CN214315323U

CN214315323U - Earphone decoration seal structure and electronic equipment

Info

Publication number: CN214315323U
Application number: CN202023247493.9U
Authority: CN
Inventors: 杨爱龙; 杜军红; 葛振纲
Original assignee: Shanghai Longcheer Technology Co Ltd
Current assignee: Shanghai Longcheer Technology Co Ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-09-28
Anticipated expiration: 2030-12-28

Abstract

The application discloses earphone decoration seal structure and electronic equipment, this seal structure includes: the earphone decoration piece passes through the gum is installed on the preceding shell the gum with the connection face of preceding shell still is equipped with the glue layer. Electronic equipment, including foretell earphone decoration seal structure. According to the application, the gum and the glue layer are arranged between the earphone decoration part and the front shell, so that the sealing performance of the decoration part and the front shell after bonding is improved, and the assembly yield of the whole machine is improved; meanwhile, the functional problems of poor sealing between the earphone decorating part and the front shell, generation of earphone sound impurities and the like caused by dimensional tolerance and flatness of materials, damage caused by environmental factors and the like can be avoided; and the problem of degumming of the earphone decorative part and the front shell generated in the reliability test can be avoided.

Description

Earphone decoration seal structure and electronic equipment

Technical Field

The application belongs to the technical field of earphones, concretely relates to earphone decoration seal structure and electronic equipment.

Background

The conventional earphone decoration piece and the sound cavity of the front shell are sealed by a ring of gum in the process of assembling the conventional earphone decoration piece to the front shell. However, in the assembling process of the earphone decoration piece and the front shell, the flatness of the injection molding can not be completely smooth under the actual conditions, the earphone decoration piece is easy to deform and is affected by dimensional tolerance, the earphone decoration piece and the front shell are adhered together, the sealing can not be guaranteed, and the problems of earphone sound effect distortion, noise and the like, weak adhesion strength and the like can be caused after the whole machine is assembled.

SUMMERY OF THE UTILITY MODEL

To overcome the disadvantages or shortcomings of the prior art, an earpiece decoration sealing structure and an electronic device are provided.

In order to solve the technical problem, the application is realized by the following technical scheme:

this application has provided an earphone decoration seal structure on the one hand, includes: the earphone decoration piece passes through the gum is installed on the preceding shell the gum with the connection face of preceding shell still is equipped with the glue layer.

Further, in the sealing structure of earpiece decoration described above, the glue layer is circumferentially disposed on the back of the back glue.

Further, above-mentioned earphone decoration seal structure, wherein, the glue layer is at least round annular structure.

Further, above-mentioned earphone decoration seal structure, wherein, the glue layer is the spiral structure.

Further, in the above earpiece trim sealing structure, the front case is provided with a groove for mounting the earpiece trim.

Further, in the above earpiece decoration sealing structure, the bottom of the groove has an arc-shaped corner structure.

Further, in the above earpiece decoration sealing structure, the earpiece decoration is embedded in the groove.

Further, in the above earpiece trim sealing structure, an accommodating portion for at least installing the adhesive is further provided between the earpiece trim and the groove.

Further, in the above earpiece trim sealing structure, the earpiece trim is made of an elastic material.

The application further provides electronic equipment, which comprises the earphone decoration sealing structure.

Compared with the prior art, the method has the following technical effects:

according to the application, the gum and the glue layer are arranged between the earphone decoration part and the front shell, so that the sealing performance of the decoration part and the front shell after bonding is improved, and the assembly yield of the whole machine is improved; meanwhile, the functional problems of poor sealing between the earphone decorating part and the front shell, generation of earphone sound impurities and the like caused by dimensional tolerance and flatness of materials, damage caused by environmental factors and the like can be avoided; and the problem of degumming of the earphone decorative part and the front shell generated in the reliability test can be avoided.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1: the schematic view of the sealing structure of the tin decor in an example of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in FIG. 1, in one embodiment of the present application, an earpiece trim 10 sealing arrangement includes: the earphone decoration 10 comprises an earphone decoration 10, a back adhesive 30 and a front shell 20, wherein the earphone decoration 10 is installed on the front shell 20 through the back adhesive 30, and a glue layer 40 is further arranged on the connection surface of the back adhesive 30 and the front shell 20. In the embodiment, the back adhesive 30 and the glue layer 40 are arranged between the earphone decoration 10 and the front shell 20, so that the sealing performance of the decoration 10 bonded with the front shell 20 is improved, and the assembly yield of the whole machine is improved; meanwhile, the functional problems of sound and impurities of the earphone and the like caused by poor sealing between the earphone decoration piece 10 and the front shell 20 due to dimensional tolerance and flatness of materials, damage caused by environmental factors and the like can be avoided; the problem of the earpiece decoration 10 coming off the front shell 20 as a result of the reliability test can also be avoided.

Wherein the earpiece trim 10 is made of an elastic material. Due to the fact that the elastic material has certain buffering performance, damage and the like caused in the installation process of the earphone decorating part 10 can be reduced through the arrangement, and the service life can be prolonged.

Further, the glue layer 40 is circumferentially disposed on the surface of the back glue 30, and preferably, the glue layer 40 may be disposed by way of spot coating. The glue layer 40 is preferably disposed at a clearance point on the surface of the gum 30, so as to avoid damage to the earpiece decoration 10 due to excessive squeezing.

In order to improve the reliability of the sealing performance, in one example, the glue layer 40 has at least one ring-shaped structure, such as one ring, two rings, three rings, etc., and the specific number of the rings is set by way of example only and is not intended to limit the scope of the present application.

Preferably, in another example, the glue layer 40 is a spiral structure, wherein, to ensure the reliability of the sealing, the spiral structure is preferably provided with at least one layer, that is, the vertical projection of the spiral structure is a whole circle, wherein the specific number of the spiral structure can be increased or decreased as required by the actual application.

Of course, the glue layer 40 may also adopt a combination of the above ring structure and spiral structure, wherein it is preferable to be able to cooperate with the back glue 30 to realize the sealing between the earpiece decoration 10 and the front shell 20.

In one embodiment, the front housing 20 is provided with a recess for receiving the earpiece trim 10.

Further, the bottom of the groove has an arc-shaped corner structure, which can effectively reduce the wear of parts and components during installation, and can effectively improve the sealing performance between the earpiece decoration 10 and the front shell 20 by filling the structures such as the back glue 30 and the glue layer 40.

Wherein the earpiece decoration 10 is embedded in the recess, as shown in fig. 1.

An accommodating portion for at least installing the adhesive 30 is further disposed between the earpiece decoration 10 and the groove, wherein the adhesive 30 and the glue layer 40 can be disposed in the accommodating portion.

Table 1 comparative analysis of prior art and present application

	Prior Art	This application
			Defective rate of sealing earphone decoration and front shell in assembling stage	1.0％	0.01％
Reliability environment test and destructive test reject ratio	2.0％	0.01％

Wherein, realize discovering through the comparison of above-mentioned table 1 for the earphone decoration in the equipment phase can reduce to 0.01% from current 1.0% with preceding shell sealing defective rate, and reliability environment is surveyed and destructive test defective rate can reduce to 0.01% from current 2.0%. Promptly, this application has solved basically that equipment phase earphone decoration and preceding shell are sealed badly and the reliability environment is surveyed and the bad problem of destructive test, has good market perspective.

The electronic devices include, but are not limited to, a mobile phone, a tablet, a notebook, MP3, MP4, a stereo, and the like.

In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements may be made in the present invention without departing from the spirit and scope of the present invention and shall be covered by the appended claims.

Claims

1. An earpiece decoration seal structure, comprising: the earphone decoration piece passes through the gum is installed on the preceding shell the gum with the connection face of preceding shell still is equipped with the glue layer.

2. The earpiece trim seal structure of claim 1, wherein the glue layer is disposed circumferentially on a back side of the adhesive backing.

3. The earpiece trim seal structure of claim 2, wherein the glue layer is at least one ring of annular structure.

4. The earpiece trim seal structure of claim 2, wherein the glue layer is a spiral structure.

5. The earpiece trim seal structure of claim 1, wherein the front shell is provided with a recess for mounting the earpiece trim.

6. The earpiece trim seal structure of claim 5, wherein a bottom of the recess has an arcuate corner structure.

7. The earpiece trim seal structure of claim 5 or 6, wherein the earpiece trim is disposed embedded in the recess.

8. The earpiece trim seal structure of claim 7, further comprising a receptacle between the earpiece trim and the recess for at least mounting the adhesive.

9. The earpiece trim seal structure of any one of claims 1 to 6, wherein the earpiece trim is made of an elastic material.

10. An electronic device characterized by comprising the earpiece trim sealing structure according to any one of claims 1 to 9.