CN214373022U - Ceramic pressure sensor - Google Patents
Ceramic pressure sensor Download PDFInfo
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- CN214373022U CN214373022U CN202120525732.8U CN202120525732U CN214373022U CN 214373022 U CN214373022 U CN 214373022U CN 202120525732 U CN202120525732 U CN 202120525732U CN 214373022 U CN214373022 U CN 214373022U
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- welding
- end signal
- rear end
- wheatstone bridge
- ceramic substrate
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Abstract
The utility model provides a ceramic pressure sensor, which comprises a ceramic substrate, a Wheatstone bridge circuit arranged on the upper surface of the ceramic substrate and a rear end signal adjusting circuit board; the four welding columns are arranged on the upper surface of the ceramic substrate and are respectively conducted with the branches of the Wheatstone bridge circuit, and the thickness of each welding column is larger than that of the Wheatstone bridge circuit; the rear end signal adjusting circuit board is provided with connecting points corresponding to the positions of the welding columns, the connecting points are communicated with a rear end signal adjusting circuit of the rear end signal adjusting circuit board, and the welding columns are communicated with the connecting points through welding. Utilize the welding column to switch on ceramic substrate and rear end signal adjustment circuit board to form the space that can supply ceramic substrate deformation between the two, need not to adopt the higher manual work of processing cost or equipment welding metal guide pillar, need not to connect the post hole at ceramic substrate surface machining, can realize switching on of wheatstone bridge circuit and rear end signal adjustment circuit board through reflow soldering, processing technology is simple, and is with low costs, and the welding precision is higher.
Description
Technical Field
The utility model belongs to the sensor field, concretely relates to pottery pressure sensor.
Background
At present, a ceramic pressure sensor is based on piezoresistive effect, pressure is directly applied to the front surface of a ceramic substrate to enable the substrate to generate micro deformation, a thick film resistor is printed on the back surface of the ceramic substrate to be connected into a Wheatstone bridge, and due to the piezoresistive effect of a piezoresistor, the bridge generates a voltage signal which is in direct proportion to the pressure, highly linear and in direct proportion to excitation voltage, and the voltage signal is received and output by a rear-end signal adjusting circuit. Since the ceramic substrate of the ceramic sensor is deformed, a deformation space is reserved between the ceramic substrate and the rear end signal adjusting circuit board, and reflow soldering cannot be directly adopted; the post connecting hole can be reserved on the general commercial ceramic substrate of prior art, through at post connecting hole welding metal guide pillar, correspond the position welding on metal guide pillar with rear end signal processing circuit board again, and automatic weld's equipment requirement is higher, and the cost is high, adopts manual welding, and the cost is higher, and the welding accuracy is relatively poor. Therefore, a need exists for a ceramic pressure sensor that is inexpensive to manufacture and accurate in soldering.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome above-mentioned conventional art's weak point, provide a low in production cost, accurate ceramic pressure sensor of welding.
The purpose of the utility model is realized by the following scheme:
a ceramic pressure sensor comprises a ceramic substrate, a Wheatstone bridge circuit and a rear end signal adjusting circuit board, wherein the Wheatstone bridge circuit and the rear end signal adjusting circuit board are arranged on the upper surface of the ceramic substrate; the four welding columns are arranged on the upper surface of the ceramic substrate and are respectively conducted with the branches of the Wheatstone bridge circuit, and the thickness of each welding column is larger than that of the Wheatstone bridge circuit; the rear end signal adjusting circuit board is provided with connecting points corresponding to the positions of the welding columns, the connecting points are communicated with a rear end signal adjusting circuit of the rear end signal adjusting circuit board, and the welding columns are communicated with the connecting points through welding.
In one embodiment of the present invention, the welding pillars are equally distributed in the circumferential direction of the wheatstone bridge circuit.
In one embodiment of the present invention, a first reinforcing ring is fixed to the upper surface of the ceramic substrate, the wheatstone bridge circuit is located in the first reinforcing ring, and the height of the first reinforcing ring is equal to the height of the solder post.
In one embodiment of the present invention, a second reinforcing ring is fixed to the upper surface of the ceramic substrate, and the second reinforcing ring is coaxial with the first reinforcing ring.
The utility model discloses an among them embodiment, wheatstone bridge circuit surface is equipped with the waterproof layer, and the thickness sum of wheatstone circuit and waterproof layer is less than the height of weld column.
Compared with the ceramic pressure sensor structure of prior art, the utility model discloses utilize the welding column to switch on ceramic substrate and rear end signal adjustment circuit board to form the space that can supply ceramic substrate deformation between the two, need not to adopt the higher manual work of processing cost or equipment welding metal guide pillar, need not to connect the post hole at ceramic substrate surface machining, can realize switching on of wheatstone bridge circuit and rear end signal adjustment circuit board through reflow soldering, processing technology is simple, and is with low costs, and for the mode of manual welding metal guide pillar, the welding precision is higher.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a ceramic pressure sensor.
Fig. 2 is a left side view of fig. 1.
Wherein: 10. a ceramic substrate; 20. a Wheatstone bridge circuit; 30. welding the column; 40. a first reinforcement ring; 50. a second reinforcement ring.
Detailed Description
Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1 and 2, the back end signal adjusting circuit board and the elastic rubber ring are omitted in fig. 1 and 2, and the present embodiment provides a ceramic pressure sensor, which includes a ceramic substrate 10, a wheatstone bridge circuit 20 disposed on the upper surface of the ceramic substrate 10, and a back end signal adjusting circuit board; the ceramic substrate comprises a ceramic substrate 10, four welding columns 30 and a Wheatstone bridge circuit 20, wherein the four welding columns 30 are arranged on the upper surface of the ceramic substrate 10, each welding column 30 is respectively conducted with a branch of the Wheatstone bridge circuit 20, and the thickness of each welding column 30 is larger than that of the Wheatstone bridge circuit 20; the rear end signal adjusting circuit board is provided with connection points corresponding to the positions of the welding columns 30, the connection points are conducted with a rear end signal adjusting circuit of the rear end signal adjusting circuit board, and the welding columns 30 are conducted with the connection points through welding.
The working principle is as follows: a Wheatstone bridge circuit 20 and a corresponding welding column 30 are formed on the surface of a ceramic substrate 10 through a film array process, and then each connection point is welded on the corresponding welding column 30 by adopting reflow soldering, so that the Wheatstone bridge circuit 20 is conducted with a rear end signal adjusting circuit board, the rear end signal adjusting circuit board is used for receiving piezoresistive changes generated by deformation of the ceramic substrate 10 due to compression of a branch of the Wheatstone bridge circuit corresponding to each welding point, and the piezoresistive changes are output as corresponding pressure values after being processed by the rear end signal adjusting circuit board.
In order to facilitate the welding of the solder columns 30 to the connection points and the stability of the solder columns 30 in supporting the rear signal conditioning circuit board, the solder columns 30 are equally angularly distributed around the wheatstone bridge circuit 20.
In order to reduce the measurement error, the first reinforcing ring 40 is fixed on the upper surface of the ceramic substrate 10, the wheatstone bridge circuit 20 is positioned in the first reinforcing ring 40, and the height of the first reinforcing ring 40 is equal to the height of the welding column 30. The first reinforcing ring 40 is used for reinforcing the periphery of the Wheatstone bridge circuit 20, so that the deformation output pressure of the rear-end signal adjusting circuit board generated by the ceramic substrate 10 in the first reinforcing ring 40 is ensured, and the influence on the measurement accuracy and precision of the ceramic pressure sensor caused by the deformation of the ceramic substrate 10 on the periphery of the first reinforcing ring 40 is avoided.
During the use, ceramic pressure sensor can install in a cavity, the stress deformation that ceramic substrate 10 produced for the buffering installation time causes influences the monitoring result of rear end signal adjustment circuit board, ceramic substrate 10 fixed surface has second reinforcing ring 50, second reinforcing ring 50 is coaxial with first reinforcing ring 40, it has the elastic rubber circle to fill between first reinforcing ring 40 and the second reinforcing ring 50, through filling the elastic rubber circle between first reinforcing ring 40 and second reinforcing ring 50, thereby the deformation that produces when buffering ceramic substrate 10 encapsulates pressure transmitter, avoid influencing the monitoring result of rear end signal adjustment circuit board to the deformation of ceramic substrate 10 in first reinforcing ring 40.
The surface of the Wheatstone bridge circuit 20 is provided with a waterproof layer, and the sum of the thicknesses of the Wheatstone bridge circuit and the waterproof layer is less than the height of the welding column 30.
It should be noted that the utility model discloses also can form a plurality of wheatstone bridge circuit 20 through battle membrane technology processing simultaneously through the different regions on same ceramic substrate 10, cut again after corresponding connection rear end signal adjustment circuit board, realize batch production's purpose, improve production efficiency.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A ceramic pressure sensor comprises a ceramic substrate, a Wheatstone bridge circuit and a rear end signal adjusting circuit board, wherein the Wheatstone bridge circuit and the rear end signal adjusting circuit board are arranged on the upper surface of the ceramic substrate; the ceramic substrate is characterized by further comprising four welding columns arranged on the upper surface of the ceramic substrate, wherein each welding column is respectively conducted with a branch of the Wheatstone bridge circuit, and the thickness of each welding column is larger than that of the Wheatstone bridge circuit; the rear end signal adjusting circuit board is provided with connecting points corresponding to the positions of the welding columns, the connecting points are communicated with a rear end signal adjusting circuit of the rear end signal adjusting circuit board, and the welding columns are communicated with the connecting points through welding.
2. The ceramic pressure sensor of claim 1 wherein each of the solder columns is equiangularly distributed about a circumference of the wheatstone bridge circuit.
3. The ceramic pressure sensor of claim 2, wherein a first reinforcing ring is secured to the top surface of the ceramic wafer, the wheatstone bridge circuit being located within the first reinforcing ring, the first reinforcing ring having a height equal to a height of the solder post.
4. The ceramic pressure sensor of claim 3, wherein a second reinforcing ring is affixed to an upper surface of the ceramic wafer, the second reinforcing ring being coaxial with the first reinforcing ring.
5. The ceramic pressure sensor according to claim 4, wherein the surface of the Wheatstone bridge circuit is provided with a waterproof layer, and the sum of the thicknesses of the Wheatstone bridge circuit and the waterproof layer is smaller than the height of the solder column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120525732.8U CN214373022U (en) | 2021-03-12 | 2021-03-12 | Ceramic pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120525732.8U CN214373022U (en) | 2021-03-12 | 2021-03-12 | Ceramic pressure sensor |
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| Publication Number | Publication Date |
|---|---|
| CN214373022U true CN214373022U (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120525732.8U Active CN214373022U (en) | 2021-03-12 | 2021-03-12 | Ceramic pressure sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114112122A (en) * | 2021-11-30 | 2022-03-01 | 无锡胜脉电子有限公司 | High-precision ceramic pressure sensor |
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2021
- 2021-03-12 CN CN202120525732.8U patent/CN214373022U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114112122A (en) * | 2021-11-30 | 2022-03-01 | 无锡胜脉电子有限公司 | High-precision ceramic pressure sensor |
| CN114112122B (en) * | 2021-11-30 | 2024-03-15 | 无锡胜脉电子有限公司 | High-precision ceramic pressure sensor |
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