CN214327875U - Support plate device suitable for double-sided coating and coating equipment - Google Patents
Support plate device suitable for double-sided coating and coating equipment Download PDFInfo
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- CN214327875U CN214327875U CN202120239114.7U CN202120239114U CN214327875U CN 214327875 U CN214327875 U CN 214327875U CN 202120239114 U CN202120239114 U CN 202120239114U CN 214327875 U CN214327875 U CN 214327875U
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- hole
- support plate
- carrier
- carrier plate
- small
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- 239000011248 coating agent Substances 0.000 title claims abstract description 39
- 238000000576 coating method Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000010935 stainless steel Substances 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 9
- 230000000873 masking effect Effects 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The utility model provides a support plate device and coating equipment suitable for two-sided coating film, this support plate device include first substrate support plate and second substrate support plate, be provided with first through-hole on the first substrate support plate, be provided with the second through-hole on the second substrate support plate, the second through-hole with first through-hole intercommunication forms the boss hole that the cross-section is the T type. The carrier plate device of the utility model realizes the simultaneous coating of two surfaces without using a cover plate, thereby reducing the equipment manufacturing and purchasing cost; the production efficiency and the process yield are improved.
Description
Technical Field
The utility model relates to a coating equipment technical field specifically is a support plate device and coating equipment suitable for two-sided coating film.
Background
Vacuum coating equipment mainly refers to a type of coating needing to be carried out under a higher vacuum degree, and specifically comprises a plurality of types of vacuum ion evaporation, magnetron sputtering (MBE), Molecular Beam Epitaxy (PLD), Laser sputtering Deposition and the like, and mainly comprises two types of evaporation and sputtering.
Vacuum coating equipment in the prior art is a single-sided coating mode, and when double-sided coating is required, the method is generally adopted as follows: after one surface is plated, the other surface film is plated through automatic turnover, so that two coating devices are needed, the turnover-assisted automatic device is needed, the yield and the coating efficiency are low, and the working process of vacuum coating is influenced. In addition, the carrier plate of the conventional coating equipment needs the cover plate to cover the mask, and the carrier plate is easy to deform and cause a plating winding phenomenon, so that the process yield is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a support plate device and coating film equipment suitable for two-sided coating film, the support plate of solving traditional coating film equipment is because of the output and the coating film inefficiency that design defect leads to and the low level technical problem of processing procedure yield.
In order to achieve the above object, the present invention provides the following technical solutions:
a support plate device suitable for double-sided coating comprises a first substrate support plate and a second substrate support plate, wherein a first through hole is formed in the first substrate support plate, a second through hole is formed in the second substrate support plate, and the second through hole is communicated with the first through hole to form a boss hole with a T-shaped cross section.
In a preferred embodiment, the first substrate carrier is a carrier tray, the second substrate carrier is a small carrier, and the aperture of the first through hole on the carrier tray is smaller than the aperture of the second through hole on the small carrier, so that the first through hole on the carrier tray and the second through hole on the small carrier are communicated to form the boss hole.
In a preferred embodiment, the side wall of the second through hole is obliquely arranged, so that the second through hole is funnel-shaped; wherein the inclination angle of the side wall of the second through hole in the vertical direction is 20-25 °.
Preferably, the sidewall of the second through hole is inclined at an angle of 22 ° in the vertical direction.
In a preferred embodiment, the step width of the boss hole is 0.95 to 1.2 mm.
Preferably, the step width of the boss hole is 1.2 mm.
In a preferred embodiment, screw holes are correspondingly formed in the edges of the carrier plate tray and the small carrier plate, and screws are arranged in the screw holes to fixedly connect the carrier plate tray and the small carrier plate.
In a preferred embodiment, the carrier tray is provided with a positioning pin, and the small carrier is correspondingly provided with a positioning hole adapted to the positioning pin.
In a preferred embodiment, the carrier plate tray is made of a titanium alloy material.
In a preferred embodiment, the small carrier plate is made of stainless steel.
Preferably, the first through hole and the second through hole are square holes.
In a preferred embodiment, the surfaces of the carrier plate tray and the small carrier plate are both subjected to micron-sized fine polishing treatment, so that the carrier plate tray and the small carrier plate are seamlessly attached.
The utility model also provides a coating equipment of including above-mentioned support plate device.
Compared with the prior art, the utility model discloses a support plate device and coating equipment suitable for two-sided coating film, its beneficial effect lies in: the utility model realizes simultaneous coating on both sides by the design of the carrier plate without using a cover plate, thereby reducing the equipment manufacturing and purchasing costs; the productivity of the equipment is improved, and because of the finish machining design of the slot plane of the carrier plate, the four edge parts of the carrier plate are supported by the carrier plate and are tightly pasted, so that the function of automatic edge masking is realized in the back surface film coating process of the carrier plate, and the product reject ratio is reduced.
