CN214443891U

CN214443891U - Wafer marking device

Info

Publication number: CN214443891U
Application number: CN202120483116.0U
Authority: CN
Inventors: 黄汉杰; 杨伟林; 王灿; 庄景涛; 张鑫; 杨林杰
Original assignee: Youxin Xiamen Semiconductor Equipment Co ltd
Current assignee: Youxin Xiamen Semiconductor Equipment Co ltd
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-10-22
Anticipated expiration: 2031-03-05

Abstract

The utility model relates to the laser processing field, in particular to a wafer marking device, which comprises a laser, a power adjusting component, a power detecting component, a focusing component and an objective table; the power adjusting assembly, the focusing assembly and the objective table are sequentially arranged on a beam path emitted by the laser; the power detection assembly is arranged between the power adjusting assembly and the focusing assembly; the power adjusting assembly comprises a rotatable wave plate and a light splitting mechanism, and the wave plate and the light splitting mechanism are sequentially arranged on a path of a light beam emitted by the laser. Through setting up and adjusting power subassembly, power detection subassembly, the mode that adjusts the power subassembly and include wave plate, beam splitting mechanism carries out power regulation and control to the light beam that the laser instrument sent, has solved prior art and can not adjust the light-emitting power, can not monitor the problem that the power of marking the device whether changes yet to according to corresponding power-demarcation angle relation table, can carry out more accurate regulation to concrete power.

Description

Wafer marking device

Technical Field

The utility model relates to a laser beam machining field, in particular to mark device is beaten to wafer.

Background

Laser marking is a marking method in which a workpiece is irradiated locally with high-energy-density laser to vaporize a surface layer material or to undergo a chemical reaction of color change, thereby leaving a permanent mark. The basic principle of laser marking is that a laser generator generates high-energy continuous laser beam, the focused laser acts on a printing material to melt or even gasify the surface material instantaneously, and a required image-text mark is formed by controlling the path of the laser on the surface of the material.

CN206306643U patent "a laser marking device based on CCD and galvanometer for coaxial visual positioning", published as 2017.07.07, provides a laser marking device based on CCD and galvanometer for coaxial visual positioning, comprising a light source and a field lens, wherein the field lens is arranged above the light source; the galvanometer is arranged above the field lens; the laser is arranged on one side of the galvanometer; the CCD module is arranged on the other side of the galvanometer and is coaxial with the galvanometer; the laser emitted by the laser irradiates the workpiece to be marked through the CCD module, the galvanometer and the field lens; the light reflected by the workpiece to be marked is incident to the CCD module through the field lens and the galvanometer; and the controller is electrically connected with the laser, the CCD module and the galvanometer respectively. The laser and the CCD module of the marking device are arranged on two sides of the galvanometer, so that the marking device is simple in structure and occupies a small space; the processing precision is improved by adopting coaxial imaging, and the complexity of manual intervention and positioning is avoided.

However, when the marking device is used, the output power cannot be adjusted, and whether the power of the marking device varies or not cannot be monitored.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems that the luminous power can not be adjusted and the power of the marking device can not be monitored whether to have variation when the marking device is adopted,

the utility model provides a wafer marking device, which comprises a laser, a power adjusting component, a power detecting component, a focusing component and an objective table;

the power adjusting assembly, the focusing assembly and the objective table are sequentially arranged on a beam path emitted by the laser; the power detection assembly is arranged between the power adjusting assembly and the focusing assembly;

the power adjusting assembly comprises a rotatable wave plate and a light splitting mechanism, and the wave plate and the light splitting mechanism are sequentially arranged on a path of a light beam emitted by the laser.

Further, the wave plate is an 1/2 wave plate, and the light splitting mechanism is a cubic light splitting crystal.

Further, the wave plate is driven to rotate by the driving piece; the driving piece is a motor.

Furthermore, a light blocking mechanism is arranged on a vertical polarized light path of the light beam emitted by the laser after being split by the light splitting mechanism.

