CN214256653U

CN214256653U - Heating plate structure and heating device

Info

Publication number: CN214256653U
Application number: CN202120254053.1U
Authority: CN
Inventors: 刘畅; 迟兴帅; 张玲; 辛培培
Original assignee: Shenzhen Cone Technology Co ltd
Current assignee: Shenzhen Cone Technology Co ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2021-09-21
Anticipated expiration: 2031-01-27

Abstract

The utility model relates to an electric heat trade technical field especially relates to a heating plate structure and heating device, and the heating plate structure includes flexible circuit board, and sets up at least two heating film that are used for the intensification to generate heat on flexible circuit board surface, its characterized in that, each the heating film is arranged and is set up, and passes through flexible circuit board parallel connection electricity is connected. The flexible circuit board is used as the conductor and the connecting part, so that the circuit connection is stable and safe, and the deformation is easy and convenient to use; the heating film adopts a parallel structure, so that the heating sheet under a certain voltage can receive the heating film with higher resistance value, and the material and cost of the heating film are greatly reduced; and the heating films with the parallel structures work independently and do not interfere with each other, so that the problem that all the heating films cannot work when one heating film fails in the traditional mode is solved.

Description

Heating plate structure and heating device

Technical Field

The application relates to the technical field of electric heating industry, in particular to a heating plate structure and a heating device.

Background

The heating plate is a sheet-shaped electric appliance which utilizes electric energy to achieve the heating effect, has the advantages of small volume, convenient use and high heating efficiency, can control the heating temperature through an intelligent temperature control system, and has wide application range and long service life. However, in the wearable heating product, the heating structure usually adopts the heating sheet and the lead wire to be connected in series, and if the circuit is loosened in the processing process, the fault is easy to occur; when the voltage is constant, the more the number of the heating films in the series structure is, the lower the acceptable resistance of the single heating film is, and the material use and cost of the heating film are greatly increased; and when one of the heating films has a problem, all the heating films under the series structure can not work.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a heating plate structure and heating device, aim at solving the problem that traditional heating plate structure's circuit is easy not hard up, with high costs and work influences each other.

The application provides a heating plate structure in the first aspect, including flexible circuit board to and set up at least two heating film that are used for rising temperature and generate heat on flexible circuit board surface, each heating film arranges the setting, and connects through flexible circuit board parallel connection electricity.

In one embodiment, the flexible circuit board includes a first circuit board located at an upper end position of each of the heat generating films and electrically connected to an upper end of each of the heat generating films, respectively, and a second circuit board located at a lower end position of each of the heat generating films and electrically connected to a lower end of each of the heat generating films, respectively.

In one embodiment, one end of the second circuit board extends towards the first circuit board in a bending way and is connected with the first circuit board in a side-by-side mode.

In one embodiment, both ends of each heating film are electrically connected with the flexible circuit board through the conductive adhesive.

In one embodiment, one end of the first circuit board is connected with a power supply through a first lead, and one end of the second circuit board is connected with the power supply through a second lead.

In one embodiment, the heater chip structure further includes a thermocouple mounted on at least one of the heat generating films, the thermocouple being configured to detect a temperature of the heat generating film and output a detection signal.

In one embodiment, the working end of the thermocouple is connected with at least one heating film, the free end of the thermocouple is connected with the flexible circuit board, and the surface of the thermocouple is coated with insulating heat-conducting glue.

In one embodiment, the heating film includes a carbon nanotube film, the carbon nanotube film is formed by stacking 20-500 layers of films drawn from a carbon nanotube array, and carbon nanotubes in the carbon nanotube film are arranged in the same direction.

In one embodiment, the heat generating film includes a carbon nanotube film, cloth, or plastic film coated with a conductive paste on a surface thereof.

The second aspect of the present application provides a heating device, which includes the heating plate structure provided above, and a power supply and a control circuit electrically connected to the flexible circuit board, wherein the control circuit is used for controlling the power on and off of the heating plate structure.

Compared with the prior art, the application has the beneficial effects that: the flexible circuit board is used as the conductor and the connecting part, so that the circuit connection is stable and safe, and the deformation is easy and convenient to use; the heating film adopts a parallel structure, so that the heating sheet under a certain voltage can receive the heating film with higher resistance value, and the material and cost of the heating film are greatly reduced; and the heating films with the parallel structures work independently and do not interfere with each other, so that the problem that all the heating films cannot work when one heating film fails in the traditional mode is solved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of a heater chip structure according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a heater chip structure according to another embodiment of the present application;

fig. 3 is a schematic block diagram of a heating device according to an embodiment of the present application.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 and fig. 2, a heating sheet structure provided in a first aspect of an embodiment of the present application includes a flexible circuit board 10, and at least two heating films 20 disposed on a surface of the flexible circuit board 10 for heating, where the heating films 20 are arranged in parallel and electrically connected in parallel through the flexible circuit board 10. The heating films 20 may be arranged at intervals or in close proximity.

The flexible circuit board 10 is composed of a flexible substrate, which may be polyimide, polyethylene terephthalate, or polyvinyl chloride, and copper. Wherein the copper in contact with the remainder of the heat patch structure is exposed and the remainder of the copper is in the flexible substrate.

Optionally, the heating film 20 includes a Carbon Nanotube (CNT) film, the CNT film is formed by stacking 20 to 500 layers of films drawn from a CNT array, and the CNTs in the CNT film are aligned in the same direction. Namely, the carbon nanotubes in the carbon nanotube film are all in the same orientation, and under the same size, the more the number of layers of the film is, the smaller the resistance is, and the carbon nanotube film is selected according to different application products.

Alternatively, the heat generating film 20 includes a carbon nanotube film, cloth, or plastic film coated with the conductive paste on the surface. The conductive slurry is CNT slurry, graphene slurry, carbon black slurry or 2 mixed slurries or 3 mixed slurries, and the solid content is 10-20%.

In addition, the shape of the heating film 20 can be arbitrarily selected according to the application scene and the requirement, such as square, triangle, trapezoid, circle, etc.

The flexible circuit board 10 is used as a conductor and a connecting part, so that all parts in the heating sheet structure are not required to be connected by a lead to realize electric conduction, but the copper in the flexible circuit board 10 is connected with other parts in the heating sheet structure to realize electric conduction, so that the circuit in the heating sheet structure is stable and safe in connection, easy to deform and convenient to use; the heating film 20 adopts a parallel structure, so that the acceptable resistance value of the heating film 20 under a certain voltage is higher, the number of layers of films to be superposed is less, and the material and the cost of the heating film 20 are greatly reduced; and the heating films 20 with the parallel structure work independently and do not interfere with each other, thereby solving the problem that all the heating films 20 can not work when one heating film 20 is in problem in the traditional mode.

Referring to fig. 1, in one embodiment, the flexible circuit board 10 includes a first circuit board 11 and a second circuit board 12, the first circuit board 11 is located at an upper end of each heating film 20 and electrically connected to an upper end of each heating film 20, and the second circuit board 12 is located at a lower end of each heating film 20 and electrically connected to a lower end of each heating film 20.

The upper end and the lower end of each heating film 20 are respectively electrically connected with the first circuit board 11 and the second circuit board 12, and the first circuit board 11 and the second circuit board 12 are respectively positioned at the upper end position and the lower end position of each heating film 20 and do not form an electrifying loop with each other, so that the parallel connection of each heating film 20 is realized, each heating film 20 can work independently and do not interfere with each other, meanwhile, the resistance value which can be accepted by each heating film 20 is higher, the reliability of the heating sheet structure is ensured, and meanwhile, the use material and the cost of the heating film 20 can be greatly reduced.

Referring to fig. 2, in another embodiment, one end of the second circuit board 12 extends toward the first circuit board 11 and is connected to the first circuit board 11 in parallel.

One end of the second circuit board 12 extends from the lower end of each heating film 20 to the upper end of the first circuit board 11, and is connected with the first circuit board 11 side by side, wherein the connection can be any connection mode for insulating and isolating the first circuit board 11 and the second circuit board 12, so that the first circuit board 11 and the second circuit board 12 form a whole and cannot form an energizing loop, the current of each other cannot cause influence, and the parallel connection of the heating films 20 is ensured.

In one embodiment, the upper and lower ends of each heating film 20 are electrically connected to the flexible circuit board 10 through the conductive adhesive 50. The conductive adhesive 50 may be silver-based conductive adhesive, gold-based conductive adhesive, copper-based conductive adhesive, carbon-based conductive adhesive, conductive tape, or the like, which can effectively adhere various conductive materials and has conductive properties. The upper and lower ends of each heating film 20 are fixed to the flexible circuit board 10 by the conductive adhesive 50, so that the heating films 20 and the flexible circuit board 10 are electrically connected, and when there is current, the current can flow through the flexible circuit board 10 to achieve energization.

