CN214309936U - CMP polishing pad compression ratio measuring device - Google Patents

CMP polishing pad compression ratio measuring device Download PDF

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Publication number
CN214309936U
CN214309936U CN202120106109.9U CN202120106109U CN214309936U CN 214309936 U CN214309936 U CN 214309936U CN 202120106109 U CN202120106109 U CN 202120106109U CN 214309936 U CN214309936 U CN 214309936U
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China
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adjuster
weight
polishing pad
compression ratio
cmp polishing
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CN202120106109.9U
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Chinese (zh)
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吕俊园
黄振坤
黄学良
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Hubei Dinglong Co ltd
Hubei Dinghui Microelectronics Materials Co ltd
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Hubei Dinglong Co ltd
Hubei Dinghui Microelectronics Materials Co ltd
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Abstract

The utility model provides a CMP polishing pad compression ratio measuring device, include: support device (1), adjusting device (2), measuring device (3) and computing device (4), measuring device (3) includes: electric jar (31), shoulder pole (32), two first guiding axle (33) and two second guiding axle (34), first weight (35), second weight (36), instruction table (37) and plane gauge head (38), wherein, electric jar (31) is located shoulder pole (32), shoulder pole (32) are connected with first guiding axle (33) and second guiding axle (34) through the bolt, first guiding axle (33) are used for the fixed of first weight (35), adopt automatic data acquisition and computational system, can effectively reduce the error of artificial reading, practice thrift the human cost, and the bottom rack uses the vacuum adsorption formula design, and accessible control vacuum adsorption's pressure reduces measuring error.

Description

CMP polishing pad compression ratio measuring device
Technical Field
The utility model relates to a CMP polishing pad technical field especially relates to a CMP polishing pad compression ratio measuring device.
Background
As the feature size of integrated circuits is getting smaller and smaller in the process of developing deep nano-scale processes, the defects caused by the CMP process become more and more prominent in the advanced process, even to the extent of seriously affecting the performance of the chip. Therefore, the pursuit of performance of a polishing pad, which is one of the four core materials in the CMP process, is a constant topic in the development of polishing pads. The performance index of polishing pads tends to be extremely stable and uniform, and is more and more commonly recognized in the CMP field. The stability and uniformity requirements for polishing pads are the stability and uniformity of macroscopic indicators such as hardness, density, compression ratio, compression recovery rate, from batch to batch, and from sheet to sheet of polishing pads of the same batch. The compression ratio is used as an important control index in the production process of the CMP polishing pad, and has great influence on the quality and the application effect of a product, so that the provision of the compression ratio measuring device and the measuring method is particularly important.
SUMMERY OF THE UTILITY MODEL
The application aims at the defects in the prior art, provides the measuring device for the compression ratio of the CMP polishing pad, can effectively reduce the error caused by artificial reading, and greatly reduces the working time of artificial calculation by directly carrying out data analysis on the measured data through the calculating device.
The utility model provides a CMP polishing pad compression ratio measuring device, include: -a support device (1), -an adjustment device (2), -a measurement device (3) and-a calculation device (4), characterized in that the measurement device (3) comprises: the measuring device comprises an electric cylinder (31), a carrying pole (32), two first guide shafts (33) and two second guide shafts (34), a first weight (35), a second weight (36), an indicating gauge (37) and a plane measuring head (38), wherein the electric cylinder (31) is positioned on the carrying pole (32), the carrying pole (32) is connected with the first guide shaft (33) and the second guide shaft (34) through bolts, the first guide shaft (33) is used for fixing the first weight (35), the second guide shaft (34) penetrates through a through hole of the first weight and is used for fixing the second weight (36), the second weight (36) is positioned below the first weight (35), and the indicating gauge (37) is positioned below the second weight (36) and is fixedly connected with the plane measuring head (38);
further, the supporting device (1) comprises a rack (11) and a stand column (12), wherein the stand column (12) is fixed on the rack (11);
further, the adjusting device (2) comprises an optical axis clamp (21), a first adjuster (22), a second adjuster (23) and a third adjuster (24), the optical axis clamp (21) and the first adjuster (22) are mounted on the upright post (12), the optical axis clamp (21) and the first adjuster (22) can slide up and down in the axial direction of the upright post (12), the second adjuster (23) is fixedly connected with the first adjuster (22), the second adjuster (23) is connected with the third adjuster (24) through a fixing gasket, the third adjuster (24) is further provided with a fixing hole, and the plane measuring head (38) penetrates through the fixing hole of the third adjuster (24);
further, the optical axis clamp (21) is provided with a fixing hole (211) for fixing the optical axis clamp (21), the first adjuster (22), the second adjuster (23) and the third adjuster (24) are respectively provided with a first fastening knob (221), a second fastening knob (222) and a third fastening knob (223), the first fastening knob (221) is used for fixing the first adjuster (22), the second fastening knob (222) is used for finely adjusting the distance between the second adjuster (23) and the third adjuster (24), and the third fastening knob (223) is used for fastening the plane measuring head (38);
further, the upper part of the optical axis clamp (21) is fixedly connected with an electric cylinder (31), the lower part of the optical axis clamp (21) is connected with a carrying pole (32), and the distance between the optical axis clamp (21) and the carrying pole (32) is 3-5 cm;
further, the computing device (4) comprises a computing terminal (41) and a touch screen (42), wherein the computing terminal (41) is in communication connection with the indicating table (37);
preferably, a limit block (361) is arranged on the second weight (36), and a limit groove (351) is arranged below the first weight (35);
preferably, the bench (11) is a granite bench, and the bench (11) is also provided with a processing groove and a vacuum channel;
preferably, the computing terminal (41) and the indicator (37) can be in one of wired connection mode, Bluetooth mode, WiFi mode, 4G wireless connection mode and 5G wireless connection mode through Ethernet.
The utility model has the advantages that:
1. the utility model adopts the touch screen to display by adopting HMI, and can directly transmit the measured data into the computing terminal, thereby reducing the manual reading and recording errors; the human cost is reduced, the efficiency is improved, and the data model is arranged in the computing terminal and can directly analyze the acquired data.
2. The utility model discloses the measurement to CMP polishing pad compresses tightly the mode and improves, often uses the mode that the hand was pressed among the prior art, and the pressure that leads to CMP polishing pad to receive varies from person to person, the utility model discloses in adopt vacuum adsorption's form to compress tightly CMP polishing pad, through control vacuum adsorption's pressure, reduce measuring error.
3. The utility model discloses use high accuracy granite rack, make CMP polishing pad fixed by vacuum adsorption through the processing slot and the vacuum channel of control rack upper surface, can make various sample templates to be applicable to the test strip of various shapes.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of the assembly of a device for measuring the compression ratio of a CMP polishing pad
FIG. 2 is a left side view of the device for measuring the compression ratio of the CMP polishing pad of the present invention
FIG. 3 is a front view of a measuring device for a CMP polishing pad compression ratio measuring device
FIG. 4 is a schematic view showing the connection relationship between the devices for measuring the compression ratio of the CMP polishing pad
Description of the drawings: 11-a gantry; 12-a column; 21-optical axis clamp; 22-a first regulator; 23-a second regulator; 24-a third regulator; 211-fixation holes; 221-a first fastening knob; 222-a second fastening knob; 223-a third tightening knob; 31-an electric cylinder; 32-carrying pole; 33-a first guide shaft; 34-a second guide shaft; 35-a first weight; 36-a second weight; 37-an indicator table; 38-a planar probe; 351-a limit groove; 361-a limiting block; 41-touch screen; 42-computing terminal.
Detailed Description
To make the objects, aspects and advantages of the present invention clearer, the following will describe in further detail a method of implementing the present invention with reference to the accompanying drawings, which may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, which will be defined by the appended claims, in which, for the sake of clarity, the dimensions and relative dimensions of layers and regions are exaggerated.
