CN214278259U

CN214278259U - Semiconductor testing device

Info

Publication number: CN214278259U
Application number: CN202120180239.7U
Authority: CN
Inventors: 杨加国; 方鹏
Original assignee: Wuxi Shengtang Technology Co ltd
Current assignee: Wuxi Shengtang Technology Co ltd
Priority date: 2021-01-22
Filing date: 2021-01-22
Publication date: 2021-09-24
Anticipated expiration: 2031-01-22

Abstract

The utility model relates to a semiconductor test technical field just discloses a semiconductor testing arrangement, including surveying test panel, fixed mounting has quantity to be two slide rails between survey test panel's inner wall top and inner wall bottom. This semiconductor testing device, through setting up first contact, second contact and third contact, when testing, put the rear side of surveying the board on the desktop, the power cord connects the electricity, stir the fly leaf left, place the semiconductor testee on the mounting panel, then slowly loosen the fly leaf, the fly leaf is promoted by the spring and is moved to the right, make the movable block on rubber block and right side carry the semiconductor testee, then promote the movable plate backward, make first contact and the second contact of top, make third contact and the second contact of below, when the semiconductor testee has the circular telegram nature, the suggestion lamp can shine and accomplish the detection, installation effectiveness when such mode can accelerate the test, the effect that efficiency of software testing is high has been reached.

Description

Semiconductor testing device

Technical Field

The utility model relates to a semiconductor test technical field specifically is a semiconductor testing device.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, silicon is one of the most influential applications of various semiconductor materials, and a semiconductor element generally tests the electric conductivity of the semiconductor element.

The existing semiconductor testing device is complex in operation, long in time consumption and low in efficiency when large-batch testing is carried out during testing, and the testing device is not suitable for use, so that the semiconductor testing device is provided for solving the problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a semiconductor testing device possesses advantages such as efficiency of software testing is high, has solved current semiconductor testing device when testing, and complex operation is complicated, and is consuming time longer, problem that efficiency is not high when carrying out big batch test.

(II) technical scheme

For the purpose that realizes above-mentioned efficiency of software testing is high, the utility model provides a following technical scheme: a semiconductor testing device comprises a testing board, wherein two sliding rails are fixedly arranged between the top of the inner wall and the bottom of the inner wall of the testing board, a first contact is fixedly arranged at the top of the inner wall of the testing board, moving blocks are movably arranged at the outer sides of the sliding rails, a mounting board is fixedly arranged between the two moving blocks, a semiconductor tested object is movably arranged at the front side of the mounting board, the top and the bottom of the semiconductor tested object are electrically connected with a second contact, a telescopic rod is fixedly arranged at the right side of the moving block at the left side, a movable plate is fixedly arranged at the right side of the telescopic rod, a spring which is positioned at the outer side of the telescopic rod and is fixedly connected with the right side of the moving block at the left side is fixedly arranged at the left side of the movable plate, a rubber block is fixedly arranged at the right side of the movable plate, and the outer sides of the two sliding rails are movably connected with the movable plate, the top fixed mounting who surveys the board has the third contact, the bottom electricity of third contact is connected with and runs through and extend to the power cord of surveying the board bottom, the top fixed mounting who surveys the board has the warning light.

Preferably, the top of the moving block is provided with a through hole extending to the bottom of the moving block, and the diameter of the through hole is matched with that of the sliding rail.

Preferably, the number of the rubber blocks is two, the rubber blocks are symmetrically distributed, and the right sides of the rubber blocks are in contact with a semiconductor measured object.

Preferably, the left side of the rubber block is cylindrical, and the right side of the rubber block is hemispherical.

Preferably, the telescopic rod is composed of a sleeve rod and an inner rod, the inner rod is movably arranged on the inner side of the sleeve rod, the sleeve rod is fixedly connected with the moving block, and the inner rod is fixedly connected with the movable plate.

Preferably, the diameter of the slide rail is smaller than the thickness between the front and the back of the moving block, and the thickness between the front and the back of the moving block is equal to the thickness between the front and the back of the moving plate.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor testing device possesses following beneficial effect:

this semiconductor testing device, through setting up first contact, second contact and third contact, when testing, put the rear side of surveying the board on the desktop, the power cord connects the electricity, stir the fly leaf left, place the semiconductor testee on the mounting panel, then slowly loosen the fly leaf, the fly leaf is promoted by the spring and is moved to the right, make the movable block on rubber block and right side carry the semiconductor testee, then promote the movable plate backward, make first contact and the second contact of top, make third contact and the second contact of below, when the semiconductor testee has the circular telegram nature, the suggestion lamp can shine and accomplish the detection, installation effectiveness when such mode can accelerate the test, the effect that efficiency of software testing is high has been reached.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is an enlarged view of the structure a of fig. 1 according to the present invention.

