CN214315718U - Electronic device - Google Patents

Abstract

The utility model provides an electronic equipment, it includes: a 1 st telescoping member having a 1 st surface and a 2 nd surface opposite the 1 st surface; a flexible insulating substrate on the 2 nd side; and a wiring disposed on the insulating base material, wherein the 1 st extensible member has a plurality of 1 st holes that are open on the 1 st surface side and are arranged at intervals.

Description

Electronic device

The present application is based on and claims priority from japanese patent application 2020-. The entire contents of this japanese patent application are incorporated by reference in the present application.

Technical Field

The utility model discloses an embodiment relates to electronic equipment.

Background

In recent years, the use of flexible substrates having flexibility and stretchability has been studied in various fields. As an example, a usage in which a flexible substrate on which electric elements are arranged in a matrix shape is attached to a housing of an electronic device or a curved surface of a human body or the like is considered. As the electric element, various sensors such as a touch sensor and a temperature sensor, and a display element can be applied.

In the flexible substrate, it is necessary to take measures to avoid damage of the wiring due to stress caused by bending or expansion and contraction. As a countermeasure for this, for example, a honeycomb-shaped opening or a shape (meandering shape) in which the wiring is bent is provided on the base material on which the support wiring is provided.

SUMMERY OF THE UTILITY MODEL

This embodiment provides an electronic device including: a 1 st telescopic member having a 1 st surface and a 2 nd surface opposite to the 1 st surface; a flexible insulating substrate on the 2 nd side; and a wiring disposed on the insulating base material, wherein the 1 st extensible member has a plurality of 1 st holes that are open on the 1 st surface side and are arranged at intervals.

This embodiment provides an electronic device including: a 1 st telescopic member having a 1 st surface and a 2 nd surface opposite to the 1 st surface; a flexible insulating substrate on the 2 nd side; and a wiring disposed on the insulating base material, wherein the 1 st extensible member has a 1 st slit opened on the 1 st surface side.

This embodiment can provide an electronic device that can be easily broken.

Drawings

Fig. 1 is a schematic plan view of a flexible substrate according to the present embodiment.

Fig. 2 is an enlarged plan view of a part of the flexible substrate shown in fig. 1.

Fig. 3 is a plan view showing the positions of pinhole lines formed on the flexible substrate shown in fig. 2.

Fig. 4 is a schematic cross-sectional view of a part of the flexible substrate shown by a-B in fig. 2 and 3.

Fig. 5 is a schematic cross-sectional view of a part of the flexible substrate shown by C-D in fig. 2 and 3.

Fig. 6 is a schematic cross-sectional view of a part of the flexible substrate shown by E-F in fig. 2 and 3.

Fig. 7 is a schematic cross-sectional view of a part of the flexible substrate indicated by G-H in fig. 2 and 3.

Fig. 8 is a diagram showing a state in which the flexible substrate is attached to the steering wheel.

Fig. 9 is a schematic cross-sectional view of a portion of the flexible substrate shown by I-J in fig. 2.

Fig. 10 is a view showing a 1 st modification of the flexible substrate.

Fig. 11 is a view showing a 2 nd modification of the flexible substrate.

Fig. 12 is a diagram showing a 3 rd modification of the flexible substrate.

Fig. 13 is a view showing a 4 th modification of the flexible substrate.

Fig. 14 is a view showing a 5 th modification of the flexible substrate.

Fig. 15 is a schematic cross-sectional view of a part of the flexible substrate shown in fig. 14.

Fig. 16 is a view showing a 6 th modification of the flexible substrate.

Fig. 17 is a view showing a 7 th modification of the flexible substrate.

Detailed Description

The present embodiment is described below with reference to the drawings. The present disclosure is merely an example, and appropriate modifications that can be easily conceived by those skilled in the art while maintaining the gist of the present invention are naturally included in the scope of the present invention. In addition, in order to make the description clearer, the width, thickness, shape, and the like of each part in the drawings are schematically shown as compared with the actual form in some cases, but the present invention is merely an example and is not limited to the explanation of the present invention. In the present specification and the drawings, the same reference numerals are given to components that perform the same or similar functions as those of the components described in the previous drawings, and overlapping detailed description may be omitted as appropriate.

In the present embodiment, the flexible substrate 100 is disclosed as an example of an electronic device.

Fig. 1 is a schematic plan view of a flexible substrate 100 according to the present embodiment.