Referring to fig. 1, in one embodiment, one end of the first circuit board 11 is connected to a power source through a first wire 41, and one end of the second circuit board 12 is connected to the power source through a second wire 42.

Preferably, the same ends of the first circuit board 11 and the second circuit board 12 are connected to a power supply through the first conducting wire 41 and the second conducting wire 42, respectively, and the connection of the same ends to the power supply can save conducting wires and facilitate subsequent processing and use.

Referring to fig. 2, in one embodiment, one end of the first circuit board 11 is connected to a power source through a first wire 41, and one end of the second circuit board 12 is connected to the power source through a second wire 42.

Preferably, the same end of the first circuit board 11 and the second circuit board 12 located at the upper end of each heating film 20 and connected side by side with the first circuit board 11 is connected with the power supply through the first lead 41 and the second lead 42, respectively, and the first lead 41 and the second lead 42 can be fixed together to form a bundle, so that the leads can be saved and the subsequent processing and use are facilitated.

Referring to fig. 1 and 2, in one embodiment, the heating sheet structure further includes a thermocouple 30 mounted on at least one of the heat generating films 20, and the thermocouple 30 is configured to detect a temperature of the heat generating film 20 and output a detection signal.

Optionally, the working end of the thermocouple 30 is connected with at least one heating film 20, the free end of the thermocouple 30 is connected with the flexible circuit board 10, and the surface of the thermocouple 30 is coated with an insulating heat-conducting glue.

When the heating film 20 is electrified to generate heat, the temperature of the working end and the temperature of the free end form a temperature difference, namely the temperature of the heating film 20 is different from the temperature of the flexible circuit board 10, so that electromotive force is generated, when the temperature rises to a specified value, the thermocouple 30 outputs a detection signal, and the control circuit intermittently cuts off the power of the heating sheet structure according to the detection signal, so that the temperature control effect is achieved. The surface of the thermocouple 30 is coated with an insulating heat-conducting adhesive to prevent short circuit with the heating film 20.

In one embodiment, the copper at the connection position of the flexible circuit board 10 and each heating film 20, the first conducting wire 41 and the second conducting wire 42 is exposed to contact each heating film 20, the first conducting wire 41 and the second conducting wire 42, and when the power supply is powered on, the copper in the flexible circuit board forms a closed loop with each heating film 20, the first conducting wire 41, the second conducting wire 42 and the power supply to enable each heating film 20 to be powered on and heated up to generate heat.

Referring to fig. 1, in one embodiment, when the power is turned on, a current flows from the positive electrode of the power to the first circuit board 11 through the first lead 41, then flows from the first circuit board 11 to the heating films 20 through the connection portions of the upper ends of the heating films 20 electrically connected to the first circuit board 11, flows from the heating films 20 to the second circuit board 12 through the connection portions of the lower ends of the heating films 20 electrically connected to the second circuit board 12, and finally returns to the negative electrode of the power through the second lead 42 from the second circuit board 12, thereby forming a closed loop.

Of course, the other way around, when the power is turned on, the current flows from the positive electrode of the power supply to the second circuit board 12 through the second lead 42, then flows from the second circuit board 12 to each heating film 20 through the connection point where the lower end of each heating film 20 is electrically connected to the second circuit board 12, then flows from each heating film 20 to the first circuit board 11 through the connection point where the upper end of each heating film 20 is electrically connected to the first circuit board 11, and finally returns to the negative electrode of the power supply through the first lead 41 from the first circuit board 11, thereby forming a closed loop.

Referring to fig. 2, in another embodiment, when the power is turned on, the current flows from the positive electrode of the power source into the first circuit board 11 through the first lead 41, then flows from the first circuit board 11 into the heating films 20 through the connection portions where the upper ends of the heating films 20 are electrically connected to the first circuit board 11, flows from the heating films 20 into the second circuit board 12 through the connection portions where the lower ends of the heating films 20 are electrically connected to the second circuit board 12, finally flows from the second circuit board 12 located at the lower end of the heating films 20 to the upper end of the heating films 20 through the bent extension portions, and returns to the negative electrode of the power source through the second lead 42 from the second circuit board 12 located at the upper end of the heating films 20 and connected to the first circuit board 11 side by side, thereby forming a closed loop.

