CN214381351U

CN214381351U - Noise reduction module and earphone structure

Info

Publication number: CN214381351U
Application number: CN202120753176.XU
Authority: CN
Inventors: 杨晨蔚; 马红梅; 蒯军
Original assignee: Lanto Electronic Ltd
Current assignee: Lanto Electronic Ltd; Kunshan Liantao Electronics Co Ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2021-10-08
Anticipated expiration: 2031-04-13

Abstract

The application discloses module and headphone structure of making an uproar falls, falls the module of making an uproar and includes sound production subassembly and microphone. The sounding subassembly includes body and through-hole, and the body has first surface and the second surface relative with the first surface, and the through-hole runs through first surface and second surface, and wherein the body is fallen ware and speaker including falling, falls the ware electric connection speaker of making an uproar, and the speaker is located the first surface. The microphone is arranged on the second surface of the body, the microphone is electrically connected with the noise reducer, and the microphone receives sound through the through hole. The noise reduction module of this application passes through sound production subassembly and microphone integrated design, can effectively reduce the space that the module of making an uproar occupied of making an uproar, and the integrated design of the module of making an uproar is favorable to the equipment of earphone structure to be made.

Description

Noise reduction module and earphone structure

Technical Field

The application relates to the technical field of earphone structures, in particular to a noise reduction module and an earphone structure for an earphone.

Background

The technology is changing day by day, and the product related to the earphone structure possesses more and more powerful function of antinoise, and in the past the earphone in the back of wearing through the inseparable laminating ear in order to reach noise reduction effect, above-mentioned isolated noise through physics has reached passive form antinoise earphone. The earphone of the existing product is internally provided with an active noise reduction device, the noise reduction microphone on the earphone is used for detecting external noise, and a noise reduction processor is used for generating reverse sound waves to offset with the forward sound waves of the external noise, so that the active noise reduction effect is achieved. Besides the active anti-noise effect, the active noise reduction earphone can effectively eliminate the noise of the environment by the aid of the self-physical passive anti-noise effect. However, most of the noise reduction modules adopt separated devices, which not only occupies a large space, but also has the problem that the separated devices are difficult to assemble in the earphone shell.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a module and headphone structure of making an uproar falls can effectively solve present because the module of making an uproar falls adopts the device of disconnect-type, and the space that not only occupies is big, is difficult to assemble the problem in the earphone casing moreover.

In order to solve the technical problem, the present application is implemented as follows:

the first aspect provides a noise reduction module, which includes a sound generating component and a microphone. The sounding subassembly includes body and through-hole, and the body has first surface and the second surface relative with the first surface, and the through-hole runs through first surface and second surface, and wherein the body is fallen ware and speaker including falling, falls the ware electric connection speaker of making an uproar, and the speaker is located the first surface. The microphone is arranged on the second surface of the body, the microphone is electrically connected with the noise reducer, and the microphone receives sound through the through hole.

In one implementation, the microphone overlies the through-hole.

In one implementation, the noise reducer further comprises a processing unit for processing the analog signal or the digital signal, and the noise reducer is used for performing digital noise reduction or analog noise reduction.

A second aspect provides a headphone structure comprising a housing and a noise reduction module according to the first aspect. The shell is provided with a sound guide port and an inner cavity, and the sound guide port is communicated with the inner cavity. The noise reduction module according to the first aspect is disposed in the inner cavity, and the first surface of the noise reduction module corresponds to the sound guide port.

In one implementation, the microphone receives sound from a sound guide.

In one implementation, an outer microphone is also included, the outer microphone being electrically connected to the noise reducer, the outer microphone receiving ambient sound from outside the housing.

In one implementation, the outer microphone is located on a side of the second surface of the sound emitting assembly.

In one of them implementation, still include control circuit board, control circuit board is located the intracavity to control circuit board electric connection sound production subassembly, control circuit board is located one side of the second surface of sound production subassembly.

In one of them implementation, still include temperature sensor, temperature sensor electrical connection control circuit board, temperature sensor is located the one side of the first surface of sound generating component.

In one embodiment, the sound generating device further comprises a power supply electrically connected to the control circuit board, and the power supply is located on one side of the second surface of the sound generating component.