In the present embodiment, as shown in the figure, the 1 st direction D1, the 2 nd direction D2, and the 3 rd direction D3 are defined. The 1 st direction D1 and the 2 nd direction D2 are directions parallel to the main surface of the flexible substrate 100 and intersect each other. The 3 rd direction D3 is a direction perpendicular to the 1 st direction D1 and the 2 nd direction D2, and corresponds to the thickness direction of the flexible substrate 100. The 1 st direction D1 and the 2 nd direction D2 intersect perpendicularly in the present embodiment, but may intersect at an angle other than perpendicular. In this specification, a direction toward the tip of an arrow indicating the 3 rd direction D3 is referred to as "up", and a direction toward the opposite direction from the tip of the arrow is referred to as "down". Further, the observation position at which the flexible substrate 100 is observed from the distal end side of the arrow indicating the 3 rd direction D3 is set, and observation from the observation position toward the D1-D2 plane defined by the 1 st direction D1 and the 2 nd direction D2 is referred to as plan view.

The flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electric elements 3, a 1 st stretching member 91, a scanning line driver DR1, and a signal line driver DR 2. The scanning line 1, the signal line 2, the electric element 3, the scanning line driver DR1, and the signal line driver DR2 are located above the 1 st telescopic member 91. The plurality of scan lines 1 extend in the 1 st direction D1 and are arranged in the 2 nd direction D2, respectively. The plurality of scanning lines 1 are connected to a scanning line driver DR1, respectively. The plurality of signal lines 2 extend in the 2 nd direction D2 and are arranged in the 1 st direction D1, respectively. The plurality of signal lines 2 are connected to the signal line driver DR2, respectively. The plurality of electric elements 3 are located at intersections of the scanning lines 1 and the signal lines 2, and are electrically connected to the scanning lines 1 and the signal lines 2. The function of the electric element 3 will be described in detail later.

Fig. 2 is an enlarged plan view of a part of the flexible substrate 100 shown in fig. 1.

The flexible substrate 100 includes an insulating base 4 that supports the scanning lines 1 and the signal lines 2 in addition to the above-described components.

The insulating base material 4 has, in plan view: a plurality of 1 st portions (line portions) PT1 extending in the 1 st direction D1 and arranged in a row in the 2 nd direction D2; a plurality of 2 nd portions (line portions) PT2 extending in the 2 nd direction D2 and arranged in a row in the 1 st direction D1; and a plurality of islands IL provided at intersections of the 1 st portion PT1 and the 2 nd portion PT 2. In a plan view, the 1 st portion PT1 and the 2 nd portion PT2 are formed in a wave shape. Island IL is connected to part 1 PT1 and part 2 PT 2. The insulating substrate 4 has flexibility and can be formed of, for example, polyimide, but is not limited to this example.

The scanning line 1 is disposed on the 1 st portion PT1 of the insulating substrate 4 and arranged in a wave shape. The signal line 2 is disposed on the 2 nd portion PT2 of the insulating base material 4 and arranged in a wave shape. The scanning line 1 and the signal line 2 are examples of wiring provided in the flexible substrate 100. The scanning lines 1 and the signal lines 2 may be formed of, for example, a metal material or a transparent conductive material, and may have a single-layer structure or a stacked structure. The flexible substrate 100 may further include other types of wiring such as a power supply line for supplying power to the electric element 3 in addition to the scanning line 1 and the signal line 2.

The scanning line 1 has a 1 st portion 11 indicated by a solid line and a 2 nd portion 12 indicated by a broken line. The 2 nd portion 12 overlaps the electrical element 3. The part 111 and the part 2 12 are disposed on different layers from each other and electrically connected via contact holes CH1 and CH 2.

The scanning line 1 supplies a scanning signal to the electric element 3. When the electric element 3 is a member accompanied by signal output such as a sensor, for example, the output signal from the electric element 3 is supplied to the signal line 2. In addition, when the electric element 3 is a member that operates in accordance with an input signal, such as a light-emitting element or an actuator, for example, a drive signal is supplied to the signal line 2. A controller including a supply source of a scanning signal, a supply source of a driving signal, a processor for performing output signal processing, and the like may be provided on the flexible substrate 100, or may be provided on a device connected to the flexible substrate 100.

The electric element 3 is located on the island portion IL. The electric element 3 is smaller than the island IL, and in fig. 2, the island IL protrudes from the edge of the electric element 3. The electric element 3 is, for example, a sensor, a semiconductor element, an actuator, or the like. For example, an optical sensor, a temperature sensor, a pressure sensor, a touch sensor, or the like that receives visible light or near-infrared light can be applied as the sensor. For example, a light-emitting element, a light-receiving element, a diode, a transistor, or the like can be applied as the semiconductor element. When the electric element 3 is a light-emitting element, a flexible display having flexibility and stretchability can be realized. As the light emitting element, for example, a light emitting diode having a size of about 100 μm such as a mini LED or a micro LED, or an organic electroluminescence element can be applied. When the electric element 3 is an actuator, for example, a piezoelectric element can be applied. The electric element 3 is not limited to the components illustrated here, and elements having a plurality of functions can be applied. The electric element 3 may be a capacitor, a resistor, or the like. The arrangement position and shape of the electric element 3 are not limited to the example shown in fig. 2.

