CN214375780U

CN214375780U - Miniature projecting apparatus radiator

Info

Publication number: CN214375780U
Application number: CN202120099746.8U
Authority: CN
Inventors: 邓小华; 杨文升
Original assignee: Guangzhou Shenghui Electrical Appliances Co ltd
Current assignee: Guangzhou Shenghui Electrical Appliances Co ltd
Priority date: 2021-01-14
Filing date: 2021-01-14
Publication date: 2021-10-08
Anticipated expiration: 2031-01-14

Abstract

The utility model discloses a micro projector radiator, which comprises a radiator body; the radiator body is provided with a radiating joint part; the upper end surface of the heat dissipation attaching part is provided with a plurality of mounting columns; the projector chip assembly is arranged on the heat dissipation attaching part through the mounting column and the screw; the lower end face of the heat dissipation attaching part is provided with a first heat dissipation assembly; a first U-shaped positioning groove, a second U-shaped positioning groove and a third U-shaped positioning groove are respectively formed in the inner side wall of the radiator body; the first U-shaped positioning groove, the second U-shaped positioning groove and the third U-shaped positioning groove are respectively matched with an outer contour bulge integrated with the projector chip; the outer side wall of the radiator body is provided with a second radiating assembly; the utility model discloses a set up first radiator unit and second radiator unit and realize main and supplementary heat dissipation function, effectively improved the radiating efficiency, and simple structure, it is all convenient to make and install, and heat dispersion is good.

Description

Miniature projecting apparatus radiator

Technical Field

The utility model relates to a radiator technical field, especially a miniature projecting apparatus radiator.

Background

A micro projector, which is also called a portable projector or a mini projector; the miniature projector makes the traditional huge projector exquisite, portable, miniaturized, entertaining and practical, so that the projection technology is closer to life and entertainment. It has the functions of business office, teaching, business trip, personal entertainment, replacing TV, etc.

In the nowadays of increasingly popular projection application, the miniature portable projector is more and more favored by business people. The people can project wonderful images in front of a waiting room, a taxi, a hotel and an elevator, so that the office time and place are more free; a private cinema belonging to the cinema can be built at home, and the film watching effect and the comfort and the pleasure which are the same as those of the large cinema can be enjoyed; and when the user is camping on a tour, the user can project wonderful images in the wonderful environment of the nature and enjoy wonderful balance feeling brought by the nature and the science and technology.

But the products born under the limited scientific technical background also bring troubles to people. In the forum of portal sites related to projection products, many consumers have made questions about heat dissipation, maintenance, and repair of projectors. The biggest characteristic of the micro projector is small volume and portability, so that the internal structure design of the micro projector is very compact, and the gaps among parts are very limited, thus facing a very practical heat dissipation problem. The micro projector chip integration can generate a large amount of heat during operation, if the heat can not be dispersed in time, the machine is easily damaged, the machine can be restarted uninterruptedly, and due to the difference of the structural design process of each projector, the heat dissipation function limitation of the radiator of the existing structural process can not meet the heat dissipation requirement of the projector chip integration.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's defect, provide a simple structure, it is all convenient to make and install, the miniature projecting apparatus radiator that heat dispersion is good.

The utility model discloses a following technical scheme realizes:

a micro projector radiator comprises a radiator body; wherein: the radiator body is provided with a radiating joint part; the upper end surface of the heat dissipation attaching part is provided with a plurality of mounting columns; the projector chip assembly is arranged on the heat dissipation attaching part through the mounting column and the screw; the lower end face of the heat dissipation attaching part is provided with a first heat dissipation assembly; a first U-shaped positioning groove, a second U-shaped positioning groove and a third U-shaped positioning groove are respectively formed in the inner side wall of the radiator body; the first U-shaped positioning groove, the second U-shaped positioning groove and the third U-shaped positioning groove are respectively matched with an outer contour bulge integrated with the projector chip; and a second heat dissipation assembly is arranged on the outer side wall of the heat sink body.

Further, the first heat dissipation assembly comprises a plurality of first heat dissipation fins; each first heat dissipation fin is horizontally arranged on the lower end face of the heat dissipation attaching portion.

