CN214350120U

CN214350120U - IGBT automatic assembly device of inverter circuit

Info

Publication number: CN214350120U
Application number: CN202022835647.XU
Authority: CN
Inventors: 赵向良; 王文聪; 申彬淼; 张开罗; 李江辉
Original assignee: Henan Xipu Electric Co ltd
Current assignee: Henan Xipu Electric Co ltd
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2021-10-08
Anticipated expiration: 2030-12-01

Abstract

The utility model discloses an IGBT automatic assembly device of an inverter circuit, which comprises a heat conducting paste brushing device, wherein the heat conducting paste brushing device is used for brushing heat conducting paste on the surface of a chip; the mounting hole testing device is used for realizing the blocking test of the pin jack of the circuit board; the pin welding device is used for realizing the welding and fixing of chip pins; the heat conducting fin mounting device is used for mounting the heat conducting fins; the automatic assembly of the circuit board can be realized by the aid of the transmission units, and the circuit board assembly efficiency is greatly improved.

Description

IGBT automatic assembly device of inverter circuit

Technical Field

The utility model relates to an inverter circuit technical field, concretely relates to inverter circuit's automatic assembly device of IGBT.

Background

The inverter circuit corresponds to the rectifier circuit, and converts direct current into alternating current to be called as inversion, the inverter circuit can be used for forming various alternating current power supplies and is widely applied in industry, the IGBT module is a modularized semiconductor product formed by bridging and packaging IGBT (insulated gate bipolar transistor) and FWD (diode chip) through a specific circuit, the packaged IGBT module is directly applied to equipment such as a frequency converter, a UPS (uninterrupted power supply) and the like, and the prior art cannot realize automatic assembly in the assembly process of a circuit board and has low efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an inverter circuit's IGBT automatic assembly device just in order to solve above-mentioned problem, have and can realize the automatic equipment to the circuit board, advantage such as efficient sees the explanation below in detail.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a pair of inverter circuit's automatic assembly device of IGBT, include:

the heat conducting paste brushing device is used for brushing heat conducting paste on the surface of the chip;

the mounting hole testing device is used for realizing the blocking test of the pin jack of the circuit board;

the pin welding device is used for realizing the welding and fixing of chip pins;

the heat conducting fin mounting device is used for mounting the heat conducting fins;

the base, apply paint with a brush thermal paste device, mounting hole testing arrangement, pin welding set and conducting strip installation device all set up on the base, apply paint with a brush and be provided with the transmission unit between thermal paste device, mounting hole testing arrangement, pin welding set and the conducting strip installation device.

By adopting the structure, the transmission unit can transmit and move the circuit board to be assembled between the pin welding device and the heat conducting strip installation device, firstly, the transmission unit transmits the circuit board to be assembled to the installation hole testing device in a moving way, pin jacks on the circuit board to be assembled are tested, when the test is unqualified, unqualified circuit boards are transmitted and led out through the transmission unit, repair and correction are carried out, the next step of procedure is carried out when the test is qualified, the heat conducting strip can be coated on the chip through the heat conducting strip coating device while the pin installation holes are detected, the heat conducting strip is installed on the circuit board by the heat conducting strip installation device, the chip is installed on the circuit board, finally, welding is carried out through the pin welding device, and after the welding is finished, finished products can be transmitted and led out through the transmission unit.

Preferably, the device for coating the heat conductive paste comprises two first lifting structures which are distributed in parallel, the transmission unit penetrates through the two first lifting structures, the lower ends of the two first lifting structures are fixedly connected to the base, a first cross beam is fixedly connected between the upper ends of the two first lifting structures, a coating machine is arranged on the first cross beam, an opening and closing mechanism is arranged on one side, close to each other, of the two first lifting structures in a lifting mode, two chip positioning clamping plates used for clamping and positioning the chips are arranged between the two opening and closing mechanisms, the chip positioning clamping plates are located above the transmission unit, and a plurality of positioning clamping holes are formed when the two chip positioning clamping plates are close to each other.