In the present embodiment, the 1 st portion PT1 and the 2 nd portion PT2, the scanning line 1, the signal line 2, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7, which will be described later, of the insulating base material 4 are collectively referred to as a line portion LP, and the island portion IL of the insulating base material 4, the inorganic insulating layer 19, which will be described later, and the electric element 3 are collectively referred to as an island portion IP. The line part LP and the island part IP are located on the 1 st expansion member 91. In a plan view, line portion LP includes a plurality of wave-shaped 1 st line portions LP1 extending in the 1 st direction D1 and arranged in the 2 nd direction D2, and a plurality of wave-shaped 2 nd line portions LP2 extending in the 2 nd direction D2 and arranged in the 1 st direction D1. The island-like portion IP is located at the intersection of the 1 st line portion LP1 and the 2 nd line portion LP 2. The 1 st line portion LP1 includes the 1 st portion PT1 of the insulating substrate 4 and the scanning line 1. The 2 nd line part LP2 includes the 2 nd part PT2 of the insulating substrate 4 and the signal line 2. In addition, the insulating base material 4 is not formed in the region surrounded by the adjacent 2 1 st line portions LP1 and the adjacent 2 nd line portions LP2, and the opening OP is formed. In other words, the opening OP can also be said to be an area surrounded by the adjacent 2 1 st portions PT1 and the adjacent 2 nd portions PT 2. The openings OP are arranged in a matrix in the 1 st direction D1 and the 2 nd direction D2.

Fig. 3 is a plan view illustrating the positions of the pinhole lines PF formed on the flexible substrate 100 illustrated in fig. 2.

The perforation lines PF are formed by a plurality of holes HL spaced at intervals. The hole HL includes a 1 st hole HL1 formed on the back surface side of the flexible substrate 100 and a 2 nd hole HL2 formed on the front surface side of the flexible substrate 100, as described later. The 1 st hole HL1 and the 2 nd hole HL2 overlap each other in the 3 rd direction D3. That is, the pinhole line PF has a plurality of 1 st holes HL1 spaced apart from each other and a plurality of 2 nd holes HL2 spaced apart from each other.

At least a part of the pinhole lines PF is overlapped with and arranged along the wirings such as the scanning lines 1 and the signal lines 2. As shown by enlarging the area a, a part of the pinhole line PF overlaps the signal line 2 and is arranged along the signal line 2. As shown by enlarging the area B, a part of the pinhole line PF overlaps the scanning line 1 and is aligned along the scanning line 1.

At least a part of the pinhole lines PF are arranged in a direction intersecting the extending direction of the wiring. As the region C is enlarged, a part of the pinhole lines PF are arranged in a direction intersecting the extending direction of the signal line 2. Further, a part of the pinhole lines PF may be arranged in a direction intersecting the extending direction of the scanning lines 1.

At least a part of the pinhole line PF does not overlap with the insulating base material 4 and the wiring. That is, a part of the pinhole line PF is formed at a position overlapping the opening OP.

In the illustrated example, the pinhole lines PF do not overlap the electric element 3. Thus, when the electric element 3 is a light-emitting element or the like, the display quality of the flexible substrate 100 can be suppressed from being degraded. The position of the pinhole line PF is not limited to the illustrated example.

Fig. 4 is a schematic cross-sectional view of a part of the flexible substrate 100 shown by a-B in fig. 2 and 3.

The flexible substrate 100 includes the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, the 3 rd organic insulating layer 7, and the 2 nd stretching member 92 in addition to the above elements.

The 1 st telescopic member 91 has the 1 st surface SF1 and the 2 nd surface SF2 opposite to the 1 st surface SF 1. The 1 st line portion LP1 is located on the 2 nd plane SF 2. The 1 st line portion LP1 has a 1 st side surface SS1, a 2 nd side surface SS2 opposite to the 1 st side surface SS1, and an upper surface US.

The 1 st portion PT1 of the insulating substrate 4 is located on the 2 nd side SF 2. The 1 st organic insulation layer 5 covers the insulation substrate 4. The scan line 1 is located on the 1 st organic insulation layer 5. The 2 nd organic insulation layer 6 covers the 1 st organic insulation layer 5 and the scan line 1. The 3 rd organic insulation layer 7 covers the 2 nd organic insulation layer 6. The 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7 are all formed of an organic material.

The 2 nd telescopic member 92 has a 3 rd surface SF3 opposite to the 2 nd surface SF2 and a 4 th surface SF4 opposite to the 3 rd surface SF 3. The 2 nd telescoping member 92 covers the 1 st side surface SS1, the 2 nd side surface SS2, and the upper surface US of the 1 st line portion LP 1. That is, the 2 nd stretching member 92 covers the scan line 1, the insulating base 4, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7. The 2 nd stretching member 92 contacts the insulating substrate 4, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7 in the 1 st line part LP 1. In addition, the 3 rd side SF3 of the 2 nd telescopic member 92 meets the 2 nd side SF2 of the 1 st telescopic member 91 at the opening OP.

The 1 st extensible member 91 may be formed by applying an organic material to the lower surfaces of the insulating base 4 and the 2 nd extensible member 92, or may be formed in a film or plate shape and attached via an adhesive layer. The 2 nd expansion member 92 is formed of a parylene (PPX) structure, for example, parylene (registered trademark).

The 1 st telescopic member 91 has a 1 st hole HL1 opened on the 1 st surface SF1 side. The 2 nd telescopic member 92 has a 2 nd hole HL2 opened on the 4 th surface SF4 side. The 2 nd hole HL2 is formed at a position overlapping with the 1 st hole HL1 in the 3 rd direction D3. The 1 st hole HL1 penetrates between the 1 st surface SF1 and the 2 nd surface SF 2. The 2 nd hole HL2 penetrates between the 3 rd face SF3 and the 4 th face SF 4. The 1 st hole HL1 and the 2 nd hole HL2 are formed at positions overlapping with the 1 st portion PT1, the 1 st organic insulating layer 5, the scan line 1, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7 of the insulating base material 4.

The 1 st hole HL1 and the 2 nd hole HL2 were formed by laser processing and ashing processing. The 1 st hole HL1 is formed by, for example, laser irradiation from the 1 st surface SF1 side to the 1 st telescopic member 91. The 2 nd hole HL2 is formed by, for example, laser irradiation from the 4 th surface SF4 side to the 2 nd telescopic member 92.

Fig. 5 is a schematic cross-sectional view of a part of the flexible substrate 100 shown by C-D in fig. 2 and 3.

The 2 nd line portion LP2 is located on the 2 nd surface SF2 of the 1 st telescopic member 91. The 2 nd line portion LP2 has a 1 st side surface SS1, a 2 nd side surface SS2 opposite to the 1 st side surface SS1, and an upper surface US.

The 2 nd portion PT2 of the insulating substrate 4 is located on the 2 nd side SF2 of the 1 st telescoping member 91. The 1 st organic insulation layer 5 covers the insulation substrate 4. The 2 nd organic insulation layer 6 covers the 1 st organic insulation layer 5. The signal line 2 is located on the 2 nd organic insulation layer 6. The 3 rd organic insulating layer 7 covers the signal line 2 and the 2 nd organic insulating layer 6. The 2 nd telescoping member 92 covers the 1 st side surface SS1, the 2 nd side surface SS2 and the upper surface US of the 2 nd line portion LP2, and contacts the 2 nd surface SF2 of the 1 st telescoping member 91 at the opening OP. That is, the 2 nd stretching member 92 covers the insulating base 4, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, the 3 rd organic insulating layer 7, and the signal line 2. The 2 nd stretching member 92 is in contact with the insulating base 4, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7 in the 2 nd line part LP 2.

The 1 st hole HL1 and the 2 nd hole HL2 are formed at positions overlapping with the 2 nd portion PT2, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, the signal line 2, and the 3 rd organic insulating layer 7 of the insulating base material 4. Further, by covering the signal line 2 with the 3 rd organic insulating layer 7, the signal line 2 can be prevented from being exposed from the 2 nd hole HL 2.

Fig. 6 is a schematic cross-sectional view of a part of the flexible substrate 100 shown by E-F in fig. 2 and 3.

The 2 nd hole HL2 is connected with the 1 st hole HL 1. That is, the hole HL of the pinhole line PF penetrates between the 1 st surface SF1 and the 4 th surface SF4 at the opening OP. That is, at the opening OP, the 1 st hole HL1 and the 2 nd hole HL2 can be collectively formed by laser irradiation from the 1 st surface SF1 side or laser irradiation from the 4 th surface SF4 side.

Fig. 7 is a schematic cross-sectional view of a part of the flexible substrate 100 indicated by G-H in fig. 2 and 3. Fig. 7 shows a 1 st portion PT1 of the insulating base material 4 and a cross section along the scanning line 1.

The 1 st hole HL1 and the 2 nd hole HL2 are formed at positions overlapping each other in the 3 rd direction D3. In addition, the 1 st hole HL1 and the 2 nd hole HL2 overlap the scan line 1, respectively. The same applies to the cross section along the signal line 2 shown in fig. 3.

Fig. 8 is a diagram showing a state in which the flexible substrate 100 is attached to the steering wheel 80.

As shown in fig. 8 (a), the flexible board 100 is attached to the central portion 81 of the steering wheel 80. The position of the easy-tear line 104 to be torn when the airbag body is inflated is defined on the steering wheel 80. The flexible substrate 100 has a pinhole line PF at a position corresponding to the easy-tear line 104.

As shown in fig. 8 (b), when the airbag body 105 is inflated, the central portion 81 of the steering wheel 80 opens along the easy-tear line 104. At this time, the flexible substrate 100 is broken along the pinhole line PF, and the flexible substrate 100 is split into the split portion 100A and the split portion 100B. By splitting the flexible substrate 100 by the pinhole lines PF, the flexible substrate 100 can be prevented from interfering with the expansion of the airbag body 105.

According to the present embodiment, the flexible substrate 100 has the pinhole lines PF. Therefore, the flexible substrate 100 is easily broken along the pinhole line PF. This can prevent the flexible substrate 100 from interfering with the destruction of the object to which the flexible substrate 100 is attached. The pinhole line PF is formed at a position overlapping with the wirings such as the scanning line 1 and the signal line 2. Since the wiring has a high elastic modulus compared to the organic films such as the 1 st stretching member 91 and the 2 nd stretching member 92, the flexible substrate 100 can be easily broken along the pinhole PF.

In addition, in the present embodiment, an example in which the 1 st hole HL1 and the 2 nd hole HL2 are formed at positions overlapping in the 3 rd direction D3 is shown, but the present invention is not limited to this example, and the 1 st hole HL1 and the 2 nd hole HL2 may be formed at positions not overlapping with each other in the 3 rd direction D3. The flexible substrate 100 of the present embodiment can be attached to an object other than a steering wheel, which is required to be torn or broken. In this case, the pinhole line PF is formed at a position corresponding to the torn/broken portion of the object.

Fig. 9 is a schematic cross-sectional view of a part of the flexible substrate 100 shown by I-J in fig. 2.

The electric element 3 is disposed on the island portion IL of the insulating base 4. An inorganic insulating layer 19 (passivation film layer) is disposed between the electric element 3 and the island portion IL. The inorganic insulating layer 19 is formed in an island shape overlapping with the electric element 3 (or the island-shaped portion IL) in a plan view. The 1 st portion 11 is disposed on the 1 st organic insulating layer 5 and covered by the 2 nd organic insulating layer 6. The 2 nd portion 12 is disposed on the inorganic insulating layer 19 and electrically connected to the electric element 3. In the example shown in fig. 9, both end portions of the 2 nd portion 12 are covered with the 1 st organic insulating layer 5.

The contact holes CH1 and CH2 are disposed on the 1 st organic insulating layer 5. The 1 st portion 11 is electrically connected to the 2 nd portion 12 through connecting members CM1 and CM2 disposed in the contact holes CH1 and CH 2. Connecting members CM1 and CM2 may be part of section 111 or may be provided independently of section 1 11.

In this manner, the island-shaped inorganic insulating layer 19 is disposed between the electric element 3 and the insulating base 4. The inorganic insulating layer 19 functions as a protective film that prevents moisture and the like from entering the electric element 3 and the 2 nd portion 12 of the scanning line 1. Therefore, the reliability of the flexible substrate 100 is improved. In addition, although the inorganic film is generally more likely to crack than the organic film, since the inorganic insulating layer 19 is not provided below the 1 st portion 11 of the scanning line 1, disconnection of the 1 st portion 11 can be suppressed. The same applies to signal lines not shown. In addition, compared with the case where the inorganic insulating layer 19 is provided on the entire flexible substrate 100, the flexibility and stretchability of the flexible substrate 100 are less likely to be impaired.

In addition, in the scanning line 1, the 2 nd portion 12 overlapping with the electric element 3 is disposed in a layer different from the 1 st portion 11, and thus the degree of freedom in design in the vicinity of the electric element 3 is improved. Further, since the contact holes CH1 and CH2 are provided above the inorganic insulating layer 19, connection failure at the connection position between the 1 st portion 11 and the 2 nd portion 12 can be suppressed.

An island portion IL of the insulating base material 4 is disposed below the electric element 3. This enables the electric element 3 to be supported satisfactorily. Further, the insulating base material 4 is supported by the 1 st extensible member 91. Therefore, the strength of the flexible substrate 100 as a whole is increased, and intrusion of moisture or the like from below can be suppressed.

In addition, the 3 rd organic insulating layer 7 covers the electric element 3. Therefore, even if the 2 nd hole HL2 is formed in the 2 nd telescopic member 92 at a position overlapping the electric element 3, the electric element 3 can be prevented from being exposed from the 2 nd hole HL 2.

Fig. 10 is a view showing a 1 st modification of the flexible substrate 100. The configuration shown in fig. 10 is different from the configurations shown in fig. 4 to 6 in that the 1 st hole HL1 does not penetrate the 1 st telescopic member 91 and the 2 nd hole HL2 does not penetrate the 2 nd telescopic member 92. Fig. 10 (a) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by a-B in fig. 2 and 3. Fig. 10 (b) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by C-D in fig. 2 and 3. Fig. 10 (c) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by E-F in fig. 2 and 3.

The 1 st telescopic member 91 has a portion 91a interposed between the 1 st hole HL1 and the 2 nd surface SF 2. The 2 nd telescopic member 92 has a portion 92a sandwiched between the 2 nd hole HL2 and the 3 rd face SF 3. As shown in fig. 10 (a), the 1 st and 2 nd holes HL1 and HL2 do not penetrate the 1 st line portion LP 1. The portion 91a is located between the 1 st hole HL1 and the insulating substrate 4 of the 1 st line portion LP 1. The portion 92a is located between the 2 nd hole HL2 and the upper surface US of the 1 st line portion LP 1. The portions 91a and 92a overlap with the 1 st portion PT1 of the insulating substrate 4 and the scanning line 1.

As shown in fig. 10 (b), the 1 st and 2 nd holes HL1 and HL2 do not penetrate the 2 nd line portion LP 2. The portion 91a is located between the 1 st hole HL1 and the insulating substrate 4 of the 2 nd line portion LP 2. The portion 92a is located between the 2 nd hole HL2 and the upper surface US of the 2 nd line portion LP 2. The portions 91a and 92a overlap with the 2 nd portion PT2 of the insulating base material 4 and the signal line 2. In comparison with the configuration shown in fig. 5, the configuration shown in fig. 10 (b) is such that the signal line 2 is not covered with the 3 rd organic insulating layer 7, but the 2 nd hole HL2 does not penetrate the 2 nd extensible member 92, so that the signal line 2 is covered with the 2 nd extensible member 92. Thereby preventing the signal line 2 from being exposed from the 2 nd hole HL 2.

As shown in (c) of fig. 10, the 1 st hole HL1 and the 2 nd hole HL2 are not connected to each other. Portions 91a and 92a are interposed between the 1 st hole HL1 and the 2 nd hole HL 2.

Fig. 11 is a view showing a 2 nd modification of the flexible substrate 100. The difference between the configuration shown in fig. 11 and the configurations shown in fig. 4 to 6 is that the 1 st hole HL1 and the 2 nd hole HL2 are filled with the 1 st filling member 101 and the 2 nd filling member 102, respectively. Fig. 11 (a) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by a-B in fig. 2 and 3. Fig. 11 (b) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by C-D in fig. 2 and 3. Fig. 11 (c) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by E-F in fig. 2 and 3.

The 1 st hole HL1 penetrates between the 1 st surface SF1 and the 2 nd surface SF 2. The 2 nd hole HL2 penetrates between the 3 rd surface SF3 and the 4 th surface SF 4. The flexible substrate 100 includes a 1 st filling member 101 filled inside the 1 st hole HL1 and a 2 nd filling member 102 filled inside the 2 nd hole HL 2.

As shown in fig. 11 (a), the 1 st filling member 101 is in contact with the 1 st portion PT1 of the insulating base material 4. The 2 nd filling member 102 is in contact with the 2 nd organic insulating layer 6, which is the upper surface US of the 1 st line part LP 1. As shown in fig. 11 (b), the 1 st filling member 101 is in contact with the 2 nd portion PT2 of the insulating base material 4. The 2 nd filling member 102 is in contact with the upper surface US of the 2 nd line part LP2, that is, the 2 nd organic insulating layer 6 and the signal line 2. As shown in fig. 11 (c), the 1 st filling member 101 and the 2 nd filling member 102 are connected and integrated.

According to the present modification, the exposure of the lower surface of the insulating base material 4 can be suppressed by filling the 1 st filling member 101 in the 1 st hole HL 1. Therefore, the intrusion of moisture into the insulating base material 4 can be suppressed. In addition, the exposure of the 2 nd organic insulating layer 6 and the signal line 2 can be suppressed by filling the 2 nd filling member 102 in the 2 nd hole HL 2. Therefore, the penetration of moisture into the 2 nd organic insulating layer 6 and the signal line 2 can be suppressed.

The 1 st filling member 101 has a modulus of elasticity greater than that of the 1 st extensible member 91. In addition, the elastic modulus of the 2 nd filling member 102 is larger than that of the 2 nd expansion member 92. Therefore, even when the 1 st and 2 nd filling members 101 and 102 are filled in the 1 st and 2 nd holes HL1 and HL2, the pinhole line PF can be easily broken.

Fig. 12 is a diagram showing a 3 rd modification of the flexible substrate 100. The configuration shown in fig. 12 is different from the configuration shown in fig. 4 to 6 in that a 2 nd hole HL2 is formed in the 2 nd telescopic member 92. Fig. 12 (a) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by a-B in fig. 2 and 3. Fig. 12 (b) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by C-D in fig. 2 and 3. Fig. 12 (c) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by E-F in fig. 2 and 3.

The needle hole line PF is constituted by the 1 st hole HL 1. As shown in the drawing, the pinhole lines PF are not formed on the front surface side (the 4 th SF4 side) of the flexible substrate 100, and thus the pinhole lines PF can be made less visible.

Fig. 13 is a diagram illustrating a 4 th modification of the flexible substrate 100. The constitution shown in fig. 13 is different from the constitution shown in fig. 3 in that the needle hole line PF is not formed at the opening OP.

In the illustrated example, the pinhole line PF is formed not at the opening OP but at a position overlapping with the 1 st portion PT1 and a position overlapping with the 2 nd portion PT 2. That is, the pinhole line PF is formed at a position overlapping the scanning line 1 and the signal line 2. In this manner, the perforation lines PF are formed in a concentrated manner on the wiring, whereby the flexible substrate 100 can be more easily torn.

Fig. 14 is a view showing a 5 th modification of the flexible substrate 100. The configuration shown in fig. 14 is different from the configuration shown in fig. 3 in that a slit SL is formed instead of the perforation line PF.

As described later, the slits SL include a 1 st slit SL1 formed on the back surface side of the flexible substrate 100 and a 2 nd slit SL2 formed on the front surface side of the flexible substrate 100. The 1 st slit SL1 and the 2 nd slit SL2 overlap each other in the 3 rd direction D3 and extend in the same direction as each other.

At least a part of the slit SL overlaps with and extends along the wirings such as the scanning line 1 and the signal line 2. As the region a is enlarged, a part of the slit SL overlaps the signal line 2 and extends along the signal line 2. In addition, as the region B is enlarged, a part of the slit SL overlaps the scanning line 1 and extends along the scanning line 1.

At least a part of the slits SL extend in a direction intersecting the extending direction of the wiring. As the region C is enlarged, a part of the slit SL extends in a direction intersecting the extending direction of the signal line 2. Further, a part of the slit SL may extend in a direction intersecting the extending direction of the scanning line 1.

At least a part of the slit SL does not overlap with the insulating base 4 and the wiring. That is, a part of the slit SL is formed at a position overlapping the opening OP.

Fig. 15 is a schematic cross-sectional view of a part of the flexible substrate 100 shown in fig. 14. Fig. 15 (a) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by a-B in fig. 14. Fig. 15 (b) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by C-D in fig. 14. Fig. 15 (c) is a schematic cross-sectional view of a part of the flexible substrate 100 shown by E-F in fig. 14.

As shown in fig. 15 (a), the 1 st telescopic member 91 has a 1 st slit SL1 opening on the 1 st surface SF1 side. The 2 nd telescopic member 92 has a 2 nd slit SL2 opening on the 4 th surface SF4 side. The 2 nd slit SL2 is formed at a position overlapping with the 1 st slit SL1 in the 3 rd direction D3. The 1 st slit SL1 penetrates between the 1 st surface SF1 and the 2 nd surface SF 2. The 2 nd slit SL2 penetrates between the 3 rd face SF3 and the 4 th face SF 4. The 1 st slit SL1 and the 2 nd slit SL2 are formed at positions corresponding to the 1 st portion PT1, the 1 st organic insulating layer 5, the scan line 1, the 2 nd organic insulating layer 6, and the 3 rd organic insulating layer 7 of the insulating substrate 4.

As shown in fig. 15 (b), the 1 st slit SL1 and the 2 nd slit SL2 are formed at positions overlapping the 2 nd portion PT2, the 1 st organic insulating layer 5, the 2 nd organic insulating layer 6, the signal line 2, and the 3 rd organic insulating layer 7 of the insulating base 4.

As shown in fig. 15 (c), the 2 nd slit SL2 is connected to the 1 st slit SL 1. That is, the slit SL penetrates between the 1 st surface SF1 and the 4 th surface SF4 at the opening OP.

Fig. 16 is a view showing a 6 th modification of the flexible substrate 100. Fig. 16 shows a case where the electric element 3 shown in fig. 2 is a light emitting element L1, L2, L3.

The flexible substrate 100 includes a light emitting element L1 of red (R), a light emitting element L2 of green (G), and a light emitting element L3 of blue (B). In each island IL, 1 of the light emitting elements L1, L2, and L3 is arranged. The light emitting elements L1, L2, and L3 are LEDs having a size of about 100 μm, such as mini LEDs and micro LEDs. In this manner, the flexible substrate 100 includes the light emitting elements L1, L2, and L3, and thus a flexible display having flexibility and stretchability can be realized.

Fig. 17 is a view showing a 7 th modification of the flexible substrate 100. The configuration shown in fig. 17 is different from the configuration shown in fig. 16 in that 3 light emitting elements L1, L2, and L3 are arranged on 1 island-like portion IL.

The light-emitting elements L1, L2, and L3 are, for example, any of red, green, and blue light-emitting elements. Alternatively, the light emitting elements L1, L2, and L3 may be light emitting elements of the same color as each other. In the illustrated example, 3 light emitting elements L1, L2, and L3 are arranged on 1 island IL, but the present invention is not limited to this example, and 2 light emitting elements or 4 or more light emitting elements may be arranged on 1 island IL. The arrangement and orientation of the light emitting elements L1, L2, and L3 are not limited to the illustrated examples.

As described above, according to the present embodiment, an electronic device that can be easily torn can be obtained.

Although several embodiments of the present invention have been described, these embodiments are merely examples, and are not intended to limit the scope of the present invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims (18)

1. An electronic device, comprising:

a 1 st telescopic member having a 1 st surface and a 2 nd surface opposite to the 1 st surface;

a flexible insulating substrate on the 2 nd side; and

a wiring disposed on the insulating substrate,

the 1 st telescopic member has a plurality of 1 st holes that are opened on the 1 st surface side and are arranged at intervals.

2. The electronic device of claim 1,

at least a part of the plurality of the 1 st holes overlaps with and is arranged along the wiring.

3. The electronic device of claim 1,

at least a part of the plurality of 1 st holes are arranged in a direction intersecting with an extending direction of the wiring.

4. The electronic device of claim 1,

the 1 st telescoping member is interposed between the 1 st aperture and the 2 nd surface.

5. The electronic device of claim 1,

further comprises a 1 st filling member filled in the 1 st hole,

the 1 st hole penetrates between the 1 st surface and the 2 nd surface,

the elastic modulus of the 1 st filling member is larger than that of the 1 st telescopic member.

6. The electronic device of claim 1,

at least a part of the 1 st holes do not overlap with the insulating base material and the wiring.

7. The electronic device of claim 1,

further comprising a 2 nd stretching member covering the insulating base material, the 2 nd stretching member having a 3 rd surface opposite to the 2 nd surface and a 4 th surface opposite to the 3 rd surface,

the 2 nd telescopic member has a plurality of 2 nd holes opened on the 4 th surface side and arranged at intervals,

the 2 nd hole is formed at a position overlapping the 1 st hole.

8. The electronic device of claim 7,

at least a part of the plurality of 2 nd holes overlaps and is arranged along the wiring.

9. The electronic device of claim 7,

at least a part of the plurality of the 2 nd holes are arranged in a direction intersecting with an extending direction of the wiring.

10. The electronic device of claim 7,

the 2 nd telescoping member is sandwiched between the 2 nd hole and the 3 rd face.

11. The electronic device of claim 7,

further comprises a 2 nd filling member for filling the 2 nd hole with the 2 nd filling member,

the 2 nd hole penetrates between the 3 rd surface and the 4 th surface,

the modulus of elasticity of the 2 nd filler member is greater than the modulus of elasticity of the 2 nd telescoping member.

12. The electronic device of claim 7,

at least a part of the plurality of 2 nd holes does not overlap with the insulating base material and the wiring.

13. The electronic device of claim 7,

the 2 nd hole is connected with the 1 st hole.

14. The electronic device of claim 1,

the insulating base material includes a plurality of line portions where the wirings are located and island-shaped portions connected to the plurality of line portions.

15. An electronic device, comprising:

a 1 st telescopic member having a 1 st surface and a 2 nd surface opposite to the 1 st surface;

a flexible insulating substrate on the 2 nd side; and

a wiring disposed on the insulating substrate,

the 1 st telescopic member has a 1 st slit opened on the 1 st surface side.

16. The electronic device of claim 15,

further comprising a 2 nd stretching member covering the insulating base material, the 2 nd stretching member having a 3 rd surface opposite to the 2 nd surface and a 4 th surface opposite to the 3 rd surface,

the 2 nd telescopic member has a 2 nd slit opened on the 4 th surface side,

the 2 nd slit overlaps the 1 st slit and extends in the same direction as the 1 st slit.

17. The electronic device of claim 16,

at least a part of the 1 st slit and the 2 nd slit overlaps with and extends along the wiring.

18. The electronic device of claim 16,

at least a part of the 1 st slit and the 2 nd slit extends in a direction intersecting with an extending direction of the wiring.

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