The utility model particularly provides a CMP polishing pad compression ratio measuring device, as shown in FIG. 4, include: a support device 1, an adjusting device 2, a measuring device 3 and a calculating device 4; as shown in fig. 1 and 3, the measuring device 3 comprises an electric cylinder 31, a carrying pole 32, two first guiding shafts 33 and two second guiding shafts 34, a first weight 35, a second weight 36, an indicating gauge 37 and a plane measuring head 38, wherein the electric cylinder 31 is located on the carrying pole 32, the carrying pole 32 is connected with the first guiding shaft 33 and the second guiding shaft 34, four through holes are arranged on the carrying pole 32 for fixing the first guiding shaft 33 and the second guiding shaft 34 respectively, the utility model preferably uses bolt fixing, the first guiding shafts 33 are located at the left and right outer sides of the carrying pole 32, the second guiding shafts 34 are located at the left and right inner sides of the carrying pole 32, the first guiding shafts 33 are used for fixing the first weight 35, four through holes are arranged at the positions of the first weight 35 corresponding to the upper and lower positions of the carrying pole 32 for the first guiding shafts 33 and the second guiding shafts 34 to pass through, a bolt and a gasket are arranged below the first guiding shafts 33, the first weight 35 can move up and down in the axial direction of the first guide shaft 33, wherein the second guide shaft 34 penetrates through a through hole of the first weight 35 and is used for fixing the second weight 36, a bolt and a gasket are arranged below the same second guide shaft 34, the second weight 36 is positioned below the first weight 35, and the second weight 36 can also slide up and down in the axial direction of the second guide shaft 34; in addition, in the embodiment of the present invention, a limiting block 361 is disposed on the second weight 36, the number of the limiting blocks 361 is 3-5, and correspondingly, a limiting groove 351 is disposed below the first weight, the number of the limiting grooves is the same as that of the limiting blocks 361, the shape of the limiting groove 351 is the same as that of the limiting blocks 361, the width and depth of the limiting groove 351 are slightly larger than those of the limiting blocks 361, the first weight can fall on the second weight in the testing process, the limiting blocks 361 are just placed in the limiting groove 351, the horizontal position offset of the weights can be effectively prevented, and the measurement accuracy is higher; the quality and the volume of second weight 36 are less than first weight 35, and indicator 37 is located second weight 36 below and both pass through double-end screw threaded connection, and indicator 37 lower extreme and plane gauge head 38 fixed connection, the utility model discloses well indicator 37 is preferred to use the amesdial of MITUTOYO production; the flat side head 38 is preferably a flat side head having a diameter of 10 mm.
The utility model discloses well strutting arrangement 1 includes rack 11 and stand 12, wherein, on stand 12 is fixed in rack 11, wherein stand 12 lower part is provided with the screw thread, be fixed in on rack 11 through threaded connection as the preferred scheme of the utility model, the granite rack is chooseed for use to rack 11, wherein rack 11 still is provided with processing slot and vacuum channel (not shown in the figure), wherein process the slot and set up in granite rack upper surface, be used for placing of CMP polishing pad sample, the lower part is provided with vacuum channel, wherein, vacuum channel is connected with vacuum generator (not shown in the figure), place inside the granite rack in the vacuum generator, be used for the polishing pad sample fixed at the vacuum adsorption on granite rack surface.
The utility model discloses well adjusting device 2 includes optical axis anchor clamps 21, first regulator 22, second regulator 23 and third regulator 24, and optical axis anchor clamps 21 and first regulator 22 are installed on stand 12, optical axis anchor clamps 21 and first regulator 22 can slide from top to bottom, and wherein optical axis anchor clamps 21 and first regulator 22 are used for the vertical distance of whole regulation measuring device 3 and rack 1, and second regulator 23 and first regulator 22 fixed connection, second regulator 23 and third regulator 24 are connected through fixed gasket, the utility model discloses in use two upper and lower fixed gaskets, fixed gasket pass through the screw thread and connect respectively on second regulator 23 and third regulator 24, fixed gasket can take place small deformation after the atress, third regulator 24 still is provided with the fixed orifices, plane gauge head 38 runs through the fixed orifices of third regulator 24;
the utility model discloses well optical axis anchor clamps 21 is provided with fixed orifices 211 for optical axis anchor clamps 21's is fixed, the utility model discloses in preferably use screw thread fixation to be provided with first fastening knob 221, second fastening knob 222 and third fastening knob 223 on first regulator 22, second regulator 23 and the third regulator 24 respectively after the height control finishes, first fastening knob 221 is used for the fixed of first regulator 22, second fastening knob 222 is used for the fine setting of distance between second regulator 23 and the third regulator 24, third fastening knob 223 is used for the fastening of plane gauge head 38;
the utility model discloses well optical axis anchor clamps 21 top and electric jar 31 fixed connection, the utility model discloses preferably use threaded connection in the use, optical axis anchor clamps 21 below is connected with shoulder pole 32, the utility model discloses preferably use two-way threaded connection, wherein the distance between optical axis anchor clamps 21 and the shoulder pole 32 is 3-5 cm;
the utility model discloses well computing device 4 includes computing terminal 41 and touch-sensitive screen 42 computing terminal 41 and instruction table 37 communication connection, computing terminal 41 are conventional calculator among the prior art, possess data processing and calculation function, and touch-sensitive screen 42 is the conventional touch-sensitive screen of selling among the prior art, and wherein computing terminal and instruction table 37 preferably use ethernet wired connection.
The utility model discloses in still provide a CMP polishing pad compression ratio measuring device's concrete application method: adjusting the proper height, pressing a start button to press the second weight 36 downwards at the starting device, then pressing a reset key on the indicator 37 to return to zero, and pressing the start button again to return the second weight 36 to the original position; flatly placing a polishing pad sample on a bench 11, selecting any test point to measure T1, T2 and T3, descending a second weight 36 to press the polishing pad sample through a measuring head, keeping 60s, then taking the reading of an indicator 37, namely T1, descending the first weight 35 after the T1 is stabilized, equalizing the pressure of the first weight 35 and the second weight 36 on the polishing pad sample, taking the reading of the indicator 37, namely T2, 60s, then returning the first weight 35 and the second weight 36 to the original position, descending the second weight 36 to the polishing pad sample, and taking the reading of the indicator 37, namely T3, 60 s;
a calculation formula is built in the calculation terminal, wherein:
the compression ratio (%) [ (T1-T2)/T1] × 100%;
a compression deformation amount (μm) — (T1-T2);
compression recovery (%) [ (T3-T2)/(T1-T2) ] 100%.
It should be noted that, according to the explanation and illustration of the above description, the person skilled in the art can make variations and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some equivalent modifications and variations of the present invention should be covered by the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims (9)

