CN112913498B

CN112913498B - Plant lamp module

Info

Publication number: CN112913498B
Application number: CN202110128168.0A
Authority: CN
Inventors: 郝建广; 牛威; 冯帅杰; 谭渭东; 叶永康
Original assignee: Dongguan Haoshun Precision Technology Co ltd
Current assignee: Dongguan Haoshun Precision Technology Co ltd
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2022-12-27
Anticipated expiration: 2041-01-29
Also published as: CN112913498A

Abstract

The invention relates to a plant lamp module which comprises a PCB and a plurality of illuminating lamps arranged on one surface of the PCB in an array mode, wherein each illuminating lamp comprises a lamp bead located in the center and a diffusion lens covering the lamp beads, each diffusion lens is bonded to the PCB through an adhesive, the adhesive forms an annular waterproof layer to seal each illuminating lamp, and after the waterproof layer is formed, the PCB is filled and sealed through the pouring adhesive to form a pouring layer. The diffusion lens is bonded through the adhesive firstly, the adhesive forms an annular waterproof layer, a waterproof ring is not required to be additionally arranged, the process and the cost are saved, the diffusion lens is bonded through the adhesive in advance, so that the pouring sealant is blocked by the waterproof layer formed by the adhesive, and the light emitting and heat dissipating effects of the LED lamp cannot be influenced by the inside of the diffusion lens.

Description

Plant lamp module

Technical Field

The invention relates to the technical field of plant lamps, in particular to a plant lamp module.

Background

Current plant lamp module adopts a plurality of LED lamps of integration on the PCB board to throw light on usually, in order to provide the required light source of growth for the plant, and the required water source of vegetation is provided by spray set usually, often can splash to the plant lamp module during the water source that spray set sprayed, for this reason, the plant lamp module needs to have higher waterproof performance, current scheme is that adopt the casting glue to get up in order to play water-proof effects with each device embedment on the PCB board, the LED lamp on the plant module comprises lamp pearl and diffusion lens usually, probably flow into inside the LED lamp in the gap of diffusion lens and PCB board during the casting glue embedment, influence the luminous and the heat dispersion of LED lamp.

Disclosure of Invention

The invention aims to provide a plant lamp module to prevent pouring sealant from flowing into an LED lamp during pouring and sealing.

For this reason, provide a plant lamp module group, including PCB board and a plurality of light of array arrangement in PCB board one side, the light all includes the diffusion lens that is located the lamp pearl at center and cage cover lamp pearl, and each diffusion lens all bonds on the PCB board through the adhesive, the adhesive forms annular waterproof layer in order to seal each light, and behind the waterproof layer shaping, use the casting glue to carry out the embedment to the PCB board in order to form the potting layer.

Further, the lighting lamp is specifically an LED lamp.

Furthermore, an electric connector is integrated on the PCB and is electrically connected with each device on the PCB through wiring on the PCB.

Furthermore, a temperature and humidity sensor is integrated on the PCB.

Further, an illumination sensor is integrated on the PCB board.

Further, the waterproof layer is bonded to the outer peripheral surface of the diffusion lens.

Further, the outer peripheral surface of the waterproof layer is arc-shaped.

Further, the surface of the PCB is coated with water-logging ink to improve the light reflection rate.

Further, have on the PCB board with the unanimous first waterproof ring of light quantity, first waterproof ring encircles each lamp pearl respectively, and the one side of each diffusion lens orientation PCB board has the waterproof ring of second of encircleing first waterproof ring, first waterproof ring with the waterproof ring of second is crisscross each other.

Furthermore, the shape of the first waterproof ring is the shape of the second waterproof ring which contracts 1cm towards the direction of the lamp bead.

Has the advantages that:

the diffusion lens is bonded through the adhesive, the adhesive forms an annular waterproof layer, a waterproof ring is not required to be additionally arranged, the process and the cost are saved, and the diffusion lens is bonded through the adhesive in advance, so that the pouring sealant is blocked by the waterproof layer formed by the adhesive, and the light emitting and heat dissipating effects of the LED lamp cannot be influenced by the inside of the diffusion lens.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the drawings. In the drawings:

FIG. 1 is a schematic diagram showing a right-view structure of a plant lamp module according to the present invention;

fig. 2 is a schematic front view of the plant lamp module of the present invention;

FIG. 3 is a schematic view showing an installation structure of the LED lamp of the present invention;

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

See fig. 1, the plant lamp module of this embodiment includes aluminum alloy support 1, and fixes aluminium base PCB 2 at aluminum alloy support 1 lower surface, and the lower surface of PCB 2 is smeared with the white ponding printing ink of one deck high reflection to improve the reflection of light effect of PCB 2 lower surface, in order to improve the light intensity of installing at the LED lamp 3 of PCB 2 lower surface, see fig. 2, LED lamp 2 array is arranged at the PCB lower surface, see fig. 3, LED lamp 3 includes that tin welds the LED lamp pearl 31 of the full gloss register of PCB 2 lower surface and covers the reflective 120 degree diffusion lens 32 of lamp pearl 31, and diffusion lens 32 all has 3 location base 321, and location base 321 cooperates with location through-hole or location depression on PCB 2, fixes a position diffusion lens 32 for lamp pearl 31 is located diffusion lens 32's center, makes diffusion lens 32 best to the diffusion effect of lamp pearl 31 light.

According to the technical scheme, the diffusion lens 32 is bonded on the PCB 2 through 3220W epoxy resin sealant, so that the diffusion lens 32 is fixed, a circle of epoxy resin waterproof layer 33 is formed on the periphery of the lens of the diffusion lens 32, the problem that the light scattering effect of the diffusion lens 32 is affected when subsequent pouring sealant flows into the diffusion lens 32 during pouring is avoided, and according to the technical scheme, in the technical scheme, a temperature and humidity sensor 4, a photoresistor 5 and a sunken connector 6 are further installed on the PCB 2, each lamp bead 31, the temperature and humidity sensor 4, the photoresistor 5 and the sunken connector 6 are electrically connected through wiring on the PCB 2, when the plant lamp module is used, the plant lamp module is connected with an external control terminal through the sunken connector 6, power is supplied to all devices on the PCB 2 through the external terminal, the temperature and humidity sensor 4 transmits detected temperature and humidity to the external control terminal, when the external control terminal detects that the temperature is too low, a heating device is turned on, when the humidity is detected to be too low, the humidification device is turned on, so that the temperature and humidity and the temperature and humidity of the plant are controlled to be maintained in a range suitable for growing of a plant are avoided, and the LUX terminal is wasted when the temperature and humidity of the lamp bead is detected.

After each device integrated on the PCB 2 is installed, the plant lamp module is encapsulated by HS-W808 pouring glue, so that a pouring layer 7 is formed on the surface of the PCB 2, the waterproof effect reaches IP6 level, because the diffusion lens 32 is adhered by epoxy resin sealant in advance, the pouring glue is blocked by the waterproof layer 33 formed by epoxy resin, the pouring glue cannot enter the diffusion lens 32 to influence the luminous effect of the LED lamp 3, and because the waterproof layer 33 is arranged on the periphery of the diffusion lens 32, the waterproof layer 33 is extruded towards the direction of the diffusion lens 32 by the pouring glue during pouring and sealing, not only does the diffusion lens 32 play a role of supporting the waterproof layer to avoid degumming of the waterproof layer 33, but also the waterproof layer 33 is extruded towards the diffusion lens 32 to play a better supporting effect, further, the periphery of the waterproof layer 32 is set to be arc-shaped, the waterproof layer 33 is extruded perpendicular to the surface when the pouring glue is extruded, at this moment, the PCB 2 and the diffusion lens 32 can play a role of supporting the waterproof layer 33, the waterproof layer 33 is not only caused by extrusion of the waterproof layer during pouring and sealing glue extrusion, but also the PCB 2 and the diffusion lens 32 and the waterproof layer are adhered more firmly.

Referring to fig. 3, the lower surface of the PCB 2 is provided with first waterproof rings 8 with the same number as the LED lamps 3, each first waterproof ring 8 corresponds to one lamp bead 31, the first waterproof rings 8 are arranged around the lamp beads 31, the upper surface of the diffusion lens 32 is provided with second waterproof rings 322 which are staggered with the first waterproof rings 8, the height of each second waterproof ring 322 is lower than the height of the corresponding positioning column base 321, the shape of each first waterproof ring 8 is consistent with that of each second waterproof ring 322, and the size of each first waterproof ring 8 is slightly smaller than that of each second waterproof ring 322, specifically, the first waterproof rings 8 can be in a shape and size that the second waterproof rings 322 retract 1cm in the direction of the corresponding lamp bead 31, the first waterproof rings 8 and the second waterproof rings 322 are matched to prevent excessive epoxy resin from permeating into the LED lamps 3 in the process of using the epoxy resin to glue the diffusion lens 32, and play a role in auxiliary positioning in the process of the diffusion lens 32 in the early stage, and the diffusion lens 32 roughly determines the position through the first waterproof rings 8 and then completes the accurate positioning through the positioning column bases 321.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The utility model provides a vegetation lamp module group which characterized in that: the LED lamp comprises a PCB and a plurality of illuminating lamps arranged on one surface of the PCB in an array mode, wherein each illuminating lamp comprises a lamp bead positioned in the center and a diffusion lens covering the lamp beads, each diffusion lens is bonded on the PCB through an adhesive, the adhesive forms an annular waterproof layer to seal each illuminating lamp, and the waterproof layer is bonded on the outer peripheral surface of each diffusion lens; after the waterproof layer is formed, the outer peripheral surface of the waterproof layer is arc-shaped, the PCB is encapsulated by using an encapsulation adhesive to form an encapsulation layer, and the waterproof layer is extruded perpendicular to the arc-shaped surface when the encapsulation adhesive is extruded;

the adhesive is specifically an epoxy resin adhesive;

the PCB board is provided with first waterproof rings consistent with the number of the illuminating lamps, the first waterproof rings surround the lamp beads respectively, one surface of each diffusion lens facing the PCB board is provided with second waterproof rings surrounding the first waterproof rings, the first waterproof rings and the second waterproof rings are staggered with each other, and the first waterproof rings are in the shape of contracting 1cm towards the direction of the lamp beads, wherein the shape of the second waterproof rings is the shape of the first waterproof rings.

2. The vegetation lamp module of claim 1, characterized in that: the lighting lamp is specifically an LED lamp.

3. The vegetation lamp module of claim 1, characterized in that: the PCB is also integrated with an electric connector, and the electric connector is electrically connected with each device on the PCB through wiring on the PCB.

4. The vegetation lamp module of claim 3, characterized in that: and a temperature and humidity sensor is integrated on the PCB.

5. The vegetation lamp module of claim 3, wherein: and an illumination sensor is integrated on the PCB.

6. The vegetation lamp module of claim 1, characterized in that: the surface of the PCB is coated with water-accumulated ink to improve the light reflection rate.