CN214254384U

CN214254384U - Gas operating head

Info

Publication number: CN214254384U
Application number: CN202120355360.9U
Authority: CN
Inventors: 郎欣林; 罗会才; 周诚
Original assignee: Shenzhen Fengtai Industrial Technology Co ltd
Current assignee: Shenzhen Fengtai Industrial Technology Co ltd
Priority date: 2021-02-08
Filing date: 2021-02-08
Publication date: 2021-09-21
Anticipated expiration: 2031-02-08

Abstract

The present application relates to a gas operating head, the gas operating head includes: the operating head comprises an operating head main body, a gas inlet pipe and a gas outlet pipe, wherein the operating head main body is of a cavity structure with a hollow interior, and a gas channel communicated with the interior of the cavity structure is arranged on the operating head main body; the operating head main body is provided with an operating platform, and an operating working surface is arranged on the operating platform; at least one air port is arranged on the operation working face, and the air port is communicated with the cavity structure. This operating head, through the gas channel of operating head main part, can carry out atmospheric pressure control to the cavity structures inside of operating head main part, the inside atmospheric pressure of cavity structures passes through at least one gas port, can adsorb or blow away the operation such as.

Description

Gas operating head

Technical Field

The application relates to the field of chip processing, in particular to a gas operating head.

Background

Micro LED technology, i.e. LED scaling and matrixing technology. The LED display screen is a high-density micro-sized LED array integrated on a chip, for example, each pixel of the LED display screen can be addressed and independently driven to be lightened, and can be regarded as a miniature version of an outdoor LED display screen, and the distance between pixel points is reduced from a millimeter level to a micron level.

In the process of chip packaging, the LED thin film needs to be directly transported to the driving backplane without packaging, in the production of μ LED, millions or even tens of millions of micron-sized LED dies need to be correctly and efficiently moved to the circuit substrate, taking a 4K television as an example, up to 2400 thousands of dies (calculated by three colors of 4000x2000 x RGB) need to be transferred, and even if 1 ten thousands of dies are transferred at a time, 2400 times of repetition is required, which is called bulk transfer. The huge transfer printing equipment is the key for realizing the integrated manufacturing of the three-primary-color Micro-LED chip.

However, the existing die bonder for transferring chips is arranged on a mobile chip, and the batch operation of the chips cannot be realized.

SUMMERY OF THE UTILITY MODEL

To perform batch operations on wafers, a gas handling head is provided.

In a first aspect, the present application provides a gas operating head comprising: an operating head body in which, among others,

the operating head main body is of a cavity structure with a hollow interior, and a gas channel communicated with the interior of the cavity structure is arranged on the operating head main body;

the operating head main body is provided with an operating platform, and an operating working surface is arranged on the operating platform;

at least one air port is arranged on the operation working face, and the air port is communicated with the cavity structure.

Optionally, the operating head body is a wedge-shaped structure, and the operating platform is an end structure of the wedge-shaped structure.

Optionally, the operation table protrudes from an outer wall of the operation head main body, and the operation working surface is located on one surface of the boss.

Optionally, the air ports are air hole openings, and air hole channels corresponding to the number of the air hole openings are arranged in the outer wall of the operating head main body;

one end of each air hole channel is communicated with one air hole opening, and the other end of each air hole channel is communicated with the cavity structure.

Optionally, the air vent channel is perpendicular to the operative work surface.

Optionally, the ratio of the air hole opening diameter to the length of the air hole channel comprises: 1:2 to 1: 100.

Optionally, a plurality of said air vent openings are arranged in at least one row on said operative work surface.

Optionally, the distance between two adjacent air hole openings on the same row is equal.

Optionally, each of the air ports is a strip-shaped opening;

strip-shaped through grooves corresponding to the strip-shaped openings in number are formed in the outer wall of the operating head main body;

one end of each strip-shaped through groove is communicated with one strip-shaped opening, and the other end of each strip-shaped through groove is communicated with the cavity structure.

Optionally, the strip-shaped openings are multiple, and each strip-shaped opening is linear.

