CN214347561U - Dispensing structure - Google Patents

Dispensing structure Download PDF

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Publication number
CN214347561U
CN214347561U CN202023085124.4U CN202023085124U CN214347561U CN 214347561 U CN214347561 U CN 214347561U CN 202023085124 U CN202023085124 U CN 202023085124U CN 214347561 U CN214347561 U CN 214347561U
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China
Prior art keywords
glue
dispensing
groove
connecting piece
overflow
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CN202023085124.4U
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Chinese (zh)
Inventor
魏聪
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Goertek Techology Co Ltd
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Goertek Optical Technology Co Ltd
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Priority to CN202023085124.4U priority Critical patent/CN214347561U/en
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Abstract

The utility model discloses a structure is glued to point relates to the point and glues technical field. The glue dispensing structure comprises a first connecting piece and a second connecting piece, wherein a glue dispensing groove is formed in the first connecting piece, a connecting protrusion used for being inserted into the glue dispensing groove and being bonded with the glue dispensing groove through glue is arranged on the second connecting piece, and the glue dispensing groove or/and the connecting protrusion are/is provided with an anti-overflow glue flow channel. The utility model discloses the problem of colloid overflow has been solved to the structure is glued to the point, has guaranteed the outward appearance and the quality of product.

Description

Dispensing structure
Technical Field
The utility model relates to a glue technical field, concretely relates to glue structure is glued.
Background
Hot melt adhesives have been widely used because of their unique, stable, and robust properties.
At present, when two parts of an electronic product are bonded, a dispensing groove and a connecting protrusion are often arranged on the two parts respectively, a glue body is dispensed into the dispensing groove, and then the connecting protrusion is inserted into the dispensing groove and is bonded with the dispensing groove through the glue body, so that the two parts are connected.
Although the structure can play a role in bonding, when the pressure maintaining is carried out on the two parts, the colloid in the glue dispensing groove overflows to the two parts, and the appearance and the quality of a product are seriously influenced.
SUMMERY OF THE UTILITY MODEL
To the above defect that prior art exists, the utility model provides a structure is glued to point, this point structure of gluing has solved the problem of colloid overflow.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the glue dispensing structure comprises a first connecting piece and a second connecting piece, wherein a glue dispensing groove is formed in the first connecting piece, a connecting protrusion used for being inserted into the glue dispensing groove and being bonded with the glue dispensing groove through glue is arranged on the second connecting piece, and the glue dispensing groove or/and the connecting protrusion are/is provided with an anti-overflow glue flow channel.
Wherein, the glue overflow preventing runner is in a wave shape.
The glue overflow preventing runner is arranged on the bottom wall of the glue dispensing groove.
The cross section of the glue overflow preventing runner is arc-shaped or U-shaped.
The cross-sectional profile of the glue dispensing groove is U-shaped.
Wherein, two groove lateral walls height degrees of point gluey groove are not equal.
And a glue accommodating gap is arranged between the groove side wall and the connecting bulge.
Wherein the colloid is hot melt adhesive.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides a glue dispensing structure, because the point is glued groove or/and is connected the arch and be provided with the anti-overflow and glue the runner, consequently, when the point that puts into a certain amount of colloid and second connecting piece in the point is glued the inslot, the anti-overflow is glued the runner and can be acceptd a part colloid, prevents that the colloid overflow of point inslot from leading to the fact the pollution to first connecting piece and second connecting piece to the outside, compares with prior art, the utility model discloses glue dispensing structure has solved the problem of colloid overflow, has guaranteed the outward appearance and the quality of product.
Drawings
Fig. 1 is a schematic structural view of a dispensing slot and an overflow-proof runner in the dispensing structure of the present invention;
fig. 2 is a sectional view of the dispensing slot and the connecting protrusion in the dispensing structure of the present invention;
fig. 3 is a sectional view of the dispensing structure of the present invention;
in the figure: 1-a first connecting piece, 11-a glue dispensing groove, 12-an anti-overflow glue flow channel, 2-a second connecting piece, 21-a connecting bulge, 3-glue and 4-a glue accommodating gap.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in fig. 1 to 3, the dispensing structure includes a first connecting member 1 and a second connecting member 2, the first connecting member 1 is provided with a dispensing slot 11, the second connecting member 2 is provided with a connecting protrusion 21, the dispensing slot 11 is used for accommodating a glue body 3 and the connecting protrusion 21, the connecting protrusion 21 is used for being inserted into the dispensing slot 11 and being bonded with the dispensing slot 11 through the glue body 3, and the dispensing slot 11 or/and the connecting protrusion 21 is/are provided with an anti-overflow glue channel 12.
The glue overflow preventing flow channel 12 in this embodiment is disposed on the bottom wall of the dispensing slot 21, in practical application, the glue overflow preventing flow channel 12 may also be disposed on the side wall of the dispensing slot 11, the connecting protrusion 21, or the bottom wall of the dispensing slot 11, the side wall of the dispensing slot, and the connecting protrusion 21, which is specifically selected according to practical requirements, and this embodiment is not limited to this,
the anti-overflow glue runner 12 in this embodiment is wavy, and because when the pressurize frock pressurize first connecting piece 1 and second connecting piece 2, can have the uneven condition of pressurize power, wavy anti-overflow glue runner 12 not only can accept partly colloid 3, prevents the colloid overflow, can effectively guarantee moreover that the both sides of connecting protrusion 21 and colloid 3 contact are glued highly unanimously, improve the bonding quality.
In order to facilitate the flow of the glue 3, in this embodiment, the cross-sectional profile of the glue overflow preventing flow channel 12 is preferably circular arc-shaped or U-shaped, and in practical applications, the cross-sectional profile of the glue overflow preventing flow channel 12 may also be square, polygonal or triangular, which is specifically selected according to practical requirements, which is not limited in this embodiment.
In order to facilitate the glue 3 to flow into the bottom of the glue dispensing slot 11, in this embodiment, it is preferable that the cross-sectional profile of the glue dispensing slot 11 is U-shaped, and in practical application, the cross-sectional profile of the glue dispensing slot 11 may also be square, which is specifically selected according to practical requirements, and this embodiment is not limited thereto.
In this embodiment, the heights of the two side walls of the dispensing slot 11 are different, and may be equal in practical application.
In order to improve the bonding effect, the glue accommodating gap 4 is provided between the groove side wall of the glue dispensing groove 11 and the connecting protrusion 21, so that the glue 3 can conveniently climb to the position between the groove side wall of the glue dispensing groove 11 and the connecting protrusion 21 to bond the groove side wall of the glue dispensing groove 11 and the connecting protrusion 21.
Specifically, glue containing gap 4 is arranged between a shorter groove side wall and connecting protrusion 21, in practical application, glue containing gap 4 may also be arranged between a higher groove side wall and connecting protrusion 21, or glue containing gap 4 is arranged between connecting protrusion 21 and two groove side walls, and the glue containing gap is specifically selected according to actual requirements, which is not limited in this embodiment.
The glue body 3 in this embodiment is preferably a hot melt glue, since it has stable and strong properties.
When the glue dispensing device is used, a certain amount of glue is dispensed into the glue dispensing groove 11, the connecting protrusion 21 of the second connecting piece 2 is inserted into the glue dispensing groove 11 of the first connecting piece 1, the glue overflow preventing flow channel 12 at the moment can accommodate a part of glue 3, and the glue 3 in the glue dispensing groove 11 overflows to the outside to pollute the first connecting piece 1 and the second connecting piece 2.
According to the above embodiment, the utility model discloses glue the structure, solved the problem of 3 overflows of colloid, guaranteed the outward appearance and the quality of product.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without the labor of creation from the above conception, which falls within the protection scope of the present invention.