Drawings
In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings used in the description of the embodiment will be briefly introduced below. It should be apparent that the drawings in the following description are only for the purpose of illustrating the embodiments of the present invention or the technical solutions in the prior art more clearly, and that other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a side sectional view of a carrier plate apparatus according to an embodiment of the present invention;
fig. 2 is a side sectional view of a carrier plate apparatus according to another embodiment of the present invention;
fig. 3 is a front view of a carrier plate apparatus according to an embodiment of the present invention;
fig. 4 is a perspective view of a carrier plate device in an embodiment of the present invention;
fig. 5 is a side view of a plate carrier device according to an embodiment of the present invention;
fig. 6 is a front view of a carrier plate apparatus according to another embodiment of the present invention;
1-1, a first substrate carrier plate; 1-2, a first through hole; 1-3, side wall; 2-1, a second substrate carrier; 2-2, a first through hole; 1. a carrier plate tray; 2. a small carrier plate; 3. a screw; 4. and a positioning pin.
Detailed Description
The invention will be further described with reference to specific embodiments, the advantages and features of the invention will become more apparent as the description proceeds. These examples are merely illustrative and do not limit the scope of the invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
In the description of the present embodiments, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to a number of indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
Referring to the attached drawing 1, the carrier plate device suitable for double-sided coating of the present invention comprises a first substrate carrier plate 1-1 and a second substrate carrier plate 2-1, wherein the first substrate carrier plate 1-1 is provided with a first through hole 1-2, the second substrate carrier plate 2-1 is provided with a second through hole 2-2, and the second through hole 2-2 is communicated with the first through hole 1-2 to form a boss hole with a T-shaped cross section.
The utility model discloses in, second through-hole 2-2 with first through-hole 1-2 intercommunication forms the boss hole that the cross-section is the T type, be used for with the substrate is placed in the boss recess in boss hole, and the structure in boss hole sets up for the coating film can be simultaneously on the two sides of substrate, and needn' T use the apron, has reduced the cost of equipment manufacturing and purchase, has improved work efficiency, has promoted the equipment productivity. And because the groove plane finish machining design of the carrier plate, the four edge parts of the carrier plate are supported and tightly attached to the steps of the boss, the width range of the steps is the width of the mask, the effect of automatic edge masking is achieved in the back surface film coating process of the substrate, and the reject ratio of products is reduced.
Referring to fig. 2, in another preferred embodiment of the present invention, the side wall 1-3 of the first through hole 1-2 is inclined to form a funnel shape of the first through hole 1-2; wherein, the inclination angle of the side wall 1-3 of the first through hole 1-2 in the vertical direction is 20-25 degrees. Preferably, the sidewall 1-3 of the first through hole 1-2 is inclined at an angle of 22 ° in the vertical direction. The structure is arranged, the inclined plane of the hole wall enlarges the opening of the through hole, when the substrate deviates from the position of the through hole above the through hole, the edge of the substrate can contact with the inclined plane of the side wall 1-3 after falling down, and then the substrate falls into the groove formed by the first through hole 1-2 and the second through hole 2-2 along the inclined plane under the guiding action of the inclined plane, so that when the manipulator and the visual system of the substrate during installation have deviation or the reciprocating precision has problems, the substrate can still accurately enter the groove, the success rate of installing the substrate is improved, the yield is improved, and the cost is saved.
Referring to fig. 3-5, in a preferred embodiment, the first substrate carrier is a carrier tray 1, and the second substrate carrier is a small carrier 2, preferably, screw holes are correspondingly formed on the edges of the carrier tray 1 and the small carrier 2, and screws 3 are disposed in the screw holes to fixedly connect the carrier tray 1 and the small carrier 2, so as to facilitate detachment and installation; a plurality of first through holes and second through holes are correspondingly formed in the carrier plate tray 1 and the small carrier plate 2 respectively, and the aperture of the first through hole in the carrier plate tray 1 is smaller than that of the second through hole in the small carrier plate 2, so that the first through hole in the carrier plate tray 1 is communicated with the second through hole in the small carrier plate 2 to form the boss hole. Wherein, the step width of the boss hole is 0.95-1.2 mm. The aperture of the small carrier plate 2 is slightly larger than that of the carrier plate tray 1, the difference range of the aperture of the small carrier plate and the aperture of the carrier plate is the step width of the boss hole, namely the mask width, and the function of mechanical masking of the bottom surface of the substrate is achieved.
In this embodiment, the first through holes and the second through holes respectively formed in the carrier plate tray 1 and the small carrier plate 2 are square holes, the difference in aperture between the through holes in the carrier plate tray 1 and the small carrier plate 2 is 0.95-1.2 mm, and preferably, the difference in aperture between the through holes in the carrier plate tray 1 and the small carrier plate 2 is 1.2 mm.
Referring to fig. 6, in order to facilitate the fixed installation of the carrier tray 1 and the small carrier 2 and ensure that the step width of each boss hole is accurate and consistent, in a preferred embodiment, a positioning pin 4 is disposed on the carrier tray 1, a positioning hole adapted to the positioning pin 4 is correspondingly disposed on the small carrier 2, and the positioning pin 4 is inserted into the positioning hole. In specific implementation, a plurality of positioning pins 4 can be arranged on the carrier plate tray 1, a plurality of positioning holes are correspondingly arranged on the small carrier plate 2, the small carrier plate 2 and the carrier plate tray 1 are fixed after being sleeved according to the positioning pins 4 and the positioning holes, and then screws 3 are screwed into corresponding screw holes on the edges of the carrier plate tray 1 and the small carrier plate 2, so that the carrier plate tray 1 and the small carrier plate 2 are fixedly connected.
