CN214409387U - Optical coupling module and optical communication device - Google Patents
Optical coupling module and optical communication device Download PDFInfo
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- CN214409387U CN214409387U CN202120649294.6U CN202120649294U CN214409387U CN 214409387 U CN214409387 U CN 214409387U CN 202120649294 U CN202120649294 U CN 202120649294U CN 214409387 U CN214409387 U CN 214409387U
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Abstract
The utility model relates to the technical field of optical communication equipment, and provides an optical coupling component and an optical communication device, wherein the optical coupling component comprises a base body with a mounting surface and a bearing body with a bearing surface, and a photoelectric conversion chip having an optical port, the mounting surface of the base body being provided with an optical fiber fixing base having an extended port through which the optical fiber extends in a direction of the photoelectric conversion chip, the carrier being provided on the mounting surface of the base body and the carrying surface of the carrier being arranged perpendicular to the mounting surface of the base body, the photoelectric conversion chip being provided on the carrying surface of the carrier and the optical port of the photoelectric conversion chip being arranged opposite to the extended port of the optical fiber fixing base, the optical coupling assembly being free from an additional lens, and the optical coupling between the optical fiber and the photoelectric conversion chip is realized by adopting a passive alignment mode, the optical coupling process is simple, the production cost of the optical communication device is effectively reduced, and the volume of the optical communication device is reduced.
Description
Technical Field
The utility model relates to an optical communication equipment technical field especially provides an optical coupling subassembly and optical communication device.
Background
With the rapid development of optical communication technology and application, the requirements for data transmission rate and transmission capacity of various optical communication devices are higher and higher.
At present, an optical module based on a Vertical Cavity Surface Emitting Laser (VCSEL) and a photoelectric detection diode (PIN) is widely applied to short-distance interconnection optical communication due to the advantages of low cost and high integration. The coupling technology is mainly to realize coupling by turning the optical path between the optical fiber and the photoelectric conversion chip by 90 degrees through the lens, but the manufacturing cost of the lens is high, the coupling mode between the lens and the photoelectric conversion chip is generally active coupling, the coupling alignment process is complicated, the production cost of the optical communication device is greatly increased, and in addition, the lens can occupy a large amount of the internal installation space of the optical communication device, and the volume of the optical communication device is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical coupling subassembly and optical communication device aims at solving current optical communication device's the high and bulky technical problem of manufacturing cost.
In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions: the utility model provides an optical coupling subassembly, is including the base member that has the installation face, has the supporting body of loading face to and have the photoelectric conversion chip of optical port, the base member be equipped with the optic fibre fixing base on the installation face, the optic fibre fixing base has the confession optic fibre court the port that stretches out that the direction of photoelectric conversion chip stretches out, the supporting body is located the base member just on the installation face the loading face with the supporting body the installation face mutually perpendicular sets up, the photoelectric conversion chip is located the supporting body just on the loading face the optical port with the optic fibre fixing base stretch out the port and set up relatively.
The utility model provides an optical coupling subassembly has following beneficial effect at least: after the photoelectric conversion chip is arranged on the bearing surface of the bearing body, the bearing body is arranged on the mounting surface of the base body, the bearing surface is perpendicular to the mounting surface, the optical microscope is adopted to observe the optical port of the photoelectric conversion chip and the extension port of the optical fiber fixing seat, the bearing body is moved until the optical port is aligned with the extension port, the optical fiber is fixed on the optical fiber fixing seat, one end of the optical fiber extends towards the direction of the photoelectric conversion chip through the extension port, thus, the optical coupling between the optical fiber and the photoelectric conversion chip can be realized without adopting a lens to perform 90-degree turning on the optical path between the optical fiber and the photoelectric conversion chip, the production cost of the optical communication device is effectively reduced, the volume of the optical communication device is reduced, and the optical coupling between the optical fiber and the photoelectric conversion chip is realized by adopting a passive alignment mode, the optical coupling process is simple, and the production cost of the optical communication device can be further reduced.
In one embodiment, the mounting surface of the base body is provided with a movable groove for accommodating the carrier, an extending direction of the movable groove is perpendicular to a direction of the optical port of the photoelectric conversion chip, and when the carrier is placed in the movable groove, the optical port of the photoelectric conversion chip and the protruding port of the optical fiber fixing seat are on the same horizontal plane.
In one embodiment, a first heat conduction layer is arranged between the carrier and the groove surface of the movable groove.
In one embodiment, the optical fiber fixing seat includes a seat body disposed on the mounting surface of the base body, and the seat body is provided with a fixing groove having the protruding port and configured to accommodate the optical fiber.
In one embodiment, the cross section of the fixing groove is in a V-shaped structure.
In one embodiment, the optical fiber fixing base further includes a cover body, and the cover body is disposed on the base body to fix the optical fiber in the fixing groove.
In one embodiment, the carrier is a ceramic carrier, a silicon carrier, or an aluminum nitride carrier.
In one embodiment, the substrate is a silicon substrate, a ceramic substrate or an aluminum nitride substrate.
In order to achieve the above object, the utility model also provides an optical communication device, including circuit board, optic fibre, integrated in signal control chip on the circuit board to and above-mentioned optical coupling subassembly, the circuit board is located the base member on the installation face, optic fibre is fixed to be located on the optic fibre fixing base of optical coupling subassembly's base member just the one end warp of optic fibre the port court that stretches out of optic fibre fixing base the direction of the photoelectric conversion chip of optical coupling subassembly is stretched out, signal control chip with photoelectric conversion chip electric connection.
Since the optical communication device employs all embodiments of the optical coupling component, at least all beneficial effects of the embodiments are achieved, and no further description is given here.
In one embodiment, a carrier of the optical coupling assembly is provided with a first bonding pad and a second bonding pad which are electrically connected with each other, the photoelectric conversion chip is electrically connected with the first bonding pad, and the signal control chip is electrically connected with the second bonding pad.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical communication device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an optical coupling assembly in the optical communication device shown in FIG. 1;
FIG. 3 is a left side view of the optical coupling assembly of FIG. 2;
FIG. 4 is a cross-sectional view taken along line A-A of the optical coupling assembly of FIG. 3;
FIG. 5 is a schematic structural diagram of a photoelectric conversion chip in the optical coupling assembly shown in FIG. 2;
fig. 6 is a schematic structural diagram of a usage state of an optical coupling assembly according to an embodiment of the present invention;
fig. 7 is an enlarged schematic view of a portion a of fig. 6.
Wherein, in the figures, the respective reference numerals:
100. the optical communication device comprises an optical communication device 110, an optical coupling component 111, a substrate 1111, a mounting surface 1112, a movable groove 112, a carrier, 1121, a bearing surface 1122, a first pad, 1123, a second pad, 113, a photoelectric conversion chip 1131, an optical port 114, an optical fiber fixing seat 1141, a seat body 1142, a cover body 1143, a fixing groove 1144, an extending port 120, a circuit board 130, an optical fiber 140 and a signal control chip.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 2 and fig. 5 to 7, an optical coupling assembly 110 includes a base 111 having a mounting surface 1111, a carrier 112 having a mounting surface 1121, and a photoelectric conversion chip 113 having a light port 1131, wherein the mounting surface 1111 of the base 111 is provided with an optical fiber fixing base 114, the optical fiber fixing base 114 has a protruding port 1144 through which the optical fiber 130 protrudes toward the photoelectric conversion chip 113, the carrier 112 is disposed on the mounting surface 1111 of the base 111, the mounting surface 1121 of the carrier 112 is perpendicular to the mounting surface 1111 of the base 111, the photoelectric conversion chip 113 is disposed on the mounting surface 1121 of the carrier 112, and the light port 1131 of the photoelectric conversion chip 113 is disposed opposite to the protruding port 1144 of the optical fiber fixing base 114, i.e., a center line of the light port 1131 of the photoelectric conversion chip 113 and a center line of the protruding port 1144 of the optical fiber fixing base 114 are on the same straight line.
Referring to fig. 6 and 7, after the photoelectric conversion chip 113 is disposed on the supporting surface 1121 of the carrier 112, the carrier 112 is disposed on the mounting surface 1111 of the base 111, the supporting surface 1121 is perpendicular to the mounting surface 1111, the optical port 1131 of the photoelectric conversion chip 113 and the protruding port 1144 of the optical fiber fixing seat 114 are observed by using an optical microscope, the carrier 112 is moved until the optical port 1131 is aligned with the protruding port 1144, the optical fiber 130 is fixed on the optical fiber fixing seat 114, and one end of the optical fiber 130 protrudes toward the photoelectric conversion chip 113 through the protruding port 1144, so that the optical coupling between the optical fiber 130 and the photoelectric conversion chip 113 can be realized without turning the optical path between the optical fiber 130 and the photoelectric conversion chip 113 by 90 degrees by using a lens, the production cost of the optical communication device is effectively reduced, the volume of the optical communication device is reduced, and the optical coupling between the optical fiber 130 and the photoelectric conversion chip 113 is realized by using a passive alignment method, the optical coupling process is simple, and the production cost of the optical communication device can be further reduced.
In this embodiment, as shown in fig. 2, a movable groove 1112 for accommodating the carrier 112 is formed on the mounting surface 1111 of the base 111, an extending direction of the movable groove 1112 is perpendicular to an orientation of the optical port 1131 of the photoelectric conversion chip 113, and when the carrier 112 is disposed in the movable groove 1112, the optical port 1131 of the photoelectric conversion chip 113 and the protruding port 1144 of the optical fiber fixing base 114 are located on the same horizontal plane. Specifically, referring to fig. 2, the optical port 1131 of the photoelectric conversion chip 113 is oriented in the X-axis direction shown in fig. 2, and the extending direction of the movable groove 1112 is the Y-axis direction shown in fig. 2, when the photoelectric conversion chip 113 and the optical fiber 130 are optically coupled, the relative position between the optical port 1131 and the protruding port 1144 is observed through an optical microscope, and the carrier 112 is moved along the movable groove 1112 until the optical port 1131 is aligned with the protruding port 1144, so that the carrier 112 only needs to be moved along the extending direction of the movable groove 1112, the optical coupling operation procedure between the photoelectric conversion chip 113 and the optical fiber 130 is effectively simplified, and the production cost of the optical communication device 100 can be further reduced.
Specifically, a first heat conduction layer (not shown) is disposed between the supporting body 112 and the groove surface of the movable groove 1112, wherein the first heat conduction layer may be a heat conduction silica gel layer, and heat generated by the photoelectric conversion chip 113 during operation is transferred to the supporting body 112 and then quickly transferred to the base 111 through the first heat conduction layer, so as to realize quick heat dissipation of the photoelectric conversion chip 113 and effectively improve the heat dissipation performance of the optical communication device 100.
In this embodiment, please refer to fig. 3 and 4, the optical fiber fixing seat 114 includes a seat body 1141 disposed on the mounting surface 1111 of the base 111, and the seat body 1141 is provided with a fixing groove 1143 having an extending port 1144 and configured to accommodate the optical fiber 130.
When the optical coupling assembly 110 is applied to a multi-path parallel optical communication device, the base 1141 is provided with a plurality of fixing grooves 1143 parallel to each other, each fixing groove 1143 is used for accommodating and fixing one optical fiber 140, correspondingly, the photoelectric conversion chip 113 has a plurality of optical ports 1131, and each optical port 1131 and each fixing groove 1143 are arranged in a one-to-one correspondence manner.
Specifically, as shown in fig. 4, the cross section of the fixing groove 1143 has a V-shaped structure. The position of the optical fiber 130 can be effectively limited by the fixing groove 1143 with the V-shaped structure, when the optical fiber 130 is placed in the fixing groove 1143, the axis of the optical fiber 130 coincides with the center of the top of the fixing groove 1143, and when the photoelectric conversion chip 113 and the optical fiber 130 are optically coupled, the center of the optical port 1131 is also in the same straight line with the center of the top of the fixing groove 1143, so that the optical fiber 130 and the photoelectric conversion chip 113 are coupled in an aligned manner, the coupling precision between the optical fiber 130 and the photoelectric conversion chip 113 is effectively improved, and the optical coupling efficiency is improved.
Specifically, as shown in fig. 2, the optical fiber fixing base 114 further includes a cover 1142, and the cover 1142 is disposed on the base 1141 to fix the optical fiber 130 in the fixing groove 1143. The cover 1142 and the base 1141 may be fixedly connected by bonding, for example, UV glue is used to bond the cover 1142 and the base 1141; alternatively, the cover 1142 and the base 1141 may be fixedly connected by fastening means, such as screws, bolts, or other fastening means to fixedly connect the cover 1142 and the base 1141.
In the present embodiment, in order to improve the thermal conductivity of the carrier 112, increase the heat dissipation speed of the photoelectric conversion chip 113, and improve the heat dissipation performance of the optical communication device 100, the carrier 112 is a ceramic carrier, a silicon carrier, or an aluminum nitride carrier.
In the present embodiment, in order to improve the thermal conductivity of the substrate 111 and improve the heat dissipation performance of the optical communication device 100, the substrate 111 is a silicon substrate, a ceramic substrate, or an aluminum nitride substrate.
Referring to fig. 1, an optical communication device 100 includes a circuit board 120, an optical fiber 130, a signal control chip 140 integrated on the circuit board 120, and the optical coupling assembly 110, where the circuit board 120 is disposed on a mounting surface 1111 of a substrate 111, the optical fiber 130 is fixedly disposed on an optical fiber fixing seat 114 of the substrate 111 of the optical coupling assembly 110, one end of the optical fiber 130 extends out toward a photoelectric conversion chip 113 of the optical coupling assembly 110 through an extending port 1144 of the optical fiber fixing seat 114, and the signal control chip 140 is electrically connected to the photoelectric conversion chip 113.
Since the optical communication device 100 employs all embodiments of the optical coupling assembly 110, at least all advantages of the embodiments are provided, and no further description is given here.
In this embodiment, referring to fig. 2, a first pad 1122 and a second pad 1123 electrically connected to each other are disposed on the carrier 112, wherein the first pad 1122 is disposed on the supporting surface 1121 of the carrier 112, the second pad 1123 is disposed on a surface of the carrier 112 adjacent to the supporting surface 1121 or a surface opposite to the supporting surface 1121, the photoelectric conversion chip 113 is electrically connected to the first pad 1122 through a bonding process, and the signal control chip 140 is electrically connected to the second pad 1123 through the bonding process, so that the signal control chip 140 is electrically connected to the photoelectric conversion chip 113.
It should be noted that, when the photoelectric conversion chip 113 is a light emitting device, such as a vertical cavity surface emitting laser array bare chip, the signal control chip 140 is a driving bare chip; when the photoelectric conversion chip 113 is a light receiving device, such as a PIN photodetector array bare chip, the signal control chip 140 is an amplifier bare chip. The optical communication device 100 may only have an optical signal output function, for example, the vertical cavity surface emitting laser array bare chip and the driving bare chip are electrically connected to form an optical signal output channel; alternatively, the optical communication device 100 may only have an optical signal input function, for example, the PIN photodetector array bare chip and the amplifier bare chip are electrically connected to form an optical signal input channel; alternatively, the optical communication device 100 has both optical signal input and output functions, for example, the vertical cavity surface emitting laser array bare chip and the driving bare chip are electrically connected to form an optical signal output channel, and the PIN photodetector array bare chip and the amplifier bare chip are electrically connected to form an optical signal input channel.
In this embodiment, one end of the optical fiber 130 close to the photoelectric conversion chip 113 is in a spherical structure or a conical structure, so that the light beam is refracted by the end surface of the optical fiber 130 and then enters the inside of the optical fiber 130 for total reflection transmission, or the light beam is refracted by the end surface of the optical fiber 130 and then effectively enters the inside of the photoelectric conversion chip 113 through the optical port 1131 of the photoelectric conversion chip 113, thereby effectively improving the coupling efficiency between the optical fiber 130 and the photoelectric conversion chip 113.
In this embodiment, in order to further improve the heat dissipation performance of the optical communication device 100, a second heat conduction layer (not shown) is disposed between the circuit board 120 and the substrate 111 of the optical coupling assembly 110, wherein the second heat conduction layer may be a heat conduction silica gel layer.
The optical coupling method of the optical coupling assembly 110 includes the following steps:
s100, disposing the photoelectric conversion chip 113 on the supporting surface 1121 of the carrier 112;
s200, placing the carrier 112 on the mounting surface 1111 of the base 111 and making the bearing surface 1121 and the mounting surface 1111 perpendicular to each other;
s300, observing the light port 1131 of the photoelectric conversion chip 113 and the extending port 1144 of the optical fiber fixing seat 114 by using an optical microscope, and moving the carrier 112 until the light port 1131 is aligned with the extending port 1144;
s400, the carrier 112 is fixed on the mounting surface 1111 of the base 111.
Since the optical coupling method adopts all embodiments of the optical coupling assembly 110, at least all the advantages of the embodiments are achieved, and no further description is given here.
In step S100, the first pad 1122 is disposed on the supporting surface 1121 of the carrier 112, and the photoelectric conversion chip 113 is connected and fixed to the first pad 1122 through a bonding process.
In step S400, when the mounting surface 1111 of the base 111 is provided with the movable groove 1112, the carrier 112 is disposed in the movable groove 1112, and the carrier 112 can be fixedly connected to the groove surface of the movable groove 1112 by an adhesive method, a welding method, or an ultrasonic welding method.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An optical coupling assembly, characterized by: the optical coupling subassembly is including the base member that has the installation face, has the supporting body of loading face to and have the photoelectric conversion chip of light port, the base member be equipped with the optic fibre fixing base on the installation face, the optic fibre fixing base has the confession optic fibre towards the port that stretches out that the direction of photoelectric conversion chip stretches out, the supporting body is located the base member just on the installation face the supporting body with the installation face mutually perpendicular sets up of supporting body, the photoelectric conversion chip is located the supporting body just on the loading face the light port of photoelectric conversion chip with the optic fibre fixing base stretch out the port and set up relatively.
2. The light coupling assembly of claim 1, wherein: the mounting surface of the base body is provided with a movable groove for containing the bearing body, the extending direction of the movable groove is perpendicular to the direction of the optical port of the photoelectric conversion chip, and when the bearing body is arranged in the movable groove, the optical port of the photoelectric conversion chip and the extending port of the optical fiber fixing seat are positioned on the same horizontal plane.
3. The light coupling assembly of claim 2, wherein: a first heat conduction layer is arranged between the bearing body and the groove surface of the movable groove.
4. The light coupling assembly of claim 1, wherein: the optical fiber fixing seat comprises a seat body arranged on the mounting surface of the base body, and a fixing groove which is provided with the extending port and is used for accommodating the optical fiber is formed in the seat body.
5. The light coupling assembly of claim 4, wherein: the cross section of the fixing groove is of a V-shaped structure.
6. The light coupling assembly of claim 4, wherein: the optical fiber fixing seat further comprises a cover body, and the cover body is covered on the seat body to fix the optical fiber in the fixing groove.
7. The light coupling assembly of any one of claims 1-6, wherein: the bearing body is a ceramic bearing body, a silicon bearing body or an aluminum nitride bearing body.
8. The light coupling assembly of any one of claims 1-6, wherein: the substrate is a silicon substrate, a ceramic substrate or an aluminum nitride substrate.
9. An optical communication apparatus, characterized in that: the optical coupling assembly comprises a circuit board, an optical fiber, a signal control chip integrated on the circuit board and the optical coupling assembly according to any one of claims 1 to 8, wherein the circuit board is arranged on the mounting surface of the substrate, the optical fiber is fixedly arranged on an optical fiber fixing seat of the substrate of the optical coupling assembly, one end of the optical fiber extends out towards the direction of a photoelectric conversion chip of the optical coupling assembly through an extending port of the optical fiber fixing seat, and the signal control chip is electrically connected with the photoelectric conversion chip.
10. The optical communication apparatus according to claim 9, wherein: the optical coupling assembly is characterized in that a first bonding pad and a second bonding pad which are electrically connected with each other are arranged on a supporting body of the optical coupling assembly, the photoelectric conversion chip is electrically connected with the first bonding pad, and the signal control chip is electrically connected with the second bonding pad.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120649294.6U CN214409387U (en) | 2021-03-30 | 2021-03-30 | Optical coupling module and optical communication device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120649294.6U CN214409387U (en) | 2021-03-30 | 2021-03-30 | Optical coupling module and optical communication device |
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| CN214409387U true CN214409387U (en) | 2021-10-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112987202A (en) * | 2021-03-30 | 2021-06-18 | 普联技术有限公司 | Optical coupling module, optical communication device and optical coupling method |
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- 2021-03-30 CN CN202120649294.6U patent/CN214409387U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112987202A (en) * | 2021-03-30 | 2021-06-18 | 普联技术有限公司 | Optical coupling module, optical communication device and optical coupling method |
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