CN214364666U - Heat conduction balance reinforced composite floor - Google Patents

Heat conduction balance reinforced composite floor Download PDF

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Publication number
CN214364666U
CN214364666U CN202120104725.0U CN202120104725U CN214364666U CN 214364666 U CN214364666 U CN 214364666U CN 202120104725 U CN202120104725 U CN 202120104725U CN 214364666 U CN214364666 U CN 214364666U
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layer
heat
heat conduction
fixed connection
adhesive
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CN202120104725.0U
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冯若原
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Shandong Tianxi New Material Co ltd
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Shandong Tianxi New Material Co ltd
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Abstract

The utility model relates to a laminate flooring technical field just discloses a heat conduction balance laminate flooring is reinforceed, which comprises a substrate, the right side and the first viscose agent left side fixed connection of base plate, the right side and the enhancement layer left side fixed connection of first viscose agent, the enhancement layer right side is provided with the polyurethane resin layer, the right side and the second viscose agent left side fixed connection of polyurethane resin layer, the left side fixed connection of second viscose agent right side and resistance to compression layer, the cavity layer in first cavity layer, the second has been seted up to base plate inside, the cavity in the first cavity in situ portion is provided with first heat-conducting layer. According to the heat conduction balance reinforced composite floor, the first heat conduction layer and the second heat conduction layer are arranged to form a cross shape, so that the heat conduction effect is better, more uniform and faster; the anti-compression effect can be played through the anti-compression layer that sets up, and flexibility performance and anti fracture performance can be strengthened through the polyurethane resin layer that sets up, make and strengthen composite sheet result of use better.