Further, the second heat dissipation assembly comprises a plurality of second heat dissipation fins; each second radiating fin is vertically arranged on the outer side wall of the radiator body.

Furthermore, the first heat dissipation fins and the second heat dissipation fins are vertically distributed in space.

Furthermore, a first power supply connecting hole and a second power supply connecting hole are respectively formed in the heat dissipation attaching portion.

Furthermore, the edge of the heat dissipation attaching part is convexly provided with an installation part; the installation part is provided with a mounting hole.

The utility model has the advantages that:

the utility model discloses a set up heat dissipation laminating portion and the integrated laminating of projecting apparatus chip and form the face contact, the integrated main heat that produces of projecting apparatus chip is passed through heat transfer of heat dissipation laminating portion and is given first radiator unit, and first radiator unit carries out the heat exchange with the air thereby realizes the heat dissipation function; a part of heat generated by the integration of the projector chip is transferred to the second heat dissipation assembly through the heat of the outer side wall of the radiator body, and the second heat dissipation assembly exchanges heat with air so as to realize a heat dissipation function; the main and auxiliary heat dissipation functions are realized by arranging the first heat dissipation assembly and the second heat dissipation assembly, and the heat dissipation efficiency is effectively improved. The first U-shaped positioning groove, the second U-shaped positioning groove and the third U-shaped positioning groove are arranged, so that the projector chip integration and the heat dissipation laminating part can be conveniently and quickly assembled, and the assembling efficiency is improved; the utility model discloses simple structure, it is all convenient to make and install, and heat dispersion is good.

Drawings

Fig. 1 is a schematic view of the overall structure of a micro projector radiator according to an embodiment of the present invention;

fig. 2 is a schematic view of another perspective three-dimensional structure of a micro projector radiator according to an embodiment of the present invention.

In the drawings: 1-a radiator body; 2-heat dissipation attaching part; 3-a first heat dissipation assembly; 4-a first U-shaped positioning slot; 5-a second U-shaped positioning groove; 6-a third U-shaped positioning groove; 7-a second heat dissipation assembly; 21-mounting a column; 22-first power connection hole; 23-a second power connection hole; 24-a mounting portion; 25-mounting holes; 31-first cooling fins; 71-second heat fins.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, and the present invention will be described in detail with reference to the accompanying drawings and specific embodiments below according to the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front, back, upper end, lower end, top, bottom … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the term "connected" is to be construed broadly, e.g., "connected" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature; in addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 and 2, a micro projector heat sink includes a heat sink body 1; wherein: the radiator body 1 is formed with a heat dissipation attaching part 2; the upper end surface of the heat dissipation attaching part 2 is provided with a plurality of mounting columns 21; the projector chip assembly is arranged on the heat dissipation attaching part 2 through the mounting column 21 and a screw; the lower end face of the heat dissipation attaching part 2 is provided with a first heat dissipation assembly 3; a first U-shaped positioning groove 4, a second U-shaped positioning groove 5 and a third U-shaped positioning groove 6 are respectively arranged on the inner side wall of the radiator body 1; the first U-shaped positioning groove 4, the second U-shaped positioning groove 5 and the third U-shaped positioning groove 6 are respectively matched with the outer contour bulges integrated on the projector chip; and a second heat radiation component 7 is arranged on the outer side wall of the heat radiator body 1. It should be noted that, the present invention forms a surface contact by arranging the heat dissipation attaching part 2 and the projector chip integration attaching, the main heat generated by the projector chip integration is transferred to the first heat dissipation assembly 3 through the heat dissipation attaching part 2, and the first heat dissipation assembly 3 exchanges heat with the air to realize the heat dissipation function; a part of heat generated by the integration of the projector chip is transferred to the second heat dissipation assembly 7 through the heat of the outer side wall of the radiator body 1, and the second heat dissipation assembly 7 exchanges heat with air so as to realize a heat dissipation function; the main and auxiliary heat dissipation functions are realized by arranging the first heat dissipation assembly 3 and the second heat dissipation assembly 7, and the heat dissipation efficiency is effectively improved. It should be noted that the first U-shaped positioning groove 4, the second U-shaped positioning groove 5 and the third U-shaped positioning groove 6 are arranged to facilitate the rapid assembly of the projector chip integration and heat dissipation attachment portion 2, thereby improving the assembly efficiency; the utility model discloses simple structure, it is all convenient to make and install, and heat dispersion is good.

