CN214488068U - High-efficiency wafer shower device - Google Patents
High-efficiency wafer shower device Download PDFInfo
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- CN214488068U CN214488068U CN202023275482.1U CN202023275482U CN214488068U CN 214488068 U CN214488068 U CN 214488068U CN 202023275482 U CN202023275482 U CN 202023275482U CN 214488068 U CN214488068 U CN 214488068U
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Abstract
A wafer high-efficiency shower device. Relate to wafer processing equipment, especially relate to the high-efficient device that drenches of wafer. The utility model comprises a groove body with an opening at the top, a lifting rod, a liquid level sensor and a lifting linear driving mechanism; the bottom of the tank body is provided with a water inlet and a water outlet; the lifting rod is movably arranged in the groove body through the lifting linear driving mechanism; the wafer boat is placed on the wafer support, the rapid cleaning tank is started after the wafer boat is placed on the wafer support, pure water enters the tank body from a water inlet at the bottom of the tank body, the pure water overflows and cleans the wafers through the overflowing holes, the cleaning spray head simultaneously washes the wafers, and when the water level rises to the liquid level sensor, the washing and the pure water introduction are respectively stopped; at the moment, nitrogen gas flows from the nitrogen inlet to the nitrogen outlet, the nitrogen gas forms 90-degree and 45-degree bubbles due to the arrangement angle of the nitrogen outlet, the wafer is cleaned, meanwhile, the linear driving mechanism is lifted to start to work up and down, the set time is reached, the nitrogen gas is stopped from entering, and the wafer cleaning is finished.
Description
Technical Field
The utility model relates to a wafer processing equipment especially relates to high-efficient device that drenches of wafer.
Background
With the increasing popularity and updating of electronic products, the manufacturing process of semiconductors has also been rapidly developed. In the manufacturing process of semiconductors, the wafer cleaning process plays a great role throughout the whole process. At present, the wafer cleaning is usually only discharged onto a wafer boat, and the wafer on the wafer boat is cleaned by spraying or placing the wafer in a cleaning tank and stirring water in the cleaning tank, and the cleaning mode is low in efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a to above problem, provide a compact structure, use simple and convenient, improve wafer cleaning efficiency's high-efficient device that drenches of wafer.
The technical scheme of the utility model is that: the lifting linear driving mechanism comprises a groove body with an opening at the top, a lifting rod, a liquid level sensor and a lifting linear driving mechanism;
the bottom of the tank body is provided with a water inlet and a water outlet;
the water inlet is communicated with a water pump in the pure water tank through a pipeline;
a sealing lifting mechanism is arranged below the water outlet, and the opening and closing of the water outlet are controlled by the sealing lifting mechanism;
the lifting rod is movably arranged in the groove body through the lifting linear driving mechanism;
the bottom of the lifting rod is matched with the wafer boat and is positioned in the groove body;
the bottom of the lifting rod is provided with a plurality of through holes which are communicated up and down and a plurality of nitrogen blowing outlets which are communicated with a nitrogen gas source;
the top of the lifting rod is provided with a drum nitrogen inlet communicated with the drum nitrogen outlet;
a liquid level sensor matched with the wafer boat is arranged on the inner side wall of the groove body; the liquid level sensor is hung on the inner side wall of the tank body;
and an overflow port matched with the liquid level sensor is arranged on the tank body.
The cleaning device also comprises a plurality of cleaning spray heads arranged at the top of the tank body.
The sealing lifting mechanism comprises a sealing plate and a drainage linear driving mechanism;
the cylinder body of the drainage linear driving mechanism is fixedly connected with the equipment frame body, and the piston rod of the drainage linear driving mechanism is fixedly connected with the middle position of the bottom of the sealing plate;
and the top of the sealing plate is provided with a sealing ring matched with the bottom of the groove body, and the opening and closing of the sealing plate and the groove body are controlled by the lifting of the drainage linear driving mechanism.
The drainage linear driving mechanism comprises a drainage air cylinder, a drainage hydraulic cylinder or a drainage electric push rod.
The lifting linear driving mechanism comprises a lifting air cylinder, a lifting hydraulic cylinder or a lifting electric push rod.
The lifting rod comprises a lifting arm and a wafer support which are fixedly connected.
The top of the wafer support is provided with an arc-shaped groove;
the drum nitrogen outlet is positioned in the arc-shaped groove.
The model of the liquid level sensor is UQZ-04-20.
And an upper limit sensor for limiting an upper limit point and a lower limit sensor for limiting a lower limit point are arranged on a cylinder body of the lifting linear driving mechanism.
The utility model comprises a groove body with an opening at the top, a lifting rod, a liquid level sensor and a lifting linear driving mechanism; the bottom of the tank body is provided with a water inlet and a water outlet; the lifting rod is movably arranged in the groove body through the lifting linear driving mechanism; the wafer boat is placed on the wafer support, the rapid cleaning tank is started after the wafer boat is placed on the wafer support, pure water enters the tank body from a water inlet at the bottom of the tank body, the pure water overflows and cleans the wafers through the overflowing holes, the cleaning spray head simultaneously washes the wafers, and when the water level rises to the liquid level sensor, the washing and the pure water introduction are respectively stopped; at the moment, nitrogen gas flows from the nitrogen inlet to the nitrogen outlet, the nitrogen gas forms 90-degree and 45-degree bubbles due to the arrangement angle of the nitrogen outlet, the wafer is cleaned, meanwhile, the linear driving mechanism is lifted to start to work up and down, the set time is reached, the nitrogen gas is stopped from entering, and the wafer cleaning is finished. After the cleaning, the sealing plate is separated from the tank body through the drainage linear driving mechanism, and water in the tank body is quickly drained and collected.
Drawings
Figure 1 is a schematic structural view of the present invention,
FIG. 2 is a schematic diagram of the location of the nitrogen outlet of the drum;
in the figure, 1 is a tank body, 11 is a water inlet, 12 is a water outlet, 13 is an overflow port, 2 is a lifting rod, 21 is a lifting arm, 22 is a wafer holder, 221 is an overflow hole, 222 is a nitrogen blowing outlet, 223 is an arc-shaped groove, 3 is a liquid level sensor, 4 is a lifting linear driving mechanism, 41 is an upper limit sensor, 42 is a lower limit sensor, 51 is a sealing plate, 52 is a water discharging linear driving mechanism, and 6 is a cleaning nozzle.
Detailed Description
The utility model is shown in figure 1-2, and comprises a tank body 1 with an opening at the top, a lifting rod 2, a liquid level sensor 3 and a lifting linear driving mechanism 4;
the bottom of the tank body 1 is provided with a water inlet 11 and a water outlet 12;
the water inlet 11 is communicated with a water pump in the pure water tank through a pipeline;
a sealing lifting mechanism is arranged below the water outlet 12, and the opening and closing of the water outlet 12 are controlled by the sealing lifting mechanism;
the lifting rod 2 is movably arranged in the tank body 1 through the lifting linear driving mechanism 4;
the top of the lifting rod 2 is fixedly connected with a piston rod of the lifting linear driving mechanism 4, and a cylinder body of the lifting linear driving mechanism 4 is fixedly connected with the equipment frame body;
the bottom of the lifting rod 2 is matched with the wafer boat and is positioned in the groove body 1;
the bottom of the lifting rod 2 is provided with a plurality of through holes 221 which are vertically communicated and a plurality of nitrogen blowing outlets 222 which are communicated with a nitrogen gas source;
a drum nitrogen inlet communicated with the drum nitrogen outlet 222 is formed in the top of the lifting rod 2;
a liquid level sensor 3 matched with the wafer boat is arranged on the inner side wall of the tank body 1; the liquid level sensor 3 is hung on the inner side wall of the tank body 1 through a hanging rope;
and an overflow port 13 matched with the liquid level sensor 3 is arranged on the tank body 1.
And the cleaning device also comprises a plurality of cleaning spray heads 6 arranged at the top of the tank body 1. The cleaning spray head 6 is communicated with a water pump in the pure water tank.
The sealing lifting mechanism comprises a sealing plate 51 and a drainage linear driving mechanism 52;
the cylinder body of the drainage linear driving mechanism 52 is fixedly connected with the equipment frame body, and the piston rod of the drainage linear driving mechanism is fixedly connected with the middle position of the bottom of the sealing plate 51;
the top of the sealing plate 51 is provided with a sealing ring matched with the bottom of the tank body 1, and the opening and closing of the sealing plate 51 and the tank body 1 are controlled by the lifting of the drainage linear driving mechanism 52.
The drainage linear driving mechanism 52 includes a drainage cylinder, a drainage hydraulic cylinder, or a drainage electric push rod.
The lifting linear driving mechanism 4 comprises a lifting air cylinder, a lifting hydraulic cylinder or a lifting electric push rod.
The poppet 2 includes a poppet arm 21 and a wafer support 22 fixedly connected thereto.
The top of the wafer support 22 is provided with an arc-shaped groove 223;
the drum nitrogen outlet 222 is located within the arcuate recess 223.
The model of the liquid level sensor is UQZ-04-20.
An upper limit sensor 41 for limiting an upper limit point and a lower limit sensor 42 for limiting a lower limit point are provided on the cylinder of the lifting linear drive mechanism 4. The up-down movement amplitude of the lifting basket is controlled by adjusting the position of the upper limit sensor 41 and the position of the lower limit sensor 42. When the lifting linear driving mechanism 4 is a lifting cylinder, the up-and-down movement frequency of the lifting basket is controlled by adjusting the air inlet air quantity adjusting valve.
Placing the wafer boat on a wafer support 22, starting the rapid cleaning tank after placing, enabling pure water to enter the tank body 1 from a water inlet 11 at the bottom of the tank body 1, enabling the pure water to overflow and clean the wafer through an overflowing hole 221, simultaneously enabling a cleaning nozzle 6 to rinse the wafer, and stopping rinsing and pure water introduction respectively when the water level rises to a liquid level sensor 3; at this time, nitrogen gas flows from the nitrogen inlet to the nitrogen outlet 222, and the nitrogen gas flows through the nitrogen outlet 222 to form 90 ° and 45 ° bubbles due to the angle (in fig. 2, the middle part is vertically provided with a 90 ° air hole, the two sides of the 90 ° air hole are provided with 45 ° air holes, and the 45 ° air hole and the 90 ° air hole are respectively communicated with the nitrogen inlet), so that the wafer is cleaned, and meanwhile, the linear driving mechanism 4 is lifted to work up and down, and the wafer cleaning is finished when the set time is reached, and the nitrogen gas is stopped to enter. After the cleaning is finished, the sealing plate 51 is separated from the tank body 1 by the drainage linear driving mechanism 52, and the water in the tank body 1 is quickly drained and collected.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.
Claims (9)
1. The efficient wafer flushing device is characterized by comprising a groove body with an opening at the top, a lifting rod, a liquid level sensor and a lifting linear driving mechanism;
the bottom of the tank body is provided with a water inlet and a water outlet;
the water inlet is communicated with a water pump in the pure water tank through a pipeline;
a sealing lifting mechanism is arranged below the water outlet, and the opening and closing of the water outlet are controlled by the sealing lifting mechanism;
the lifting rod is movably arranged in the groove body through the lifting linear driving mechanism;
the bottom of the lifting rod is matched with the wafer boat and is positioned in the groove body;
the bottom of the lifting rod is provided with a plurality of through holes which are communicated up and down and a plurality of nitrogen blowing outlets which are communicated with a nitrogen gas source;
the top of the lifting rod is provided with a drum nitrogen inlet communicated with the drum nitrogen outlet;
a liquid level sensor matched with the wafer boat is arranged on the inner side wall of the groove body; the liquid level sensor is hung on the inner side wall of the tank body;
and an overflow port matched with the liquid level sensor is arranged on the tank body.
2. The wafer high-efficiency showering device according to claim 1, further comprising a plurality of cleaning nozzles arranged at the top of the tank body.
3. The wafer high-efficiency shower device according to claim 1, wherein the sealing lifting mechanism comprises a sealing plate and a water discharge linear driving mechanism;
the cylinder body of the drainage linear driving mechanism is fixedly connected with the equipment frame body, and the piston rod of the drainage linear driving mechanism is fixedly connected with the middle position of the bottom of the sealing plate;
and the top of the sealing plate is provided with a sealing ring matched with the bottom of the groove body, and the opening and closing of the sealing plate and the groove body are controlled by the lifting of the drainage linear driving mechanism.
4. The wafer high-efficiency showering device according to claim 3, wherein the drain linear driving mechanism comprises a drain cylinder, a drain hydraulic cylinder or a drain electric push rod.
5. The wafer high-efficiency shower apparatus according to claim 1, wherein the lifting linear driving mechanism comprises a lifting cylinder, a lifting hydraulic cylinder or a lifting electric push rod.
6. The wafer high efficiency shower apparatus as claimed in claim 1, wherein the lift rod comprises a lift arm and a die holder fixedly connected.
7. The wafer high-efficiency shower device according to claim 6, wherein an arc-shaped groove is formed at the top of the chip support;
the drum nitrogen outlet is positioned in the arc-shaped groove.
8. The wafer high efficiency showering device according to claim 1, wherein said level sensor is model number UQZ-04-20.
9. The wafer high-efficiency showering device according to claim 1, wherein an upper limit sensor for limiting an upper limit point and a lower limit sensor for limiting a lower limit point are arranged on the cylinder of the lifting linear driving mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023275482.1U CN214488068U (en) | 2020-12-28 | 2020-12-28 | High-efficiency wafer shower device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023275482.1U CN214488068U (en) | 2020-12-28 | 2020-12-28 | High-efficiency wafer shower device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214488068U true CN214488068U (en) | 2021-10-26 |
Family
ID=78213071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023275482.1U Active CN214488068U (en) | 2020-12-28 | 2020-12-28 | High-efficiency wafer shower device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214488068U (en) |
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2020
- 2020-12-28 CN CN202023275482.1U patent/CN214488068U/en active Active
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