Preferably, the first lifting structure comprises a rod body, a lifting sliding cavity is formed in the rod body, one side of the lifting sliding cavity, which is close to the lifting sliding cavity, is opened, a lifting sliding block is arranged in the lifting sliding cavity in a vertically sliding mode, a lifting motor is arranged inside the lower end of the rod body, the output shaft end of the lifting motor faces upwards and is fixedly connected with a lead screw, the upper end of the lead screw extends into the lifting sliding cavity and is in threaded connection with the lifting sliding block, and one side of the lifting sliding block penetrates through the opening of the lifting sliding cavity and is connected with the opening and closing mechanism.

Preferably, the mechanism that opens and shuts is including opening and shutting the guide rail, and the both ends of opening and shutting the guide rail slide and be provided with by the gliding slider of the cylinder drive that opens and shuts, and one side and the chip location splint of chip location splint fixed connection each other of slider are close to each other and are kept away from in the guide rail that opens and shuts under the flexible drive of the push rod of the cylinder that opens and shuts, two sliders and slider one side fixed connection's chip location splint.

Preferably, the mounting hole testing device comprises two first supporting rods, the lower ends of the two first supporting rods are fixedly connected to the base, a second cross beam is fixedly connected between the upper ends of the two first supporting rods, the transmission unit penetrates through the two first supporting rods, a lifting plate is arranged above the transmission unit, first guide rods are arranged at the two ends of the lifting plate in a vertical sliding mode, the upper ends of the two first guide rods are fixedly connected to the second cross beam, the lifting plate is driven by a lifting cylinder fixedly mounted on the second cross beam to move up and down, and a detection unit is arranged on the lower side of the lifting plate.

Preferably, the detection unit comprises a pressure sensing unit, the pressure sensing unit is fixedly arranged on the lower side surface of the lifting plate, a U-shaped support is arranged below the pressure sensing unit, two ends of the upper part of the U-shaped support are fixedly connected to the lower side surface of the lifting plate, a plurality of test rods are arranged on the lower plate body of the U-shaped support in a sliding manner along the vertical direction, the upper ends of the test rods are fixedly connected with elastic contact heads for limiting the downward movement direction, and a circuit board aligning assembly for aligning and positioning the position of a circuit board is arranged on the lower side of the U-shaped support;

the elastic contact pressure head comprises an upper pressure block and a lower pressure block which are distributed up and down, a first spring is fixedly connected between the upper pressure block and the lower pressure block, and the lower end of the lower pressure block is fixedly connected to the upper end of the test rod.

Preferably, the circuit board aligning component comprises an aligning rod with a V-shaped appearance, the V-shaped opening of the aligning rod faces, more than two vertical rods which are distributed in parallel are fixedly connected to the upper side of the aligning rod, the upper ends of the vertical rods are slidably connected with the bottom of the U-shaped support, a second spring is nested on the vertical rod between the bottom of the U-shaped support and the upper portion of the aligning rod, and two ends of the second spring are fixedly connected with the U-shaped support and the aligning rod respectively.

Preferably, the pin welding device comprises two second lifting structures which have the same structure as the first lifting structure, the two second lifting structures are distributed in parallel, the lower ends of the two second lifting structures are fixedly connected to the base, the upper ends of the two second lifting structures are fixedly connected with a third beam, and a welding machine is arranged on the third beam;

the two second lifting structures are provided with rotating motors in a lifting mode, one sides of the lifting sliding blocks of the second lifting structures are fixedly connected with the corresponding rotating motors, output shaft ends of the two rotating motors are opposite to each other and fixedly connected with first positioning assemblies, and the first positioning assemblies are used for achieving positioning and clamping of the circuit board.

Preferably, the first positioning assembly comprises a mounting plate, one side of the mounting plate is fixedly connected to the output shaft end of the rotating motor, positioning rods are arranged at two ends of the other side of the mounting plate and driven to stretch by positioning cylinders fixedly mounted on the mounting plate, the outer sides of the positioning rods are formed with positioning bulges, and the positioning rods are matched and connected with positioning holes formed in corresponding positions on the circuit board.