Claims (8)

1. The glue dispensing structure comprises a first connecting piece and a second connecting piece, wherein a glue dispensing groove is formed in the first connecting piece, a connecting protrusion used for being inserted into the glue dispensing groove and being bonded with the glue dispensing groove through glue is arranged on the second connecting piece, and the glue dispensing structure is characterized in that the glue dispensing groove or/and the connecting protrusion are/is provided with an overflow glue preventing runner.
2. The dispensing structure of claim 1, wherein the overflow-preventing runner is wavy.
3. The dispensing structure of claim 1, wherein the overflow-proof runner is disposed on a bottom wall of the dispensing slot.
4. The dispensing structure of claim 1, wherein the cross-sectional profile of the overflow-preventing runner is circular arc-shaped or U-shaped.
5. The dispensing structure according to any one of claims 1 to 4, wherein the dispensing slot has a U-shaped cross-sectional profile.
6. The dispensing structure of claim 5, wherein the dispensing slot has two slot sidewalls of unequal height.
7. The dispensing structure of claim 6, wherein a glue containing gap is arranged between the side wall of the groove and the connecting protrusion.
8. The dispensing structure of claim 5, wherein the adhesive is a hot melt adhesive.
CN202023085124.4U 2020-12-17 2020-12-17 Dispensing structure Active CN214347561U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023085124.4U CN214347561U (en) 2020-12-17 2020-12-17 Dispensing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023085124.4U CN214347561U (en) 2020-12-17 2020-12-17 Dispensing structure

Publications (1)

Publication Number Publication Date
CN214347561U true CN214347561U (en) 2021-10-08

Family

ID=77986115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023085124.4U Active CN214347561U (en) 2020-12-17 2020-12-17 Dispensing structure

Country Status (1)

Country Link
CN (1) CN214347561U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221227

Address after: 266104 No. 500, Songling Road, Laoshan District, Qingdao, Shandong

Patentee after: GOERTEK TECHNOLOGY Co.,Ltd.

Address before: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronics office building)

Patentee before: GoerTek Optical Technology Co.,Ltd.

TR01 Transfer of patent right