CN214311799U - Intelligent card RFID semi-automatic production line - Google Patents
Intelligent card RFID semi-automatic production line Download PDFInfo
- Publication number
- CN214311799U CN214311799U CN202120095051.2U CN202120095051U CN214311799U CN 214311799 U CN214311799 U CN 214311799U CN 202120095051 U CN202120095051 U CN 202120095051U CN 214311799 U CN214311799 U CN 214311799U
- Authority
- CN
- China
- Prior art keywords
- chip
- winding
- moving unit
- welding
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The application discloses a semi-automatic production line of an intelligent card RFID, which comprises vacuum working tables, wherein two groups of vacuum working tables are arranged at intervals; the chip supply device comprises a chip supply mechanism and a chip supply platform; the chip filling device is used for sequentially allocating the chips on the chip supply platform to the substrates on the two vacuum working tables; the winding device can wind the substrates arranged on the two vacuum working tables with coils according to a preset sequence; coil welding set can weld the coil of establishing and the chip that fills on the base plate that disposes on two vacuum table according to the order of predetermineeing to make both electricity couplings, this smart card RFID semi-automatization production line can accomplish the base plate automatically and fill the chip, base plate wire winding and coil and chip bonding, and the base plate is filled chip, base plate wire winding and coil and chip bonding in two at least processes can be paralleled, very big promotion production efficiency.
Description
Technical Field
The application relates to a smart card RFID semi-automatization production line.
Background
The smart card production process relates to the base plate piece and punches a hole, the base plate is loaded the chip, the base plate wire winding, one or more in processes such as coil and chip bonding, among the conventional equipment, the chip is loaded to the base plate, base plate wire winding and coil and chip bonding are accomplished by the station in series in proper order, but the base plate is loaded the chip, base plate wire winding and coil and the not fine matching of chip bonding's beat, therefore the conventional equipment smart card production mode inefficiency, can not satisfy the demand that promotes manufacturing efficiency.
SUMMERY OF THE UTILITY MODEL
For overcoming the problem that exists among the correlation technique, this application provides a smart card RFID semi-automatization production line, this smart card RFID semi-automatization production line can accomplish the base plate automatically and fill chip, base plate wire winding and coil and chip bonding to two at least processes in chip, base plate wire winding and coil and the chip bonding are filled to the base plate can be parallel, very big promotion production efficiency.
In order to solve the technical problem, the technical scheme adopted by the application is as follows:
the utility model provides a smart card RFID semi-automatization production line is provided, includes: two groups of vacuum working tables are arranged at intervals; the chip supply device comprises a chip supply mechanism and a chip supply platform; the chip filling device is used for sequentially allocating the chips on the chip supply platform to the substrates on the two vacuum working tables; the winding device can wind the substrates arranged on the two vacuum working tables with coils according to a preset sequence; and a coil welding device which can weld the coils wound on the substrates arranged on the two vacuum working tables and the loaded chips according to a preset sequence so as to enable the coils and the loaded chips to be electrically coupled.
Preferably, the chip feeding mechanism comprises at least one of a vibration disc feeding mechanism, a tray disc feeding mechanism and a material roll feeding mechanism, the two vacuum working tables are arranged in parallel, and one end of the extending direction of the vacuum working tables is provided with a chip feeding device and the other end of the vacuum working tables is used for taking and placing the substrate.
Preferably, one side of the chip supply platform is positioned in the working range of the chip supply mechanism, the chip supply mechanism can arrange the chips on the chip supply platform according to a preset position, and the other side of the chip supply platform is positioned in the stroke range of the two vacuum working tables; the chip loading device includes: the chip loading device comprises a loading adsorption unit, a loading vertical moving unit and a loading horizontal moving unit, wherein the loading horizontal moving unit is arranged above two vacuum working tables and a chip supply platform in a crossing mode, and can drive the loading vertical moving unit and the loading adsorption unit arranged on the loading vertical moving unit to reciprocate on the two vacuum working tables and the chip supply platform so as to allocate chips on the chip supply platform to substrates on the two vacuum working tables according to a preset sequence.