1. A CMP polishing pad compression ratio measuring apparatus, comprising: -a support device (1), -an adjustment device (2), -a measurement device (3) and-a calculation device (4), characterized in that the measurement device (3) comprises: the measuring instrument comprises an electric cylinder (31), a carrying pole (32), two first guide shafts (33) and two second guide shafts (34), a first weight (35), a second weight (36), an indicating meter (37) and a plane measuring head (38), wherein the electric cylinder (31) is located on the carrying pole (32), the carrying pole (32) is connected with the first guide shaft (33) and the second guide shaft (34) through bolts, the first guide shaft (33) is used for fixing the first weight (35), the second guide shaft (34) penetrates through a through hole of the first weight and is used for fixing the second weight (36), the second weight (36) is located below the first weight (35), and the indicating meter (37) is located below the second weight (36) and is fixedly connected with the plane measuring head (38).
2. The CMP polishing pad compression ratio measuring device according to claim 1, wherein the supporting device (1) comprises a gantry (11) and a column (12), wherein the column (12) is fixed to the gantry (11).
3. The device for measuring the compression ratio of the CMP polishing pad according to claim 1, wherein the adjusting device (2) comprises an optical axis clamp (21), a first adjuster (22), a second adjuster (23) and a third adjuster (24), the optical axis clamp (21) and the first adjuster (22) are installed on the upright column (12), the optical axis clamp (21) and the first adjuster (22) can slide up and down in the axial direction of the upright column (12), the second adjuster (23) is fixedly connected with the first adjuster (22), the second adjuster (23) is connected with the third adjuster (24) through a fixing gasket, the third adjuster (24) is further provided with a fixing hole, and the plane measuring head (38) penetrates through the fixing hole of the third adjuster (24).
4. The CMP polishing pad compression ratio measuring device according to claim 3, characterized in that the optical axis clamp (21) is provided with a fixing hole (211) for fixing the optical axis clamp (21), the first adjuster (22), the second adjuster (23) and the third adjuster (24) are respectively provided with a first fastening knob (221), a second fastening knob (222) and a third fastening knob (223), the first fastening knob (221) is used for fixing the first adjuster (22), the second fastening knob (222) is used for fine adjustment of the distance between the second adjuster (23) and the third adjuster (24), and the third fastening knob (223) is used for fastening the plane measuring head (38).
5. The device for measuring the compression ratio of the CMP polishing pad according to claim 3, wherein the optical axis clamp (21) is fixedly connected with the electric cylinder (31) at the upper part, and is connected with the carrying pole (32) at the lower part, wherein the distance between the optical axis clamp (21) and the carrying pole (32) is 3-5 cm.
6. The device for measuring the compression ratio of the CMP polishing pad according to claim 1, wherein the computing device (4) comprises a computing terminal (41) and a touch screen (42), and the computing terminal (41) is in communication connection with the indicating meter (37).
7. The device for measuring the compression ratio of the CMP polishing pad according to claim 1, wherein a limit block (361) is arranged on the second weight (36), and a limit groove (351) is arranged below the first weight (35).
8. The CMP polishing pad compression ratio measuring device according to claim 2, characterized in that the stage (11) is a granite stage, and the stage (11) is further provided with machining grooves and vacuum channels.
9. The device for measuring the compression ratio of a CMP polishing pad according to claim 6, wherein the computing terminal (41) and the indicating gauge (37) are connected in a wired, Bluetooth, WiFi, 4G, 5G wireless manner via Ethernet.
CN202120106109.9U 2021-01-15 2021-01-15 CMP polishing pad compression ratio measuring device Active CN214309936U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120106109.9U CN214309936U (en) 2021-01-15 2021-01-15 CMP polishing pad compression ratio measuring device

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Application Number Priority Date Filing Date Title
CN202120106109.9U CN214309936U (en) 2021-01-15 2021-01-15 CMP polishing pad compression ratio measuring device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227530A (en) * 2021-12-10 2022-03-25 湖北鼎汇微电子材料有限公司 Polishing pad and method for manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227530A (en) * 2021-12-10 2022-03-25 湖北鼎汇微电子材料有限公司 Polishing pad and method for manufacturing semiconductor device
CN114227530B (en) * 2021-12-10 2022-05-10 湖北鼎汇微电子材料有限公司 Polishing pad and method for manufacturing semiconductor device

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