In this application embodiment, the noise reduction module passes through sound production subassembly and microphone integrated design, can effectively reduce the space that the noise reduction module occupy, will fall the noise reduction module again and assemble in headphone structure, has the space of excess in the headphone structure, can be used to new design demand or other space utilization etc. to reach the space in the highly effective utilization headphone structure, and it is little to the influence of falling the noise of earphone. In addition, the integrated design of the noise reduction module is beneficial to the assembly and the manufacture of the earphone structure.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a perspective view of a noise reduction module of the present application;

FIG. 2 is a side view of a noise reduction module of the present application; and

fig. 3 is a cross-sectional view of the earphone structure of the present application.

Detailed Description

Embodiments of the present application are illustrated in the drawings and, for purposes of clarity, numerous implementation details are set forth in the following description. It should be understood, however, that these implementation details should not be used to limit the application. That is, in some embodiments of the present application, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings. In the following embodiments, the same or similar components will be denoted by the same reference numerals.

Referring to fig. 1 and 2, fig. 1 is a perspective view of a noise reduction module according to the present application, and fig. 2 is a side view. As shown in the drawings, the present embodiment provides a noise reduction module 1, which includes a sound generating component 11 and a microphone 12. The sound generating assembly 11 includes a body 111 and a through hole 112, the body 111 has a first surface 1101 and a second surface 1102 opposite to the first surface 1101, the through hole 112 penetrates the first surface 1101 and the second surface 1102, wherein the body 111 includes a noise reducer 1111 and a speaker 1112, the noise reducer 1111 is electrically connected to the speaker 1112, the noise reducer 1111 further includes a processing unit, the processing unit is configured to process an analog signal or a digital signal, and the noise reducer 1111 is configured to perform digital noise reduction or analog noise reduction. Speaker 1112 is located on first surface 1101. The microphone 12 is disposed on the second surface 1102 of the body 111, and the microphone 12 is electrically connected to the noise reducer 1111. The microphone 12 receives sound through the through hole 112, wherein the microphone 12 covers the through hole 112.

Please refer to fig. 3, which is a sectional view of the earphone structure of the present application. As shown in the drawings, the present embodiment provides an earphone structure 2, which includes a housing 21 and a noise reduction module 1. The housing 21 has a sound guide port 211 and an inner cavity 212, and the sound guide port 211 communicates with the inner cavity 212. The noise reduction module 1 is disposed in the inner cavity 212, and the first surface 1101 of the noise reduction module 1 corresponds to the sound guide port 211. Wherein the earphone structure 2 comprises a wireless earphone, a wired earphone or an earphone device (e.g. a hearing aid, etc.) for noise reduction according to the user's needs.

In the present embodiment, the sound guide port 211 of the earphone structure 2 is communicated with the ear canal of the ear, and the sound guide port 211 is an opening of the earphone structure 2 for emitting a sound source. The microphone 12 receives sound from the sound leading port 211. Wherein the earphone structure 2 is worn on the ear, and the ear canal is used for receiving the sound source emitted from the sound guide port 211 of the earphone structure 2 and receiving the sound from the environment. At this time, the microphone 12 will detect and receive the ambient sound in the ear canal through the through hole 112, so that the noise reduction module 1 analyzes the ambient sound, and the noise reducer 1111 generates a backward sound wave to offset the forward sound wave of the ambient sound, thereby achieving the active noise reduction effect.

Furthermore, because the noise reduction module 1 of the present embodiment integrates the sound generating component 11 and the microphone 12, the microphone 12 is disposed at the position of the second surface 1102 of the sound generating component 11, so that the microphone 12 receives the ambient sound from the ear canal through the through hole 112, thereby overcoming the structural disadvantage of the prior art that the microphone 12 is disposed at the position of the first surface 1101 of the sound generating component 11 to collect the ambient sound received by the ear canal. The embodiment can save the space of the inner cavity 212 of the earphone structure 2 occupied by the microphone close to the sound guide port 211, can efficiently utilize the space of the inner cavity 212 to achieve new design requirements or space utilization and the like, and has little influence on noise reduction of the active noise reduction earphone.

As described above, in the present embodiment, the temperature sensor 15 is attached to the space in the cavity 212 near the sound guide port 211. In this embodiment, the earphone structure 2 further includes a control circuit board 14, the control circuit board 14 is located in the inner cavity 212, the control circuit board 14 is electrically connected to the sound generating component 11, and the control circuit board 14 is located on one side of the second surface 1102 of the sound generating component 11. The temperature sensor 15 is electrically connected to the control circuit board 14, and the temperature sensor 15 is located on one side of the first surface 1101 of the sound emitting assembly 11.