Preferably, the winding device comprises a winding horizontal moving unit, a winding vertical moving unit and a winding unit, wherein the winding horizontal moving unit is arranged above the two vacuum working tables in a crossing manner, can drive the winding vertical moving unit and the winding unit arranged on the winding horizontal moving unit to reciprocate on the two vacuum working tables, and winds the substrates on the two vacuum working tables with coils according to a preset sequence.
Preferably, the coil welding device comprises a welding horizontal moving unit, a welding vertical moving unit and a welding unit, wherein the welding horizontal moving unit is arranged above the two vacuum work tables in a crossing manner and can drive the welding vertical moving unit and the welding unit arranged on the welding vertical moving unit to reciprocate on the two vacuum work tables.
Preferably, the winding units are arranged in a plurality of groups at intervals, the intervals of the winding units are integral multiples of the intervals of the chips on the substrate, a winding adjusting mechanism is arranged between the winding units and the winding vertical moving unit, and the winding adjusting mechanism can adjust the intervals, angles and heights of the winding units.
Preferably, the welding units are arranged in a plurality of groups at intervals, the intervals of the welding units are integral multiples of the intervals of the chips on the substrate, a welding adjusting mechanism is arranged between the welding units and the welding vertical moving unit, and the welding adjusting mechanism can adjust the intervals, angles and heights of the welding units.
Preferably, the chip supply stage is provided with a chip correction mechanism for correcting the position of the chip.
Preferably, the loading suction unit includes a plurality of loading tips and a loading vertical reciprocating member for driving the loading tips mounted thereon to reciprocate independently in a vertical direction.
Preferably, the winding device is provided with winding units matched with the number of the filling suckers.
The technical scheme provided by the application can comprise the following beneficial effects: this smart card RFID semi-automatization production line can accomplish the base plate automatically and fill chip, base plate wire winding and coil and chip bonding to two at least processes in chip, base plate wire winding and coil and the chip bonding are filled to the base plate can be parallel, very big promotion production efficiency.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic view of the overall structure shown in embodiment 1 of the present application.
Fig. 2 is a schematic view 2 of the overall structure shown in embodiment 1 of the present application.
Fig. 3 is a schematic view of a chip loading apparatus shown in embodiment 1 of the present application.
Fig. 4 is a schematic view of a winding device shown in embodiment 1 of the present application.
Fig. 5 is a schematic view of a coil welding apparatus shown in embodiment 1 of the present application.
Fig. 6 is a schematic view of a chip supply apparatus shown in embodiment 2 of the present application.
Fig. 7 is a schematic view of a chip supply apparatus shown in embodiment 3 of the present application.
Description of the reference numerals
| Numbering | Name (R) | Numbering | Name (R) |
| 5 | |
801 | |
| 501 | Chip supply platform | 8011 | |
| 502 | |
8012 | Wire feeding mechanism |
| 6 | |
802 | Winding vertical moving unit |
| 601 | Loading |
803 | Winding |
| 6011 | |
9 | |
| 6012 | Filling |
901 | Welding |
| 602 | Filling a |
902 | |
| 603 | Filling |
903 | Welding |
| 7A | First vacuum working table | 19 | |
| 7B | Second vacuum working table | 20 | Material rolling |
| 8 | |
21 | Operating area |
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
Example 1
The application provides a smart card RFID semi-automatic production line, wherein a substrate is taken and placed manually, a substrate filling chip, a substrate winding and a coil and chip welding can be automatically completed, and the substrate can be made of materials such as PVC, PETG, PC, Teslin and the like;
most of chips sold in the market at present are bulk chips, tray disc type chips and material roll type chips, for this reason, the chip supply device 5 in the application is relatively independent from other devices in space, the chip supply device 5 and a wire body can be quickly disassembled and quickly installed and positioned, so that the feeding mode of equipment can be conveniently changed, the tray disc type chips need to be cut off from the tray disc when in use, and single chips are obtained by cutting the tray disc.