Preferably, the heat conducting fin mounting device comprises two second supporting rods, a guide hopper for guiding and mounting the heat conducting fin is arranged between the two second supporting rods, the lower ends of the two second supporting rods are fixedly connected to the base, the transmission unit penetrates through the two second supporting rods, a fourth cross beam is fixedly connected between the upper ends of the two second supporting rods, a mechanical arm for moving the heat conducting fin is arranged on the fourth cross beam, second positioning assemblies with the same structure as the first positioning assemblies are arranged on one sides of the two second supporting rods close to the transmission unit, and mounting plates of the second positioning assemblies are fixedly connected to the second supporting rods;

the guide hopper is arranged above the transmission unit, the guide hopper is in a trapezoidal cylinder shape with a wide upper part and a narrow lower part, the two ends of the guide hopper are provided with second guide rods in an up-and-down sliding mode, the upper ends of the second guide rods are fixedly connected to the lower side of a fourth cross beam, and the guide hopper is driven by an electric telescopic rod fixedly installed on the fourth cross beam to slide up and down along the axial direction of the second guide rods.

Has the advantages that: 1. the automatic assembly of the circuit board can be realized by the aid of the transmission units, and the circuit board assembly efficiency is greatly improved.

2. The first positioning assembly and the rotating motor are matched to realize positioning rotation of the circuit board, so that assembly operation on two sides of the circuit board is facilitated.

3. The direction fill is realized being convenient for accurately installing the conducting strip on the circuit board to the direction of conducting strip and the location clamping cooperation of second locating component to the circuit board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a front view of the present invention;

figure 2 is a perspective view of the present invention from figure 1;

FIG. 3 is a perspective view of the plastic-coated heat conductive paste device of the present invention;

fig. 4 is a cross-sectional view of a first elevating structure of the present invention;

fig. 5 is a front view of the mounting hole testing device of the present invention;

fig. 6 is a perspective view of the mounting hole testing device of fig. 5 according to the present invention;

FIG. 7 is a cross-sectional view of the elastic contact-pressing head of the present invention;

fig. 8 is a perspective view of the pin welding device of the present invention;

fig. 9 is an enlarged view of a portion of fig. 8 according to the present invention;

fig. 10 is a perspective view of the heat conductive sheet mounting device of the present invention.

The reference numerals are explained below: 1. coating a heat conducting paste device; 101. a first lifting structure; 101a, a rod body; 101b, a lifting sliding cavity; 101c, a lifting slide block; 101d, a lead screw; 101e, a lifting motor; 102. a first cross member; 103. a brushing machine; 104. an opening and closing mechanism; 104a, an opening and closing guide rail; 104b, an opening and closing cylinder; 104c, a slide block; 105. a chip positioning clamp plate; 106. positioning the clamp hole; 2. a mounting hole testing device; 201. a first support bar; 202. an elastic pressure-contact head; 202a, pressing a block; 202b, a lower pressing block; 202c, a first spring; 203. a first guide bar; 204. a lifting plate; 205. a pressure sensing unit; 206. a lifting cylinder; 207. a test rod; 208. a U-shaped bracket; 209. a circuit board leveling assembly; 209a, a swing rod; 209b, a second spring; 209c, vertical bar; 210. a second cross member; 3. a pin welding device; 301. a second lifting structure; 302. a first positioning assembly; 302a, a mounting plate; 302b, positioning a cylinder; 302c, a positioning rod; 302d, a limiting bulge; 303. welding machine; 304. a third cross member; 305. a rotating electric machine; 4. a heat-conducting fin mounting device; 401. a second support bar; 402. a mechanical arm; 403. a guide hopper; 404. a second positioning assembly; 405. an electric telescopic rod; 406. a fourth cross member; 407. a connecting rod; 408. a second guide bar; 5. a base; 6. a transmission unit; 7. and (7) positioning the holes.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-10, the present invention provides an I GBT automatic assembly device of an inverter circuit, which includes a thermal paste applying device 1, wherein the thermal paste applying device 1 is used for applying thermal paste on a chip surface; the mounting hole testing device 2 is used for realizing the blocking test of the pin jack of the circuit board; the pin welding device 3 is used for realizing the welding and fixing of chip pins; the heat conducting fin mounting device 4 is used for mounting the heat conducting fin, and the heat conducting fin mounting device 4 is used for mounting the heat conducting fin; the base, apply paint with a brush thermal cream device 1, mounting hole testing arrangement 2, pin welding set 3 and conducting strip installation device 4 and all set up on the base, apply paint with a brush and be provided with transmission unit 6 between thermal cream device 1, mounting hole testing arrangement 2, pin welding set 3 and the conducting strip installation device 4. The circuit board is transferred and moved among the heat conducting paste brushing device 1, the mounting hole testing device 2, the pin welding device 3 and the heat conducting fin mounting device 4 under the transmission descending of the transmission unit 6, so that the circuit board is sequentially subjected to the test of the pin jack of the circuit board, the brushing of the chip heat conducting paste, the mounting of the heat conducting fin, the mounting of the chip and the circuit board and the final welding of the chip pin and the circuit board.

