CN214256972U - Consolidate dull and stereotyped heat radiation structure - Google Patents
Consolidate dull and stereotyped heat radiation structure Download PDFInfo
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- CN214256972U CN214256972U CN202023295456.5U CN202023295456U CN214256972U CN 214256972 U CN214256972 U CN 214256972U CN 202023295456 U CN202023295456 U CN 202023295456U CN 214256972 U CN214256972 U CN 214256972U
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Abstract
The utility model belongs to dull and stereotyped heat dissipation field of consolidating, concretely relates to consolidate dull and stereotyped heat radiation structure. The utility model provides a pair of consolidate dull and stereotyped heat radiation structure has consolidated the flat board on the one hand, makes it more massive, and on the other hand has still increased its radiating effect. The utility model provides a reinforced flat plate heat dissipation structure, which comprises a reinforcing plate, a fan and a heat conduction pipe, wherein four corners of the reinforcing plate are provided with buckles; a hole is formed in the reinforcing plate corresponding to the flat plate heating point, a groove is formed in the reinforcing plate close to the air outlet, the side face of the groove close to the edge of the flat plate is provided with the air outlet, and a communicating groove is formed between the hole and the groove in the reinforcing plate; the fan is arranged in the groove; the heat conduction pipe comprises a heat absorption part, a heat transfer part and a heat dissipation part, wherein the heat absorption part is arranged in the hole, the heat transfer part is arranged in the communicating groove, and the heat dissipation part is arranged in the groove close to the air outlet.
Description
Technical Field
The utility model belongs to dull and stereotyped heat dissipation field of consolidating, concretely relates to consolidate dull and stereotyped heat radiation structure.
Background
Nowadays, tablet computers are very wide in daily life and industrial application, and tablet computers are small in size, light in weight and convenient to carry, which is an advantage of tablet computers, and also bring some disadvantages to tablets, for example, the tablet computers are too light and thin to cause infirm and easy to damage, for example, the tablet computers are too small in size to cause poor heat dissipation effect, and the tablet computers are easy to generate heat to cause performance reduction.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of consolidate dull and stereotyped heat radiation structure has consolidated the flat board on the one hand, makes it more massive, and on the other hand has still increased its radiating effect.
The utility model provides a reinforced flat plate heat dissipation structure, which comprises a reinforcing plate, a fan and a heat conduction pipe, wherein four corners of the reinforcing plate are provided with buckles; a hole is formed in the reinforcing plate corresponding to the flat plate heating point, a groove is formed in the reinforcing plate close to the air outlet, the side face of the groove close to the edge of the flat plate is provided with the air outlet, and a communicating groove is formed between the hole and the groove in the reinforcing plate; the fan is arranged in the groove; the heat conduction pipe comprises a heat absorption part, a heat transfer part and a heat dissipation part, wherein the heat absorption part is arranged in the hole, the heat transfer part is arranged in the communicating groove, and the heat dissipation part is arranged in the groove close to the air outlet.
As the utility model discloses a further optimization still includes heat conduction silica gel piece, and in heat conduction silica gel piece located the hole, the dull and stereotyped point of generating heat of one side laminating of heat conduction silica gel piece, the heat absorption portion of the another side laminating heat pipe of heat conduction silica gel piece.
As the utility model discloses a further optimization, the heat pipe passes through countersunk screw with the gusset plate and is connected.
As a further optimization of the utility model, the heat conducting pipe is made of copper.
As the utility model discloses a further optimization, the gusset plate is equipped with the line hole near the position of fan.
As a further optimization of the utility model, the power cord of the fan is connected to the flat-plate USB interface through the wiring hole.
As a further optimization of the utility model, the fan is an ultra-thin type direct current blower.
As the utility model discloses a further optimization still includes the shrouding, and the shrouding is used for the reinforced (rfd) recess of closing cap, allies oneself with logical groove and hole.
The utility model provides a pair of consolidate dull and stereotyped heat radiation structure can play the dull and stereotyped effect of reinforcement on the one hand, and on the other hand can also effectively dispel the heat to dull and stereotyped point of generating heat, utilizes the heat pipe to send the position of the air outlet with the heat of the point of generating heat, recycles the fan and blows off the heat, and this kind of structure can not guarantee the heat and follow the conveying of single direction alone, avoids the heat backward flow, and compact structure very is applicable to panel computer's heat dissipation moreover.
Drawings
FIG. 1 is a back schematic view of the present invention;
FIG. 2 is a schematic view of a heat dissipating portion of the structure shown in FIG. 1;
FIG. 3 is an exploded view of the structure shown in FIG. 2;
FIG. 4 is a schematic view of the structure of FIG. 1 after the cover plate has been closed;
the heat-conducting type solar water heater comprises a reinforcing plate 1, a buckle 1a, a hole 1b, a groove 1c, a communicating groove 1d, a wiring hole 1f, an air outlet 1g, a fan 2, a heat-conducting pipe 3, a heat absorbing part 3a, a heat conducting part 3b, a heat radiating part 3c, a sealing plate 4, an air inlet 4a and a heat-conducting silica gel sheet 5.
Detailed Description
As shown in fig. 1-4, the present invention provides a reinforced flat heat dissipation structure, which comprises a reinforcing plate 1, a fan 2 and a heat pipe 3.
The back of dull and stereotyped is established to gusset plate 1 cover, is equipped with buckle 1a on four angles of gusset plate 1, and buckle 1a blocks four angles of dull and stereotyped, makes gusset plate 1 fixed with the flat board.