In a preferred embodiment, the carrier plate tray 1 is made of a titanium alloy material. The titanium alloy has high strength, good corrosion resistance and high heat resistance, and meets the requirements of vacuum coating. The small carrier plate 2 is made of stainless steel. The stainless steel small carrier plate can meet the requirement of rigidity and non-deformation hardness, so that the micro deformation caused by long-term taking and placing of the cover plate is reduced, and the mechanical mask effect is achieved.
In another preferred embodiment, the surfaces of the carrier tray 1 and the small carrier 2 are both processed by micron-sized fine polishing, so that the carrier tray 1 and the small carrier 2 are seamlessly attached.
The utility model discloses in, above-mentioned support plate tray 1 and substrate size can design according to the user demand, only need the technological property can satisfy the requirement can, do not block in the size. Likewise, the modular design of the small carrier plate 2 can be customized and combined according to the use requirements.
In this specific embodiment, the substrate may be a silicon wafer for forming a cell, and the silicon wafer may be used as a substrate to realize double-sided coating to manufacture a high-efficiency solar cell such as a HeteroJunction cell (HJT for short) with a high intrinsic thin film.
The carrier plate device suitable for double-sided coating is characterized in that: 1. the small stainless steel carrier plate is fixedly connected with the carrier plate tray to form a boss hole type structure, so that the mechanical masking effect on the back surface of the battery piece is achieved, and the edge of the transparent conductive oxide film (usually an ITO material) is isolated during film coating. 2. The step width of the small stainless steel carrier plate is 1.2mm, the theoretical mechanical mask width is 0.95mm, the shielding area is small, and the battery filling factor is high; 3. the small stainless steel carrier plate can not damage the amorphous silicon passivation layer; 4. at 100 ℃, the width of the limit mechanical mask is more than 0.2mm, and the tolerance limit of the limit sheet placing is more than 0.25 mm; 5. when the process temperature of the inner groove of the small stainless steel carrier plate rises, the edge of the groove is widened due to thermal expansion, and the damage to the battery piece is avoided.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The utility model provides a support plate device suitable for two-sided coating film which characterized in that: the novel substrate support plate comprises a first substrate support plate and a second substrate support plate, wherein a first through hole is formed in the first substrate support plate, a second through hole is formed in the second substrate support plate, and the second through hole is communicated with the first through hole to form a boss hole with a T-shaped cross section.
2. The carrier board device suitable for double-sided coating according to claim 1, wherein: the first substrate carrier plate is a carrier plate tray, the second substrate carrier plate is a small carrier plate, and the aperture of the first through hole on the carrier plate tray is smaller than that of the second through hole on the small carrier plate, so that the first through hole on the carrier plate tray is communicated with the second through hole on the small carrier plate to form the boss hole.
3. The carrier board device suitable for double-sided coating according to claim 1 or 2, wherein: the side wall of the second through hole is obliquely arranged, so that the second through hole is funnel-shaped;
wherein the inclination angle of the side wall of the second through hole in the vertical direction is 20-25 °.
4. The carrier board device suitable for double-sided coating according to claim 1 or 2, wherein: the step width of the boss hole is 0.95-1.2 mm.
5. The carrier board device suitable for double-sided coating according to claim 2, wherein: the edge of the support plate tray and the edge of the small support plate are correspondingly provided with screw holes, and screws are arranged in the screw holes and fixedly connect the support plate tray and the small support plate.
6. The carrier board device suitable for double-sided coating according to claim 2, wherein: the carrier plate tray is provided with a positioning pin, and the small carrier plate is correspondingly provided with a positioning hole matched with the positioning pin.
7. The carrier board device suitable for double-sided coating according to claim 2, wherein: the carrier plate tray is made of a titanium alloy material.
8. The carrier board device suitable for double-sided coating according to claim 2, wherein: the small carrier plate is made of stainless steel.
9. The carrier board device suitable for double-sided coating according to claim 2, wherein: the surface of the support plate tray and the surface of the small support plate are both subjected to micron-sized fine polishing treatment, so that the support plate tray and the small support plate are seamlessly attached.
10. A coating equipment is characterized in that: comprising a carrier plate arrangement according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120239114.7U CN214327875U (en) | 2021-01-26 | 2021-01-26 | Support plate device suitable for double-sided coating and coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120239114.7U CN214327875U (en) | 2021-01-26 | 2021-01-26 | Support plate device suitable for double-sided coating and coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214327875U true CN214327875U (en) | 2021-10-01 |
Family
ID=77907087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120239114.7U Expired - Fee Related CN214327875U (en) | 2021-01-26 | 2021-01-26 | Support plate device suitable for double-sided coating and coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214327875U (en) |
-
2021
- 2021-01-26 CN CN202120239114.7U patent/CN214327875U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211001 |
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| CF01 | Termination of patent right due to non-payment of annual fee |