Of course, the other way around, when the power is turned on, the current flows from the positive electrode of the power supply through the second lead 42 into the second circuit board 12, which is located at the upper end of each heating film 20 and connected to the first circuit board 11 side by side, then flows from the bent extension of the second circuit board 12 to the lower end of each heating film 20, then flows from the second circuit board 12, which is located at the lower end of each heating film 20, through the connection between the lower end of each heating film 20 and the second circuit board 12, and flows into each heating film 20, then flows from each heating film 20 through the connection between the upper end of each heating film 20 and the first circuit board 11, and finally returns to the negative electrode of the power supply through the first lead 41 from the first circuit board 11, thereby forming a closed loop.

The second aspect of the present application provides a heating device, which includes the heating plate structure provided above, and a power supply 100 and a control circuit 200 electrically connected to the flexible circuit board 10, wherein the control circuit 200 is used for controlling the heating plate structure to be powered on and powered off. The control circuit 200 controls the heating plate structure to be powered on and powered off according to the detection signal output by the thermocouple 30.

By adopting the flexible circuit board 10 as a conductor and a connecting part, all parts in the heating sheet structure do not need to be connected by a lead to realize the electric conduction, but the copper in the flexible circuit board 10 is connected with other parts in the heating sheet structure to realize the electric conduction, so that the circuit in the heating sheet structure is stable and safe in connection, easy to deform and convenient to use; the heating film 20 adopts a parallel structure, so that the acceptable resistance value of the heating film 20 under a certain voltage is higher, the number of layers of films to be superposed is less, and the material and the cost of the heating film 20 are greatly reduced; the heating films 20 with the parallel structure work independently and do not interfere with each other, so that the problem that all the heating films 20 cannot work when one heating film 20 is in a problem in the traditional mode is solved; the control circuit 200 controls the heating sheet structure to be powered on and off according to the change of the detection signal obtained by detecting the temperature of each heating film 20 by the thermocouple 30, thereby achieving the temperature control effect.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. A heating plate structure comprises a flexible circuit board and at least two heating films arranged on the surface of the flexible circuit board and used for heating, and is characterized in that the heating films are arranged and electrically connected in parallel through the flexible circuit board.

2. A heater chip structure according to claim 1, wherein the flexible circuit board includes a first circuit board and a second circuit board, the first circuit board is located at an upper end position of each of the heat generating films and is electrically connected to an upper end of each of the heat generating films, respectively, and the second circuit board is located at a lower end position of each of the heat generating films and is electrically connected to a lower end of each of the heat generating films, respectively.

3. A heat patch structure of claim 2, wherein one end of said second circuit board extends bent toward said first circuit board and is connected side by side with said first circuit board.

4. A heater chip structure according to any one of claims 1 to 3, wherein both ends of each of said heat generating films are electrically connected to said flexible circuit board by a conductive adhesive.

5. A heater chip structure as set forth in claim 2 or 3, wherein one end of said first circuit board is connected to a power source through a first lead wire, and one end of said second circuit board is connected to said power source through a second lead wire.

6. A heater chip structure according to claim 1, further comprising a thermocouple mounted on at least one of the heat generating films, the thermocouple being configured to detect a temperature of the heat generating film and output a detection signal.

7. The heater chip structure of claim 6, wherein a working end of said thermocouple is connected to at least one of said heat generating films, a free end of said thermocouple is connected to said flexible circuit board, and a surface of said thermocouple is coated with an insulating heat conductive adhesive.

8. The heater sheet structure of claim 1, wherein the heat generating film comprises a carbon nanotube film, the carbon nanotube film is formed by stacking 20-500 layers of films drawn from a carbon nanotube array, and carbon nanotubes in the carbon nanotube film are arranged in the same direction.

9. A heater chip structure as set forth in claim 1, wherein said heat generating film comprises a carbon nanotube film, cloth or plastic film coated with conductive paste on the surface thereof.

10. A heating device comprising the heater chip structure of any one of claims 1 to 9, and a power supply and control circuit electrically connected to the flexible circuit board, the control circuit being configured to control the heater chip structure to be powered on and off.