CN214482129U - Backflow fixture structure of large power module - Google Patents
Backflow fixture structure of large power module Download PDFInfo
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- CN214482129U CN214482129U CN202120507350.2U CN202120507350U CN214482129U CN 214482129 U CN214482129 U CN 214482129U CN 202120507350 U CN202120507350 U CN 202120507350U CN 214482129 U CN214482129 U CN 214482129U
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Abstract
The utility model discloses a reflow fixture structure of a large-scale power module, which is used for clamping the power module during reflow soldering, and mainly comprises a printing patch carrier, a reflow base, an insulating substrate fixing frame and a terminal cover plate which are arranged in a matching way, wherein the printing patch carrier is used for performing solder printing and chip mounting on insulating substrates with different sizes and types; the reflow base is used for placing the power module so as to facilitate flux printing and soldering lug placement on a substrate of the power module; the insulating substrate fixing frame is placed on a substrate of the power module and is fixedly connected with the substrate through a substrate positioning column so as to place the printed and pasted insulating substrate on the substrate in the insulating substrate fixing frame according to a design drawing; the terminal cover plate is installed on a substrate of the power module, an insulating substrate isolation needle is inserted into the terminal cover plate to prevent the insulating substrate from shifting, and after placement is completed, the power module and the corresponding clamp are placed into a reflow oven together for reflow soldering.
Description
Technical Field
The utility model relates to a power electronics field, concretely relates to large-scale power module's backward flow anchor clamps structure.
Background
Most conventional power modules use a two-step reflow method in which the chip is separately reflowed to the DBC and the DBC is separately reflowed to the substrate, and the reflow jig is relatively simple in design and only needs to consider a single solder soldering process. Is not suitable for reflow soldering of large power modules. The use of the integrated DBC fixing frame can cause abnormal conditions such as DBC unfilled corners when the clamp is disassembled after reflow is finished. The bottom of the conventional power module is generally of a planar design and is in direct and complete contact with the bottom surface of the reflow oven. When a complex protruding structure is designed at the bottom of the large module, the large module cannot be directly placed on the bottom surface of the flat reflow furnace for reflow, and the heat conduction is greatly influenced because of incomplete contact, so that the welding process cannot be completed. The design types and the number of the large-scale power modules DBC are large, the large-scale power modules DBC are easy to shift during reflow, and the performance of the modules and the performance of subsequent process steps are affected when the distance between the DBCs is too short or the DBCs are shifted too much.
Disclosure of Invention
The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a simple structure and can effectively simplify the reflow soldering process's large-scale power module's backward flow anchor clamps structure.
The utility model aims at providing a reflow fixture structure of a large-scale power module, which is used for clamping a power module during reflow soldering, and mainly comprises a printing patch carrier, a reflow base, an insulating substrate fixing frame and a terminal cover plate which are matched with each other, wherein the printing patch carrier is used for performing solder printing and chip mounting on insulating substrates with different sizes and types; the reflow base is used for placing the power module so as to facilitate flux printing and soldering lug placement on a substrate of the power module; the insulating substrate fixing frame is placed on a substrate of the power module and is fixedly connected with the substrate through a substrate positioning column so as to place the printed and pasted insulating substrate on the substrate in the insulating substrate fixing frame according to a design drawing; the terminal cover plate is installed on a substrate of the power module, an insulating substrate isolation needle is inserted into the terminal cover plate to prevent the insulating substrate from shifting, and after placement is completed, the power module and the corresponding clamp are placed into a reflow oven together for reflow soldering.
Furthermore, a plurality of concave grooves matched with the shape and size of the insulating substrate are formed in the upper surface of the printing patch carrier, a plurality of small holes are uniformly formed in the concave grooves in a penetrating mode, a vacuum cavity is arranged on the lower surface of the printing patch carrier, and a vacuum system is arranged through the vacuum cavity to adsorb the insulating substrate.