FIG. 1 is a top view of a smart card RFID semi-automatic production line with a hidden protective cover and a part of a rack, and FIG. 1 is used for illustrating the overall arrangement of the smart card RFID semi-automatic production line;
referring to FIGS. 1 to 5
The first vacuum workbench 7A and the second vacuum workbench 7B are arranged in parallel, a chip filling device 6, a winding device 8 and a coil welding device 9 are arranged above the first vacuum workbench 7A and the second vacuum workbench 7B in a crossing mode, and the chip filling device 6, the winding device 8 and the coil welding device 9 can sequentially and alternately perform chip filling, winding and welding on the substrates on the first vacuum workbench 7A and the second vacuum workbench 7B;
the two vacuum working tables are arranged in parallel, one end of the vacuum working table in the extending direction is provided with a chip supply device, the other end of the vacuum working table is arranged to be an operation area, an operator is positioned in the operation area, and blank substrates and processed substrates are alternately placed on the first vacuum working table 7A and the second vacuum working table 7B.
In order to optimize the operation path of the chip filling device 6 for filling the first vacuum table 7A and the second vacuum table 7B with chips, a chip supply platform 501 is arranged between the first vacuum table 7A and the second vacuum table 7B, and the chip supply platform 501 is used for conveying the chips cut by the chip connection supply device 5 to the working range of the chip filling device 6;
one side of the chip supply platform 501 is in the working range of the chip supply mechanism 502, the chip supply mechanism 502 can arrange the chips on the chip supply platform 501 according to the preset position, and the other side of the chip supply platform 501 is in the stroke range of the two vacuum working tables;
the chip loading device 6 includes: a loading adsorption unit 601, a loading vertical moving unit 602 and a loading horizontal moving unit 603, wherein the loading horizontal moving unit 603 is arranged above the two vacuum tables and the chip supply platform 501 in a crossing manner, and can drive the loading vertical moving unit 602 and the loading adsorption unit 601 mounted thereon to reciprocate on the two vacuum tables and the chip supply platform 501 so as to allocate chips on the chip supply platform 501 to the substrates on the two vacuum tables according to a preset sequence, and further, the chip supply platform 501 is provided with a chip correction mechanism for correcting the positions of the chips;
as further shown in fig. 3, the charging adsorption unit 601 includes a plurality of charging suction heads 6011 and a charging vertical cylinder 6012; as an example, eight loading suction heads 6011 are provided at intervals, eight loading vertical cylinders 6012 are provided to control vertical movement of the loading suction heads 6011 accordingly, and the pitch of the loading suction heads 6011 coincides with the pitch of the chips on the chip supply platform 501, the loading vertical moving unit 602 drives the loading suction unit 601 to take out 8 chips from the chip supply platform 501 at a time, the chip supply platform 501 may return to the chip supply device 5 to continue loading the chips, the pitch of the chips on the loading suction unit 601 does not coincide with the pitch of the chips to be loaded on the substrate, and the loading vertical cylinders 6012 drive the loading suction heads 6011 to load the chips one by one on the corresponding positions of the substrate where the chips are to be loaded.
The winding device 8 includes a winding horizontal moving unit 803, a winding vertical moving unit 802 and a winding unit 801, wherein the winding horizontal moving unit 803 is disposed above the two vacuum tables in a crossing manner, and can drive the winding vertical moving unit 802 and the winding unit 801 mounted thereon to reciprocate on the two vacuum tables, and coils are wound on the substrates on the two vacuum tables in a predetermined sequence.
As further shown in fig. 4, the winding unit 801 includes a winding mechanism 8011 and a wire supplying mechanism 8012, the winding unit 801 has 8 sets at intervals, the interval of the sets is adapted to the position of the substrate where the winding is required, the interval, the angle and the height of the winding unit 801 can be finely adjusted, and the winding unit 801 is driven by the winding vertical moving unit 802 to complete the winding of 8 coils on the first vacuum table 7A or the second vacuum table 7B at one time.