Description

Heat conduction balance reinforced composite floor
Technical Field
The utility model relates to a laminate flooring technical field specifically is a heat conduction balance laminate flooring is reinforceed.
Background
A composite floor is one of the floors. However, the composite floor is artificially changed in the natural structure of the floor material, and the floor with certain physical properties meeting the expected requirements is achieved. Composite floors are often referred to as laminate flooring and solid wood composite flooring in the market, and laminate flooring is a popular floor material in recent years. Official name of school: the impregnated paper laminates the wood floor. It is made up by using crushed log, adding glue, preservative and additive and making high-temp. high-pressure pressing treatment by means of hot press, so that it breaks the physical structure of log and overcomes the defect of poor stability of log. The existing reinforced composite floor is unbalanced and uneven in heat-conducting property, simple and single in structural property and poor in using effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat conduction balance laminate flooring has solved the problem that the above-mentioned background proposed.
In order to achieve the above object, the utility model provides a following technical scheme: a heat-conducting balance reinforced composite floor comprises a substrate, the right side of the substrate is fixedly connected with the left side of a first adhesive, the right side of the first adhesive is fixedly connected with the left side of the reinforcing layer, the right side of the reinforcing layer is provided with a polyurethane resin layer, the right side of the polyurethane resin layer is fixedly connected with the left side of the second adhesive, the right side of the second adhesive is fixedly connected with the left side of the compression-resistant layer, the substrate is internally provided with a first hollow layer and a second hollow layer, the first hollow layer is internally provided with a first heat conduction layer, the outer wall of the first heat conduction layer is fixedly connected with the inner wall of the first hollow layer, the back of the first heat conduction layer is provided with a second heat conduction layer, the front surface of the second heat conduction layer is fixedly connected with the back surface of the first heat conduction layer, and the outer wall of the second heat conduction layer is fixedly connected with the inner wall of the second hollow layer.
Preferably, the substrate and the first adhesive have the same length and width, and the thickness of the substrate is three times of the thickness of the first adhesive.
Preferably, the first adhesive is mainly made of a natural resin material, and the first adhesive is in a transparent state.
Preferably, the reinforcing layer has a length and a width corresponding to the width of the first adhesive, and the reinforcing layer has a thickness twice the width of the first adhesive.
Preferably, the left side of the polyurethane resin layer is fixedly connected with the right side of the reinforcing layer.
Preferably, the first hollow layer and the second hollow layer form a cross shape.
The utility model provides a heat conduction balance laminate flooring is reinforceed. The heat conduction balance reinforced composite floor has the following beneficial effects:
according to the heat conduction balance reinforced composite floor, the first heat conduction layer and the second heat conduction layer are arranged to form a cross shape, so that the heat conduction effect is better, more uniform and faster; the anti-compression effect can be played through the anti-compression layer that sets up, and flexibility performance and anti fracture performance can be strengthened through the polyurethane resin layer that sets up, make and strengthen composite sheet result of use better.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of the structure of FIG. 1 according to the present invention;
fig. 3 is a schematic diagram of the left side sectional structure of the substrate of the present invention.
In the figure: the heat-conducting layer comprises a substrate 1, a first adhesive 2, a reinforcing layer 3, a polyurethane resin layer 4, a second adhesive 5, a pressure-resistant layer 6, a first hollow layer 7, a first heat-conducting layer 8, a second hollow layer 9 and a second heat-conducting layer 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1-3, the utility model provides a technical solution: a heat conduction balance reinforced composite floor comprises a substrate 1, the right side of the substrate 1 is fixedly connected with the left side of a first adhesive 2, the length and the width of the substrate 1 are consistent with those of the first adhesive 2, the thickness of the substrate 1 is three times of that of the first adhesive 2, the thickness of the substrate 1 is 0.25 mm, the first adhesive 2 is mainly made of natural resin materials, the first adhesive 2 is in a transparent state, the right side of the first adhesive 2 is fixedly connected with the left side of a reinforcing layer 3, the length and the width of the reinforcing layer 3 are consistent with those of the first adhesive 2, the thickness of the reinforcing layer 3 is two times of that of the first adhesive 2, a polyurethane resin layer 4 is arranged on the right side of the reinforcing layer 3, the left side of the polyurethane resin layer 4 is fixedly connected with the right side of the reinforcing layer 3, the right side of the polyurethane resin layer 4 is fixedly connected with the left side of a second adhesive 5, the right side of the second adhesive 5 is fixedly connected with the left side of a compression-resistant layer 6, the pressure-resistant effect can be achieved through the arranged pressure-resistant layer 6, the flexibility performance and the fracture resistance can be enhanced through the arranged polyurethane resin layer 4, so that the use effect of the reinforced composite board is better, the first hollow layer 7 and the second hollow layer 9 are arranged in the base plate 1, the first hollow layer 7 and the second hollow layer 9 form a cross shape, the first heat-conducting layer 8 is arranged in the first hollow layer 7, the outer wall of the first heat-conducting layer 8 is fixedly connected with the inner wall of the first hollow layer 7, the back surface of the first heat-conducting layer 8 is provided with the second heat-conducting layer 10, the first heat-conducting layer 8 and the second heat-conducting layer 10 are made of silica gel materials, the front surface of the second heat-conducting layer 10 is fixedly connected with the back surface of the first heat-conducting layer 8, the outer wall of the second heat-conducting layer 10 is fixedly connected with the inner wall of the second hollow layer 9, and the cross shape is formed through the arranged first heat-conducting layer 8 and the second heat-conducting layer, the heat conduction effect can be better, more uniform and faster.
When the heat conduction balance reinforced composite floor is used, the first heat conduction layer 8 and the second heat conduction layer 10 can have good heat conduction effects, and the first hollow layer 7 and the second hollow layer 9 form a cross shape, so that the first heat conduction layer 8 and the second heat conduction layer 10 form a cross shape, and finally, the heat conduction effect is better, more uniform and quicker; when this reinforce composite sheet meets external force punching press, can play the resistance to compression effect through the resistance to compression layer 6 that sets up, can strengthen reinforcing composite sheet flexibility performance and anti fracture performance through the polyurethane resin layer 4 that sets up, make reinforcing composite sheet result of use better.
In conclusion, the first heat conduction layer 8 and the second heat conduction layer are arranged in a cross shape, so that the heat conduction effect is better, more uniform and faster; the anti-compression effect can be played through the anti-compression layer 6 that sets up, and the polyurethane resin layer 4 through setting up can strengthen flexible performance and anti fracture performance, makes the reinforced composite board result of use better.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A heat conduction balance strengthened composite floor comprises a substrate (1), and is characterized in that: the right side of base plate (1) and the left side fixed connection of first viscose agent (2), the right side of first viscose agent (2) and the left side fixed connection of enhancement layer (3), the right side of enhancement layer (3) is provided with polyurethane resin layer (4), the right side of polyurethane resin layer (4) and the left side fixed connection of second viscose agent (5), the right side of second viscose agent (5) and the left side fixed connection of resistance to compression layer (6), first hollow layer (7), second hollow layer (9) have been seted up to the inside of base plate (1), the inside of first hollow layer (7) is provided with first heat-conducting layer (8), the outer wall of first heat-conducting layer (8) and the inner wall fixed connection of first hollow layer (7), the back of first heat-conducting layer (8) is provided with second heat-conducting layer (10), the front of second heat-conducting layer (10) and the back fixed connection of first heat-conducting layer (8), the outer wall of the second heat conduction layer (10) is fixedly connected with the inner wall of the second hollow layer (9).
2. The heat conducting balanced laminate flooring of claim 1, wherein: the length and the width of the substrate (1) are consistent with those of the first adhesive (2), and the thickness of the substrate (1) is three times that of the first adhesive (2).
3. The heat conducting balanced laminate flooring of claim 1, wherein: the first adhesive (2) is mainly made of natural resin materials, and the first adhesive (2) is in a transparent state.
4. The heat conducting balanced laminate flooring of claim 1, wherein: the length and the width of the reinforcing layer (3) are consistent with those of the first adhesive (2), and the thickness of the reinforcing layer (3) is twice of the width of the first adhesive (2).
5. The heat conducting balanced laminate flooring of claim 1, wherein: the left side of the polyurethane resin layer (4) is fixedly connected with the right side of the reinforcing layer (3).
6. The heat conducting balanced laminate flooring of claim 1, wherein: the first hollow layer (7) and the second hollow layer (9) form a cross shape.
CN202120104725.0U 2021-01-14 2021-01-14 Heat conduction balance reinforced composite floor Active CN214364666U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120104725.0U CN214364666U (en) 2021-01-14 2021-01-14 Heat conduction balance reinforced composite floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120104725.0U CN214364666U (en) 2021-01-14 2021-01-14 Heat conduction balance reinforced composite floor

Publications (1)

Publication Number Publication Date
CN214364666U true CN214364666U (en) 2021-10-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120104725.0U Active CN214364666U (en) 2021-01-14 2021-01-14 Heat conduction balance reinforced composite floor

Country Status (1)

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CN (1) CN214364666U (en)

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