CN214490105U - Grinding and polishing machine for semiconductor material - Google Patents
Grinding and polishing machine for semiconductor material Download PDFInfo
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- CN214490105U CN214490105U CN202120463121.5U CN202120463121U CN214490105U CN 214490105 U CN214490105 U CN 214490105U CN 202120463121 U CN202120463121 U CN 202120463121U CN 214490105 U CN214490105 U CN 214490105U
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- 238000005498 polishing Methods 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 239000000463 material Substances 0.000 title claims abstract description 42
- 230000002146 bilateral effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 230000001788 irregular Effects 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000010248 power generation Methods 0.000 description 1
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Abstract
The utility model relates to a semiconductor production facility technical field just discloses semiconductor material grinding and polishing machine, comprises a workbench, the top fixedly connected with L shaped plate of workstation, the first electronic jar of inside fixedly connected with of L shaped plate, the output fixedly connected with of first electronic jar is located the inboard connection shell of L shaped plate, the outside swing joint of connection shell has the plectane that extends to the connection shell below, the inside fixedly connected with of connection shell and plectane fixed connection's first motor, the inside swing joint of plectane has quantity to be two and is located the montant of connecting the shell left and right sides. This semiconductor material grinding and polishing machine possesses advantages such as convenient to use, has solved prior art, and grinding and polishing machine's polishing dish only has the degree of freedom of vertical direction usually, when carrying out the grinding and polishing to the semiconductor material of irregular shape, needs to fix a position the centre gripping to semiconductor material's machined surface many times, and the process is loaded down with trivial details, leads to the problem of not being convenient for to use.
Description
Technical Field
The utility model relates to a semiconductor production facility technical field specifically is semiconductor material grinding and polishing machine.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as computers, mobile phones or digital recorders, have close relationship with the semiconductor, and the semiconductor material needs to be ground and polished in the production process.
In the prior art, a polishing disc of a grinding and polishing machine usually has only vertical freedom, when a semiconductor material with an irregular shape is ground and polished, a processing surface of the semiconductor material needs to be positioned and clamped for many times, and the process is complicated, so that the semiconductor material grinding and polishing machine is inconvenient to use, and the problem is solved.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a semiconductor material grinds burnishing machine possesses advantages such as convenient to use, has solved prior art, and the polishing dish of grinding burnishing machine only has the degree of freedom of vertical direction usually, when grinding the polishing to irregularly shaped semiconductor material, needs to fix a position the centre gripping to semiconductor material's machined surface many times, and the process is loaded down with trivial details, leads to the problem of not being convenient for to use.
(II) technical scheme
In order to realize the purpose of convenient use, the utility model provides a following technical scheme: semiconductor material grinding and polishing machine, including the workstation, the top fixedly connected with L shaped plate of workstation, the inside fixedly connected with first electronic jar of L shaped plate, the output fixedly connected with of first electronic jar is located the connecting shell of L shaped plate inboard, the outside swing joint of connecting shell has the plectane that extends to connecting shell below, the inside fixedly connected with of connecting shell and plectane fixedly connected with first motor, the inside swing joint of plectane has the quantity to be two and is located the montant of connecting shell left and right sides, the bottom fixedly connected with of montant is located the casing of plectane below, the inside fixedly connected with output of casing runs through the second motor of casing, the output fixedly connected with of second motor is located the installation piece of casing below, the bottom fixedly connected with polishing dish of installation piece, the top fixedly connected with quantity of workstation is the fixed plate of two, the utility model discloses a polishing machine, including fixed plate, workstation top, first U-shaped piece, the inside threaded connection of fixed plate has the screw rod that is located polishing dish below, two the equal swing joint in one side that the screw rod is relative has and is located two splint between the fixed plate and with the contact of workstation top, the top fixedly connected with quantity of plectane is two and is located the first U-shaped piece of connecting the shell left and right sides, two the equal fixedly connected with in one side that the montant is relative has the second U-shaped piece that is located first U-shaped piece top, the inboard of first U-shaped piece and second U-shaped piece all with the electronic jar swing joint of second.
Preferably, the top of the L-shaped plate is provided with an assembly hole matched with the first electric cylinder, and the bottom of the connecting shell is open.
Preferably, the top of the circular plate is provided with a mounting hole, and the inside of the mounting hole is fixedly connected with a first bearing sleeved with the outer side of the connecting shell.
Preferably, the mounting groove that is located the montant outside is seted up in the outside of plectane, the inside fixedly connected with of mounting groove runs through the installation axle of montant, the hole of stepping down that is located the second motor output outside is seted up to the bottom of casing, the montant is bilateral symmetry and distributes.
Preferably, the fixed plate is bilateral symmetry and distributes, the screw hole with screw rod looks adaptation is seted up to the inside of fixed plate, the inside fixedly connected with of splint cup joints the second bearing with the screw rod outside.
Preferably, round holes are formed in the front side and the rear side of the first U-shaped block, the inner side of the first U-shaped block is movably connected with a round shaft extending to the inner portions of the round holes, through holes are formed in the front side and the rear side of the second U-shaped block, the inner side of the second U-shaped block is movably connected with a short shaft extending to the inner portions of the through holes, and the outer sides of the round shaft and the short shaft are fixedly connected with the second electric cylinder.
(III) advantageous effects
Compared with the prior art, the utility model provides a semiconductor material grinds burnishing machine possesses following beneficial effect:
the semiconductor material grinding and polishing machine comprises a worktable, a screw rod, a first electric cylinder, a second electric cylinder, a connecting shell, a vertical rod, a polishing disc, a second U-shaped block, a mounting block, a screw rod, a second motor, a first motor, a second U-shaped block, a second motor, a third motor and a fourth motor, wherein the worktable is arranged on the worktable and positioned between the two clamping plates, the screw rod drives the clamping plates to move, the two clamping plates are close to each other and clamp and position the semiconductor material, the first electric cylinder drives the connecting shell to move downwards, the connecting shell drives the polishing disc indirectly connected with the connecting shell to move downwards, the first motor is started, the first motor drives the polishing disc indirectly connected with the circular plate to rotate, the vertical rod drives the polishing disc indirectly connected with the polishing disc to rotate, the polishing disc is conveniently attached to irregular surfaces of the semiconductor material, the second motor is started, the mounting block drives the polishing disc to rotate, the irregular surface of the semiconductor material can be ground and polished, and the situation that the processing surface of the semiconductor material is positioned and clamped for many times is avoided, so that the purpose of convenient use is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a sectional view of the structure of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.
In the figure: 1. a work table; 2. an L-shaped plate; 3. a first electric cylinder; 4. a connecting shell; 5. a circular plate; 6. a first motor; 7. a vertical rod; 8. a housing; 9. a second motor; 10. mounting blocks; 11. a polishing disk; 12. a fixing plate; 13. a screw; 14. a splint; 15. a first U-shaped block; 16. a second U-shaped block; 17. a second electric cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a semiconductor material grinding and polishing machine comprises a worktable 1, an L-shaped plate 2 is fixedly connected to the top of the worktable 1, a first electric cylinder 3 is fixedly connected to the inside of the L-shaped plate 2, a connecting shell 4 located at the inner side of the L-shaped plate 2 is fixedly connected to the output end of the first electric cylinder 3, an assembly hole matched with the first electric cylinder 3 is formed at the top of the L-shaped plate 2, the bottom of the connecting shell 4 is open, a circular plate 5 extending to the lower side of the connecting shell 4 is movably connected to the outer side of the connecting shell 4, a mounting hole is formed at the top of the circular plate 5, a first bearing sleeved with the outer side of the connecting shell 4 is fixedly connected to the inside of the connecting shell 4, a first motor 6 fixedly connected to the circular plate 5 is fixedly connected to the inside of the connecting shell 4, two vertical rods 7 located at the left and right sides of the connecting shell 4 are movably connected to the inside of the circular plate 5, a housing 8 located below the circular plate 5 is fixedly connected to the bottom of the vertical rods 7, the inside of the shell 8 is fixedly connected with a second motor 9 of which the output end penetrates through the shell 8, the outer side of the circular plate 5 is provided with a mounting groove positioned on the outer side of the vertical rod 7, the inside of the mounting groove is fixedly connected with a mounting shaft penetrating through the vertical rod 7, the bottom of the shell 8 is provided with a abdicating hole positioned on the outer side of the output end of the second motor 9, the vertical rod 7 is distributed in bilateral symmetry, the output end of the second motor 9 is fixedly connected with a mounting block 10 positioned below the shell 8, the bottom of the mounting block 10 is fixedly connected with a polishing disk 11, the top of the workbench 1 is fixedly connected with two fixing plates 12, the inner thread of the fixing plate 12 is connected with a screw 13 positioned below the polishing disk 11, one opposite side of the two screw 13 is movably connected with a clamping plate 14 positioned between the two fixing plates 12 and contacted with the top of the workbench 1, the fixing plates 12 are distributed in bilateral symmetry, the fixing plates 12 are internally provided with threaded holes matched with the screw 13, the inner part of the clamping plate 14 is fixedly connected with a second bearing which is sleeved with the outer side of the screw 13, the top part of the circular plate 5 is fixedly connected with two first U-shaped blocks 15 which are positioned at the left side and the right side of the connecting shell 4, one side opposite to the two vertical rods 7 is fixedly connected with a second U-shaped block 16 which is positioned above the first U-shaped block 15, the inner sides of the first U-shaped block 15 and the second U-shaped block 16 are movably connected with a second electric cylinder 17, the front side and the rear side of the first U-shaped block 15 are respectively provided with a round hole, the inner side of the first U-shaped block 15 is movably connected with a round shaft which extends into the two round holes, the front side and the rear side of the second U-shaped block 16 are respectively provided with a through hole, the inner side of the second U-shaped block 16 is movably connected with a short shaft which extends into the two through holes, the outer sides of the round shaft and the short shaft are fixedly connected with the second electric cylinder 17, a semiconductor material to be processed is arranged on the worktable 1 and is positioned between the two clamping plates 14, rotating the screw 13, the screw 13 drives the clamping plates 14 to move, the two clamping plates 14 approach each other and clamp and position the semiconductor material, the first electric cylinder 3 drives the connecting shell 4 to move downwards, the connecting shell 4 drives the polishing disc 11 in indirect connection with the connecting shell to move downwards, the first motor 6 is started, the first motor 6 drives the circular plate 5 to rotate, the circular plate 5 drives the polishing disc 11 in indirect connection with the circular plate 5 to rotate around the connecting shell 4, the second electric cylinder 17 drives the second U-shaped block 16 to move, the second U-shaped block 16 drives the vertical rod 7 to rotate around the circular plate 5, the vertical rod 7 drives the polishing disc 11 in indirect connection with the polishing disc 5 to rotate around the circular plate 5, so that the polishing disc 11 is conveniently attached to the irregular surface of the semiconductor material, the second motor 9 is started, the second motor 9 drives the mounting block 10 to rotate, the mounting block 10 drives the polishing disc 11 to rotate, and then the irregular surface of the semiconductor material can be ground and polished, the positioning and clamping of the processing surface of the semiconductor material for many times are avoided, so that the purpose of convenient use is achieved.
In summary, the semiconductor material grinding and polishing machine is characterized in that a semiconductor material to be processed is placed on a workbench 1 and is positioned between two clamping plates 14, a screw 13 is rotated, the screw 13 drives the clamping plates 14 to move, the two clamping plates 14 approach each other and clamp and position the semiconductor material, a first electric cylinder 3 drives a connecting shell 4 to move downwards, the connecting shell 4 drives a polishing disk 11 in indirect connection with the connecting shell to move downwards, a first motor 6 is started, the first motor 6 drives a circular plate 5 to rotate, the circular plate 5 drives the polishing disk 11 in indirect connection with the circular plate 5 to rotate around the connecting shell 4, a second electric cylinder 17 drives a second U-shaped block 16 to move, the second U-shaped block 16 drives a vertical rod 7 to rotate around the circular plate 5, the vertical rod 7 drives the polishing disk 11 in indirect connection with the circular plate 5 to rotate, so that the polishing disk 11 is convenient to be attached to irregular surfaces of the semiconductor material, the second motor 9 is started, the second motor 9 drives the mounting block 10 to rotate, the mounting block 10 drives the polishing disc 11 to rotate, grinding and polishing can be performed on the irregular surface of the semiconductor material, positioning and clamping on the processing surface of the semiconductor material for multiple times are avoided, and therefore the purpose of convenient use is achieved, the problems that in the prior art, the polishing disc 11 of a grinding and polishing machine is generally only provided with the freedom degree in the vertical direction, when the semiconductor material with the irregular shape is ground and polished, the processing surface of the semiconductor material needs to be positioned and clamped for multiple times, the process is complex, and inconvenience in use is caused are solved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Semiconductor material grinding and polishing machine, including workstation (1), its characterized in that: the top of the workbench (1) is fixedly connected with an L-shaped plate (2), the inside of the L-shaped plate (2) is fixedly connected with a first electric cylinder (3), the output end of the first electric cylinder (3) is fixedly connected with a connecting shell (4) positioned at the inner side of the L-shaped plate (2), the outer side of the connecting shell (4) is movably connected with a circular plate (5) extending to the lower side of the connecting shell (4), the inside of the connecting shell (4) is fixedly connected with a first motor (6) fixedly connected with the circular plate (5), the inside of the circular plate (5) is movably connected with two vertical rods (7) which are positioned at the left side and the right side of the connecting shell (4), the bottom of each vertical rod (7) is fixedly connected with a shell (8) positioned at the lower side of the circular plate (5), the inside of each shell (8) is fixedly connected with an output end which penetrates through a second motor (9) of the shell (8), the output end of the second motor (9) is fixedly connected with an installation block (10) positioned below the shell (8), the bottom of the installation block (10) is fixedly connected with a polishing disk (11), the top of the workbench (1) is fixedly connected with two fixing plates (12), the inner threads of the fixing plates (12) are connected with screw rods (13) positioned below the polishing disk (11), one opposite sides of the two screw rods (13) are movably connected with clamping plates (14) which are positioned between the two fixing plates (12) and are contacted with the top of the workbench (1), the top of the circular plate (5) is fixedly connected with two first U-shaped blocks (15) which are positioned on the left side and the right side of the connecting shell (4), and one opposite sides of the two vertical rods (7) are fixedly connected with second U-shaped blocks (16) which are positioned above the first U-shaped blocks (15), the inner sides of the first U-shaped block (15) and the second U-shaped block (16) are movably connected with a second electric cylinder (17).
2. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: the top of L shaped plate (2) is seted up the pilot hole with first electronic jar (3) looks adaptation, the bottom of connecting shell (4) is the opening form.
3. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: the mounting hole is formed in the top of the circular plate (5), and a first bearing sleeved with the outer side of the connecting shell (4) is fixedly connected to the inside of the mounting hole.
4. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: the mounting groove that is located montant (7) outside is seted up in the outside of plectane (5), the inside fixedly connected with of mounting groove runs through the installation axle of montant (7), the hole of stepping down that is located the second motor (9) output outside is seted up to the bottom of casing (8), montant (7) are bilateral symmetry and distribute.
5. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: the fixed plate (12) is distributed in a bilateral symmetry mode, threaded holes matched with the screw rods (13) are formed in the fixed plate (12), and second bearings sleeved with the outer sides of the screw rods (13) are fixedly connected to the inner portions of the clamping plates (14).
6. The semiconductor material grinding and polishing machine according to claim 1, characterized in that: round holes are formed in the front side and the rear side of the first U-shaped block (15), the inner side of the first U-shaped block (15) is movably connected with a round shaft extending to the inner portion of the round hole, through holes are formed in the front side and the rear side of the second U-shaped block (16), the inner side of the second U-shaped block (16) is movably connected with a short shaft extending to the inner portion of the through hole, and the outer sides of the round shaft and the short shaft are fixedly connected with the second electric cylinder (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463121.5U CN214490105U (en) | 2021-03-03 | 2021-03-03 | Grinding and polishing machine for semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120463121.5U CN214490105U (en) | 2021-03-03 | 2021-03-03 | Grinding and polishing machine for semiconductor material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214490105U true CN214490105U (en) | 2021-10-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120463121.5U Expired - Fee Related CN214490105U (en) | 2021-03-03 | 2021-03-03 | Grinding and polishing machine for semiconductor material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214490105U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378706A (en) * | 2022-01-13 | 2022-04-22 | 赛恩斯(广州)工业技术有限公司 | Polishing equipment for processing artificial quartz stone and adaptive two end faces and implementation method |
-
2021
- 2021-03-03 CN CN202120463121.5U patent/CN214490105U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378706A (en) * | 2022-01-13 | 2022-04-22 | 赛恩斯(广州)工业技术有限公司 | Polishing equipment for processing artificial quartz stone and adaptive two end faces and implementation method |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211026 |
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| CF01 | Termination of patent right due to non-payment of annual fee |