board, a second flexible circuit board, a third flexible circuit board, and a fourth flexible circuit board, and the plurality of side plates includes a first side plate, a second side plate, a third side plate, and a fourth side plate;

4. The chip atomic clock of claim 3, wherein the first side plate, the second side plate, the third side plate and the fourth side plate are all disposed at the same included angle with the bottom plate.

5. The chip atomic clock of claim 4, wherein the first side plate, the second side plate, the third side plate, and the fourth side plate are all disposed perpendicular to the bottom plate.

6. The chip atomic clock according to any one of claims 3 to 4, wherein the heights of the first side plate, the second side plate, the third side plate and the fourth side plate from the bottom plate are all less than or equal to the height of the physical packaging module.

7. The chip atomic clock according to any one of claims 3 to 4, wherein any adjacent two of the first side plate, the second side plate, the third side plate, and the fourth side plate are fixedly connected by solder.

8. The chip atomic clock according to any one of claims 3 to 4, wherein the first side board is printed with a main control circuit module, the second side board is printed with a microwave synthesis circuit module, the third side board is printed with a digital-to-analog conversion circuit module, and the fourth side board is printed with a filter amplification circuit;

9. The chip atomic clock of claim 1, further comprising: a connector assembly;

10. The chip atomic clock as claimed in claim 9, wherein the connector includes a plurality of connectors, and the plurality of connectors are arranged perpendicular to the base plate.