Furthermore, the power detection assembly comprises a reflecting mirror and a power meter, the reflecting mirror can vertically move in the horizontal direction relative to the light beam emitted by the laser, and the reflecting mirror is used for reflecting the light beam emitted by the laser to the power meter for detection.

Further, the reflecting mirror is driven to move by an air cylinder.

Further, the focusing assembly comprises a vibrating mirror and a field lens, the vibrating mirror is matched with the field lens, and light beams emitted by the laser sequentially pass through the vibrating mirror and the field lens.

Further, the object stage is an edge finder.

Furthermore, a beam expander is arranged between the power adjusting assembly and the focusing assembly, and the beam expander is arranged on a path of a light beam emitted by the laser.

Furthermore, the beam expander is an electric beam expander, and the size of the laser spot can be adjusted by the electric beam expander.

Compared with the prior art, the utility model provides a pair of mark device is beaten to wafer carries out power control and control through setting up regulation power subassembly, power detection subassembly, and the mode of adjusting power subassembly and including rotatable wave plate, beam splitting mechanism to the light beam that the laser instrument sent, has solved prior art and can not adjust light-emitting power, can not monitor the problem of beating the power of mark device and whether taking place the variation yet to according to corresponding power-calibration angle relation table, can carry out more accurate regulation to concrete power.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of an optical path of a wafer marking device according to the present invention;

fig. 2 is a schematic view of a light path when the wafer marking device provided by the present invention detects power;

fig. 3 is a graph of power-calibration angle relationship according to an embodiment of the present invention.

Reference numerals:

10. laser 20, adjusting power assembly 21 and wave plate

22. Light splitting mechanism 30, power detection assembly 31 and reflector

32. Power meter 40, focusing assembly 41, galvanometer

42. Field lens 50, stage 60, light blocking mechanism

70. Beam expanding lens

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Specific embodiments are given below:

referring to fig. 1, a wafer marking device, characterized in that: comprises a laser 10, a power adjusting component 20, a power detecting component 30, a focusing component 40 and an object stage 50; the power adjusting component 20, the focusing component 40 and the objective table 50 are sequentially arranged on a beam path emitted by the laser 10; the power detection assembly 30 is arranged between the adjusting power assembly 20 and the focusing assembly 40; the power adjusting assembly 20 comprises a rotatable wave plate 21 and a light splitting mechanism 22, wherein the wave plate 21 and the light splitting mechanism 22 are sequentially arranged on a path of a light beam emitted by the laser 10.

In specific implementation, a light beam emitted by the laser 10 sequentially passes through the power adjusting assembly 20, the focusing assembly 40 and the object stage 50 to mark an object on the object stage 50; the laser 10 is used for emitting a light beam, the adjusting power component 20 is used for adjusting the power of the light beam emitted by the laser 10, the focusing component 40 focuses the light beam emitted by the laser 10 to the object stage 50, and the object stage 50 is used for placing a processing object;

the power detection assembly 30 is arranged between the adjusting power assembly 20 and the focusing assembly 40 and is used for detecting the power of the light beam adjusted by the adjusting power assembly 20; specifically, power sensing assembly 30 is movable to sense when in the path of the beam emitted by laser 10 and not to sense when not in the path of the beam emitted by laser 10.

The power adjusting assembly 20 comprises a rotatable wave plate 21 and a light splitting mechanism 22, light beams emitted by the laser 10 sequentially pass through the wave plate 21 and the light splitting mechanism 22, the wave plate 21 can be adjusted in a rotatable mode, the light splitting mechanism 22 divides the light beams emitted by the laser 10 into vertical polarized light and parallel polarized light, and the purpose of adjusting the power of the light beams can be achieved through the combination of the wave plate 21 and the light splitting mechanism 22.

The working principle is as follows: when the device is used for the first time, the motor angle when the linear polarization direction of the light beam emitted by the laser 10 is changed into the vertical polarization light after passing through the wave plate 21 is calibrated, and at this time, the minimum power which penetrates through the light splitting mechanism 22 is also the minimum power which can be collected by the power detection assembly 30. After the angle is calibrated, the wave plate 21 is rotated by a certain step amount until the wave plate is rotated by 45 degrees, the maximum power which penetrates through the light splitting mechanism 22 is obtained, a power-calibration angle relation table is obtained, the corresponding calibration angle can be found through the relation table when the light beam power is set, the adjustment is convenient, and the accuracy of the light extraction rate can be ensured; when the machine is initialized, the wave plate 21 is rotated to a calibrated angle, the actual power is measured and compared with a power-calibrated angle relation table, and the condition of the machine is considered to be good when the power error is within +/-5%, so that whether the light beam power of the marking device is changed or not is monitored.

Specifically, the light beam emitted by the laser 10 sequentially enters the power adjusting component 20 and the power detecting component 30, preferably, the wave plate 21 is an 1/2 wave plate, the light splitting mechanism 22 is a cubic light splitting crystal, and the 1/2 wave plate and the cubic light splitting crystal are used in cooperation, so that a light splitting prism with a variable light splitting ratio can be realized, the proportion of parallel polarized light is controlled, and the power value is controlled; 1/2 the wave plate is driven by a driving member, preferably a motor, to adjust the rotation of 1/2 wave plate more accurately.

The power detection assembly 30 includes a reflector 31 and a power meter 32, preferably, the reflector 31 is driven by an air cylinder, the reflector 31 is driven by the air cylinder to move vertically in a horizontal direction relative to the light beam emitted by the laser 10, when the reflector 31 is far away from the path of the light beam emitted by the laser 10, the light beam emitted by the laser 10 is not reflected to the power meter 32, and when the reflector 31 is moved to the path of the light beam emitted by the laser 10, the reflector 31 is used for reflecting the light beam emitted by the laser 10 to the power meter 32 for detection.

In the following embodiment, the laser 10 is used as an example with a wavelength of 355nm, power of 0-12W adjustable, pulse width of 30-50 ns, repetition frequency of 30-50 KHz in operation, and 32 measuring ranges of a power meter of 0-15W:

and (3) detection process: referring to fig. 2, the reflecting mirror 31 is driven by the air cylinder to move to the path of the light beam emitted by the laser 10, and the light beam emitted by the laser 10 passes through 1/2 wave plate, cubic beam splitter crystal, the reflecting mirror 31 and the power meter 32 in sequence; after passing through an 1/2 wave plate, a light beam emitted by the calibration laser 10 is in a polarization direction which is a vertical polarization direction and is used as an original point angle of the motor, and at the moment, the light beam is the minimum power which penetrates through the cubic light splitting crystal and can be collected by the power meter 32; after the angle is calibrated, 1/2 wave plate is rotated by a certain step amount until 45 degrees is rotated, the transmitted light splitting crystal is the maximum power at the moment, and then a power-calibration angle relation table is obtained, which is shown in table 1 and a power-calibration angle relation chart, which is shown in fig. 3.

It should be appreciated that to increase the accuracy of the adjustment, the step size, including but not limited to 3 degrees, may be smaller, and the parameter table may be populated by the corresponding laser 10, with corresponding changes for different laser 10 models.

When setting the beam power, the power-calibration angle relation table can be referred to find the nearest interval of the two power values, and the power-calibration angle relation in the interval can be regarded as a linear relation, so as to obtain the specific required angle to drive 1/2 slide adjustment.

Table 1 relationship table of power versus calibration angle:

preferably, the light blocking mechanism 60 is disposed on the vertical polarized light path of the light beam emitted from the laser 10 after being split by the splitting mechanism 22, and preferably, the light blocking mechanism 60 is a light blocking plate on which the vertical polarized light impinges to prevent the vertical polarized light from affecting the surrounding environment.

Marking process: referring to fig. 1, the mirror 31 is driven by the cylinder to be away from the path of the light beam emitted by the laser 10, the mirror 31 does not reflect the light beam emitted by the laser 10 to the power meter 32, and the light beam emitted by the laser 10 passes through the power adjusting assembly 20, the beam expander 70, the focusing assembly 40 and the stage 50 in sequence to mark an object on the stage 50. A beam expander 70 is arranged between the power adjusting component 20 and the focusing component 40, the beam expander 70 is arranged on the path of the light beam emitted by the laser 10, and the beam expander 70 can reduce the divergence angle of the light spot, improve the quality of the focused light spot, and influence the size of the focused light spot.

Specifically, the focusing assembly 40 includes a galvanometer 41 and a field lens 42, the galvanometer 41 is matched with the field lens 42, the galvanometer 41 is disposed above the field lens 42, and the light beam emitted by the laser 10 sequentially passes through the galvanometer 41 and the field lens 42, preferably, the focal length of the field lens 42 is 255mm, and a wafer with a processed breadth of phi 240 can be processed.

The galvanometer 41 can carry out vector marking and dot matrix marking, the marking range is adjustable, the galvanometer has the advantages of high response speed, high marking quality, good light path sealing performance and strong environmental adaptability, and the field lens 42 can change the position of an imaging light beam on the premise of not changing the optical characteristics of an optical system; the adaptation of the galvanometer 41 and the field lens 42 can ensure marking quality.

Preferably, the stage 50 is an edge finder that accurately determines the center position of the workpiece being machined.

Better, beam expander 70 is electronic beam expander, and the adjustable laser spot size of electronic beam expander, and is specific, and electronic beam expander 1 ~ 8 times is adjustable, uses electronic beam expander, has opened more technological parameters, better matches the process window that different products correspond.

Although terms such as laser, modulation power assembly, power detection assembly, focusing assembly, stage, waveplate, beam splitting mechanism … … are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A wafer marking device is characterized in that: the laser device comprises a laser (10), a power adjusting component (20), a power detecting component (30), a focusing component (40) and an object stage (50);

the power adjusting assembly (20), the focusing assembly (40) and the objective table (50) are sequentially arranged on a beam path emitted by the laser (10); the power detection assembly (30) is arranged between the adjusting power assembly (20) and the focusing assembly (40);

the power adjusting assembly (20) comprises a rotatable wave plate (21) and a light splitting mechanism (22), wherein the wave plate (21) and the light splitting mechanism (22) are sequentially arranged on a path of a light beam emitted by the laser (10).

2. The wafer marking device of claim 1, wherein: the wave plate (21) is an 1/2 wave plate, and the light splitting mechanism (22) is a cubic light splitting crystal.

3. Wafer marking device according to claim 2, characterized in that: the wave plate (21) is driven to rotate by a driving piece; the driving piece is a motor.

4. The wafer marking device of claim 1, wherein: and a light blocking mechanism (60) is arranged on a vertical polarized light path of the light beam emitted by the laser (10) after being split by the splitting mechanism (22).

5. The wafer marking device of claim 1, wherein: the power detection assembly (30) comprises a reflecting mirror (31) and a power meter (32), the reflecting mirror (31) can vertically move in the horizontal direction relative to the light beam emitted by the laser (10), and the reflecting mirror (31) is used for reflecting the light beam emitted by the laser (10) to the power meter (32) for detection.

6. Wafer marking device according to claim 5, characterized in that: the reflector (31) is driven to move by an air cylinder.

7. The wafer marking device of claim 1, wherein: the focusing assembly (40) comprises a galvanometer (41) and a field lens (42), the galvanometer (41) is matched with the field lens (42), and light beams emitted by the laser (10) sequentially pass through the galvanometer (41) and the field lens (42).

8. The wafer marking device of claim 1, wherein: the object stage (50) is an edge finder.

9. The wafer marking device of claim 1, wherein: a beam expander (70) is arranged between the power adjusting assembly (20) and the focusing assembly (40), and the beam expander (70) is arranged on a path of a light beam emitted by the laser (10).

10. The wafer marking device of claim 9, wherein: the beam expander (70) is an electric beam expander, and the electric beam expander can adjust the laser spot size.