And, the control circuit board 14 has corresponding control logic corresponding to the temperature sensor 15, and can monitor the body temperature of the human body through the ear canal of the human body in real time or timely. The temperature sensor 15 is matched with a display device wirelessly transmitted to a terminal device, such as a mobile phone, a computer or an intelligent watch, and the display device can directly read the body temperature of a human body. Moreover, the application program of the terminal equipment has the functions of storage and statistics, and can count the temperature curve in a certain time period, so that the health condition of the human body can be monitored and pre-judged. The temperature sensor 15 can set the sampling interval frequency through the application software of the display device, and wirelessly transmit the data stream to the storage space of the terminal device, so as to compare preset reasonable or unreasonable values, and if the preset reasonable or unreasonable values exceed the preset reasonable values, the display device or the earphone structure 2 sends warning, such as sound or vibration.

In addition, the earphone structure 2 further includes a power supply 16, the power supply 16 is electrically connected to the control circuit board 14, and the power supply 16 is located on one side of the second surface 1102 of the sound emitting component 11.

In this embodiment, the earphone structure 2 further includes an external microphone 13, the external microphone 13 is electrically connected to the noise reducer 1111, and the external microphone 13 receives the ambient sound from the outside of the housing 21. The outer microphone 13 is located at one side of said second surface 1102 of the sound emitting assembly 11. Where the external microphone 13 receives ambient sound first, then the noise reducer 1111 pre-processes the ambient sound and produces a reverse sound wave through the speaker 1112 that is directed into the ear canal from the sound-directing port 211. In this embodiment, the combined noise reduction of the microphone 12 and the outer microphone 13 can process most frequencies, and can adapt to and correct signals quickly.

To sum up, this application provides a module and headphone structure of making an uproar falls, falls the module of making an uproar and passes through sound production subassembly and microphone integrated design, can effectively reduce the space that the module of making an uproar occupied of falling, will fall the module of making an uproar again and assemble in headphone structure, has the space of many in the headphone structure, can be used to new design demand or other space utilization etc. to reach the space in the high-efficient headphone structure that utilizes, and it is little to the influence of making an uproar falls of earphone. In addition, the integrated design of the noise reduction module is beneficial to the assembly and the manufacture of the earphone structure.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

While the foregoing specification illustrates and describes several preferred embodiments of this application, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the invention as expressed herein, either by the above teachings or by the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.

Claims

1. A noise reduction module, comprising:

the sounding assembly comprises a body and a through hole, wherein the body is provided with a first surface and a second surface opposite to the first surface, and the through hole penetrates through the first surface and the second surface, the body comprises a noise reducer and a loudspeaker, the noise reducer is electrically connected with the loudspeaker, and the loudspeaker is positioned on the first surface; and

the microphone is arranged on the second surface of the body and electrically connected with the noise reducer, and the microphone receives sound through the through hole.

2. The noise reduction module of claim 1, wherein the microphone overlies the through-hole.

3. The noise reduction module of claim 1, wherein the noise reducer further comprises a processing unit for processing an analog signal or a digital signal, and wherein the noise reducer is configured for performing digital noise reduction or analog noise reduction.

4. An earphone structure, comprising:

the shell is provided with a sound guide port and an inner cavity, and the sound guide port is communicated with the inner cavity; and

the noise reduction module of any one of claims 1-3 disposed within the internal cavity, the first surface of the noise reduction module corresponding to the sound guide port.

5. The earphone structure of claim 4 wherein the microphone receives sound from the sound-guide port.

6. The earphone structure of claim 4 further comprising a control circuit board, wherein the control circuit board is located in the cavity and is electrically connected to the sound emitting assembly, and the control circuit board is located on one side of the second surface of the sound emitting assembly.

7. The earphone structure of claim 6 further comprising a temperature sensor electrically connected to the control circuit board, the temperature sensor being located on a side of the first surface of the sound emitting assembly.

8. The earphone structure of claim 6 further comprising a power supply, the power supply being electrically connected to the control circuit board, the power supply being located on a side of the second surface of the sound emitting assembly.

9. The headphone structure of claim 4 further comprising an outer microphone electrically connected to the noise reducer, the outer microphone receiving ambient sound from outside the housing.

10. The earphone structure of claim 9 wherein the outer microphone is located on one side of the second surface of the sound emitting assembly.