Referring to the attached

drawings

1, 2, 3 and 4 in the specification, the device 1 for applying heat conductive paste includes two first lifting structures 101 distributed in parallel, the transmission unit 6 passes through the two first lifting structures 101, the lower ends of the two first lifting structures 101 are fixedly connected to the base 5, first cross beams 102 are fixedly connected to the upper ends of the two first lifting structures 101, an applying machine 103 is arranged on the first cross beams 102, opening and closing mechanisms 104 are arranged on the sides, close to each other, of the two first lifting structures 101 in a lifting mode, two chip positioning clamping plates 105 used for clamping and positioning chips are arranged between the two opening and closing mechanisms 104, the chip positioning clamping plates 105 are located above the transmission unit 6, and a plurality of positioning clamping holes 106 are formed when the two chip positioning clamping plates 105 are close to each other. First elevation structure 101 includes the body of rod 101a, it has lift smooth chamber 101b to open in the body of rod 101a, the one side opening that lift smooth chamber 101b is close to, it is provided with lift slider 101c to slide from top to bottom in the smooth chamber 101b to lift, the lower extreme internally mounted of the body of rod 101a has lift motor 101e, lift motor 101 e's output shaft end is upwards and fixedly connected with lead screw 101d, the upper end of lead screw 101d extends to in the smooth chamber 101b of lift and with lift slider 101c threaded connection, the opening that lift smooth chamber 101b was passed to one side of lift slider 101c and with open and shut mechanism 104 and be connected each other. The opening and closing mechanism 104 comprises an opening and closing guide rail 104a, two ends of the opening and closing guide rail 104a are provided with sliding blocks 104c driven to slide by an opening and closing air cylinder 104b in a sliding mode, one side of each sliding block 104c is fixedly connected with a chip positioning clamping plate 105, and under the telescopic driving of a push rod of the opening and closing air cylinder 104b, the two sliding blocks 104c and the chip positioning clamping plates 105 fixedly connected to one side of each sliding block 104c are close to and far away from each other along the inside of the opening and closing guide rail 104 a. The output shaft end of the lifting motor 101e rotates to drive the fixedly connected lead screw 101d to rotate, the lead screw 101d rotates to drive the lifting slide block 101c connected with the thread to vertically lift and slide in the lifting slide cavity 101b, thereby driving the opening and closing mechanism 104 fixedly connected with one side of the lifting slide block 101c to vertically move, a push rod of the opening and closing cylinder 104b of the opening and closing mechanism 104 stretches to drive the fixedly connected slide block 104c to slide on the opening and closing guide rail 104a, thereby realizing the opening and closing between the two chip positioning clamp plates 105, the two chip positioning clamp plates 105 are provided with the formed positioning clamp holes 106 to realize the positioning and clamping of the chip, at the moment, the heat conducting paste on the surface of the chip is coated by the coating machine 103, under the vertical movement of the opening and closing mechanism 104, the insertion and installation of the chip on the circuit board to be assembled transmitted by the transmission unit 6 is realized.