The reinforcing plate 1 is provided with holes 1b corresponding to the flat heating points, the flat heating points are usually the positions of the CPUs, the reinforcing plate 1 is provided with grooves 1c near the air outlets 1g, the side surfaces of the grooves 1c near the flat edges are provided with air outlets 1g, and the air outlets 1g are strip-shaped slotted holes arranged in an array. A communicating groove 1d is arranged between the hole 1b and the groove 1c on the reinforcing plate 1. In this embodiment, the hole 1b, the communicating groove 1d and the groove 1c form a U-shaped structure.
The fan 2 is fixed in the groove 1c through a countersunk screw, and the air inlet surface of the fan 2 deviates from a flat plate. Meanwhile, in the embodiment, a wiring hole 1f is further formed in the reinforcing plate 1 near the fan 2, a power line required by the fan 2 is connected to a power supply through the wiring hole 1f, and preferably, a wire casing is directly formed in the reinforcing plate 1, so that the power line of the fan 2 is connected to a flat USB interface along the wire casing, and the power supply is supplied to the fan 2 through the USB interface.
The heat pipe 3 includes a heat absorbing portion 3a, a heat transfer portion 3b and a heat dissipating portion 3c, and the heat absorbing portion 3a, the heat transfer portion 3b and the heat dissipating portion 3c are formed in another U shape corresponding to the hole 1b, the communicating groove 1d and the recess 1 c. The heat absorption part 3a is arranged in the hole 1b and is attached to the heating point of the flat plate to absorb heat of the heating point of the flat plate. The heat transfer portion 3b is fitted into the communicating groove 1d, and transfers heat absorbed by the heat absorbing portion 3a to the heat radiating portion 3 c. The heat dissipation part 3c is installed in the groove 1c close to the air outlet 1g, and the heat dissipation part 3c blows away the heat transferred from the heat transfer part 3b through the air outlet 1g under the action of the fan 2. The heat conduction pipe 3 is connected with the reinforcing plate 1 through a countersunk head screw.
In the embodiment, the fan 2 is separated from the flat heating point, and heat is transmitted through the heat conduction pipe 3, so that the structure has the great advantage that heat flow can stably flow towards one direction, backflow cannot be formed, and the heat dissipation effect is good. And the fan 2 introduces outside air from the front and blows hot air from the side, so that the air flow forms an arc shape, the flowing distance of cold air flow is increased, and the heat dissipation effect is further improved.
In addition, this embodiment has still set up shrouding 4, and shrouding 4 is used for the reinforced recess 1c of closing cap, allies oneself with logical groove 1d and hole 1b, and shrouding 4 plays the effect of protection fan 2 and heat pipe 3 on the one hand, and on the other hand can also avoid the air current to cluster in disorder, stabilizes the flow direction of air current, guarantees the radiating effect. An air inlet 4a is arranged on the sealing plate 4 and is used for the air inlet of the fan 2.
For the better heat absorption effect who optimizes heat pipe 3, this embodiment still is provided with heat conduction silica gel piece 5, and heat conduction silica gel piece 5 is located in hole 1b, and the dull and stereotyped point of generating heat of laminating of one side of heat conduction silica gel piece 5, the heat absorption portion 3a of heat pipe 3 is laminated to the another side of heat conduction silica gel piece 5 for the heat can furthest follow the dull and stereotyped point of generating heat and transmit on the heat pipe 3. Meanwhile, the heat conduction pipe 3 is made of copper materials, so that the heat conduction effect is further improved.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. A reinforced flat plate heat dissipation structure is characterized by comprising a reinforced plate, a fan and a heat conduction pipe, wherein four corners of the reinforced plate are provided with buckles; a hole is formed in the reinforcing plate corresponding to the flat plate heating point, a groove is formed in the reinforcing plate close to the air outlet, the side face of the groove close to the edge of the flat plate is provided with the air outlet, and a communicating groove is formed between the hole and the groove in the reinforcing plate; the fan is arranged in the groove; the heat conduction pipe comprises a heat absorption part, a heat transfer part and a heat dissipation part, wherein the heat absorption part is arranged in the hole, the heat transfer part is arranged in the communicating groove, and the heat dissipation part is arranged in the groove close to the air outlet.
2. The structure of claim 1, further comprising a heat conductive silicone sheet, wherein the heat conductive silicone sheet is disposed in the hole, one side of the heat conductive silicone sheet is attached to the flat heating point, and the other side of the heat conductive silicone sheet is attached to the heat absorbing portion of the heat conductive pipe.
3. A reinforced plate heat dissipation structure as recited in claim 1, wherein the heat pipes are connected to the reinforcing plate by countersunk screws.
4. A reinforced plate heat dissipation structure as recited in claim 1, wherein the heat pipes are made of copper.
5. The structure of claim 1, wherein the reinforcing plate has wire holes at positions adjacent to the fans.
6. A reinforced planar heat dissipating structure as claimed in claim 5, wherein the power cord of the fan is connected to the USB port of the planar board through a wire hole.
7. The structure of claim 1, wherein the fan is an ultra-thin dc blower.
8. The reinforced plate heat dissipating structure of claim 1, further comprising a sealing plate for covering the reinforcing grooves, channels and holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023295456.5U CN214256972U (en) | 2020-12-30 | 2020-12-30 | Consolidate dull and stereotyped heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023295456.5U CN214256972U (en) | 2020-12-30 | 2020-12-30 | Consolidate dull and stereotyped heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214256972U true CN214256972U (en) | 2021-09-21 |
Family
ID=77722672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023295456.5U Active CN214256972U (en) | 2020-12-30 | 2020-12-30 | Consolidate dull and stereotyped heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214256972U (en) |
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2020
- 2020-12-30 CN CN202023295456.5U patent/CN214256972U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A reinforced plate heat dissipation structure Effective date of registration: 20220610 Granted publication date: 20210921 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: Wuhan Shengxiang Electronic Technology Co.,Ltd. Registration number: Y2022420000154 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |