CN214381562U - High-strength PCB substrate - Google Patents
High-strength PCB substrate Download PDFInfo
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- CN214381562U CN214381562U CN202120336520.5U CN202120336520U CN214381562U CN 214381562 U CN214381562 U CN 214381562U CN 202120336520 U CN202120336520 U CN 202120336520U CN 214381562 U CN214381562 U CN 214381562U
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Abstract
The utility model discloses a high-strength PCB substrate, which comprises a fixed frame, a stable supporting mechanism and a heat conducting mechanism; fixing the frame: the inner wall surface of the insulating frame is provided with an insulating frame, a bottom plate is arranged inside the insulating frame, the upper surface of the bottom plate is provided with a supporting plate, the upper surface of the supporting plate is bonded with an insulating plate through glue solution, the upper surface of the insulating plate is provided with a grid plate, and the outer side surfaces of the supporting plate, the insulating plate and the grid plate are fixedly connected with the inner wall surface of the insulating frame; firm supporting mechanism: the upper end face of the stable supporting mechanism is provided with a glass fiber plate; the heat conduction mechanism: the heat conducting mechanism is arranged on the upper surface of the glass fiber board, and the upper surface of the heat conducting mechanism is provided with a copper foil layer; wherein: still include mounting hole and spacing groove, the mounting hole sets up respectively in the upper surface four corners of fixed frame, and this high strength PCB base plate can guarantee the installation accuracy of device, reduces the damage of impact force to the device, can guarantee the production quality of device.
Description
Technical Field
The utility model relates to a PCB base plate processing technology field specifically is a high strength PCB base plate.
Background
The PCB is named as printed circuit board, also called as printed circuit board, is an important electronic component, is a support of the electronic component, is a carrier for electrical connection of the electronic component, is manufactured by electronic printing technology, so it is called as printed circuit board, the substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, the single-sided and double-sided printed circuit boards are manufactured on the substrate material copper clad laminate, the processing such as hole processing, chemical copper plating, copper electroplating, etching and the like is selectively carried out to obtain the required circuit pattern, the circuit pattern has the functions of electric conduction, insulation and support, the performance, quality, processability in manufacturing, manufacturing cost, manufacturing level and the like of the printed circuit board, and the existing substrate is greatly dependent on the substrate material, the inner core thin copper clad laminate is used as a base, the conductive pattern layer and a prepreg are alternately laminated together at one time, the interconnection between the conductive pattern layers with more than 3 layers is formed, so that the defects of incapability of ensuring the installation precision of the device, incapability of dispersing impact force, serious damage of the impact force to the device, incapability of ensuring the production quality of the device, poor insulation and heat absorption effects and poor safety of the device exist, and the high-strength PCB substrate is provided.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a high strength PCB base plate, can guarantee the installation accuracy of device, multiple supporting mechanism can disperse the impact force, reduces the damage of impact force to the device, can guarantee the production quality of device, and is insulating effectual with the heat absorption, improves the security of device, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-strength PCB substrate comprises a fixing frame, a stable supporting mechanism and a heat conducting mechanism;
fixing the frame: the inner wall surface of the insulating frame is provided with an insulating frame, a bottom plate is arranged inside the insulating frame, the upper surface of the bottom plate is provided with a supporting plate, the upper surface of the supporting plate is bonded with an insulating plate through glue solution, the upper surface of the insulating plate is provided with a grid plate, and the outer side surfaces of the supporting plate, the insulating plate and the grid plate are fixedly connected with the inner wall surface of the insulating frame;
firm supporting mechanism: the upper end face of the stable supporting mechanism is provided with a glass fiber plate;
the heat conduction mechanism: the heat conducting mechanism is arranged on the upper surface of the glass fiber board, and the upper surface of the heat conducting mechanism is provided with a copper foil layer;
wherein: still include mounting hole and spacing groove, the mounting hole sets up respectively in the upper surface four corners of fixed frame, and the spacing groove symmetry respectively sets up in the left and right sides face of fixed frame, and the device installation of being convenient for is fixed, can guarantee the installation accuracy of device, and multiple supporting mechanism can disperse the impact force, reduces the impact force to the damage of device, can guarantee the production quality of device, and is insulating and effectual with the heat absorption, improves the security of device.
Further, firm supporting mechanism includes recess board, prism, clamp plate and prismatic groove, the recess board sets up in the up end of waffle slab, and the inside bottom surface of recess board is equipped with evenly distributed's prism, and the inside grafting of recess board has the clamp plate, and the bottom surface of clamp plate is equipped with evenly distributed's prismatic groove, and the prism is pegged graft with vertical prismatic groove that corresponds, and the up end of clamp plate is equipped with glass fiber board, and multiple supporting mechanism can be with the impact force dispersion, reduces the damage of impact force to the device, can guarantee the production quality of device.
Further, heat conduction mechanism includes heat insulating board, heat conduction insulation board, heat-sink shell and rectangle mouth, the heat insulating board sets up in the up end of glass fiber board, and the middle part of heat insulating board is equipped with evenly distributed's rectangle mouth, and the up end of heat insulating board is equipped with the heat-sink shell, and the up end of heat-sink shell is equipped with the heat conduction insulation board, and the up end of heat conduction insulation board is equipped with the copper foil layer, can guarantee the security of device use, improves the life of device, and is insulating and heat absorption effectual, improves the security of device.
Furthermore, the insulating frame is a bakelite frame, the insulating plate is a bakelite plate, and the heat absorbing layer is a PCM phase change heat absorbing plate, so that the insulating and heat absorbing effects are good, and the safety of the device is improved.
Furthermore, the pressing plate is matched with the groove of the groove plate, so that the strength of the device can be improved.
Compared with the prior art, the beneficial effects of the utility model are that: this high strength PCB base plate has following benefit:
1. the fixing frame is held by hands, the limiting groove slides down along the limiting column arranged at the external installation part, the fixing frame is placed at the external installation part and passes through the installation hole by an external bolt to be fixed at the external installation part, the device is convenient to install and fix, the limiting effect of the device is good, and the installation precision of the device can be ensured.
2. Can produce the impact to fixed frame when the device falls to the ground, the impact transmits for the insulating frame, and then transmits for bottom plate, backup pad, insulation board and grating, weakens the impact, and when recess board and clamp plate atress, prismatic and prismatic groove can be transmitted to power, can the secondary weaken the impact force, and multiple supporting mechanism can disperse the impact force, reduces the damage of impact force to the device, can guarantee the production quality of device.
3. When copper foil layer and circuit connection operation during operation, can produce the heat, the heat absorption that the heat conduction insulation board produced copper foil layer during operation absorbs and transmits for the heat-sink shell, thereby turn into the internal energy of heat conduction insulation board and heat-sink shell with the heat, the rectangle mouth can make the glass fiber board for the minority heat of heat-sink shell, heat insulating board and glass fiber board can reduce the heat transfer, avoid the intensity that the below structure is heated and is influenced the device, avoid copper foil layer high temperature to influence normal use, can guarantee the security of device use, the life of the device is prolonged, insulating frame and insulation board can completely cut off power transmission, the security of the device is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the internal sectional structure of the stable supporting mechanism of the present invention.
In the figure: the heat-insulating plate comprises a fixing frame 1, an insulating frame 2, a bottom plate 3, a supporting plate 4, an insulating plate 5, a grid plate 6, a stabilizing and supporting mechanism 7, a groove plate 71, a prism 72, a pressing plate 73, a prismatic groove 74, a glass fiber plate 8, a heat-conducting mechanism 9, a heat-insulating plate 91, a heat-conducting insulating plate 92, a heat-absorbing layer 93, a rectangular opening 94, a copper foil layer 10, mounting holes 11 and limiting grooves 12.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a high-strength PCB substrate comprises a fixed frame 1, a stable supporting mechanism 7 and a heat conducting mechanism 9;
fixing frame 1: the inner wall surface of the device is provided with an insulating frame 2, a fixing frame 1 provides a stable support and an installation place, the insulating frame 2 improves the safety of the device, a bottom plate 3 is arranged inside the insulating frame 2, the bottom plate 3 provides the stable support and the installation place, a supporting plate 4 is arranged on the upper surface of the bottom plate 3, the supporting plate 4 provides the stable support, an insulating plate 5 is bonded on the upper surface of the supporting plate 4 through glue solution, the insulating plate 5 improves the safety of the device, a grid plate 6 is arranged on the upper surface of the insulating plate 5, the grid plate 6 provides the stable support, and the outer side surfaces of the supporting plate 4, the insulating plate 5 and the grid plate 6 are fixedly connected with the inner wall surface of the insulating frame 2;
firm supporting mechanism 7: the fixing support mechanism 7 comprises a groove plate 71, prisms 72, a pressing plate 73 and prism grooves 74, the groove plate 71 is arranged on the upper end face of the grid plate 6, the prisms 72 are uniformly distributed on the inner bottom face of the groove plate 71, the pressing plate 73 is inserted into the groove plate 71, the prism grooves 74 are uniformly distributed on the bottom face of the pressing plate 73, the prisms 72 are inserted into the prism grooves 74 corresponding to the vertical direction, the glass fiber plate 8 is arranged on the upper end face of the pressing plate 73, when the device falls to the ground, impact force is generated on the fixing frame 1 and transmitted to the insulating frame 2 and further transmitted to the bottom plate 3, the support plate 4, the insulating plate 5 and the grid plate 6, the impact force is weakened, when the groove plate 71 and the pressing plate 73 are stressed, the force is transmitted to the prisms 72 and the prism grooves 74, the impact force can be weakened secondarily, the multiple supporting mechanisms can disperse the impact force, the damage of the impact force to the device is reduced, and the production quality of the device can be ensured;
the heat conduction mechanism 9: the heat insulation plate is arranged on the upper surface of the glass fiber plate 8, the upper surface of the heat conduction mechanism 9 is provided with a copper foil layer 10, the heat conduction mechanism 9 comprises a heat insulation plate 91, a heat conduction insulation plate 92, a heat absorption layer 93 and a rectangular opening 94, the heat insulation plate 91 is arranged on the upper end surface of the glass fiber plate 8, the middle part of the heat insulation plate 91 is provided with the rectangular opening 94 which is uniformly distributed, the upper end surface of the heat insulation plate 91 is provided with the heat absorption layer 93, the upper end surface of the heat absorption layer 93 is provided with the heat conduction insulation plate 92, the upper end surface of the heat conduction insulation plate 92 is provided with the copper foil layer 10, when the copper foil layer 10 is connected with a circuit to operate, heat can be generated, the heat generated when the copper foil layer 10 operates is absorbed by the heat conduction insulation plate 92 and transferred to the heat absorption layer 93, so that the heat is converted into internal energy of the heat conduction insulation plate 92 and the heat absorption layer 93, the rectangular opening 94 can enable a small part of the heat absorption layer 93 to be supplied to the glass fiber plate 8, and the heat insulation plate 91 and the glass fiber plate 8 can reduce heat transfer, the strength of the device is prevented from being influenced by the heat of the lower structure, the normal use of the device is prevented from being influenced by the overhigh temperature of the copper foil layer 10, the use safety of the device can be ensured, the service life of the device is prolonged, the insulation and heat absorption effects are good, and the safety of the device is improved;
wherein: still include mounting hole 11 and spacing groove 12, mounting hole 11 sets up respectively in the upper surface four corners of fixed frame 1, and spacing groove 12 symmetry respectively sets up in the left and right sides face of fixed frame 1, and handheld fixed frame 1 makes spacing groove 12 slide down along the spacing post that the externally mounted position set up, puts externally mounted position, passes mounting hole 11 with outside bolt and fixes fixed frame 1 at externally mounted position, and the device of being convenient for is installed fixedly, and the spacing effectual of device can guarantee the installation accuracy of device.
Wherein: the insulating frame 2 is a bakelite frame, the insulating plate 5 is a bakelite plate, and the heat absorbing layer 93 is a PCM phase change heat absorbing plate, so that the insulating and heat absorbing effects are good, and the safety of the device is improved.
Wherein: the pressing plate 73 is matched with the groove of the groove plate 71, so that the strength of the device can be improved.
When in use: firstly, the fixing frame 1 is held by hand, the limiting groove 12 slides down along the limiting column arranged at the external installation part and is placed at the external installation part, the fixing frame 1 is fixed at the external installation part by penetrating an external bolt through the installation hole 11, the installation and the fixation of the device are convenient, the limiting effect of the device is good, the installation precision of the device can be ensured, when the device falls on the ground, impact force is generated on the fixing frame 1 and is transmitted to the insulating frame 2 and further transmitted to the bottom plate 3, the support plate 4, the insulating plate 5 and the grid plate 6, the impact force is weakened, when the groove plate 71 and the pressure plate 73 are stressed, the force is transmitted to the prism 72 and the prism groove 74, the impact force can be weakened secondarily, the multi-support mechanism can disperse the impact force, the damage of the impact force on the device is reduced, the production quality of the device can be ensured, when the copper foil layer 10 is connected with a circuit to operate, heat can be generated, heat that heat conduction insulation board 92 produced the copper foil layer 10 during operation absorbs and transmits for heat-sink shell 93, thereby turn into the heat conduction insulation board 92 and the internal energy of heat-sink shell 93 with the heat, rectangle mouth 94 can make the less part heat of heat-sink shell 93 give glass fiber board 8, heat insulating board 91 and glass fiber board 8 can reduce heat transfer, avoid the intensity that the below structure is heated and is influenced the device, avoid the too high influence normal use of copper foil layer 10 temperature, can guarantee the security of device use, the service life of the device is prolonged, it is insulating with heat absorption effectual.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high strength PCB base plate which characterized in that: comprises a fixed frame (1), a stable supporting mechanism (7) and a heat conducting mechanism (9);
fixed frame (1): an insulating frame (2) is arranged on the inner wall surface of the insulating frame, a bottom plate (3) is arranged inside the insulating frame (2), a supporting plate (4) is arranged on the upper surface of the bottom plate (3), an insulating plate (5) is bonded on the upper surface of the supporting plate (4) through glue solution, a grid plate (6) is arranged on the upper surface of the insulating plate (5), and the outer side surfaces of the supporting plate (4), the insulating plate (5) and the grid plate (6) are fixedly connected with the inner wall surface of the insulating frame (2);
firm supporting mechanism (7): the upper end surface of the grid plate (6) is provided with a glass fiber plate (8) and the upper end surface of the stable supporting mechanism (7) is provided with a glass fiber plate;
heat conduction mechanism (9): the heat conducting mechanism is arranged on the upper surface of the glass fiber plate (8), and a copper foil layer (10) is arranged on the upper surface of the heat conducting mechanism (9);
wherein: still include mounting hole (11) and spacing groove (12), mounting hole (11) set up respectively in the upper surface four corners of fixed frame (1), and spacing groove (12) symmetry respectively sets up in the left and right sides face of fixed frame (1).
2. A high strength PCB substrate as recited in claim 1, wherein: firm supporting mechanism (7) are including recess board (71), prism (72), clamp plate (73) and prism groove (74), recess board (71) set up in the up end of graticule board (6), and the inside bottom surface of recess board (71) is equipped with evenly distributed prism (72), and the inside grafting of recess board (71) has clamp plate (73), and the bottom surface of clamp plate (73) is equipped with evenly distributed prism groove (74), and prism (72) are pegged graft with vertical prism groove (74) that corresponds, and the up end of clamp plate (73) is equipped with glass fiber board (8).
3. A high strength PCB substrate as recited in claim 1, wherein: the heat conduction mechanism (9) comprises a heat insulation plate (91), a heat conduction insulation plate (92), a heat absorption layer (93) and a rectangular opening (94), the heat insulation plate (91) is arranged on the upper end face of the glass fiber plate (8), the middle of the heat insulation plate (91) is provided with the rectangular opening (94) which is uniformly distributed, the upper end face of the heat insulation plate (91) is provided with the heat absorption layer (93), the upper end face of the heat absorption layer (93) is provided with the heat conduction insulation plate (92), and the upper end face of the heat conduction insulation plate (92) is provided with a copper foil layer (10).
4. A high strength PCB substrate as recited in claim 3, wherein: the insulation frame (2) is a bakelite frame, the insulation plate (5) is a bakelite plate, and the heat absorption layer (93) is a PCM phase change heat absorption plate.
5. A high strength PCB substrate as recited in claim 2, wherein: the pressing plate (73) is matched with the groove of the groove plate (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120336520.5U CN214381562U (en) | 2021-02-05 | 2021-02-05 | High-strength PCB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120336520.5U CN214381562U (en) | 2021-02-05 | 2021-02-05 | High-strength PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214381562U true CN214381562U (en) | 2021-10-08 |
Family
ID=77964175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120336520.5U Active CN214381562U (en) | 2021-02-05 | 2021-02-05 | High-strength PCB substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214381562U (en) |
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2021
- 2021-02-05 CN CN202120336520.5U patent/CN214381562U/en active Active
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