Optionally, the gas operating head further comprises: an operating head base, wherein;

a cavity opening is formed in one end face, far away from the operation working face, of the operation head main body;

the operating head base is fixed on the end face of the operating head main body where the cavity opening is located;

the operating head base is internally provided with a base cavity, and the base cavity is communicated with the cavity structure through the cavity opening. The gas operating head further comprises: an operating head base, wherein;

the operating head base is internally provided with a base cavity, and the base cavity is communicated with the cavity structure through the cavity opening.

Optionally, the operating head body and the operating head base are integrally formed.

Optionally, the operating head base is provided with a mount.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:

this gas operation head that this application embodiment provided, through the gas channel of operation head main part, can carry out atmospheric pressure control to the cavity structures inside of operation head main part, the inside atmospheric pressure of cavity structures passes through at least one gas port, can adsorb or blow away the operation such as. When specifically using, when aiming at the wafer with the gas port, if the inside negative pressure that is of operating head main part, adsorb the wafer with regard to the accessible gas port, if the inside malleation that is of operating head main part, just can blow off the wafer through the gas port for the wafer leaves the gas port, and then this operating head main part provides the basis for operating the wafer in batches.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic diagram of a gas operating head according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of another embodiment of a gas operating head according to the present application;

FIG. 3 is a side view of FIG. 1;

FIGS. 4-15 are various schematic views of an enlarged view of portion A of FIG. 1;

FIGS. 16-22 are various schematic views of an enlarged view of portion B of FIG. 3;

FIG. 23 is a schematic view of yet another embodiment of a gas operating head according to the present application;

FIG. 24 is an angled view of FIG. 23;

fig. 25 is a view from another angle of fig. 23.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

FIG. 1 is a schematic diagram of a gas operating head according to an embodiment of the present disclosure; FIG. 2 is a schematic view of another embodiment of a gas operating head according to the present application; FIG. 3 is a side view of FIG. 1; fig. 4-15 are various schematic views of enlarged views of portion a of fig. 1. Fig. 16-22 are various schematic views of an enlarged view of portion B of fig. 3.

Referring to fig. 1-22, in the present embodiment, the gas operating head 100 comprises: the operating head main part 101, operating head main part 101 are inside hollow cavity structures, and cavity structures are the chamber wall all around.

In the embodiment of the present application, the operating head main body 101 may be an integrally formed structure, or may be formed by welding. Usually, the structural strength is considered, and the structural strength is obtained by adopting an integral forming mode. The material of the operating head body 101 may be metal, for example: steel, alloys, etc., and may also be non-metallic materials, including: organic materials and inorganic materials, wherein the inorganic materials may include: glass or ceramic, etc.

The operating head body 101 can be further provided with a gas passage, the gas passage is used for communicating the inner space of the cavity structure with the outside, so that the inner space of the cavity structure is sucked or blown through the gas passage, and pressure regulation inside the cavity structure is realized, for example: inhale the gas passage, can be so that the cavity structures is inside to produce the negative pressure, blow to the gas passage, can be so that the cavity structures is inside to produce the malleation.

The operation table is provided on the operation table provided on the operation head main body, the operation table is provided with an operation working surface 102, and the operation working surface 102 is a working surface contacting with the chip/wafer, and considering that the chip wafer is located on the same plane when being discharged, in the embodiment of the present application, the operation working surface 102 may be a plane.

The shape of the surface of the operation working surface 102 may be any shape in the embodiment of the present application, as shown in fig. 2 to fig. 22, the operation working surface may be a long strip shape, and since the volume of the chip is very small, the size of the chip is typically in the order of tens of micrometers, for example: the wafer size of the Micro LED is defined to be less than 75 microns, even less than 50 microns, so the width of the operation surface 102 is generally narrow, and is 0.05mm to 0.1mm, and the length of the operation surface 102 can be set according to the requirement, which is not limited in this application.