Referring to fig. 1, 2, 5, 6 and 7 in the specification, the mounting hole testing device 2 includes two first supporting rods 201, lower ends of the two first supporting rods 201 are fixedly connected to the base 5, a second beam 210 is fixedly connected between upper ends of the two first supporting rods 201, the transmission unit 6 passes through between the two first supporting rods 201, a lifting plate 204 is disposed above the transmission unit 6, first guide rods 203 are slidably disposed at two ends of the lifting plate 204 up and down, upper ends of the two first guide rods 203 are fixedly connected to the second beam 210, the lifting plate 204 is driven by a lifting cylinder 206 fixedly disposed on the second beam 210 to move up and down, and a detection unit is disposed at a lower side of the lifting plate 204. The detection unit comprises a pressure sensing unit 205, the pressure sensing unit 205 is fixedly arranged on the lower side surface of the lifting plate 204, a U-shaped support 208 is arranged below the pressure sensing unit 205, two ends of the upper part of the U-shaped support 208 are fixedly connected to the lower side surface of the lifting plate 204, a plurality of test rods 207 are arranged on the lower plate body of the U-shaped support 208 in a sliding manner along the up-down direction, the upper ends of the test rods 207 are fixedly connected with elastic touch pressure heads 202 for limiting the downward moving direction, and a circuit board aligning component 209 for aligning and positioning the position of a circuit board is arranged on the lower side of the U-shaped support 208; the elastic pressure contact head 202 comprises an upper pressing block 202a and a lower pressing block 202b which are distributed up and down, a first spring 202c is fixedly connected between the upper pressing block 202a and the lower pressing block 202b, and the lower end of the lower pressing block 202b is fixedly connected to the upper end of the test rod 207. The circuit board straightening assembly 209 comprises a V-shaped straightening rod 209a, the V-shaped opening of the straightening rod 209a faces, more than two vertical rods 209c which are distributed in parallel are fixedly connected to the upper side of the straightening rod 209a, the upper ends of the vertical rods 209c are slidably connected with the bottom of the U-shaped support 208, a second spring 209b is nested on the vertical rod 209c between the bottom of the U-shaped support 208 and the upper portion of the straightening rod 209a, and two ends of the second spring 209b are respectively fixedly connected with the U-shaped support 208 and the straightening rod 209 a. The transmission unit 6 transmits the circuit board to the position of the mounting hole testing device 2, the push rod of the lifting cylinder 206 extends downwards to drive the lifting plate 204 fixedly connected with the lower side to move downwards, the lifting plate 204 moves downwards to drive the lifting plate 204 to move downwards, the lifting plate 204 is matched with the pin jack on the circuit board, when the pin jack on the circuit board is blocked, the testing rod 207 is blocked to stand still, the lifting plate 204 drives the pressure sensing unit 205 on the lower side to move downwards continuously, the pressure sensing unit 205 is abutted to the top end of the blocked testing rod 207, the elastic contact pressure head 202 arranged at the top end of the testing rod 207 has certain elastic deformation when being abutted to the pressure sensing unit 205, rigid contact is avoided, before the testing rod 207 is inserted into the pin jack on the circuit board, the centering rod 209aV type opening of the circuit board centering assembly 209 is abutted to the circuit board, under the pushing of the inner inclined plane, the position of the circuit board is slightly corrected and the second spring 209b is used for realizing the real correction The circuit board is elastically pressed.

As shown in fig. 1, 2, 8 and 9 of the specification, the pin welding device 3 includes two second lifting structures 301 having the same structure as the first lifting structure 101, the second lifting structures 301 are provided with two second lifting structures 301 distributed in parallel, the lower ends of the two second lifting structures 301 are fixedly connected to the base 5, the upper ends of the two second lifting structures 301 are fixedly connected to a third beam 304, and a welding machine 303 is provided on the third beam 304; the two second lifting structures 301 are provided with rotating motors 305 in a lifting mode on one side close to each other, one side of a lifting slide block 101c of each second lifting structure 301 is fixedly connected with the corresponding rotating motor 305, output shaft ends of the two rotating motors 305 are opposite to each other and fixedly connected with first positioning assemblies 302, and the first positioning assemblies 302 are used for positioning and clamping the circuit board. The first positioning assembly 302 comprises a mounting plate 302a, one side of the mounting plate 302a is fixedly connected to an output shaft end of the rotating motor 305, positioning rods 302c are arranged at two ends of the other side of the mounting plate 302a, the positioning rods 302c are driven to stretch by positioning cylinders 302b fixedly mounted on the mounting plate 302a, a first limiting protrusion 302d is formed on the outer side of each positioning rod 302c, and positioning holes 7 formed in corresponding positions of the positioning rods 302c and the circuit board are matched and connected with each other. The flexible locating cylinder 302b push rod that drives fixed connection of locating lever 302c of first locating component 302 is seted up some locating holes 7 towards the circuit board corresponding position and is removed to make locating lever 302c insert in locating hole 7, the spacing arch 302d that locating lever 302c outside was provided with can realize fixing circuit board position card, the upward movement of rotating electrical machines 305 and first locating component 302 is realized to second elevation structure 301, then realize treating the one hundred eighty degrees rotations of assembling the circuit board under rotating electrical machines 305's drive.

As shown in fig. 1, 2 and 10 of the specification, the heat conducting strip mounting device 4 includes two second support rods 401, a guide hopper 403 for guiding and mounting the heat conducting strip is disposed between the two second support rods 401, lower ends of the two second support rods 401 are fixedly connected to the base 5, the transmission unit 6 passes through between the two second support rods 401, a fourth beam 406 is fixedly connected between upper ends of the two second support rods 401, a mechanical arm 402 for moving the heat conducting strip is disposed on the fourth beam 406, a second positioning assembly 404 having the same structure as the first positioning assembly 302 is disposed on each side of the two second support rods 401 close to the transmission unit 6, and a mounting plate 302a of the second positioning assembly 404 is fixedly connected to the second support rods 401; the guide hopper 403 is arranged above the transmission unit 6, the guide hopper 403 is in a shape of a trapezoid cylinder with a wide top and a narrow bottom, the two ends of the guide hopper 403 are provided with second guide rods 408 in a vertically sliding manner, the upper ends of the second guide rods 408 are fixedly connected to the lower side of the fourth beam 406, and the guide hopper 403 is driven by an electric telescopic rod 405 fixedly arranged on the fourth beam 406 to slide vertically along the axial direction of the second guide rods 408. The transmission unit 6 moves the circuit board to be provided with the heat conducting strip to the position of the heat conducting strip installation device 4, the position of the circuit board to be provided with the heat conducting strip is positioned through the second positioning assembly 404, then the mechanical arm 402 clamps the heat conducting strip and puts into the guide hopper 403, and the guide hopper 403 realizes the position guide correction of the heat conducting strip, so that the circuit board slides downwards and falls on the circuit board to be assembled and fixed.

The utility model has the advantages that: 1. the automatic assembly of the circuit board can be realized by the aid of the transmission unit 6 in cooperation with the brushing heat-conducting paste device 1, the mounting hole testing device 2, the pin welding device 3, the heat-conducting fin mounting device 4 and the like, and the assembly efficiency of the circuit board is greatly improved.

2. The first positioning set 302 and the rotating motor 305 cooperate to realize positioning rotation of the circuit board, thereby facilitating assembly operations on both sides of the circuit board.

3. The guide hopper 403 guides the heat-conducting fins and the second positioning assembly 404 positions and clamps the circuit board so as to accurately mount the heat-conducting fins on the circuit board.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides an automatic assembly device of IGBT of inverter circuit which characterized in that: the method comprises the following steps:

the device (1) for brushing the heat-conducting paste is used for brushing the heat-conducting paste on the surface of the chip;

the mounting hole testing device (2), the mounting hole testing device (2) is used for realizing the blocking test of the pin jack of the circuit board;

the pin welding device (3) is used for realizing the welding and fixing of chip pins;

the heat conducting fin mounting device (4), the heat conducting fin mounting device (4) is used for mounting the heat conducting fin;

the base, apply paint heat conduction cream device (1), mounting hole testing arrangement (2), pin welding set (3) and conducting strip installation device (4) with a brush and all set up on the base, apply paint and be provided with transmission unit (6) between heat conduction cream device (1), mounting hole testing arrangement (2), pin welding set (3) and conducting strip installation device (4) with a brush.

2. The automatic IGBT assembling apparatus for an inverter circuit according to claim 1, wherein: the device (1) for brushing the heat-conducting paste comprises two first lifting structures (101) which are distributed in parallel, a transmission unit (6) penetrates through the two first lifting structures (101), the lower ends of the two first lifting structures (101) are fixedly connected onto a base (5), a first cross beam (102) is fixedly connected between the upper ends of the two first lifting structures (101), a brushing machine (103) is arranged on the first cross beam (102), an opening and closing mechanism (104) is arranged on one side, close to each other, of the two first lifting structures (101) in a lifting mode, two chip positioning clamping plates (105) used for clamping and positioning chips are arranged between the two opening and closing mechanisms (104), the chip positioning clamping plates (105) are located above the transmission unit (6), and a plurality of positioning clamping holes (106) are formed when the two chip positioning clamping plates (105) are close to each other.

3. The automatic IGBT assembling apparatus for an inverter circuit according to claim 2, wherein: first elevation structure (101) are including the body of rod (101a), it slides chamber (101b) to have seted up in body of rod (101a) to go up and down, the one side opening that slides chamber (101b) is close to goes up and down, it is provided with lift slider (101c) to slide from top to bottom in the smooth chamber of going up and down (101b), the lower extreme internally mounted of the body of rod (101a) has elevator motor (101e), the output shaft end of elevator motor (101e) is upwards and fixedly connected with lead screw (101d), the upper end of lead screw (101d) extend to in the smooth chamber of going up and down (101b) and with lift slider (101c) threaded connection, one side of lift slider (101c) is passed the opening in smooth chamber of going up and down (101b) and is connected with opening and shutting mechanism (104) each other.

4. The automatic IGBT assembling apparatus for an inverter circuit according to claim 2, wherein: the opening and closing mechanism (104) comprises an opening and closing guide rail (104a), two ends of the opening and closing guide rail (104a) are provided with sliding blocks (104c) driven to slide by opening and closing cylinders (104b) in a sliding mode, one side of each sliding block (104c) is fixedly connected with a chip positioning clamping plate (105), and under the telescopic driving of a push rod of the opening and closing cylinder (104b), the chip positioning clamping plates (105) fixedly connected with the two sliding blocks (104c) and one side of each sliding block (104c) are close to and far away from each other along the inside of the opening and closing guide rail (104 a).

5. The automatic IGBT assembling apparatus for an inverter circuit according to claim 1, wherein: the mounting hole testing device (2) comprises two first supporting rods (201), the lower ends of the two first supporting rods (201) are fixedly connected to a base (5), a second cross beam (210) is fixedly connected between the upper ends of the two first supporting rods (201), a transmission unit (6) penetrates through the two first supporting rods (201), a lifting plate (204) is arranged above the transmission unit (6), first guide rods (203) are arranged at the two ends of the lifting plate (204) in a vertical sliding mode, the upper ends of the two first guide rods (203) are fixedly connected to the second cross beam (210), the lifting plate (204) is driven by a lifting cylinder (206) fixedly mounted on the second cross beam (210) to move up and down, and a detection unit is arranged on the lower side of the lifting plate (204).

