CN214256751U

CN214256751U - Motor controller

Info

Publication number: CN214256751U
Application number: CN202120095440.5U
Authority: CN
Inventors: 张大千; 李�浩
Original assignee: Shenzhen Faraday Electric Drive Co ltd
Current assignee: Shenzhen Faraday Electric Drive Co ltd
Priority date: 2021-01-14
Filing date: 2021-01-14
Publication date: 2021-09-21
Anticipated expiration: 2031-01-14

Abstract

The embodiment of the utility model discloses electric machine controller, shown controller include PCB board and film capacitor, correspond film capacitor central point on the PCB board and put the department and set up the injecting glue hole of predetermineeing the diameter, and film capacitor installs on the PCB board, welds between film capacitor's pin and the PCB board, links firmly through the fixed glue between film capacitor and the PCB board. The utility model discloses fundamentally has solved film capacitor among the machine controller pin stressed problem in vibration environment.

Description

Motor controller

Technical Field

The utility model relates to a new energy automobile technical field especially relates to a motor controller.

Background

The on-board thin-film capacitor has wide application in the field of power electronics, and the fixing mode of the capacitor is particularly important in some service environments (such as the automobile industry) with strong vibration. The missing of effective fixation directly causes the capacitor pin to receive stress in vibration, and causes damage and breakage. For the environment with strong vibration, the capacitor usually needs to be fixed by dispensing. The general glue dispensing method is shown in fig. 1 to fig. 3, fig. 1 is to dispense a fixing glue 30 on adjacent thin film capacitors 20, fig. 2 is to dispense a circle of fixing glue 30 on the periphery of the bottom of the adjacent thin film capacitors 20, fig. 3 is a combination of the two glue dispensing methods shown in fig. 1 and fig. 2, and the glue dispensing method in fig. 3 needs to wait for the fixing glue to be completely cured before the next production is performed.

The common motor controller of new energy automobile trade has following two problems at present:

1) the method occupies extra space except the thin film capacitor body, and has great influence in some scenes with higher space requirements;

2) although the capacitor is fixed to a certain extent, the thin film capacitor pins cannot be directly protected, and the capacitor pins still receive large stress in vibration;

3) the welding floating height can amplify the swing amplitude between the film capacitor and the PCB, so that the stress of the pin is amplified;

4) after dispensing, in order to avoid the fixed glue from being damaged, the next production is carried out after the fixed glue is completely cured, which wastes working hours.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a technical problem who solves provides a machine controller to promote film capacitor's shock resistance on the PCB board.

In order to solve the technical problem, the embodiment of the utility model provides a motor controller, including PCB board and film capacitor, correspond film capacitor central point on the PCB board and put the department and set up the injecting glue hole of predetermineeing the diameter, film capacitor installs on the PCB board, welds between film capacitor's pin and the PCB board, links firmly through the fixed glue between film capacitor and the PCB board.

The utility model has the advantages that:

1) the utility model has the advantages of less usage amount and reduced cost;

2) the utility model has the scheme that the glue is injected between the capacitor and the PCB, and no extra space is occupied;

3) the scheme of the utility model fundamentally solves the problem that the pins of the film capacitor are stressed in the vibration environment;

4) the influence of the capacitance welding floating height on stress in the vibration of the pin is eliminated;

5) the utility model discloses can carry out production on next step after the scheme injecting glue, the solidification need not occupy man-hour alone, promotes production efficiency greatly, shortens production cycle.

Drawings

Fig. 1 is a structural diagram of a first dispensing method of a thin film capacitor in the prior art.

Fig. 2 is a structural diagram of a second dispensing method of a thin film capacitor in the prior art.

Fig. 3 is a structural diagram of a third dispensing method of a film capacitor in the prior art.

Fig. 4 is a front view of a motor controller according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view at a-a in fig. 4.

Fig. 6 is a side view of a motor controller according to an embodiment of the present invention.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

In the embodiment of the present invention, if there is directional indication (such as upper, lower, left, right, front, and rear … …) only for explaining the relative position relationship between the components and the motion situation under a certain posture (as shown in the drawing), if the certain posture is changed, the directional indication is changed accordingly.

In addition, the descriptions of the first, second, etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

Referring to fig. 4 to 6, a motor controller according to an embodiment of the present invention includes a PCB 10 and a film capacitor 20.

The central position of the PCB 10 corresponding to the thin film capacitor 20 is provided with a glue injection hole 11 with a preset diameter (preferably, the diameter of the glue injection hole 11 is phi 2 mm), the thin film capacitor 20 is installed on the PCB 10, the pin 21 of the thin film capacitor 20 is welded with the PCB 10 (corresponding contact on the PCB 10), and the thin film capacitor 20 is fixedly connected with the PCB 10 through a fixing glue 30. In specific implementation, the PCB 10 has a thin film capacitor 20, and a plurality of glue injection holes 11 need to be formed therein.

Referring to fig. 4 to 6, a method for fixedly mounting an on-board thin film capacitor according to an embodiment of the present invention includes steps 1 to 3.

Step 1: and a glue injection hole 11 is formed in the central position of the PCB 10 corresponding to the thin-film capacitor 20.

Step 2: the thin film capacitor 20 is mounted on the PCB 10, the pins 21 of the thin film capacitor 20 are inserted into the corresponding holes of the pins 21 on the PCB 10, and the pins 21 of the thin film capacitor 20 are soldered.

And step 3: and (3) injecting the fixing glue 30 (the fixing glue 30 is a fluid like toothpaste and is naturally cured after being dispensed) between the thin-film capacitor 20 and the PCB 10 through the glue injection hole 11 by using a needle head with the diameter smaller than that of the glue injection hole 11 until the fixing glue 30 overflows to the edge of the thin-film capacitor 20, and curing the fixing glue 30 and simultaneously carrying out next production.

As an implementation mode, the diameter of the glue injection hole 11 in the step 1 is phi 2 mm.

The utility model discloses an trompil on the PCB board, pour into the fixed glue into between to film capacitor and the PCB board through this hole, with gap filling between electric capacity and the PCB board to eliminated the relative amplitude of oscillation between electric capacity and the PCB board in the vibration environment, not stressed in the electric capacity pin vibration promptly, fundamentally has solved the pin stress failure problem of board-mounted film capacitor in vibration environment.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a motor controller, includes PCB board and film capacitor, its characterized in that, corresponds film capacitor central point department of putting on the PCB board and sets up the injecting glue hole of predetermineeing the diameter, and film capacitor installs on the PCB board, welds between film capacitor's pin and the PCB board, links firmly through the fixed glue between film capacitor and the PCB board.