In the embodiment of the present application, referring to fig. 1-3, the operating head body 101 may be a wedge-shaped structure, as shown in fig. 16-22, wherein fig. 16 is a side sectional structural schematic view of the structure shown in fig. 4 or fig. 6, and an outer elevation of the wedge-shaped structural section is a plane; FIG. 17 is a side sectional structural view of the structure of FIGS. 8-11, showing the wedge-shaped structure with the outer face of the wedge-shaped structure section being concavely curved; as can be seen in fig. 18, the outer elevation of the wedge-shaped structural section is the camber of the outer drum; fig. 19 is a side sectional structural view of the structure of fig. 12-15, showing the wedge-shaped structure in section with a planar outer elevation.

When the operating head body 101 is of a wedge structure, the operating platform may be an end structure of the wedge structure, such as: referring to fig. 4, 5 or 6, the top tip of the wedge structure serves as a worktop, and a worktop 102 is provided on the end face of the tip of the wedge structure. In particular applications, the outer surface of the wedge-shaped structure may be planar, as shown in fig. 16, 19, 20, 21 or 22; in addition, referring to fig. 17 or 18, the outer side surface of the wedge structure may also be an arc surface.

Referring to fig. 4-15, one or more air ports 103 are formed in the operation surface 102, each air port 103 is communicated with the inner space of the operation head main body 101, and in a specific application, the air port 103 may be directly formed on the outer wall of the operation head main body 101, preferably on the operation surface 102, and then communicated with the inner space of the operation head main body 101.

In the present embodiment, the number of the gas passages may be one or more, and in the present embodiment, the number is not limited. In some embodiments, one or more through holes may be provided on the outer wall of the operating head body 101 as gas passages. In another embodiment, a cavity opening may be directly formed on the outer wall of the cavity structure, and the cavity opening may be used as a gas passage. As shown in fig. 2, 108 is a cavity opening, and in fig. 2, the cavity opening 108 is provided on an end face 107 of the operating head main body 101 at an end far from the operating face.

In this application embodiment, through the gas passage of operating head main part, can carry out atmospheric pressure control to the cavity structures inside of operating head main part, the inside atmospheric pressure of cavity structures passes through at least one gas port, can adsorb or blow away the operation such as. When specifically using, when aiming at the wafer with the gas port, if the inside negative pressure that is of operating head main part, adsorb the wafer with regard to the accessible gas port, if the inside malleation that is of operating head main part, just can blow off the wafer through the gas port for the wafer leaves the gas port, and then this operating head main part provides the basis for operating the wafer in batches.

In the embodiment of the present application, the air ports disposed on the operation working surface 102 are air port openings, and when there are a plurality of air port openings, the plurality of air port openings are arranged in at least one row on the operation working surface as shown in fig. 4, 8 and 12, and the plurality of air port openings are arranged in one row on the operation working surface, and optionally, the plurality of air port openings are arranged in a straight line. Referring to fig. 5, 9 and 13, the plurality of air vent openings are arranged in a plurality of rows on the work surface, with adjacent rows being arranged in parallel. Further, considering that the pitch between the chips is uniform, alternatively, in the embodiment of the present application, the pitch between the adjacent air hole openings on the same row is equal.

When the gas port is a gas hole opening, the size of the gas port 103 is smaller than the width of the operation work surface 102, and the aperture of the gas port 103 is in the range of 0.001mm to 0.05mm in the present embodiment in consideration of the size of the chip.

In addition, as shown in fig. 16, the air port 103 may directly communicate with the inner space of the operating head main body 101 through the outer wall of the operating plane 102. In addition, in view of the stability of the air flow, as shown in fig. 17 to 22, the air port 103 may also communicate with the inner space of the operating head main body 101 through an air hole passage 106. The number of the air hole channels corresponds to the number of the air hole openings, one end of each air hole channel is communicated with one corresponding air hole channel, and the other end of each air hole channel is communicated with the inside of the operating head main body.

In a specific application, the air hole channel may be perpendicular to the operation working surface, and in consideration of the material and process of the punching, in the embodiment of the present application, the ratio of the diameter of the air hole opening to the length of the air hole channel may be between 1:2 and 1:100, and preferably, the ratio of the diameter of the air hole opening to the air hole channel may be 1: 2. According to different materials adopted by the gas operating head, the ratio of the diameter of the gas hole opening to the length of the gas hole channel can be as follows: the organic material can be 1: 10-100, for example: 1:100, the metal material is not more than: 1:20, for example: 1:2, and other inorganic materials such as glass/ceramic no more than 1: 50.

In the embodiment of the application, the air ports 103 arranged on the operation working surface 102 are strip-shaped openings, and strip-shaped through grooves corresponding to the number of the strip-shaped openings are arranged in the outer wall of the main body of the operation head; one end of each strip-shaped through groove is communicated with one strip-shaped opening, and the other end of each strip-shaped through groove is communicated with the cavity structure.

Referring to fig. 6, 10 and 14, the strip-shaped opening is one, and optionally, the strip-shaped opening is linear. Referring to fig. 7, 11 and 15, the strip-shaped openings are multiple and are arranged in parallel between adjacent strip-shaped openings. In addition, the uniform spacing between chips is considered.

Referring also to fig. 12-15, and 19-22, in order to avoid the gas operating head from accidentally touching the chip when the gas operating head is in contact with the chip, the operating face may be made to protrude further from the outer wall of the operating head body, for which purpose the console may be a boss 104 provided on the operating head body, and the operating face 102 is located on one face of the boss 104.

In this application embodiment, the structure of boss 104 does not do the restriction, and the structure of boss 104 can make the working face more salient the operating head main part, reduces the volume of operating head main part, and then when the gas operating head removed, can reduce the miscontact of gas operating head and chip, and then leads to the chip to be contacted by the miscontact and misplace. Referring to fig. 12-15, the bosses are square edges, and referring to fig. 20 and 21, the bosses are wedge-shaped edges; referring to fig. 22, the boss is cylindrical or other arcuate configuration.

In addition, referring to fig. 1 and 3, the two ends of the operation working surface are further provided with inclined surfaces 105, and the operation working surface is made to protrude out of the operation head body by the action of the inclined surfaces 105, so that the phenomenon that the chip is mistakenly contacted and dislocated due to the mistaken contact of the gas operation head and the chip is avoided.

In other embodiments of the present application, considering the installability of the operating head body, as shown in fig. 23-25, the gas operating head further comprises: an operating head base 200, wherein;

referring to fig. 2, a cavity opening 108 is formed in an end face 107 of the operating head body, which is far away from the operating face; the operating head base 200 is fixed on the end face 107 of the operating head body where the cavity opening 108 is located; a base cavity 202 is arranged inside the operating head base, and the base cavity 202 is communicated with the cavity structure through the cavity opening 108. In an embodiment of the present application, the operating head main body and the operating head base are integrally formed.

In addition, as shown in fig. 23 to 25, a mounting member 201 is optionally provided on the operating head base 200, and the mounting member may be two mounting rods to fix the operating head main body on other equipment.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A gas operating head, comprising: an operating head body in which, among others,

2. The gas operating head of claim 1, wherein the gas ports are gas hole openings, and gas hole channels corresponding to the number of the gas hole openings are arranged inside the outer wall of the operating head body;

3. The gas operating head of claim 2, wherein the gas vent channel is perpendicular to the operating face.

4. The gas operating head of claim 3, wherein the ratio of the gas hole opening diameter to the length of the gas hole passage comprises: 1:2 to 1: 100.

5. The gas operating head of claim 2, wherein a plurality of the gas vent openings are arranged in at least one row on the operating face.

6. The gas operating head of claim 5, wherein the spacing between two adjacent gas hole openings on a same row is equal.

7. The gas operating head of claim 1, wherein each of the gas ports is a bar-shaped opening;

8. The gas operating head of claim 7, wherein the plurality of strip-shaped openings are linear.

9. The gas operating head of any of claims 1 to 8, further comprising: an operating head base, wherein;

10. The gas operating head of claim 9, wherein the operating head body and the operating head base are integrally formed.

11. The gas operating head of claim 9, wherein the operating head base is provided with a mount.

12. The gas operating head of claim 1, wherein the operating head body is a wedge-shaped structure and the operating platform is an end structure of the wedge-shaped structure.

13. The gas operating head of claim 1, wherein the operator station is a boss protruding from the body of the head, and the operating face is located on a face of the boss.