CN214315743U - Circuit board with waterproof construction just has high efficiency heat radiation structure - Google Patents
Circuit board with waterproof construction just has high efficiency heat radiation structure Download PDFInfo
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- CN214315743U CN214315743U CN202120521545.2U CN202120521545U CN214315743U CN 214315743 U CN214315743 U CN 214315743U CN 202120521545 U CN202120521545 U CN 202120521545U CN 214315743 U CN214315743 U CN 214315743U
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- circuit board
- air
- waterproof
- main body
- efficiency heat
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Abstract
The utility model discloses a circuit board with waterproof construction just has high efficiency heat radiation structure, including the circuit board main part, the circuit board main part is circular structure, is provided with main control chip in the circuit on it, the one side that has components and parts of circuit board main part is encapsulated by a waterproof structure. The utility model discloses a circuit board is not only through the radiator heat dissipation, and the main control chip on the circuit board dispels the heat through volatile liquid medium. The utility model discloses a waterproof construction spare makes under the sealed condition of circuit board, volatile liquid medium can very big improvement radiating efficiency, improves main control chip's life.
Description
Technical Field
The utility model relates to a circuit board, specific saying so relates to a circuit board with waterproof construction just has high efficiency heat radiation structure.
Background
The name of the circuit board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, multilayer circuit board body, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin multilayer circuit board body, ultra-thin circuit board, printed (copper etching technology) circuit board etc..
Array LED lamp commonly used in the market can produce a large amount of heats at the during operation, and these heats conduction are for the components and parts on the circuit board, influence the life of components and parts.
Especially the operation of the main control chip, also generates a lot of heat, which needs to be exhausted, and therefore, a heat sink is needed. In the conventional method, a heat sink is mounted on a circuit board to solve the problem of heat dissipation, and a fan is mounted on the heat sink. However, because the circuit board needs to be sealed, the heat dissipation of the main control chip can only be cooled by adopting a traditional heat dissipation mode, but the effect is poor.
SUMMERY OF THE UTILITY MODEL
To the not enough among the prior art, the to-be-solved technical problem of the utility model lies in providing a circuit board that has waterproof construction and has high efficiency heat radiation structure, the purpose of designing this circuit board is to improve the radiating efficiency.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model discloses a circuit board with waterproof construction and high efficiency heat radiation structure, including the circuit board main part, the circuit board main part is circular structure, is provided with the main control chip in the circuit on it, the one side of having components and parts of the circuit board main part is encapsulated by a waterproof structure;
the waterproof structural member is an integrated circular body, the bottom of the waterproof structural member is an annular structural body, a ring-shaped dam body is vertically arranged along the upper annular surface of the annular structural body, an upper through cavity and a lower through cavity are formed in the dam body, two layers of annular grooves are formed in the inner wall of the dam body, and the circuit board main body is embedded into the lower annular groove;
the circuit board also comprises a radiator, wherein the radiator is of a circular structure and is provided with an annular outer convex edge, the annular outer convex edge is embedded into an upper-layer annular groove of the dam body, and a sealing cavity is formed between the annular outer convex edge and the circuit board main body;
the circuit board main body is provided with a heat conductor on one surface facing the sealing cavity, the heat conductor covers the main control chip, the circuit board main body is provided with a spiral cavity, a first spiral pipe is screwed in the spiral cavity, and a volatile liquid medium is filled in the first spiral pipe;
the radiator top surface is equipped with air-cooled ware, and this air-cooled ware has the air-cooled chamber and arranges the fan installation cavity of air-cooled chamber upside in, the second spiral pipe is equipped with in the air-cooled intracavity, the fan is equipped with in the fan installation cavity, air-cooled ware side direction air inlet makes wind get into the air-cooled chamber, and the air-out up in air-cooled chamber passes through the fan is discharged, the second spiral pipe invert and through the pipe with first spiral pipe is connected and is formed backflow pipeline, and the pipe passes the radiator top surface is sealed passing the department.
Further, the volatile liquid medium is one of ethylene glycol and propylene glycol.
Furthermore, the radiator is an aluminum radiator, and radiating fins are arranged on the side face of the radiator.
Further, the heat conductor is an aluminum heat conductor.
Further, the waterproof structure is silica gel.
Furthermore, a circle of arc groove is formed in an outer angle formed between the dam body and the annular structure body of the waterproof structural member.
Further, the circuit board main body is a circular nonporous circuit board.
Furthermore, a plurality of screw holes are formed in the upper ring surface of the outer side of the ring surface structural body.
Further, the first spiral pipe is an aluminum pipe.
Further, the second spiral pipe is an aluminum pipe.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a circuit board is not only through the radiator heat dissipation, and the main control chip on the circuit board dispels the heat through volatile liquid medium. The utility model discloses a waterproof construction spare makes under the sealed condition of circuit board, volatile liquid medium can very big improvement radiating efficiency, improves main control chip's life.
Drawings
Fig. 1 is a schematic structural diagram of the circuit board of the present invention.
Fig. 2 is the utility model discloses the battery of lens of circuit board and peripheral hardware installs the schematic diagram in advance.
Fig. 3 is the structure diagram of the circuit board and the peripheral lens assembly after installation.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Embodiment 1, the utility model discloses a specific structure as follows:
referring to fig. 1, the circuit board with a waterproof structure and a high-efficiency heat dissipation structure of the present invention includes a circuit board main body 6, wherein the circuit board main body 6 is a circular structure, a main control chip 8 is disposed in a circuit thereon, and a surface of the circuit board main body 6 having components is encapsulated by a waterproof structure 10;
the waterproof structural member 10 is an integral circular body, the bottom of the waterproof structural member is an annular structural body, a ring-shaped dam body is vertically arranged along the upper annular surface of the annular structural body, an upper through cavity and a lower through cavity are formed in the dam body, two layers of annular grooves are formed in the inner wall of the dam body, and the circuit board main body 6 is embedded into the lower annular groove;
the circuit board further comprises a radiator 9, wherein the radiator 9 is of a circular structure and is provided with an annular outer convex edge, the annular outer convex edge is embedded into an upper-layer annular groove of the dam body, and a sealing cavity is formed between the annular outer convex edge and the circuit board main body 6;
the circuit board main body 6 is provided with a heat conductor 5 on one surface facing the sealing cavity, the main control chip 8 is covered by the heat conductor 5, the circuit board main body is provided with a spiral cavity, a first spiral pipe 4 is screwed in the spiral cavity, and a volatile liquid medium is filled in the first spiral pipe 4;
A preferred technical solution of this embodiment: the volatile liquid medium is one of ethylene glycol and propylene glycol.
A preferred technical solution of this embodiment: the radiator 9 is an aluminum radiator, and radiating fins are arranged on the side face of the radiator.
A preferred technical solution of this embodiment: the heat conductor 5 is an aluminum heat conductor.
A preferred technical solution of this embodiment: the waterproof structure 10 is silica gel.
A preferred technical solution of this embodiment: the outer angle formed between the dam body and the annular structure body of the waterproof structural member 10 is provided with a circle of arc grooves 11.
A preferred technical solution of this embodiment: the circuit board main body 6 is a circular non-porous circuit board.
A preferred technical solution of this embodiment: the upper ring surface of the outer side of the ring surface structural body is provided with a plurality of screw holes.
A preferred technical solution of this embodiment: the first spiral pipe 4 is an aluminum pipe.
A preferred technical solution of this embodiment: the second spiral pipe 3 is an aluminum pipe.
Example 2:
as shown in fig. 2-3, the LED array 7 is installed on the outward side of the circuit board of the present invention, and the installation structure of the circuit board and the lens set is:
the lens group comprises a circular base 12 and a concave lens 13, wherein the concave lens 13 is arranged in a circular hole in the middle of the circular base 12. Through the screw, will the utility model discloses a waterproof structure 10 install in on the circular base 12, make all LED array 7 orientations concave lens 13. Because the concave lens 13 is sealed with the circular base 12, after the waterproof structural member 10 is installed, a cavity formed by the waterproof structural member, the circular base 12 and the concave lens 13 is a sealed cavity, and the LED array 7 is located in the sealed cavity, so that the waterproof purpose is achieved.
When the LED array 7 works, a large amount of heat is emitted by the LED array and conducted to the circuit board main body 6, a part of heat is conducted to the heat conductor 5 by the circuit board main body 6, the other part of heat enters air in the sealed cavity, and the heat in the air is conducted to the radiator 9. The radiator 9 conducts heat to the outside air, so as to achieve the purpose of heat dissipation.
The main control chip 8 during operation, the heat that sends mainly conducts for heat conduction ware 5, and heat conduction ware 5 conducts the heat for first spiral pipe 4 again, and the liquid medium in the first spiral pipe 4 is heated and volatilizees and form gaseous state medium, and gaseous state medium gets into second spiral pipe 3 along the pipe. Because second spiral pipe 3 is in the air passing chamber, fan 2 outwards airs exhaust, and outside air gets into the air passing chamber from the lateral part, and the air flow makes second spiral pipe 3 cool down, and then makes the gaseous state medium cooling in the second spiral pipe 3, forms liquid medium after the gaseous state medium cooling and flows back to first spiral pipe 5 from the pipe, reaches radiating purpose.
