CN214430401U

CN214430401U - Plant lamp module

Info

Publication number: CN214430401U
Application number: CN202120270467.3U
Authority: CN
Inventors: 郝建广; 牛威; 冯帅杰; 谭渭东; 叶永康
Original assignee: Dongguan Haoshun Precision Technology Co ltd
Current assignee: Dongguan Haoshun Precision Technology Co ltd
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2021-10-22
Anticipated expiration: 2031-01-29

Abstract

The utility model relates to a plant lamp module, arrange a plurality of light in PCB board one side including PCB board and array, the light is all including the diffusion lens that is located the lamp pearl at center and cage cover lamp pearl, and each diffusion lens all bonds on the PCB board through the adhesive, the adhesive forms annular waterproof layer in order to seal each light, still includes the encapsulating layer of embedment PCB board. The diffusion lens is bonded through the adhesive, the adhesive forms an annular waterproof layer, a waterproof ring is not required to be additionally arranged, the process and the cost are saved, and the diffusion lens is bonded through the adhesive in advance, so that the pouring sealant is blocked by the waterproof layer formed by the adhesive, and the light emitting and heat dissipating effects of the LED lamp cannot be influenced by the inside of the diffusion lens.

Description

Plant lamp module

Technical Field

The utility model relates to a plant lamp technical field, in particular to plant lamp module.

Background

Current plant lamp module adopts a plurality of LED lamps of integration on the PCB board to throw light on usually, in order to provide the required light source of growth for the plant, and the required water source of vegetation is provided by spray set usually, often can splash to the plant lamp module during the water source that spray set sprayed, for this reason, the plant lamp module needs to have higher waterproof performance, current scheme is that adopt the casting glue to get up in order to play water-proof effects with each device embedment on the PCB board, the LED lamp on the plant module comprises lamp pearl and diffusion lens usually, probably flow into inside the LED lamp in the gap of diffusion lens and PCB board during the casting glue embedment, influence the luminous and the heat dispersion of LED lamp.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a plant lamp module to flow into inside the LED lamp when avoiding the potting glue embedment.

Therefore, the plant lamp module comprises a PCB and a plurality of illuminating lamps arranged on one surface of the PCB in an array mode, the illuminating lamps comprise lamp beads located at the center and diffusion lenses covering the lamp beads, each diffusion lens is bonded on the PCB through an adhesive, the adhesive forms an annular waterproof layer to seal each illuminating lamp, and the plant lamp module further comprises a potting layer for potting the PCB.

Further, the lighting lamp is specifically an LED lamp.

Furthermore, an electric connector is integrated on the PCB and is electrically connected with each device on the PCB through wiring on the PCB.

Furthermore, a temperature and humidity sensor is integrated on the PCB.

Further, an illumination sensor is integrated on the PCB board.

Further, the waterproof layer is bonded to the outer peripheral surface of the diffusion lens.

Further, the outer peripheral surface of the waterproof layer is arc-shaped.

Further, the surface of the PCB is coated with water-logging ink to improve the light reflection rate.

Further, have on the PCB board with the unanimous first waterproof ring of light quantity, first waterproof ring encircles each lamp pearl respectively, and the one side of each diffusion lens orientation PCB board has the waterproof ring of second of encircleing first waterproof ring, first waterproof ring with the waterproof ring of second is crisscross each other.

Furthermore, the shape of the first waterproof ring is the shape of the second waterproof ring which contracts 1cm towards the direction of the lamp bead.

Has the advantages that:

the diffusion lens is bonded through the adhesive, the adhesive forms an annular waterproof layer, a waterproof ring is not required to be additionally arranged, the process and the cost are saved, and the diffusion lens is bonded through the adhesive in advance, so that the pouring sealant is blocked by the waterproof layer formed by the adhesive, and the light emitting and heat dissipating effects of the LED lamp cannot be influenced by the inside of the diffusion lens.

The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like elements throughout the drawings. In the drawings:

fig. 1 shows a schematic structural diagram of a plant lamp module according to the present invention in a right view;

fig. 2 is a schematic view of the plant lamp module according to the present invention;

fig. 3 shows a schematic view of the installation structure of the LED lamp of the present invention;

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Referring to fig. 1, the plant lamp module of the present embodiment includes an aluminum alloy support 1, and an aluminum-based PCB 2 fixed on a lower surface of the aluminum alloy support 1, a highly reflective white water-deposited ink layer is coated on a lower surface of the PCB 2, thereby improving the light reflecting effect of the lower surface of the PCB panel 2 to increase the light intensity of the LED lamp 3 mounted on the lower surface of the PCB panel 2, see fig. 2, the LED lamps 2 are arranged on the lower surface of the PCB in an array mode, as shown in figure 3, the LED lamps 3 comprise full-spectrum LED lamp beads 31 welded on the lower surface of the PCB 2 and reflective 120-degree diffusion lenses 32 covering the lamp beads 31, the diffusion lenses 32 are respectively provided with 3 positioning column feet 321, the positioning column feet 321 are matched with positioning through holes or positioning depressions on the PCB 2 to position the diffusion lenses 32, the lamp bead 31 is positioned at the center of the diffusion lens 32, so that the diffusion effect of the diffusion lens 32 on the light of the lamp bead 31 is optimal.

See fig. 3, the diffusion lens 32 is adhered to the PCB 2 by 3220W epoxy resin sealant, so that the diffusion lens 32 is fixed, a circle of epoxy resin waterproof layer 33 is formed on the periphery of the lens of the diffusion lens 32, and it is avoided that the subsequent potting adhesive flows into the diffusion lens 32 when potting is performed, so as to affect the light diffusion effect of the diffusion lens 32, see fig. 2, the PCB 2 is further provided with a temperature and humidity sensor 4, a photoresistor 5 and a sunken connector 6, each lamp bead 31, the temperature and humidity sensor 4, the photoresistor 5 and the sunken connector 6 are electrically connected through wiring on the PCB 2, when in use, the plant lamp module is connected with an external control terminal through the sunken connector 6, power is supplied to each device on the PCB 2 by the external terminal, the temperature and humidity sensor 4 transmits the detected temperature and humidity to the external control terminal, and when the external control terminal detects that the temperature is too low, the heating device is opened, when the humidity is detected to be too low, the humidifying device is turned on, so that the temperature and the humidity are controlled to be maintained in a range suitable for the growth of plants, the photosensitive resistor 5 detects the illumination intensity of the current environment, and when the illumination intensity is detected to be greater than 10LUX, the power supply of the terminal control lamp bead 31 is cut off, and useless waste is avoided.

After each device integrated on the PCB 2 is installed, the plant lamp module is encapsulated by HS-W808 pouring sealant, so that a pouring layer 7 is formed on the surface of the PCB 2, the waterproof effect reaches IP6 level, the diffusion lens 32 is adhered by epoxy resin sealant in advance, so the pouring sealant is blocked by the waterproof layer 33 formed by epoxy resin, the pouring sealant cannot enter the diffusion lens 32 to influence the luminous effect of the LED lamp 3, and the waterproof layer 33 is arranged on the periphery of the diffusion lens 32, so the pouring sealant extrudes the waterproof layer 33 towards the direction of the diffusion lens 32 during encapsulation, not only the diffusion lens 32 plays a role of supporting the waterproof layer to avoid the waterproof layer 33 from degumming, but also the waterproof layer 33 is extruded towards the diffusion lens 32 to play a better supporting effect, further, the periphery of the waterproof layer 32 is set to be arc-shaped, so when the pouring sealant is extruded, the waterproof layer 33 is extruded perpendicularly to the arc-shaped surface, at this time, both the PCB 2 and the diffusion lens 32 can play a role of supporting the waterproof layer 33, and the waterproof layer 33 is not degummed due to the extrusion of the waterproof layer 33 during pouring and sealing of the pouring sealant, so that the PCB 2, the diffusion lens 32 and the waterproof layer 33 are bonded more firmly.

Referring to fig. 3, the lower surface of the PCB 2 is provided with first waterproof rings 8 with the same number as the LED lamps 3, each first waterproof ring 8 corresponds to one lamp bead 31, the first waterproof rings 8 are arranged around the lamp beads 31, the upper surface of the diffusion lens 32 is provided with second waterproof rings 322 which are staggered with the first waterproof rings 8, the height of each second waterproof ring 322 is lower than the height of the positioning column base 321, the shape of each first waterproof ring 8 is the same as that of each second waterproof ring 322, and the size of each first waterproof ring 8 is slightly smaller than that of each second waterproof ring 322, specifically, the first waterproof rings 8 can be in a shape that the second waterproof rings 322 are retracted 1cm in the direction of the lamp beads 31, and the first waterproof rings 8 and the second waterproof rings 322 are matched to prevent excessive epoxy resin from permeating into the LED lamps 3 in the process of using the epoxy resin to glue the diffusion lens 32 and play a role in auxiliary positioning in the process of the diffusion lens 32 in the future, the diffuser lens 32 is roughly positioned by the first waterproof ring 8 and then accurately positioned by the positioning studs 321.

It should be finally noted that the above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced with other equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. The utility model provides a plant lamp module, its characterized in that: the LED lamp comprises a PCB and a plurality of illuminating lamps arranged on one surface of the PCB in an array mode, the illuminating lamps comprise lamp beads located at the center and diffusion lenses covering the lamp beads, each diffusion lens is bonded on the PCB through an adhesive, the adhesive forms an annular waterproof layer to seal each illuminating lamp, and the LED lamp further comprises a potting layer for potting the PCB.

2. The vegetation lamp module of claim 1, characterized in that: the lighting lamp is specifically an LED lamp.

3. The vegetation lamp module of claim 1, characterized in that: the PCB is also integrated with an electric connector, and the electric connector is electrically connected with each device on the PCB through wiring on the PCB.

4. The vegetation lamp module of claim 3, characterized in that: and a temperature and humidity sensor is integrated on the PCB.

5. The vegetation lamp module of claim 3, characterized in that: and an illumination sensor is integrated on the PCB.

6. The vegetation lamp module of claim 1, characterized in that: the waterproof layer is bonded to the outer peripheral surface of the diffusion lens.

7. The vegetation lamp module of claim 6, characterized in that: the outer peripheral surface of the waterproof layer is arc-shaped.

8. The vegetation lamp module of claim 1, characterized in that: the surface of the PCB is coated with water-accumulated ink to improve the light reflection rate.

9. The vegetation lamp module of claim 1, characterized in that: the adhesive is specifically an epoxy resin adhesive.

10. The vegetation lamp module of claim 1, characterized in that: the PCB board is provided with first waterproof rings consistent with the number of the illuminating lamps, the first waterproof rings surround the lamp beads respectively, one surface of each diffusion lens facing the PCB board is provided with second waterproof rings surrounding the first waterproof rings, the first waterproof rings and the second waterproof rings are staggered with each other, and the first waterproof rings are in the shape of contracting 1cm towards the direction of the lamp beads, wherein the shape of the second waterproof rings is the shape of the first waterproof rings.