CN214281384U - Optical module - Google Patents

Abstract

An embodiment of the present application provides an optical module, including: the upper shell, the lower shell and the upper shell cover to form a wrapping cavity. The circuit board is arranged in the wrapping cavity. The transmitter optical subassembly includes: the ceramic substrate is provided with a laser, a transmission line and a matching resistor on the surface. One end of the first lead group is connected with the laser, and the other end of the first lead group is connected with the transmission line. And one end of the second lead group is connected with the matching resistor, and the other end of the second lead group is connected with the laser. And one end of the third wire group is connected with the transmission line, and the other end of the third wire group is connected with the matching resistor. The embodiment of the application provides an optical module, what adopt among laser instrument, transmission line, matching resistance three is that the transmission line beats a gold thread to the laser instrument, on the basis of the interconnection form of laser instrument beat a line to matching resistance, increase and stride the device routing mode, the routing strides across the device that is located the centre promptly, realizes both sides electrical part interconnection through beating two or many wires to reduce the parasitic inductance of three interconnection.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

When the optical module sends signals, the golden finger introduces electric signals into the laser driving chip, the laser driving chip transmits the electric signals to the laser through the transmission line, and then the laser converts the electric signals into optical signals. In order to ensure the signal integrity between the laser driving chip and the laser, the impedance of the laser output needs to be matched with the aforementioned characteristic impedance, wherein the matching specifically refers to that the impedance value of the laser output reaches the characteristic impedance value.

Generally, an EML laser (electro-absorption modulated laser) includes a light emitting region and an electro-absorption modulated region, wherein the EA pad, a transmission line and a matching resistor of the electro-absorption modulated region are interconnected by bonding a gold wire to the EA pad via the transmission line and bonding a wire to the matching resistor via the EA pad. Therefore, parasitic inductance of gold wire interconnection among the laser bonding pad, the transmission line and the matching resistor influences signal transmission.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to reduce parasitic inductance that EA pad, transmission line, matching resistance three gold wires interconnect.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes: an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the light emission secondary module is arranged in the packaging cavity;

the transmitter optical subassembly includes: a ceramic substrate;

a laser carried by the ceramic substrate for emitting light;

the surface of the ceramic substrate is provided with a transmission line, and the transmission line is used for transmitting electric signals;

the matching resistor is arranged on the surface of the ceramic substrate and is connected with the laser in parallel;

one end of the first lead group is connected with the laser, and the other end of the first lead group is connected with the transmission line;

one end of the second lead group is connected with the matching resistor, and the other end of the second lead group is connected with the laser;

and one end of the third wire group is connected with the transmission line, and the other end of the third wire group is connected with the matching resistor.

Compared with the prior art, the beneficial effect of this application is:

an embodiment of the present application provides an optical module, including: the upper shell, the lower shell and the upper shell cover to form a wrapping cavity. The circuit board is arranged in the wrapping cavity. The light emission secondary module is arranged in the packaging cavity. Wherein, the transmitter optical subassembly includes: the ceramic substrate is provided with a laser, a transmission line and a matching resistor on the surface. And one end of the first lead group is connected with the laser, and the other end of the first lead group is connected with the transmission line. And one end of the second lead group is connected with the matching resistor, and the other end of the second lead group is connected with the laser. And one end of the third wire group is connected with the transmission line, and the other end of the third wire group is connected with the matching resistor. The embodiment of the application provides an optical module, what interconnect between laser instrument, transmission line, matching resistance three adopted is that the transmission line beats a gold thread to the laser instrument, and on the basis of this kind of interconnection form of line to matching resistance was beaten to the laser instrument, the device routing mode is striden in the increase, and the routing strides across the device that is located in the middle promptly, realizes both sides electrical part interconnect through beating two or many wires to reduce the parasitic inductance of three interconnect.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is an exploded view of the optical module;

fig. 5 is an exploded schematic view of an tosa according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of another exploded structure of an tosa according to an embodiment of the present disclosure;

fig. 7 is a schematic partial structure diagram of a light emitting device according to an embodiment of the present disclosure;

fig. 8 is a schematic partial structure diagram of an tosa according to an embodiment of the present disclosure;

fig. 9 is a partial schematic structural diagram of a tosa according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of an absorbent film structure provided in accordance with an embodiment of the present disclosure;

fig. 11 is a schematic diagram illustrating a partial structure of a tosa according to an embodiment of the present disclosure;

fig. 12 is a schematic diagram illustrating a partial structure of a tosa according to an embodiment of the present disclosure;

fig. 13 is a schematic diagram illustrating a partial structure of an tosa according to an embodiment of the present disclosure;

fig. 14 is a schematic diagram illustrating a partial structure of a tosa according to an embodiment of the present application;

FIG. 15 is an exploded view of another tosa according to an embodiment of the present invention;

FIG. 16 is a schematic diagram illustrating a portion of another tosa according to an embodiment of the present disclosure;

FIG. 17 is a first schematic view of a second ceramic substrate according to an embodiment of the present disclosure;

FIG. 18 is a second ceramic substrate structure according to an embodiment of the present disclosure;

FIG. 19 is an exploded view of a second ceramic substrate according to an embodiment of the present disclosure;

fig. 20 is a partial schematic view of an tosa according to an embodiment of the present disclosure;

fig. 21 is an exploded view of a second ceramic substrate and a laser according to an embodiment of the disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a main circuit board 105, and a cage 106 is provided on a surface of the main circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module. The following describes the optical module in the optical communication terminal according to the foregoing embodiment with reference to fig. 3 and 4; as shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect an optical transceiver module inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module includes two parts, namely an optical transmitter sub-module 400 and an optical receiver sub-module 500, which are respectively used for transmitting and receiving optical signals. The emission secondary module generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.

Fig. 5 is an exploded schematic view of an tosa according to an embodiment of the present disclosure; fig. 6 is a schematic diagram of another exploded structure of an tosa according to an embodiment of the present disclosure; the overall structure of the light emitting portion of the optical module of the present application is described below with reference to fig. 5 and 6. As shown in fig. 5 and 6, the tosa 400 includes a cover plate 401 and a housing 402, the cover plate 401 and the housing 402 are connected in a covering manner, specifically, the cover plate 401 covers the housing 402 from above, one side wall of the housing 402 has an opening 404 for inserting the circuit board 300, and the other side wall of the housing 402 has a through hole for inserting the fiber adapter 403.

Specifically, the circuit board 300 extends into the housing 402 through the opening 404, and the circuit board 300 is fixed to the lower case 202; the circuit board 300 is plated with metal traces, and the optical device can be electrically connected to the corresponding metal traces by wire bonding, so as to electrically connect the optical device in the housing 402 to the circuit board 300.

The signal light emitted by the light emitting device is emitted into the through hole, the optical fiber adapter 403 extends into the through hole 405 to be coupled and received with the signal light, the assembling structure design can enable the optical fiber adapter 403 to move back and forth in the through hole 405, the required size of the optical fiber between the light emitting sub-module and the optical fiber plug can be adjusted, and when the optical fiber is short, the optical fiber adapter can be moved backwards (towards the outer direction of the cavity) in the through hole to meet the requirement of the connection size; when the optical fiber is longer, the optical fiber adapter can be moved forwards (towards the inner direction of the cavity) in the through hole so as to straighten the optical fiber and avoid bending the optical fiber. The fiber optic adapters 403 are inserted into the through holes to effect the attachment to the tosa 400; during assembly, the fiber optic adapters 403 may be moved within the through-holes to select a fixed position.

One side wall of the housing 402 has an opening 404 for insertion of the circuit board 300 and the other side wall of the housing 402 has a through hole for insertion of the fiber optic adapter 403.

In this embodiment, the optical device disposed in the housing 402 may optionally be connected to the circuit board 300 through a pin, where the pin is designed to have a shape adapted to the lower housing, one end of the pin is inserted into the lower housing, and a metal trace is plated on the end of the pin, the optical device may be electrically connected to the corresponding metal trace in a wire bonding manner, one end of the pin disposed in the housing 402 is provided with a plurality of pins electrically connected to the metal trace, the pins are inserted into the circuit board 300 and are welded together, thereby achieving electrical connection between the optical device in the housing 402 and the circuit board 300, and of course, the pins on the pins may also be directly welded to the circuit board 300, so as to achieve electrical connection between the optical device in the housing 402 and the circuit board 300.

In the signal transmission process, after receiving the electrical signal transmitted from the circuit board 300, the light emitting device in the housing 402 converts the electrical signal into an optical signal, and then the optical signal enters the optical fiber adapter 403 and is transmitted to the outside of the optical module.

The transmitter optical subassembly module is provided with a packaging structure for packaging laser chips and the like, and the existing packaging structure comprises a coaxial packaging TO-CAN, a silicon optical packaging, a chip-on-board LENS assembly packaging COB-LENS and a micro-optical XMD packaging. The package is further divided into hermetic package and non-hermetic package, which provides a stable and reliable working environment for the laser chip on one hand and forms external electrical connection and optical output on the other hand.

According to product design and process, the optical module can adopt different packages to manufacture the transmitter optical subassembly. The laser chip has vertical cavity surface light emitting and edge light emitting, and the different light emitting directions of the laser chip can influence the selection of the packaging form. The various packages have obvious technical differences, whether they are different from the structure or from the process, and those skilled in the art know that although different packages achieve the same purpose, different packages belong to different technical routes, and different packaging technologies do not give technical suggestions to each other.

Fig. 7 is a schematic partial structure diagram of a light emitting device according to an embodiment of the present disclosure; as shown in fig. 7, the tosa 500 in the embodiment of the present application includes: the ceramic substrate 501 is disposed in the housing 402 and is made of alumina ceramic, aluminum nitride ceramic, or the like. The ceramic substrate 501 has functional circuits engraved on its surface for the transmission of signals, such as the transmission line 502. The surface of the ceramic substrate 501 is provided with an EML laser 503, the EML laser 503 is an integrated device of a laser DFB and an electro-absorption modulator EA, the laser DFB converts an electric signal into an optical signal, and the electro-absorption modulator EA performs coding modulation on the optical signal and then outputs the optical signal, so that the output optical signal carries information. The electro-absorption modulator is one of the commonly used optical modulators, and has the characteristics of high response speed and low power consumption, so that the electro-absorption modulator is widely applied to transmission of high-speed optical signals.

When the optical module performs signal transmission, a gold finger introduces an electrical signal into the laser driver chip, the laser driver chip transmits the electrical signal to the EML laser 503, and then the EML laser 503 converts the electrical signal into an optical signal, wherein the laser driver chip and the EML laser 503 are connected through a transmission line 502, the wire has a certain characteristic impedance, because the impedance output by the laser driver chip is rated, when the impedance output by the EML laser 503 is not matched with the characteristic impedance, the transmission signal between the laser driver chip and the laser is lost, and the integrity of the signal is reduced, so in order to ensure the integrity of the signal, it is necessary to ensure that the impedance output by the EML laser 503 is matched with the characteristic impedance, it should be noted that the matching means that the impedance value output by the EML laser 503 reaches the characteristic impedance value, that is, the EML laser 503 outputs an impedance value that matches the characteristic impedance value.

In the present application, the EML laser 503 is connected in parallel with the first matching resistor 504, and at this time, the first matching resistor 504 has an impedance matching function, so that the impedance output by the EML laser 503 is finally matched with the characteristic impedance.

Fig. 8 is a schematic partial structure diagram of an tosa according to an embodiment of the present disclosure. Fig. 9 is a partial schematic structural diagram of a tosa according to an embodiment of the present disclosure. As shown in fig. 8 and 9, in order to maximize parasitic inductance of the EML laser 503, the transmission line 502, and the first matching resistor 504, which are interconnected by gold wires, the present embodiment provides an tosa, including: the ceramic substrate 501, the ceramic substrate 501 surface is equipped with the transmission line 502. The surface of the ceramic substrate 501 is provided with an EML laser 503, the EML laser 503 is an integrated device of a laser DFB and an electroabsorption modulator EA, and the electroabsorption modulator EA is connected with the transmission line 502 through a wire. The ceramic substrate 501 has a first matching resistor 504 on its surface, and is connected to the electro-absorption modulator EA through a wire. The transmission line 502 is connected to the first matching resistor 504 by a wire.

As shown in fig. 8, the electro-absorption modulator EA is disposed between the first matching resistor 504 and the transmission line 502. The electro-absorption modulator EA is connected to the transmission line 502 by a first wire set 505. The first matching resistor 504 is connected to the electro-absorption modulator EA through a second set of wires 506. The transmission line 502 and the first matching resistor 504 are connected by a third wire set 507. One end of the third wire group 507 is connected to the transmission line 502, and the other end is connected to the first matching resistor 504. The electro-absorption modulator EA is located between the third lead group 507 and the ceramic substrate 501.

Furthermore, the first wire group 505, the second wire group 506, and the third wire group 507 are gold wires, but since the gold wires are in a thin and long wire bonding structure, the distance between the transmission line 502 and the first matching resistor 504 is long, which is easy to generate parasitic inductance and affect signal transmission. In order to enhance the signal transmission capability between the transmission line 502 and the first matching resistor 504, the third wire group 507 includes: sub-conductor one 5071 and sub-conductor two 5072. One end of the first sub-conductor 5071 is connected with the transmission line 502, the other end of the first sub-conductor is connected with the first matching resistor 504, one end of the second sub-conductor 5072 is connected with the transmission line 502, and the other end of the second sub-conductor is connected with the first matching resistor 504, so that parasitic inductance of gold wire interconnection among the EML laser 503, the transmission line 502 and the first matching resistor 504 is effectively relieved, and signal transmission capacity between the transmission line 502 and the first matching resistor 504 is improved.

In this embodiment, the number of sub-wires in the third wire group 507 includes, but is not limited to, 2, and the specific number is set according to the actual specification and position of the EML laser 503, the transmission line 502, and the first matching resistor 504 in the optical module.

The connection point of the first sub-conductor 5071 on the transmission line 502 and the connection point of the second sub-conductor 5072 on the transmission line 502 are not overlapped, so that the electrical connection between the sub-conductors and the transmission line 502 is effectively ensured. Similarly, the first sub-conductor 5071 at the junction of the first matched resistor 504 and the second sub-conductor 5072 at the junction of the first matched resistor 504 are not coincident.

As shown in fig. 9, an absorption film 508 is further disposed on the surface of the ceramic substrate 501, and covers the first lead group 505, the second lead group 506, and the third lead group 507. One end of the absorption film 508 is disposed outside the first matching resistor 504, and the other end is disposed outside the transmission line 502. The absorbing film 508 is glued to the ceramic substrate 501. The absorption film 508 covers the gold wires, which can effectively improve the parasitic effect of the gold wires and absorb radiation.

Fig. 10 is a schematic view of an absorbent film structure according to an embodiment of the present disclosure. As shown in fig. 10, the absorption film 508 includes: an insulating layer 5081 and a metal layer 5082, wherein the insulating layer 5081 is disposed on the inner side and faces the ceramic substrate 501, thereby reducing the sensitivity of gold wires to external signals and improving the parasitic effect of gold wires. The metal layer 5082 is disposed on the outer side, and can effectively absorb radiation generated from the outside.

The embodiment of the application provides an optical module, what the interconnection between electro-absorption modulator EA, transmission line 502, first matching resistance 504 adopted is that the transmission line makes a gold thread to EA pad, EA pad makes a line to the basis of this interconnection form of first matching resistance, increases and strides device routing mode, and routing strides electro-absorption modulator EA promptly, realizes transmission line 502, first matching resistance 504 interconnection through making two or many lines to reduce the parasitic inductance that the three interconnected. And a layer of light film structure is added on the gold wire, so that the routing inductance is reduced, routing radiation is absorbed, and the signal quality of the part is improved.

Fig. 11 is a third schematic partial structure diagram of an tosa according to an embodiment of the present disclosure, and fig. 12 is a fourth schematic partial structure diagram of an tosa according to an embodiment of the present disclosure. As shown in fig. 11 and 12, the first matching resistor 504 is disposed between the electro-absorption modulator EA and the transmission line 502. The first matching resistor 504 is connected to the electro-absorption modulator EA through a second set of wires 506. The transmission line 502 and the first matching resistor 504 are connected by a third wire set 507. The electro-absorption modulator EA is connected to the transmission line 502 by a first wire set 505. The first conductor set 505 has one end connected to the transmission line 502 and the other end connected to the electro-absorption modulator EA. The first matching resistor 504 is disposed between the first lead group 505 and the ceramic substrate 501

Further, the first wire group 505, the second wire group 506, and the third wire group 507 are gold wires, but since the gold wires are in a thin and long wire bonding structure, the distance between the electro-absorption modulator EA and the transmission line 502 is long, which is easy to generate parasitic inductance and affect signal transmission. To enhance the signal transmission capability between the electro-absorption modulator EA and the transmission line 502, the first wire group 505 includes: a plurality of first sub-conductors 5051. One end of the first sub-wire 5051 is connected to the transmission line 502, and the other end of the first sub-wire is connected to the electro-absorption modulator EA, so that parasitic inductance caused by gold wire interconnection among the EML laser 503, the transmission line 502, and the first matching resistor 504 is effectively relieved, and signal transmission capability between the transmission line 502 and the electro-absorption modulator EA is increased.

In this embodiment, the number of sub-wires in the first wire group 505 includes, but is not limited to, 2, and the specific number is set according to the actual specification and position of the EML laser 503, the transmission line 502, and the first matching resistor 504 in the optical module.

The different first sub-conductors 5051 do not overlap at the connection point of the transmission line 502, which effectively ensures the electrical connection between the sub-conductors and the transmission line 502. Likewise, the different first sub-conductors 5051 do not coincide at the junction of the electro-absorption modulator EA.

The surface of the ceramic substrate 501 is further provided with an absorption film 508 covering the first, second, and third lead groups 505, 506, and 507. The absorption film 508 has one end disposed outside the electro-absorption modulator EA and the other end disposed outside the transmission line 502. The absorbing film 508 is glued to the ceramic substrate 501. The absorption film 508 covers the gold wires, which can effectively improve the parasitic effect of the gold wires and absorb radiation.

The absorbing film 508 includes: the insulating layer and the metal layer are arranged on the inner side and face the ceramic substrate 501, so that the sensitivity of the gold wire to an external signal is reduced, and the parasitic effect of the gold wire is improved. The metal layer is arranged on the outer side and can effectively absorb radiation generated outside.

The embodiment of the application provides an optical module, what the interconnection between electro-absorption modulator EA, transmission line 502, first matching resistance 504 three adopted is that the transmission line makes a gold thread to EA pad, EA pad makes a line to the basis of this kind of interconnection form of first matching resistance 504, increase and stride the device routing mode, first matching resistance 504 is striden in routing promptly, realize electro-absorption modulator EA, transmission line 502 interconnects through making two or many lines to reduce the parasitic inductance that three interconnect. And a layer of light film structure is added on the gold wire, so that the routing inductance is reduced, routing radiation is absorbed, and the signal quality of the part is improved.

Fig. 13 is a schematic diagram of a partial structure of an tosa according to an embodiment of the present disclosure, and fig. 14 is a schematic diagram of a partial structure of an tosa according to an embodiment of the present disclosure, which is a sixth schematic diagram. As shown in fig. 13 and 14, the transmission line 502 is disposed between the electro-absorption modulator EA and the first matching resistor 504. The electro-absorption modulator EA is connected to the transmission line 502 by a first wire set 505. The first matching resistor 504 is connected to the electro-absorption modulator EA through a second set of wires 506. The transmission line 502 and the first matching resistor 504 are connected by a third wire set 507. The electro-absorption modulator EA is connected to the transmission line 502 by a first wire set 505. The second wire set 506 has one end connected to the first matching resistor 504 and the other end connected to the electro-absorption modulator EA. The transmission line 502 is disposed between the second conductive line set 506 and the ceramic substrate 501.

Further, the first wire group 505, the second wire group 506, and the third wire group 507 are gold wires, but since the gold wires are in a slender wire bonding structure, the distance between the electro-absorption modulator EA and the first matching resistor 504 is long, which easily generates parasitic inductance and affects signal transmission. To enhance the signal transmission capability between the electro-absorption modulator EA and the first matching resistor 504, the second wire set 506 includes: a plurality of second sub-conductors 5061. One end of the second sub-wire 5061 is connected with the first matching resistor 504, and the other end is connected with the electro-absorption modulator EA, so that parasitic inductance of gold wire interconnection among the EML laser 503, the transmission line 502 and the first matching resistor 504 is effectively relieved, and signal transmission capacity between the transmission line 502 and the electro-absorption modulator EA is increased.

In this embodiment, the number of sub-wires in the second wire group 506 includes, but is not limited to, 2, and the specific number is set according to the actual specification and position of the EML laser 503, the transmission line 502, and the first matching resistor 504 in the optical module.

The connection points of the different second sub-wires 5061 at the first matching resistor 504 are not overlapped, so that the electrical connection between the sub-wires and the first matching resistor 504 is effectively ensured. Likewise, the different second sub-conductors 5061 do not coincide at the junction of the electro-absorption modulator EA.

The surface of the ceramic substrate 501 is further provided with an absorption film 508 covering the first, second, and third lead groups 505, 506, and 507. The absorption film 508 has one end disposed outside the first matching resistor 504 and the other end disposed outside the electro-absorption modulator EA. The absorbing film 508 is glued to the ceramic substrate 501. The absorption film 508 covers the gold wires, which can effectively improve the parasitic effect of the gold wires and absorb radiation.

The absorbing film 508 includes: an insulating layer 5081 and a metal layer 5082, wherein the insulating layer 5081 is disposed on the inner side and faces the ceramic substrate 501, thereby reducing the sensitivity of gold wires to external signals and improving the parasitic effect of gold wires. The metal layer 5082 is disposed on the outer side, and can effectively absorb radiation generated from the outside. The embodiment of the application provides an optical module, what the interconnection between electro-absorption modulator EA, transmission line 502, first matching resistance 504 adopted is that the transmission line makes a gold thread to EA pad, EA pad makes a line to the basis of this kind of interconnection form of first matching resistance 504, increases and strides device routing mode, and routing strides transmission line 502 promptly, realizes electro-absorption modulator EA, first matching resistance 504 interconnection through making two or many lines to reduce the parasitic inductance that the three interconnected. And a layer of light film structure is added on the gold wire, so that the routing inductance is reduced, routing radiation is absorbed, and the signal quality of the part is improved.

To sum up, this application embodiment provides an optical module, what adopt between electro-absorption modulator EA, transmission line, matching resistance the transmission line beat a gold thread to EA pad, EA pad beat a line to matching resistance this kind of interconnection form's basis, increase and stride the device routing mode, promptly the routing strides across the device that is located the centre, realizes both sides electrical part interconnect through beating two or many wires to reduce the parasitic inductance that three interconnect. And a layer of light film structure is added on the gold wire, so that the routing inductance is reduced, routing radiation is absorbed, and the signal quality of the part is improved.

Fig. 15 is an exploded view of another tosa according to an embodiment of the present invention. As shown in fig. 15, an tosa according to an embodiment of the present invention includes: the tosa 400 includes a housing 402, a cover 401, and an emission assembly 430. The emission assembly 430 is located within the light emission cavity formed by the housing 402 and the cover plate 401. And the light emission cavity is internally provided with an emission assembly such as a light chip, a light detector, a collimating lens and the like. One end of the housing 402 is connected to a fiber optic adapter 403, and the emission assembly is configured to emit a light beam and to be convergently coupled to the fiber optic adapter 403 to enable the light beam to be emitted through the fiber optic. The other end of the housing 402, which is far away from the optical fiber adapter 403, is provided with a first ceramic substrate 700, the first ceramic substrate 700 is connected with one end of the flexible circuit board, and the first ceramic substrate 700 is provided with a laser chip, a light detector, a laser driver and other photoelectric devices which are electrically connected; the other end of the flexible circuit board is used for electrical connection with the circuit board 300. The housing 402 and the cover plate 401 may be made of metal material, such as die-cast or milled metal.

As shown in fig. 15, in order to realize interconnection among the EML laser, the transmission line, and the matching resistor, and eliminate parasitic inductance, an embodiment of the present application provides an tosa, including: the laser comprises a first ceramic substrate 700, a second ceramic substrate 800 and an EML laser 503, wherein the EML laser 503 is arranged between the first ceramic substrate 700 and the second ceramic substrate 800. The transmission line is laid on the surface of the first ceramic substrate 700, and the metal layer is arranged on the second ceramic substrate 800 to connect the transmission line with the EA pad of the EML laser 503.

Fig. 16 is a partial schematic view of another tosa according to an embodiment of the present disclosure. As shown in fig. 16, the first ceramic substrate 700 is disposed in the housing 402, and the surface of the main body base 705 of the first ceramic substrate 700 is engraved with the functional circuit of the laser chip for signal transmission, which includes: a first transmission line 701, a second transmission line 702, and a third transmission line 703, wherein: the third transmission line 703 is disposed between the first transmission line 701 and the second transmission line 702, the first transmission line 701 and the second transmission line 702 are ground lines, and the third transmission line 703 is a signal transmission line. The first ceramic substrate 700 is further provided with a substrate recess 704 for carrying the EML laser 503. The upper mesa of the substrate recessed mesa 704 is lower than the mesa of the body pedestal 705. After the EML laser 503 is mounted on the substrate recessed table 704, the upper surface of the EML laser 503 is aligned with the mesa of the body base 705.

The third transmission line 703 is a signal transmission line, and is disposed between the first transmission line 701 and the second transmission line 702, so as to shield clutter signals, improve anti-electromagnetic effect, provide signal backflow, and reduce crosstalk from external radiation to the laser channel.

Fig. 17 is a first schematic view of a second ceramic substrate structure provided in the present embodiment, fig. 18 is a second schematic view of the second ceramic substrate structure provided in the present embodiment, fig. 19 is an exploded schematic view of the second ceramic substrate provided in the present embodiment, and fig. 17 and fig. 18 show the structure of the second ceramic substrate from different angles.

The second ceramic substrate 800, as shown in fig. 17, 18 and 19, includes: a main body substrate 810 and a sub-substrate 820, wherein the upper surface 811 of the main body substrate 810 is provided with a first gold-plate layer 8111, and the first gold-plate layer 8111 covers the entire upper surface 811 of the main body substrate 810. The first side surface 812 adjacent to the upper surface 811 is provided with a second gold-plate layer 8121, and the second gold-plate layer 8121 covers the entire first side surface 812. The second side surface 813 opposite to the first side surface 812 is provided with a third gold-plate layer 8131, and the third gold-plate layer 8131 covers the entire second side surface 813. One end of the first gold-plate layer 8111 is connected to the second gold-plate layer 8121, and the other end is connected to the third gold-plate layer 8131. Of course, in some embodiments of the present application, the first gold-plate layer 8111 may not cover the entire upper surface 811 of the body substrate 810, and likewise the second gold-plate layer 8121 may not cover the entire first side surface 812, and the third gold-plate layer 8131 may not cover the entire second side surface 813. It is necessary that one end of the first gold-plating layer 8111 is connected to the second gold-plating layer 8121, and the other end is connected to the third gold-plating layer 8131, so that the first gold-plating layer 8111, the second gold-plating layer 8121, and the third gold-plating layer 8131 are electrically connected to each other.

The opposite side of the upper surface 811 is defined as a lower surface 814, the lower surface 814 is provided with a first conductive region 8141, a second conductive region 8142, and a third conductive region 8143, the third conductive region 8143 is disposed between the first conductive region 8141 and the second conductive region 8142, and the first conductive region 8141, the second conductive region 8142, and the third conductive region 8143 are not electrically connected to each other. Also, the first conductive region 8141 is connected to the second gold-plate layer 8121, and the third conductive region 8143 is connected to the third gold-plate layer 8131. Finally, the first conductive area 8141, the second gold-plated layer 8121, the first gold-plated layer 8111, the third gold-plated layer 8131 and the third conductive area 8143 are sequentially connected to form a sub-conductive layer.

The main substrate 810 is attached above the first ceramic substrate 700, and further, the lower surface 814 of the first ceramic substrate 700 is connected to the main substrate 810. Also, the first transmission line 701 is connected to the first conductive region 8141, the third conductive region 8143 is connected to the third transmission line 703, and the second transmission line 702 is connected to the second conductive region 8142.

Through the above connection, the first transmission line 701, the first conductive region 8141, the second gold-plating layer 8121, the first gold-plating layer 8111, the third gold-plating layer 8131, the third conductive region 8143, and the third transmission line 703 are sequentially connected to form a path.

The sub upper surface 821 of the sub substrate 820 is laid with a fourth gold plating layer 8211, the first sub side surface 822 adjacent to the sub upper surface 821 is laid with a fifth gold plating layer 8221, and the fourth gold plating layer 8211 is connected to the fifth gold plating layer 8221. The opposite side of the sub-upper surface 821 is a sub-lower surface 823, a sixth gold-plating layer 8231 is laid on the surface of the sub-lower surface 823, and the sixth gold-plating layer 8231 is connected with the fifth gold-plating layer 8221. The sixth gold-plating layer 8231 is connected to the third conductive region 8143. The fourth gold-plate layer 8211 is also connected to the first gold-plate layer 8111.

The EML laser 503 and the sub-substrate 820 are sequentially arranged above the substrate concave 704, the sub-substrate 820 is connected with an EA pad of the EML laser 503, and the sixth gold-plating layer 8231 is connected with the EA pad through conductive adhesive.

As can be seen from the above, the third transmission line 703, the third conductive region 8143, the sixth gold-plate layer 8231, the EA pad 5031, the fifth gold-plate layer 8221, the fourth gold-plate layer 8211, and the first gold-plate layer 8111 are connected to form a via.

In this embodiment, all gold-plated layers are substantially the same as the conductive layers, and replace gold wires in the original circuit, so that the parasitic inductance of the EML laser, the transmission line, and the matching resistor, which are interconnected by gold wires, is effectively reduced, and the signal transmission capability between the transmission line and the electro-absorption modulator EA is increased.

The sub upper surface 821 of the sub substrate 820 is further provided with a second matching resistor 8212, which is located between the fourth gold-plating layer 8211 and the first gold-plating layer 8111, the second matching resistor 8212 is connected with the EA pad through the fourth gold-plating layer 8211 and the fifth gold-plating layer 8221, the second matching resistor 8212 is connected with the EA pad through the fourth gold-plating layer 8211, the fifth gold-plating layer 8221 and the second conductive region 8142, the second matching resistor 8212 is further connected with the third transmission line 703 through the fourth gold-plating layer 8211, the fifth gold-plating layer 8221 and the second conductive region 8142, therefore, the EA pad and the third transmission line 703 are connected with the second matching resistor 8212, the connection between the EA pad and the third transmission line 703 and the second matching resistor 8212 is realized through the second ceramic substrate 800, the connection is realized through the conductive area on the surface of the second ceramic substrate 800, the original gold wire connection mode is replaced, the parasitic inductance of the gold wire interconnection among the EML laser, the transmission line and the matching resistor is effectively reduced, and the signal transmission capacity between the transmission line and the electric absorption modulator EA is increased.

Further, in order to improve the interconnection performance, the sub-substrate 820 and the main substrate 810 are integrally formed, and the conductive regions and the gold plating layers of the sub-substrate 820 and the main substrate 810 are made of the same material and by the same process.

Further, in order to enhance the electrical connection between the main body substrate 810 and the first ceramic substrate 700, the first transmission line 701 and the first conductive area 8141, and the third conductive area 8143 and the third transmission line 703 are connected by using conductive adhesive. The conductive adhesive can be common silver adhesive.

Fig. 20 is a partial schematic view of an tosa according to an embodiment of the present disclosure. Referring to fig. 20 and 16, in order to realize the mounting and positioning between the first ceramic substrate 700 and the second ceramic substrate 800, in the embodiment of the present application, a plurality of position-limiting marks are further disposed on the upper surface 811 of the main substrate 810, and are used for positioning the transmission lines and the conductive layers before the transmission lines and the conductive layers, so as to prevent short circuit between the first transmission lines 701 and the second transmission lines 702 or between the second transmission lines 702 and the third transmission lines 703 during the attaching process.

Further, the upper surface 811 of the main body substrate 810 is provided with a first limit mark 8112, a second limit mark 8113, a third limit mark 8114 and a fourth limit mark 8115, wherein a straight line where the first limit mark 8112 and the second limit mark 8113 are located is parallel to an edge line of the first transmission line 701, and a straight line where the third limit mark 8114 and the fourth limit mark 8115 are located is parallel to an edge line of the second transmission line 702.

Further, in order to more accurately position the first transmission line 701 and the first conductive area 8141, the third conductive area 8143 and the third transmission line 703, and the second transmission line 702 and the second conductive area 8142, and avoid a short circuit caused by a conductive area crossing different transmission lines, in the embodiment of the present application, a straight line formed by the first limit mark 8112 and the second limit mark 8113 is flush with a side edge of the first conductive area 8141 close to the third conductive area, and a straight line formed by the third limit mark 8114 and the fourth limit mark 8115 is flush with a side edge of the second conductive area 8142 close to the third conductive area 8143.

Further, the first limit mark 8112, the second limit mark 8113, the third limit mark 8114, and the fourth limit mark 8115 may be disposed on the surface of the first gold-plated layer 8111, or may be disposed on the surface of the main body substrate 810.

In some embodiments, the straight lines of the first and second position limiting marks 8112 and 8113 may be arranged in parallel with the edge line of the first transmission line 701, and the straight lines of the third and fourth position limiting marks 8114 and 8115 may be arranged in parallel with the edge line of the third transmission line 703. Or the straight lines where the first limiting mark 8112 and the second limiting mark 8113 are located are arranged in parallel with the edge line of the second transmission line 702, and the straight lines where the third limiting mark 8114 and the fourth limiting mark 8115 are located are arranged in parallel with the edge line of the third transmission line 703. The above arrangement can achieve the positioning between the main body substrate 810 and the first ceramic substrate 700.

Further, in order to achieve the positioning between the third conductive area 8143 and the EA pad, the sub-substrate 820 is provided with a through hole 824, and the surface of the through hole 824 is provided with a through hole gold plating layer. A portion of the EA pad is exposed outside via 824. In the embodiment, the through hole 824 has a semicircular opening structure, and a portion of the EA pad is exposed outside the through hole 824, that is, outside the sub-substrate 820, and is used for positioning between the EA pad and the sixth gold-plating layer 8231 to prevent an open circuit.

Fig. 21 is an exploded view of a second ceramic substrate and a laser according to an embodiment of the disclosure. As shown in fig. 21, in some embodiments of the present application, a second ceramic substrate 800 is disposed over the EML laser 503. The pads of the electro-absorption modulator of the EML laser 503 include: primary and secondary lands 5032 and interconnected; the main bonding area 5032 is a circular structure, the sub-bonding area comprises a first conducting area 5033 and a second conducting area 5034 which are perpendicular to each other, one end of the first conducting area 5033 is connected to the main bonding area 5032, the other end of the first conducting area 5033 is connected to the second conducting area 5034, and the first conducting area 5033 is perpendicular to the arc of the main bonding area 5032. The through hole 824 is located at one side of the second ceramic substrate 800 and has an arc-shaped structure. To achieve the positioning function, the edge of the second conducting region 5034 may be overlapped with one side of the second ceramic substrate 800, and the second conducting region 5034 is exposed outside the through hole 824; a portion of the main bonding area 5032 and the sub-bonding area are exposed outside the through hole 824, and the second conducting area 5034 is located in a matching manner with the through hole 824. Of course, in some embodiments of the present application, the position of the through hole 824 may be set to other shapes, and is not particularly limited. The through hole 824 and the EML laser 503 are disposed in a limited manner, so that the electrical connection position between the second ceramic substrate 800 and the EML laser 503 is limited, and an open circuit is avoided.

The EA pad and the sixth gold-plating layer 8231 are connected by using a conductive adhesive, and in order to prevent the conductive adhesive from extending to the main substrate 810 along the sixth gold-plating layer 8231 and the third conductive region 8143 to cause short circuit due to interconnection between transmission lines, the sub-lower surface 823 of the sub-substrate 820 is provided with an insulating tape 8232, the insulating tape 8232 is attached to the surface of the sixth gold-plating layer 8231, and connection between the sixth gold-plating layer 8231 and the EA pad is not hindered.

The sixth gold-plating layer 8231 is connected to the third conductive region 8143, and in order to reduce impedance and increase signal transmission capability, the sixth gold-plating layer 8231 has the same width as the third conductive region 8143.

In the embodiment of the present application, to facilitate the installation of the second ceramic substrate 800, the side surface of the sub-substrate 820 is inwardly converged relative to the side surface of the main substrate 810, and the two side edges of the main substrate 810 protrude from the side surfaces of the sub-substrate 820, so as to facilitate the clamping and fixing.

In summary, the present application discloses an optical module, including: the laser comprises a first ceramic substrate, a second ceramic substrate and an EML laser, wherein the first ceramic substrate is provided with a main body base platform and a substrate concave platform, the step surface of the main body base platform is higher than the step surface of the substrate concave platform, and the EML laser is arranged on the substrate concave platform. The main part base station sets up the transmission line, and the second ceramic substrate surface sets up the conducting layer for connect transmission line and EML laser's EA pad. Meanwhile, the matching resistor is integrated on the surface of the second ceramic substrate, and the transmission line is connected with the matching resistor, so that the electro-absorption modulator EA, the transmission line and the matching resistor are interconnected. The EML modulator has the advantages that the original gold wire connection mode is replaced, parasitic inductance of the EML laser, the transmission line and the matching resistor in gold wire interconnection is effectively reduced, and signal transmission capacity between the transmission line and the electric absorption modulator EA is improved.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (10)

1. A light module, comprising: an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the light emission secondary module is arranged in the packaging cavity;

the transmitter optical subassembly includes: a ceramic substrate;

a laser carried by the ceramic substrate for emitting light;

the surface of the ceramic substrate is provided with a transmission line, and the transmission line is used for transmitting electric signals;

the matching resistor is arranged on the surface of the ceramic substrate and is connected with the laser in parallel;

one end of the first lead group is connected with the laser, and the other end of the first lead group is connected with the transmission line;

one end of the second lead group is connected with the matching resistor, and the other end of the second lead group is connected with the laser;

and one end of the third wire group is connected with the transmission line, and the other end of the third wire group is connected with the matching resistor.

2. The optical module of claim 1, further comprising: and the absorption film is covered above the first lead group, the second lead group and the third lead group and is used for shielding external electromagnetic interference.

3. The optical module of claim 2, wherein the absorbing film is bonded to the ceramic substrate.

4. The light module of claim 2, wherein the absorbing film comprises: the metal layer is arranged in the direction back to the ceramic substrate.

5. The optical module of claim 1, wherein the laser is disposed between the matching resistor and the transmission line; the third wire group comprises at least two wires.

6. The optical module of claim 5, wherein different ones of the wires do not coincide at a connection point of the matching resistor; the different wires do not coincide at the connection point of the transmission line.

7. The optical module of claim 1, wherein the matching resistor is disposed between the laser and the transmission line; the first lead group comprises at least two leads.

8. The optical module of claim 7, wherein the different wires do not coincide at a connection point of the laser; the different wires do not coincide at the connection point of the transmission line.

9. The optical module of claim 1, wherein the transmission line is disposed between the laser and the matching resistor; the second wire group comprises at least two sub-wires.

10. The optical module of claim 9, wherein different ones of the sub-wires do not coincide at a connection point of the laser; the different sub-conductors do not coincide at the connection point of the matching resistor.

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