As further shown in fig. 5, the coil welding apparatus 9 includes a welding horizontal moving unit 903, a welding vertical moving unit 901, and a welding unit 902, wherein the welding horizontal moving unit 903 is disposed across the two vacuum tables, and can drive the welding vertical moving unit 901 and the welding unit 902 mounted thereon to reciprocate on the two vacuum tables, the welding unit 902 is provided with four sets, the pitch of the welding unit 902 is twice the pitch of the chip on the substrate, and the pitch, angle, and height of the welding unit 902 can be finely adjusted.
Example 2
Referring to fig. 6, the difference from embodiment 1 is that in embodiment 2, the chip supply device 5 is applied to bulk chips, the bulk chips are sorted by the vibration plate 19, and the sorted chips are transferred to the chip supply platform 501 for fine positioning, so that the chip loading device 6 can adsorb and load the chips onto the substrate.
Example 3
Referring to fig. 7, the difference from embodiment 1 is that the chip supply device 5 in embodiment 3 is applied to roll-type chips, the roll-type chips are supplied by the roll-type chip supply mechanism 20 and cut by the roll-type chip cutting mechanism, and the cut chips are transferred to the chip supply platform 501 for fine positioning so as to be adsorbed and loaded onto the substrate by the chip loading device 6.
In the present application, the fine tuning function of the winding unit 801 and the welding unit 902 can be realized by using a fine tuning platform assembly, which belongs to the prior art and is not described in detail herein.
In this application, coil welding set adopts butt-joint mechanism, and coil welding set can also use common welding modes in this field such as laser welding.
In the present application, the fusion bonding apparatus may use a heating and melting method common in the art, such as electric heating, to heat the substrate and the thin film by using ultrasonic waves to melt the substrate and the thin film locally.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a more detailed description of the present application in connection with specific embodiments thereof, and it is not intended that the present application be limited to the specific embodiments thereof. It will be apparent to those skilled in the art from this disclosure that many more simple derivations or substitutions can be made without departing from the spirit of the disclosure.
Claims (10)
1. A smart card RFID semi-automatization production line which characterized in that includes:
two groups of vacuum working tables are arranged at intervals;
the chip supply device comprises a chip supply mechanism and a chip supply platform;
the chip filling device is used for sequentially allocating the chips on the chip supply platform to the substrates on the two vacuum working tables;
the winding device can wind the substrates arranged on the two vacuum working tables with coils according to a preset sequence;
and a coil welding device which can weld the coils wound on the substrates arranged on the two vacuum working tables and the loaded chips according to a preset sequence so as to enable the coils and the loaded chips to be electrically coupled.
2. The semi-automatic production line of RFID of smart card of claim 1, wherein the chip feeding mechanism comprises at least one of a vibration tray feeding mechanism, a tray feeding mechanism and a material roll feeding mechanism, two vacuum tables are arranged side by side, and one end of the vacuum table in the extending direction is provided with a chip feeding device and the other end is used for picking and placing substrates.
3. The semi-automatic smart card RFID production line of claim 2, wherein one side of the chip feeding platform is within the working range of the chip feeding mechanism, the chip feeding mechanism can arrange the chips on the chip feeding platform according to preset positions, and the other side of the chip feeding platform is within the stroke range of the two vacuum working tables;
the chip loading device includes: the chip loading device comprises a loading adsorption unit, a loading vertical moving unit and a loading horizontal moving unit, wherein the loading horizontal moving unit is arranged above two vacuum working tables and a chip supply platform in a crossing mode, and can drive the loading vertical moving unit and the loading adsorption unit arranged on the loading vertical moving unit to reciprocate on the two vacuum working tables and the chip supply platform so as to allocate chips on the chip supply platform to substrates on the two vacuum working tables according to a preset sequence.
4. The semi-automatic production line of smart card RFID according to claim 2, wherein the winding device comprises a winding horizontal moving unit, a winding vertical moving unit and a winding unit, the winding horizontal moving unit is disposed across the two vacuum tables and can drive the winding vertical moving unit and the winding unit mounted thereon to reciprocate on the two vacuum tables, and the coils are wound on the substrates on the two vacuum tables according to a predetermined sequence.