Furthermore, the terminal cover plate mainly comprises an upper cover plate and a lower cover plate which are sequentially arranged, and a plurality of cover plate sleeves are arranged between the upper cover plate and the lower cover plate and are fixedly connected with the upper cover plate and the lower cover plate through substrate positioning columns and nuts; the terminal cover plate is inserted on the substrate of the power module through the substrate positioning column, and a plurality of small round holes for inserting the insulation substrate isolation PINs and the PIN PINs are formed in the terminal cover plate.
Further, the shape of the reflow base is matched with the shape of the back of the power module; the size of the insulating substrate fixing frame calculates the allowance value according to the thermal expansion coefficient of the substrate and is made into a left-right split type, so that the corner missing condition of the insulating substrate caused when the insulating substrate fixing frame is detached after backflow or backflow is prevented.
Further, the upper surface of the printing patch carrier is subjected to anodic oxidation or coloring treatment, and clamping grooves convenient for clamping the insulating substrate are arranged between two adjacent concave grooves on the printing patch carrier; the lower surface of printing paster carrier is provided with the strengthening rib structure.
Furthermore, the substrate positioning column consists of a slender cylinder and a column seat integrally arranged on the slender cylinder, and the diameter of the slender cylinder is consistent with that of the positioning hole in the substrate.
Further, the insulating substrate isolation needle consists of an elongated cylinder and an upper flat cylinder, wherein a sharp corner is arranged below the elongated cylinder and is inserted into a gap between two adjacent insulating substrates on the substrates through the sharp corner.
The utility model has the advantages of: the utility model discloses mainly constitute by the fixed frame of printing paster carrier, backward flow base, insulating substrate and the terminal apron of supporting setting, can design the printing paster carrier that is fit for multiple insulating substrate size according to actual demand, thereby can be with carrying out the printing of solder on same carrier with multiple insulating substrate style on the module simultaneously. The welding time and the welding cost are effectively shortened; the backflow base, the insulating substrate fixing frame and the terminal cover plate can realize one-step backflow from a chip to an insulating substrate and from the insulating substrate to the substrate, the insulating substrate is positioned through the isolation needle, the clamp is disassembled after backflow, the insulating substrate ceramic unfilled corner and other abnormalities are not easy to cause, and the problem that backflow cannot be directly performed on a plane due to various protruding designs at the bottom of the substrate is solved.
Drawings
Fig. 1 is a schematic structural diagram of a power module according to the present invention;
fig. 2 is a schematic front structural view of the printing patch carrier of the present invention;
fig. 3 is a schematic view of a back structure of the printing patch carrier of the present invention;
fig. 4 is a schematic structural view of the backflow base of the present invention;
fig. 5 is a schematic structural view of the insulating substrate fixing frame of the present invention;
fig. 6 is a schematic structural view of the terminal cover plate of the present invention;
FIG. 7 is a schematic view of an insulating substrate placed on a print patch carrier;
fig. 8 is a schematic structural view of the assembled jig.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention will be further described with reference to the accompanying drawings and examples.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "lateral", "vertical", and the like are the directions or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, and therefore, should not be construed as limiting the present invention.
As shown in fig. 1-8, the reflow jig structure of a large power module according to the present invention is used for clamping a power module 1 during reflow soldering, and mainly includes a printed patch carrier 2, a reflow base 3, a fixed frame 4 of an insulating substrate, and a terminal cover plate 5, which are configured in a matching manner, wherein the printed patch carrier 2 is used for performing solder printing and chip mounting on insulating substrates 7 of different sizes and types; the reflow base 3 is used for placing the power module 1 so as to facilitate flux printing and solder pad placement on the substrate 11 of the power module 1; the insulating substrate fixing frame 4 is placed on the substrate 11 of the power module 1 and is fixedly connected with the substrate 11 through the substrate positioning columns 51 so as to place the printed and pasted insulating substrate 7 on the substrate 11 in the insulating substrate fixing frame 4 according to the design drawing; the terminal cover plate 5 is installed on the substrate 11 of the power module 1, the insulating substrate isolation pin 6 is inserted into the terminal cover plate 5 to prevent the insulating substrate 7 from shifting, and after the terminal cover plate 5 is placed, the power module 1 and the corresponding clamp are placed into a reflow oven together for reflow soldering.
Referring to fig. 2-3, the upper surface of the printing patch carrier 2 is provided with a plurality of concave grooves 21 matching with the shape and size of the insulating substrate 7, a plurality of small holes 22 are uniformly arranged in the concave grooves 21, the lower surface of the printing patch carrier 2 is provided with a vacuum cavity 23, and a vacuum system is arranged through the vacuum cavity 23 to adsorb the insulating substrate 7. When the module is used, a plurality of printing patch carriers 2 which can be suitable for different sizes of the insulating substrate 7 can be designed according to processing requirements, so that the solder can be printed on one carrier by a plurality of insulating substrate styles on the module at the same time.
The upper surface of the printing patch carrier 2 is subjected to anodic oxidation or coloring treatment to avoid interference of strong reflection on the sensor, so that the recognition effect is influenced, and clamping grooves 24 which are convenient for clamping the insulating substrate 7 are arranged between every two adjacent concave grooves 21; the lower surface of the printing patch carrier 2 is provided with a reinforcing rib structure, so that the carrier can ensure enough vacuum degree when absorbing vacuum, and can keep the carrier to be integrally flat and not easy to deform.
As shown in fig. 4-5, the shape of the reflow base 3 matches the shape of the back of the power module 1; the size of the insulating substrate fixing frame 4 calculates the allowance value according to the thermal expansion coefficient of the substrate 11 and is made into a left-right split type, so that the insulating substrate corner cut condition caused by inaccurate limiting or backflow caused by different thermal expansion coefficients and the dismounting of the insulating substrate fixing frame 4 after backflow is prevented.
Referring to fig. 6, the terminal cover plate 5 mainly includes an upper cover plate 52 and a lower cover plate 53 which are sequentially arranged, and a plurality of cover plate sleeves 54 are arranged between the upper cover plate 52 and the lower cover plate 53 and are fastened and connected through a substrate positioning column 51 and a nut 55; the terminal cover plate 5 is inserted into the substrate 11 of the power module 1 through the substrate positioning column 51, and the terminal cover plate 5 is provided with a plurality of small round holes 56 for inserting the insulating substrate isolation PINs 6 and the PIN PINs. The terminal cover plate is provided with a plurality of openings which respectively correspond to the substrate positioning columns 51, the insulating substrate isolation PINs 6 and the PIN PINs, the positions of the openings of the substrate positioning columns 51 on the terminal cover plate 5 are consistent with the positions of the substrate positioning holes, and the positions of the openings of the insulating substrate isolation PINs 6 are consistent with the positions of gaps corresponding to adjacent insulating substrates; the position of the hole of the terminal cover plate 5 for inserting the PIN is consistent with the position of the insulating substrate for placing the PIN, and the PIN is inserted before backflow.
Referring to fig. 6-8, the substrate positioning post 51 is composed of an elongated cylinder and a post seat integrally disposed on the elongated cylinder, and the diameter of the elongated cylinder is consistent with the diameter of the positioning hole on the substrate, into which the positioning post is inserted and designed with a fitting clearance. The diameters of the openings on the terminal cover plate 5 and the insulating substrate fixing frame 4 are consistent with the diameter of the substrate positioning column, and a matching clearance is designed. The height of the larger diameter cylinder on the substrate positioning column 51 is determined according to the height of the PIN on the module, and the terminal cover plate at the lower part is closer to the PIN base after assembly, so that a good limiting effect can be achieved.
The insulating substrate isolation needle 6 consists of a slender cylinder and an upper flat cylinder, wherein a sharp corner part is arranged below the slender cylinder and is inserted into a gap between two adjacent insulating substrates on the substrates through the sharp corner part. The cover plate sleeve 54 is a cylindrical structure, the inner diameter of the cover plate sleeve 54 is consistent with the diameter of the base plate positioning column, the base plate positioning column 51 is just inserted into the sleeve, and a matching clearance is designed. The height of the cover sleeve 54 determines the height of the terminal cover that limits the position of the PIN above it, depending on the height of the PIN.
Referring to fig. 7, six different insulating substrates 7, abcdef, are disposed on the front surface of the power module, and the insulating substrates 7 are arranged on the printed patch carrier 2 as shown in fig. 7, so that the quantity ratios of different types are consistent. Place insulating substrate 7 on printing paster carrier according to different kind size and direction, all put the back, the vacuum system at the anchor clamps back during printing can adsorb insulating substrate 7 on printing paster carrier 2 to fixed position can not shift, carries out solder printing and chip subsides dress on insulating substrate upper surface.
The power module has a raised portion on the back, as shown in fig. 4, the design of the reflow base should match the raised portion on the back of the module, so that the bottom surface is flat after matching, which is beneficial to heat transfer of the heating bottom plate of the reflow oven. Referring to fig. 8, after the power module 1 is placed on the reflow base 3 and the matching is completed, flux printing and solder piece placement are performed on the upper surface of the substrate 11, and then the insulating substrate fixing frame 4 is placed, and the insulating substrate fixing frame 4 is fixedly connected to the substrate 11 through the substrate positioning posts 51. And placing the insulating substrate 7 printed with the patches in the insulating substrate fixing frame 4 according to the design drawing. The terminal cover plate 5 is assembled and placed on the module, and the substrate positioning posts 51 are inserted into the substrate openings g. After fixing the position, insert insulating substrate isolation needle 6 in corresponding trompil department on terminal apron 5, insulating substrate isolation needle 6's lower extreme prong department inserts the space position between the insulating substrate, keeps apart adjacent insulating substrate, prevents that insulating substrate from shifting. And after the placement is finished, putting the module and the carrier into a reflow oven together for reflow soldering. The melting temperature of the solder under the chip is slightly lower than that of the solder under the insulating substrate, and the heat transferred to the upper layer is relatively less because of the contact heat transfer of the reflow oven, so that the upper layer and the lower layer of the solder can be melted in the same reflow process, and the effect of one-step welding is achieved.
After the chip, the insulating substrate and the substrate are subjected to reflow soldering, integrally bonding, and after the integral bonding is finished, carrying out PIN PIN soldering; when PIN needle welding, insulating substrate upper end terminal welding position point is good behind the tin cream, need to pass through the base plate reference column with insulating substrate fixed frame and install in advance on the terminal apron, then put the module upside down along the base plate reference column detain on the terminal apron, overturn 180 afterwards, place the terminal apron upwards, insert insulating substrate isolation needle after, can flow back after the inspection is errorless.
The utility model discloses mainly constitute by the fixed frame of printing paster carrier, backward flow base, insulating substrate and the terminal apron of supporting setting, can design the printing paster carrier that is fit for multiple insulating substrate size according to actual demand, thereby can be with carrying out the printing of solder on same carrier with multiple insulating substrate style on the module simultaneously. The welding time and the welding cost are effectively shortened; the backflow base, the insulating substrate fixing frame and the terminal cover plate can realize one-step backflow from a chip to an insulating substrate and from the insulating substrate to the substrate, the insulating substrate is positioned through the isolation needle, the clamp is disassembled after backflow, the insulating substrate ceramic unfilled corner and other abnormalities are not easy to cause, and the problem that backflow cannot be directly performed on a plane due to various protruding designs at the bottom of the substrate is solved.
The specific embodiments described herein are merely illustrative of the principles of the present invention and its efficacy, and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical idea of the present invention shall be covered by the claims of the present invention.
Claims (7)
1. The utility model provides a reflow jig structure of large-scale power module for press from both sides dress when carrying out reflow soldering to power module which characterized in that: the device mainly comprises a printing patch carrier, a reflux base, an insulating substrate fixing frame and a terminal cover plate which are matched, wherein the printing patch carrier is used for carrying out solder printing and chip mounting on insulating substrates of different sizes and types; the reflow base is used for placing the power module so as to facilitate flux printing and soldering lug placement on a substrate of the power module; the insulating substrate fixing frame is placed on a substrate of the power module and is fixedly connected with the substrate through a substrate positioning column so as to place the printed and pasted insulating substrate on the substrate in the insulating substrate fixing frame according to a design drawing; the terminal cover plate is installed on a substrate of the power module, an insulating substrate isolation needle is inserted into the terminal cover plate to prevent the insulating substrate from shifting, and after placement is completed, the power module and the corresponding clamp are placed into a reflow oven together for reflow soldering.
2. The reflow jig structure of a large power module according to claim 1, wherein: the upper surface of the printing paster carrier is provided with a plurality of concave grooves matched with the shape and size of the insulating substrate, a plurality of small holes are uniformly arranged in the concave grooves in a penetrating mode, the lower surface of the printing paster carrier is provided with a vacuum cavity, and a vacuum system is arranged through the vacuum cavity to adsorb the insulating substrate.
3. The reflow jig structure of a large power module according to claim 1 or 2, wherein: the terminal cover plate mainly comprises an upper cover plate and a lower cover plate which are sequentially arranged, and a plurality of cover plate sleeves are arranged between the upper cover plate and the lower cover plate and are fixedly connected with the upper cover plate and the lower cover plate through substrate positioning columns and nuts; the terminal cover plate is inserted on the substrate of the power module through the substrate positioning column, and a plurality of small round holes for inserting the insulation substrate isolation PINs and the PIN PINs are formed in the terminal cover plate.
4. The reflow jig structure of a large power module according to claim 3, wherein: the shape of the backflow base is matched with that of the back of the power module; the size of the insulating substrate fixing frame calculates the allowance value according to the thermal expansion coefficient of the substrate and is made into a left-right split type, so that the corner missing condition of the insulating substrate caused when the insulating substrate fixing frame is detached after backflow or backflow is prevented.
5. The reflow jig structure of a large power module according to claim 4, wherein: the upper surface of the printing patch carrier is subjected to anodic oxidation or coloring treatment, and clamping grooves which are convenient for clamping the insulating substrate are arranged between two adjacent concave grooves on the printing patch carrier; the lower surface of printing paster carrier is provided with the strengthening rib structure.
6. The reflow jig structure of a large power module according to claim 5, wherein: the base plate positioning column consists of a long and thin cylinder and a column seat integrally arranged on the long and thin cylinder, and the diameter of the long and thin cylinder is consistent with that of the positioning hole in the base plate.
7. The reflow jig structure of a large power module according to claim 5, wherein: the insulating substrate isolation needle consists of a long and thin cylinder and a flat cylinder above the long and thin cylinder, wherein a sharp corner part is arranged below the long and thin cylinder and is inserted into a gap between two adjacent insulating substrates on the substrates through the sharp corner part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120507350.2U CN214482129U (en) | 2021-03-10 | 2021-03-10 | Backflow fixture structure of large power module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120507350.2U CN214482129U (en) | 2021-03-10 | 2021-03-10 | Backflow fixture structure of large power module |
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| CN214482129U true CN214482129U (en) | 2021-10-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888298A (en) * | 2021-03-10 | 2021-06-01 | 上海道之科技有限公司 | Backflow fixture structure of large power module |
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- 2021-03-10 CN CN202120507350.2U patent/CN214482129U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888298A (en) * | 2021-03-10 | 2021-06-01 | 上海道之科技有限公司 | Backflow fixture structure of large power module |
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