6. The automatic IGBT assembling device for the inverter circuit according to claim 5, wherein: the detection unit comprises a pressure sensing unit (205), the pressure sensing unit (205) is fixedly arranged on the lower side surface of the lifting plate (204), a U-shaped support (208) is arranged below the pressure sensing unit (205), two ends of the upper portion of the U-shaped support (208) are fixedly connected to the lower side surface of the lifting plate (204), a plurality of test rods (207) are arranged on the lower plate body of the U-shaped support (208) in a sliding mode along the up-down direction, the upper ends of the test rods (207) are fixedly connected with elastic pressure contact heads (202) used for limiting the downward moving direction, and a circuit board aligning assembly (209) used for aligning and positioning the position of a circuit board is arranged on the lower side of the U-shaped support (208);

the elastic pressure contact head (202) comprises an upper pressing block (202a) and a lower pressing block (202b) which are distributed up and down, a first spring (202c) is fixedly connected between the upper pressing block (202a) and the lower pressing block (202b), and the lower end of the lower pressing block (202b) is fixedly connected to the upper end of the testing rod (207).

7. The automatic IGBT assembling apparatus for an inverter circuit according to claim 6, wherein: the circuit board aligning component (209) comprises a V-shaped aligning rod (209a) with a V-shaped opening, the upper side of the aligning rod (209a) is fixedly connected with more than two vertical rods (209c) distributed in parallel, the upper ends of the vertical rods (209c) are connected with the bottom of a U-shaped support (208) in a sliding mode, a second spring (209b) is nested on the vertical rod (209c) between the bottom of the U-shaped support (208) and the upper portion of the aligning rod (209a), and two ends of the second spring (209b) are respectively fixedly connected with the U-shaped support (208) and the aligning rod (209 a).

8. The automatic IGBT assembling apparatus for an inverter circuit according to claim 1, wherein: the pin welding device (3) comprises two second lifting structures (301) with the same structure as the first lifting structure (101), the two second lifting structures (301) are distributed in parallel, the lower ends of the two second lifting structures (301) are fixedly connected to the base (5), the upper ends of the two second lifting structures (301) are fixedly connected with a third cross beam (304), and a welding machine (303) is arranged on the third cross beam (304);

two second elevation structure (301) are close to one side each other and all go up and down to be provided with rotating electrical machines (305), the lifting slide (101c) one side of second elevation structure (301) and the rotating electrical machines (305) that correspond are fixed connection each other, the output axle head of two rotating electrical machines (305) is relative each other and first locating component (302) of equal fixedly connected with, first locating component (302) are used for realizing the location clamping to the circuit board.

9. The automatic IGBT assembling apparatus for an inverter circuit according to claim 8, wherein: first locating component (302) is including mounting panel (302a), one side fixed connection of mounting panel (302a) to the output axle head of rotating electrical machines (305), the opposite side both ends of mounting panel (302a) are provided with locating lever (302c), locating lever (302c) are by fixed mounting location cylinder (302b) drive flexible on mounting panel (302a), the outside shaping of locating lever (302c) has spacing arch (302d), locating lever (302c) and circuit board correspond the position and offer locating hole (7) that some and cooperate each other and be connected.

10. The automatic IGBT assembling apparatus for an inverter circuit according to claim 1, wherein: the heat conducting strip mounting device (4) comprises two second supporting rods (401), a guide hopper (403) used for guiding and mounting the heat conducting strip is arranged between the two second supporting rods (401), the lower ends of the two second supporting rods (401) are fixedly connected to a base (5), a transmission unit (6) penetrates through the two second supporting rods (401), a fourth cross beam (406) is fixedly connected between the upper ends of the two second supporting rods (401), a mechanical arm (402) used for moving and operating the heat conducting strip is arranged on the fourth cross beam (406), second positioning assemblies (404) with the same structure as the first positioning assembly (302) are arranged on one sides of the two second supporting rods (401) close to the transmission unit (6), and mounting plates (302a) of the second positioning assemblies (404) are fixedly connected to the second supporting rods (401);

the guide hopper (403) is arranged above the transmission unit (6), the guide hopper (403) is in a trapezoid cylinder shape with a wide upper part and a narrow lower part, the two ends of the guide hopper (403) are provided with second guide rods (408) in a vertically sliding mode, the upper ends of the second guide rods (408) are fixedly connected to the lower side of a fourth cross beam (406), and the guide hopper (403) is driven by electric telescopic rods (405) fixedly mounted on the fourth cross beam (406) to slide vertically along the axial direction of the second guide rods (408).