In the figure: the device comprises a test board 1, a slide rail 2, a first contact 3, a moving block 4, a semiconductor object to be tested 5, a second contact 6, a telescopic rod 7, a movable plate 8, a spring 9, a rubber block 10, a movable plate 11, a third contact 12, a power line 13, a prompting lamp 14 and a mounting plate 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a semiconductor testing device comprises a testing board 1, two sliding rails 2 are fixedly arranged between the top of the inner wall of the testing board 1 and the bottom of the inner wall, the diameter of each sliding rail 2 is smaller than the thickness between the front and the back of a moving block 4, the thickness between the front and the back of the moving block 4 is equal to the thickness between the front and the back of a moving block 11, a first contact 3 is fixedly arranged at the top of the inner wall of the testing board 1, a moving block 4 is movably arranged at the outer side of each sliding rail 2, a through hole extending to the bottom of the top of the moving block 4 is formed in the top of the moving block 4, the diameter of the through hole is matched with the diameter of the sliding rail 2, a mounting board 15 is fixedly arranged between the two moving blocks 4, a semiconductor tested object 5 is movably arranged at the front side of the mounting board 15, the top and the bottom of the semiconductor tested object 5 are electrically connected with a second contact 6, and a telescopic rod 7 is fixedly arranged at the right side of the moving block 4 at the left side, the telescopic rod 7 consists of a loop bar and an inner bar, the inner bar is movably arranged on the inner side of the loop bar, the loop bar is fixedly connected with the moving block 4, the inner bar is fixedly connected with the moving plate 8, the moving plate 8 is fixedly arranged on the right side of the telescopic rod 7, the spring 9 which is positioned on the outer side of the telescopic rod 7 and is fixedly connected with the right side of the left moving block 4 is fixedly arranged on the left side of the moving plate 8, the rubber blocks 10 are fixedly arranged on the right side of the moving plate 8, the number of the rubber blocks 10 is two, the two rubber blocks 10 are symmetrically distributed, the right side of the rubber block 10 is contacted with a semiconductor measured object 5, the left side of the rubber block 10 is cylindrical, the right side of the rubber block 10 is hemispherical, the outer sides of the two slide rails 2 are movably connected with the moving plate 11, the top of the moving plate 11 is fixedly provided with a third contact 12, and the bottom of the third contact 12 is electrically connected with a power line 13 which penetrates and extends to the bottom of the test plate 1, the top of the test board 1 is fixedly provided with a prompt lamp 14.

In summary, the semiconductor testing device, by arranging the first contact 3, the second contact 6 and the third contact 12, when testing, the rear side of the testing board 1 is placed on the desktop, the power cord 13 is connected with the power cord, the movable plate 8 is moved leftwards, the semiconductor object to be tested 5 is placed on the mounting plate 15, then the movable plate 8 is slowly loosened, the movable plate 8 is pushed by the spring 9 to move rightwards, the rubber block 10 and the moving block 4 on the right side clamp the semiconductor object to be tested 5, then the movable plate 11 is pushed backwards, the first contact 3 is contacted with the second contact 6 above, the third contact 12 is contacted with the second contact 6 below, when the semiconductor object to be tested 5 is electrified, the indicator light 14 is lighted to complete the detection, in this way, the mounting efficiency during the testing can be accelerated, the effect of high testing efficiency is achieved, and the problem of the existing semiconductor testing device during the testing is solved, complex operation, long time consumption and low efficiency when carrying out mass test.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor test apparatus comprising a test board (1), characterized in that: the testing device comprises a testing board (1), wherein two sliding rails (2) are fixedly mounted between the top of the inner wall of the testing board (1) and the bottom of the inner wall, a first contact (3) is fixedly mounted at the top of the inner wall of the testing board (1), a moving block (4) is movably mounted at the outer side of the sliding rails (2), a mounting plate (15) is fixedly mounted between the two moving blocks (4), a semiconductor tested object (5) is movably mounted at the front side of the mounting plate (15), the top and the bottom of the semiconductor tested object (5) are both electrically connected with a second contact (6), a telescopic rod (7) is fixedly mounted at the right side of the moving block (4) at the left side, a movable board (8) is fixedly mounted at the right side of the telescopic rod (7), a spring (9) which is located at the outer side of the telescopic rod (7) and is fixedly connected with the right side of the moving block (4) at the left side is fixedly mounted at the left side of the movable board (8), the right side fixed mounting of fly leaf (8) has rubber block (10), two the outside of slide rail (2) all with movable plate (11) swing joint, the top fixed mounting of movable plate (11) has third contact (12), the bottom electricity of third contact (12) is connected with and runs through and extends to power cord (13) of surveying test panel (1) bottom, the top fixed mounting who surveys test panel (1) has warning light (14).

2. A semiconductor test apparatus as claimed in claim 1, characterized in that: the top of the moving block (4) is provided with a through hole extending to the bottom of the moving block, and the diameter of the through hole is matched with that of the sliding rail (2).

3. A semiconductor test apparatus as claimed in claim 1, characterized in that: the quantity of block rubber (10) is two, two block rubber (10) all are the symmetric distribution, and the right side and the semiconductor testee (5) contact of block rubber (10).

4. A semiconductor test apparatus as claimed in claim 1, characterized in that: the left side of the rubber block (10) is cylindrical, and the right side of the rubber block (10) is hemispherical.

5. A semiconductor test apparatus as claimed in claim 1, characterized in that: the telescopic rod (7) is composed of a sleeve rod and an inner rod, the inner rod is movably arranged on the inner side of the sleeve rod, the sleeve rod is fixedly connected with the moving block (4), and the inner rod is fixedly connected with the movable plate (8).

6. A semiconductor test apparatus as claimed in claim 1, characterized in that: the diameter of the slide rail (2) is smaller than the thickness between the front and the back of the moving block (4), and the thickness between the front and the back of the moving block (4) is equal to the thickness between the front and the back of the moving block (11).