5. The smart card RFID semi-automatic production line of claim 2, wherein the coil welding device comprises a welding horizontal moving unit, a welding vertical moving unit and a welding unit, the welding horizontal moving unit is arranged above the two vacuum working tables in a crossing manner and can drive the welding vertical moving unit and the welding unit mounted on the welding vertical moving unit to reciprocate on the two vacuum working tables.
6. The smart card RFID semi-automatic production line of claim 4, wherein the winding units are arranged in a plurality of groups at intervals, the distance between the winding units is an integral multiple of the distance between the chips on the substrate, and a winding adjusting mechanism is arranged between the winding units and the winding vertical moving unit and can adjust the distance, the angle and the height of the winding units.
7. The smart card RFID semi-automatic production line of claim 5, wherein the welding units are arranged in groups at intervals, the intervals are integral multiples of the intervals of the chips on the substrate, and a welding adjusting mechanism is arranged between the welding units and the welding vertical moving unit and can adjust the intervals, angles and heights of the welding units.
8. The smart card RFID semi-automated manufacturing line of claim 3, wherein the chip supply platform is provided with a chip calibration mechanism for calibrating the position of the chip.
9. A smart card RFID semi-automated manufacturing line according to claim 3, wherein the loading suction unit comprises a plurality of loading tips and a loading vertical reciprocating part for driving the loading tips mounted thereon to reciprocate independently in a vertical direction.
10. The smart card RFID semi-automated manufacturing line of claim 9, wherein the spooling device has spooling units that match the number of loading tips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120095051.2U CN214311799U (en) | 2021-01-12 | 2021-01-12 | Intelligent card RFID semi-automatic production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120095051.2U CN214311799U (en) | 2021-01-12 | 2021-01-12 | Intelligent card RFID semi-automatic production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214311799U true CN214311799U (en) | 2021-09-28 |
Family
ID=77824807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120095051.2U Active CN214311799U (en) | 2021-01-12 | 2021-01-12 | Intelligent card RFID semi-automatic production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214311799U (en) |
-
2021
- 2021-01-12 CN CN202120095051.2U patent/CN214311799U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108723655B (en) | Bus bar processing device and lamination series welding machine | |
| CN105304534A (en) | Chip mounter | |
| CN208230717U (en) | The automatic loading and unloading device and stamping equipment of press machine | |
| CN116093411A (en) | Battery processing production line | |
| CN113814517A (en) | Series welding machine | |
| CN214311799U (en) | Intelligent card RFID semi-automatic production line | |
| CN112733990A (en) | Intelligent card RFID semi-automatic production line | |
| CN110524890B (en) | Positioning platform for non-contact smart card production equipment | |
| CN214311798U (en) | Smart card RFID semi-manufactured goods production line | |
| CN210651923U (en) | Positioning platform for non-contact smart card production equipment | |
| CN112164736A (en) | Production method and equipment of solar panel | |
| CN218309404U (en) | Detection machine compatible with various display screens | |
| CN218482208U (en) | Full-automatic chip cap planting equipment | |
| CN214311797U (en) | Intelligent card RFID full-automatic production line | |
| CN109786296A (en) | Adhesion process and device in a kind of efficient radio frequency identification tag package | |
| CN115411128A (en) | Solar cell processing system | |
| CN209149339U (en) | A kind of adhering apparatus in efficient radio frequency identification tag package | |
| CN112766446A (en) | Intelligent card RFID full-automatic production line | |
| CN214313136U (en) | Smart card RFID semi-manufactured goods production line | |
| CN110919447A (en) | Piston arrangement direction correcting device and method | |
| CN210040155U (en) | Wafer chip mounting and flattening mechanism | |
| CN109801869B (en) | Efficient electronic tag packaging process and device | |
| CN220077842U (en) | Automatic feeding and discharging winding machine | |
| CN214558937U (en) | Automatic kludge of bottom plate magnetic stripe | |
| CN212638972U (en) | Material tray conveying device for high-frequency gumming machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |