CN214493915U

CN214493915U - Wafer carrying device

Info

Publication number: CN214493915U
Application number: CN202120416788.XU
Authority: CN
Inventors: 邱摩西; 刘汝拯; 陈松平; 何江波
Original assignee: Yibai Application Technology Shenzhen Co ltd; ePAK International Inc
Current assignee: Yibai Application Technology Shenzhen Co ltd; ePAK International Inc
Priority date: 2021-02-25
Filing date: 2021-02-25
Publication date: 2021-10-26
Anticipated expiration: 2031-02-25

Abstract

The utility model relates to a wafer shiies device, include: a first cover body; the second cover body is detachably covered with the first cover body; the limiting structure is arranged in the first cover body and the second cover body so as to limit the wafers placed in the second cover body and/or the first cover body; and the clamping structure is arranged in the first cover body and the second cover body and used for clamping the first cover body and the second cover body. The wafer carrying device is provided with the limiting structures in the first cover body and the second cover body, so that on one hand, the wafer placed in the second cover body and/or the first cover body can be limited, thereby limiting the horizontal displacement of the wafer, greatly reducing the activity space of the wafer and preventing the wafer from being damaged due to overlarge impact force in the carrying process; on the other hand, the wafer can be prevented from being polluted by the generated particles. In addition, the first cover body and the second cover body are provided with clamping structures, so that the first cover body and the second cover body can be easily opened and closed.

Description

Wafer carrying device

Technical Field

The utility model relates to a wafer is stored and the transportation field, more specifically says, relates to a wafer carrier.

Background

Most of the common wafer carrying devices in the market at present have large inner space of a bottom cover, the wafers are placed in the bottom cover, the moving space is large, the wafers are easily damaged due to impact in the storage and transportation processes, therefore, the moving space of the wafers is limited on the one hand by the way of placing the foam ring at the edge of the bottom cover of the wafer carrying device, the wafers can be buffered through the foam ring when being impacted in the storage and transportation processes, the wafers are protected, on the other hand, the upper cover and the bottom cover are in tight fit, and a hand position is arranged at the edge of the upper cover for opening the carrying device, but the design has the following defects:

1. during storage and transportation, the collision and friction between the wafer and the foam ring easily generate foam particles to pollute the wafer.

2. The deformation of the foam ring is large, and the movement space of the wafer is also large.

3. Is not easy to open and close.

In view of the above, there is a need to improve the existing products to solve the problems of easy contamination and damage of the wafer and difficult opening and closing.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the present invention is to provide an improved wafer carrying device.

The utility model provides a technical scheme that its technical problem adopted is: a wafer carrier apparatus is constructed comprising:

a first cover body;

the second cover body is detachably covered with the first cover body;

the limiting structure is arranged in the first cover body and the second cover body so as to limit the wafers placed in the second cover body and/or the first cover body;

and the clamping structure is arranged in the first cover body and the second cover body and used for clamping the first cover body and the second cover body.

Preferably, the limiting structure comprises a plurality of limiting retaining walls and a plurality of limiting convex ribs which are arranged corresponding to the limiting retaining walls and are matched for limiting;

the plurality of limit retaining walls are arranged in the second cover body at intervals along the circumferential direction of the second cover body, and gaps are reserved between the limit retaining walls and the side wall of the second cover body; and the plurality of limiting convex ribs are arranged in the first cover body at intervals along the circumferential direction of the first cover body, so that the second cover body and the first cover body are inserted into the gap when being covered, and the limiting retaining wall is pushed to limit the wafer.

Preferably, the first cover body comprises a cylindrical first accommodating cavity; the second cover body comprises a cylindrical second accommodating cavity;

the limiting retaining wall is arranged along the axial direction of the second accommodating cavity and extends to the second accommodating cavity, and the limiting convex rib is arranged along the axial direction of the first accommodating cavity and extends to the first accommodating cavity.

Preferably, the limit retaining wall is arc-shaped;

the inner diameter of the limiting retaining wall is arranged along the direction of putting the wafer into the retaining wall and is gradually reduced.

Preferably, the spacing barricade with one section that the second lid meets is equipped with the increase spacing barricade elastic deformation's breach, the breach set up in spacing barricade carry on the back of the body in on the lateral wall that the second lid inside wall set up.

Preferably, a plurality of arc-shaped guide ribs are arranged in the first cover body; the plurality of guide ribs are arranged in the first cover body at intervals along the circumferential direction of the first cover body;

the limiting convex rib is arranged on the guide rib and is arranged along the radial direction of the guide rib.

Preferably, the guide rib is provided with a first guide inclined plane for guiding the first cover body and the second cover body when the first cover body and the second cover body are covered;

and a first limiting surface for limiting the relative rotation of the first cover body and the second cover body is arranged on the side wall of the guide rib.

Preferably, the limiting convex rib is provided with a second guide inclined plane inserted into the gap;

and a third guide inclined plane matched with the second guide inclined plane is arranged on one side of the limiting retaining wall opposite to the gap.

Preferably, the clamping structure comprises a clamping hook and a clamping groove;

the clamping hook is arranged in the second cover body;

the clamping groove is arranged in the first cover body and corresponds to the clamping hook so as to be clamped with the clamping hook.

Preferably, a limiting boss is arranged on the inner side of the end wall of the first cover body; the clamping groove is arranged on the limiting boss;

a limiting groove matched with the limiting boss for limiting is formed in the inner side of the end wall of the second cover body;

the clamping hooks are correspondingly arranged in the limiting grooves.

Implement the utility model discloses a wafer shiies device has following beneficial effect: the wafer carrying device is provided with the limiting structures in the first cover body and the second cover body, so that on one hand, the wafer placed in the second cover body and/or the first cover body can be limited, thereby limiting the horizontal displacement of the wafer, greatly reducing the activity space of the wafer and preventing the wafer from being damaged due to overlarge impact force in the carrying process; on the other hand, the wafer can be prevented from being polluted by the generated particles. In addition, the first cover body and the second cover body are provided with clamping structures, so that the first cover body and the second cover body can be easily opened and closed.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic diagram of a wafer carrier according to some embodiments of the present invention;

FIG. 2 is an exploded view of the wafer carrier of FIG. 1;

fig. 3 is a schematic view of the first cover of the wafer carrier of fig. 2;

fig. 4 is a schematic diagram of a second cover of the wafer carrier of fig. 2;

fig. 5 is a partial cross-sectional view of the wafer carrier of fig. 1;

FIG. 6 is an enlarged view of a portion of the wafer carrier of FIG. 5;

FIG. 7 is a schematic view of a wafer being loaded into the wafer carrier of FIG. 1;

fig. 8 is a cross-sectional view of a wafer being loaded into the wafer carrier of fig. 1;

FIG. 9 is a longitudinal cross-sectional view of a wafer being loaded into the wafer carrier of FIG. 1;

fig. 10 is an enlarged view of a portion of the wafer carrier of fig. 1 with the wafer of fig. 9 placed therein.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 and 2 illustrate some preferred embodiments of the wafer carrier of the present invention. The wafer carrier 100 can be used for storing and transporting wafers 200, and the wafer carrier 100 can be easily opened and closed, which has the advantage of easy operation. The wafer carrier 100 can limit the horizontal displacement of the wafer 200, greatly reduce the movement space of the wafer 200, prevent the wafer 200 from being damaged due to the excessive impact force during the carrying process of the wafer 200, and prevent the generated particles from polluting the wafer 200.

As shown in fig. 1 and 2, the wafer carrier 100 may include a first cover 10, a second cover 20, a limiting structure and a clamping structure. The first cover 10 and the second cover 20 can be covered to form a receiving cavity for placing the wafer 200. The second cover 20 can be detachably connected to the first cover 10. The limiting structure can be disposed in the first cover 10 and the second cover 20, and can be used to limit the position of the wafer 200 placed in the second cover 20 and/or the first cover 10. The clamping structure can be disposed in the first cover 10 and the second cover 20, and can be used to clamp the first cover 10 and the second cover 20, so as to detachably connect the first cover 10 and the second cover 20.

As shown in fig. 3, further, in some embodiments, the first cover 10 may have a cylindrical shape, but it is understood that in other embodiments, the first cover 10 may not be limited to have a cylindrical shape. In some embodiments, the first cover 10 may include a cylindrical first body 11 and a cylindrical first receiving cavity 12 formed in the first body 11. The first body 11 is provided with an opening communicated with the first accommodating cavity 12. The first accommodating chamber 12 can be in communication with the second cover 20 and can be used for accommodating the wafer 200 therein.

Further, in some embodiments, a plurality of guiding ribs 13 may be disposed in the first cover 10, and each guiding rib 13 may be arc-shaped, may be located on the end wall of the first body 11, and may be protruded toward the first accommodating cavity 12 along the axial direction of the first body 11. The plurality of guiding ribs 13 may be disposed at intervals along the circumferential direction of the first cover 10, and a set distance may be left between the sidewalls of the first cover 10. The guiding rib 13 can be used for guiding the first cover 10 and the second cover 20 to cover each other. In some embodiments, the guiding rib 13 may be provided with a first guiding inclined surface 131, and the first guiding inclined surface 131 may be located at a top corner of the guiding rib 13 and may be used for guiding when the first cover body 10 and the second cover body 20 are closed. In some embodiments, the side wall of the guiding rib 13 may be provided with a first limiting surface 132; the first limiting surface 132 may be located on a side wall of the guiding rib 13 opposite to the other guiding rib 13, and may be connected to the first guiding inclined surface 131. The first position-limiting surface 132 can limit the relative rotation between the first cover 10 and the second cover 20 when the first cover 10 and the second cover 20 are closed. Specifically, when the first cover 10 and the second cover 20 are closed, the first guiding inclined surface 131 can be aligned with the groove wall 24 of the limiting groove 24 in the second cover 20 for guiding, so as to achieve a better error-proof function and facilitate the correct installation by the user. The first limiting surface can cooperate with the groove wall 24 to limit the relative movement between the first cover 10 and the second cover 20, so as to enhance the overall stability.

As shown in fig. 4, further, in some embodiments, the second cover 20 may have a cylindrical shape, but it is understood that in other embodiments, the second cover 20 may not be limited to have a cylindrical shape. In some embodiments, the second cover 20 may include a cylindrical second body 21 and a cylindrical second receiving cavity 22 formed in the second body 21. The second body 21 is provided with an opening communicated with the second accommodating cavity 22. The second chamber 22 can be in communication with the first chamber 12 and can be used for receiving the wafer 200 therein.

As shown in fig. 3 to 6, further, in some embodiments, the retaining structure may include a plurality of retaining walls 23 and a plurality of retaining ribs 14; the retaining wall 23 can be disposed in the second cover 20, and can be disposed at intervals along the circumferential direction of the second cover 20, and a gap 230 can be left between the retaining wall and the sidewall of the second cover 20; the retaining wall 23 can be disposed on the end wall of the second body 21 and can be protruded toward the second accommodating cavity 22 along the axial direction of the second body 21. The retaining wall 23 may be arc-shaped, and the inner diameter of the retaining wall 23 may be gradually decreased along the wafer 200 placing direction. Specifically, the inner diameter of the retaining wall 23 may be gradually decreased in the direction of the end wall of the second body 21, i.e., inclined outward, and the top inner diameter may be larger than the bottom inner diameter, so that the wafer 200 may be more easily stored and picked up. The plurality of limiting ribs 14 may be disposed in the first cover 10 and may be disposed at intervals along the circumferential direction of the first cover 10, specifically, in some embodiments, the limiting ribs 14 may be disposed on the guiding ribs 13 and may be disposed along the radial direction of the guiding ribs 13 and intersect with the guiding ribs 13. In some embodiments, two spacing ribs 14 may be disposed on each guiding rib 13 at intervals. When the second cover body 20 and the first cover body 10 are closed, the limiting rib 14 can be inserted into the gap 230, and can push the limiting retaining wall 23 to limit the wafer 200, and straighten the arc-shaped limiting retaining wall 23, so that the upper and lower inner diameters of the limiting retaining wall 23 are consistent, which is beneficial to realizing the zero movement of the wafer 200, i.e. the movement distance approaches to zero, thereby better protecting the wafer 200.

It is understood that, in some embodiments, the retaining wall 23 may not be limited to being disposed in the second cover 20, and the retaining rib 14 may not be limited to being disposed in the first cover 10. In other embodiments, the retaining walls 23 may also be disposed in the first cover 10 at intervals along the circumferential direction of the first cover 10, and may have a gap 230 with the side wall of the first cover 10, specifically, may be disposed on the end wall of the first cover 10 and extend toward the first receiving cavity 12. The plurality of limiting ribs 14 may be disposed in the second cover 20 along the circumferential direction of the second cover 20, and specifically, may be disposed on the end wall of the second body 21 and extend toward the second receiving cavity 22. When the second cover body 20 is closed with the first cover body 10, the limiting rib 14 can be inserted into the gap 230, so as to push the limiting wall 23 to limit the wafer 200, and straighten the arc-shaped limiting wall 23, so that the upper and lower inner diameters of the limiting wall 23 are the same, which is beneficial to realizing the zero movement of the wafer 200, thereby better protecting the wafer 200.

Further, in some embodiments, the limiting rib 14 is provided with a second guiding inclined surface 141, and the second guiding inclined surface 141 may be located at a top corner of the limiting rib 14, and may be used for guiding the limiting rib 14 inserted into the gap 230. In some embodiments, the limiting rib 14 can further include a second limiting surface 142, the second limiting surface 142 can be located on a side wall of the limiting rib 14 contacting the limiting wall 23, and the second limiting surface 142 can contact the limiting wall 23 to limit the position.

Further, in some embodiments, a third guiding inclined surface 231 may be disposed on a side of the retaining wall 23 opposite to the gap 230, and the third guiding inclined surface 231 may be disposed near the opening end of the second cover body 20. The third guiding inclined surface 231 can be matched with the second guiding inclined surface 141, so as to facilitate the insertion of the limiting rib 14 into the gap 230 for guiding. In some embodiments, a notch 232 is disposed on a section of the retaining wall 23 connected to the second cover 20, and the notch 232 may be disposed on a side wall of the retaining wall 23 opposite to the inner side wall of the second cover 20, and may be used to reduce the thickness of the retaining wall 23 and increase the elastic deformation of the retaining wall 23, so that the stress on the retaining wall 23 is concentrated, thereby facilitating the swinging of the retaining wall 23 and the straightening of the retaining wall 23 by the retaining rib 14. In some embodiments, the cross-section of the notch 232 may be V-shaped, although it is understood that the cross-section of the notch 232 may not be limited to being V-shaped in other embodiments. It is understood that, in other embodiments, when the retaining wall 23 is disposed in the first cover 10, the notch 232 may be disposed on a section where the retaining wall 23 is connected to the second cover 20, and may be located on a side wall of the retaining wall 23 opposite to a side wall of the first cover 10.

Further, in some embodiments, a plurality of limiting bosses 15 may be disposed inside the end wall of the first cover 10, the plurality of limiting bosses 15 may be spaced apart from each other along the circumferential direction of the first cover 10, and each limiting boss 15 may be located between two adjacent guiding ribs 13. The limit projection 15 may be formed by an outer side of the end wall of the first cover body 10 being recessed inward to form a depressed platform 16. In some embodiments, a limiting groove 241 may be disposed inside the end wall of the second cover 20, the limiting groove 241 may be disposed corresponding to the limiting boss 15, and the limiting groove 241 is used for the limiting boss 15 to be clamped into, and further may cooperate with the limiting boss 15 for limiting. When the first cover 10 and the second cover 20 are closed, the limiting boss 15 can be inserted into the limiting groove 241, so as to enhance the overall stability. In some embodiments, a groove wall 24 protruding toward the second receiving cavity 22 may be disposed on the inner side of the end wall of the second cover 20, and the groove wall 24 may enclose a limiting groove 241 having a switch.

Further, in some embodiments, the snap structure may include a snap 25 and a slot 17; the plurality of hooks 25 may be disposed in the second cover 20, and specifically, the hooks 25 may be disposed in the limiting grooves 241 in a one-to-one correspondence. The number of the slots 17 may be multiple, the slots 17 may be disposed in the first cover 10, specifically, the slots 17 may be disposed on the limiting bosses 15 in a one-to-one correspondence, and the slots 17 may be disposed corresponding to the hooks 25 and may be further connected to the hooks 25, so as to detachably connect the first cover 10 and the second cover 20, thereby facilitating the opening and closing of the first cover 10 and the second cover 20. In some embodiments, the slot 17 may be rectangular, and the rectangular slot 17 is beneficial to the hook 25 to provide a certain deformation space for the hook 25 when the hook 25 is clamped into and separated from the limiting boss 15, and can limit the deformation space, so that the hook is easy to operate and not easy to damage: the hook 25 extends upwards from the bottom of the limiting groove 241, the hook 25 is protected inside the limiting groove 241, damage caused by mistaken touch is avoided, the hook 25 has certain elasticity, certain interference can be achieved when the hook 25 is connected with the clamping groove 17 in a clamped mode, damage cannot occur, and the whole circular wafer carrying device is easy to open and close due to the design of the whole hook 25 and the clamping groove 17.

As shown in fig. 7-10, the specific method of using the wafer carrier 100 is as follows:

storage of the wafer 200:

firstly will the utility model discloses a second lid 20 level is placed on the platform, at first put a plurality of foam gasket 400 in second lid 20 the inside along the spacing barricade 24 of curved wafer of second lid 20 slowly, secondly put into barrier paper 300 with the same reason again, then put into wafer 200, barrier paper 300 and wafer 200 superpose according to the demand in proper order, put into a slice barrier paper 300 at the top at last, put into corresponding quantity's foam pad 300 according to the demand again, aim at the spacing groove 241 of second lid 20 with the spacing boss 15 of first lid 10 and cover, trip 25 in the second lid 20 passes the draw-in groove 17 on the spacing boss 15 of first lid 10, the both thumbs will press down along the diagonal angle slightly hard, make the trip 25 card of second lid 20 go into in proper order and go into the draw-in groove 17 of first lid 10.

Picking up the wafer:

at first will place wafer 200 the utility model discloses place on the platform, secondly the thumb of both hands is placed respectively on two trip 25 of second lid 20 symmetry, and other four fingers are pressed in second lid 20 bottom, and two thumbs outwards make power for trip 25 breaks away from draw-in groove 17, makes all trip 25 break away from draw-in groove 17 in proper order, again takes up first lid 10 upwards, takes off first lid 10 and picks up subassembly and wafer 200 in the wafer carrier device 100 in proper order.

It is to be understood that the foregoing examples merely represent preferred embodiments of the present invention, and that the description thereof is more specific and detailed, but not intended to limit the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A wafer carrier device, comprising:

a first cover (10);

a second cover body (20) detachably covering the first cover body (10);

the limiting structure is arranged in the first cover body (10) and the second cover body (20) and used for limiting the wafer (200) placed in the second cover body (20) and/or the first cover body (10);

the clamping structure is arranged in the first cover body (10) and the second cover body (20) and used for clamping the first cover body (10) and the second cover body (20).

2. The wafer carrier device according to claim 1, wherein the limiting structure comprises a plurality of limiting retaining walls (23) and a plurality of limiting convex ribs (14) which are arranged corresponding to the limiting retaining walls (23) and are matched for limiting;

the plurality of limiting retaining walls (23) are arranged in the second cover body (20) at intervals along the circumferential direction of the second cover body (20) and form gaps (230) with the side wall of the second cover body (20); the plurality of limiting convex ribs (14) are arranged in the first cover body (10) at intervals along the circumferential direction of the first cover body (10) so as to be inserted into the gap (230) when the second cover body (20) is covered with the first cover body (10), and the limiting retaining wall (23) is pushed to limit the wafer (200).

3. The wafer carrier of claim 2, wherein the first cover (10) comprises a cylindrical first receiving cavity (12); the second cover body (20) comprises a cylindrical second accommodating cavity (22);

spacing barricade (23) are followed the axial of second holding chamber (22) court second holding chamber (22) extend the setting, spacing protruding muscle (14) are followed the axial of first holding chamber (12) court first holding chamber (12) extend the setting.

4. The wafer carrier as claimed in claim 2, wherein the retaining wall (23) is arc-shaped;

the inner diameter of the limiting retaining wall (23) is gradually reduced along the placing direction of the wafer (200).

5. The wafer carrier device as claimed in claim 2, wherein a notch (232) for increasing the elastic deformation of the retaining wall (23) is disposed at a section where the retaining wall (23) is connected to the second cover (20), and the notch (232) is disposed on a side wall of the retaining wall (23) opposite to the inner side wall of the second cover (20).

6. The wafer carrier of claim 2, wherein the first cover (10) has a plurality of arcuate guide ribs (13); the guide ribs (13) are arranged in the first cover body (10) at intervals along the circumferential direction of the first cover body (10);

the limiting convex rib (14) is arranged on the guide rib (13) and is arranged along the radial direction of the guide rib (13).

7. The wafer carrier of claim 6, wherein the guiding rib (13) is provided with a first guiding inclined surface (131) for guiding the first cover body (10) and the second cover body (20) when the covers are closed;

and a first limiting surface (132) for limiting the relative rotation of the first cover body (10) and the second cover body (20) is arranged on the side wall of the guide rib (13).

8. The wafer carrier as claimed in claim 2, wherein the limiting rib (14) is provided with a second guiding inclined surface (141) inserted into the gap (230);

and a third guide inclined plane (231) matched with the second guide inclined plane (141) is arranged on one side of the limiting retaining wall (23) opposite to the gap (230).

9. The wafer carrier of claim 5, wherein the clamping structure comprises a hook (25) and a slot (17);

the clamping hook (25) is arranged in the second cover body (20);

the clamping groove (17) is arranged in the first cover body (10) and corresponds to the clamping hook (25) to be clamped with the clamping hook (25).

10. The wafer carrier device according to claim 9, wherein the inner side of the end wall of the first cover body (10) is provided with a limiting boss (15); the clamping groove (17) is arranged on the limiting boss (15);

a limiting groove (241) matched with the limiting boss (15) for limiting is formed in the inner side of the end wall of the second cover body (20);

the clamping hook (25) is correspondingly arranged in the limiting groove (241).