Specifically, in this embodiment, the first heat dissipation assembly 3 includes a plurality of first heat dissipation fins 31; each of the first heat dissipation fins 31 is horizontally arranged on the lower end surface of the heat dissipation attaching portion 2. The heat generated by the integration of the projector chip is transferred to each first radiating fin 31 through the heat dissipation attaching part 2, and the first radiating fins 31 are horizontally arranged, so that the area of heat exchange with air is increased, and the heat dissipation efficiency is further improved.

Specifically, in this embodiment, the second heat dissipation assembly 7 includes a plurality of second heat dissipation fins 71; each of the second heat dissipation fins 71 is vertically arranged on the outer side wall of the heat sink body 1. It should be noted that heat generated by the integration of the projector chip is transferred to each second heat dissipating fin 71 through the heat transfer of the outer side wall of the heat sink body 1, and the design of vertical arrangement is adopted between the second heat dissipating fins 71, so that the area of heat exchange with air is increased, and the heat dissipating efficiency is further improved.

Specifically, in this embodiment, the first heat dissipation fins 31 and the second heat dissipation fins 71 are vertically distributed in space. It should be noted that, the first heat dissipation fins 31 and the second heat dissipation fins 71 are designed to be perpendicular to each other, so that the heat dissipation space is fully utilized, and the heat dissipation efficiency is further improved.

Specifically, in this embodiment, the heat dissipation attaching portion 2 is provided with a first power connection hole 22 and a second power connection hole 23, respectively. It should be noted that the first power connection hole 22 and the second power connection hole 23 are provided to facilitate the power connection between the projector chip integration and the micro projector, so as to ensure the normal operation of the projector chip integration.

Specifically, in the present embodiment, the edge of the heat dissipation attachment portion 2 is convexly provided with an installation portion 24; the mounting portion 24 is provided with a mounting hole 25. The heat sink body 1 is mounted on the micro projector through the mounting hole 25 and the screw, and has a compact structure and an attractive appearance.

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only applicable to help understand the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the description should not be construed as a limitation to the present invention.

Claims

1. A micro projector radiator comprises a radiator body; the method is characterized in that: the radiator body is provided with a radiating joint part; the upper end surface of the heat dissipation attaching part is provided with a plurality of mounting columns; the projector chip assembly is arranged on the heat dissipation attaching part through the mounting column and the screw; the lower end face of the heat dissipation attaching part is provided with a first heat dissipation assembly; a first U-shaped positioning groove, a second U-shaped positioning groove and a third U-shaped positioning groove are respectively formed in the inner side wall of the radiator body; the first U-shaped positioning groove, the second U-shaped positioning groove and the third U-shaped positioning groove are respectively matched with an outer contour bulge integrated with the projector chip; and a second heat dissipation assembly is arranged on the outer side wall of the heat sink body.

2. The heat sink of claim 1, wherein: the first heat dissipation assembly comprises a plurality of first heat dissipation fins; each first heat dissipation fin is horizontally arranged on the lower end face of the heat dissipation attaching portion.

3. The heat sink of claim 2, wherein: the second heat dissipation assembly comprises a plurality of second heat dissipation fins; each second radiating fin is vertically arranged on the outer side wall of the radiator body.

4. A micro-projector heat sink as claimed in claim 3, wherein: the first radiating fins and the second radiating fins are vertically distributed in space.

5. The heat sink of claim 1, wherein: and the heat dissipation attaching part is respectively provided with a first power supply connecting hole and a second power supply connecting hole.

6. The heat sink of claim 1, wherein: the edge of the heat dissipation attaching part is convexly provided with an installation part; the installation part is provided with a mounting hole.