To sum up, the utility model discloses a circuit board not only dispels the heat through the radiator, and the main control chip on the circuit board dispels the heat through volatile liquid medium. The utility model discloses a waterproof construction spare makes under the sealed condition of circuit board, volatile liquid medium can very big improvement radiating efficiency, improves main control chip's life.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (10)
1. A circuit board with a waterproof structure and a high-efficiency heat dissipation structure comprises a circuit board main body (6), wherein the circuit board main body (6) is a circular structural member, and a main control chip (8) is arranged in a circuit on the circuit board main body, and is characterized in that one surface, provided with components, of the circuit board main body (6) is packaged by a waterproof structural member (10);
the waterproof structural member (10) is an integrated circular body, the bottom of the waterproof structural member is an annular structural body, a ring dam body is vertically arranged along the upper annular surface of the annular structural body, an upper through cavity and a lower through cavity are formed in the ring dam body, two layers of annular grooves are formed in the inner wall of the ring dam body, and the circuit board main body (6) is embedded into the lower annular grooves;
the circuit board further comprises a radiator (9), the radiator (9) is of a circular structure and is provided with an annular outer convex edge, the annular outer convex edge is embedded into an upper-layer annular groove of the dam body, and a sealing cavity is formed between the annular outer convex edge and the circuit board main body (6);
the circuit board main body (6) is provided with a heat conductor (5) on one surface facing the sealing cavity, the main control chip (8) is covered by the heat conductor (5), the circuit board main body is provided with a spiral cavity, a first spiral pipe (4) is screwed in the spiral cavity, and a volatile liquid medium is filled in the first spiral pipe (4);
radiator (9) top surface is equipped with air-cooled ware (1), and this air-cooled ware (1) has the air-cooled chamber and arranges the fan installation cavity of air-cooled chamber upside in, be equipped with second spiral pipe (3) in the air-cooled intracavity, fan installation cavity is equipped with fan (2), air-cooled ware (1) side direction air inlet makes wind get into the air-cooled chamber, and the air-cooled chamber up air-out passes through fan (2) discharge, second spiral pipe (3) invert and through the pipe with form backflow pipeline is connected in first spiral pipe (4), and the pipe passes radiator (9) top surface is sealed passing the department.
2. The circuit board with waterproof structure and high-efficiency heat-dissipating structure according to claim 1, wherein the volatile liquid medium is one of ethylene glycol and propylene glycol.
3. The circuit board with waterproof structure and high-efficiency heat dissipation structure as claimed in claim 1, wherein the heat sink (9) is an aluminum heat sink with fins on its side.
4. The circuit board with waterproof structure and high-efficiency heat dissipation structure as claimed in claim 1, wherein the heat conductor (5) is an aluminum heat conductor.
5. The circuit board with waterproof structure and high-efficiency heat dissipation structure according to claim 1, wherein the waterproof structure (10) is silicone.
6. A wiring board with a waterproof structure and a high-efficiency heat-dissipating structure according to claim 1, wherein the waterproof structure (10) has a circular arc groove (11) formed at an outer corner formed between the dam body and the torus structure.
7. The wiring board having a waterproof structure and a high-efficiency heat-dissipating structure according to claim 1, wherein the wiring board main body (6) is a circular non-porous wiring board.
8. The circuit board with waterproof structure and high-efficiency heat dissipation structure as claimed in claim 1, wherein the upper ring surface of the outer side of the ring surface structure is provided with a plurality of screw holes.
9. The wiring board with waterproof structure and high-efficiency heat-dissipating structure according to claim 1, wherein the first spiral tube (4) is an aluminum tube.
10. The wiring board with waterproof structure and high-efficiency heat-dissipating structure according to claim 1, wherein the second spiral tube (3) is an aluminum tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120521545.2U CN214315743U (en) | 2021-03-12 | 2021-03-12 | Circuit board with waterproof construction just has high efficiency heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120521545.2U CN214315743U (en) | 2021-03-12 | 2021-03-12 | Circuit board with waterproof construction just has high efficiency heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214315743U true CN214315743U (en) | 2021-09-28 |
Family
ID=77836245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120521545.2U Active CN214315743U (en) | 2021-03-12 | 2021-03-12 | Circuit board with waterproof construction just has high efficiency heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214315743U (en) |
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2021
- 2021-03-12 CN CN202120521545.2U patent/CN214315743U/en active Active
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