CN214253720U - Display module and display screen - Google Patents
Display module and display screen Download PDFInfo
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- CN214253720U CN214253720U CN202120315696.2U CN202120315696U CN214253720U CN 214253720 U CN214253720 U CN 214253720U CN 202120315696 U CN202120315696 U CN 202120315696U CN 214253720 U CN214253720 U CN 214253720U
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The utility model discloses a display module and a display screen, wherein the display module comprises a PCB substrate, a driving chip and an LED chip; one surface of the PCB substrate is a driving chip surface and is used for assembling a driving chip; the other surface of the PCB substrate is an LED chip surface for assembling the LED chip; packaging glue is arranged on the LED chip surface of the PCB substrate; arranging an avoiding space of the packaging adhesive in the display module, wherein the height of the avoiding space is more than or equal to the thickness of the packaging adhesive and less than or equal to the total thickness of the packaging adhesive and the PCB substrate; when the display module is spliced, the interval between the packaging glue of the adjacent packaging glue is smaller than the interval between the LED chips, and the maximum distance from the side edge of the packaging glue to the edge of the PCB substrate is smaller than or equal to the interval between the adjacent packaging glue. Through the embodiment of the utility model provides a, can make the compact concatenation of PCB base plate prevent display module assembly back printing opacity, have certain clearance between the encapsulation is glued, give the encapsulation and glue expend with heat and contract with cold buffering space, make the concatenation of display module assembly even, improve artifical concatenation efficiency, reduce manufacturing cost, improve COB-LED display screen display quality.
Description
Technical Field
The utility model relates to a LED shows the field, in particular to display module assembly and display screen.
Background
With the rapid development of LED (Light Emitting Diode) display technology, LED display screens are widely used in many areas of entertainment, media, sports, education, military and the like, and with the continuous improvement of display demands, indoor LED display screens are also developing in the directions of wide color gamut, fine pitch, wide viewing angle and the like, wherein a COB-LED (chip On board) display screen, which is a highly concerned indoor display product, is warped therein.
The COB-LED has the advantages of wide color gamut, large visual angle, fine spacing, high reliability, low power consumption, good heat dissipation, low cost and the like. At present, a display unit is spliced by a plurality of small COB-LED display modules of the conventional COB-LED display screen, and then the whole display screen of the display unit is spliced into the LED display screen, wherein the display module is structurally characterized in that packaging glue is combined with a PCB substrate in an equal area, and the length and the width of the packaging glue are equal to those of the PCB substrate. The problem associated with the small display pitch is the dramatically increased demand for assembly and splicing accuracy. The splicing mode of the existing display module is divided into two categories: one is to compactly splice the display modules, as shown in fig. 1; the other type is that the display modules are spliced manually according to certain gaps, as shown in figure 2. The first type of splicing method can enable the display module to be spliced compactly and be spliced efficiently manually, but not enough gap space is reserved for expansion with heat and contraction with cold of materials, and the display module is extruded mutually when being heated and expanded, so that the display module is possibly failed or potential reliability hidden danger is brought. The second splicing method can ensure that the splicing gaps of the display module are difficult to be uniform, the manual splicing efficiency is low, the precision is difficult to control, meanwhile, the risks of light transmission, dark lines and 45-degree bright lines of the display module are brought due to the excessively large gaps, and a uniform gap is difficult to form among the display modules.
Therefore, in the existing COB-LED display screen splicing mode, the display module is spliced through manual assembly, the gap of the display module is difficult to be uniform, the gap is easy to be too narrow or too wide, and the theoretical gap value is difficult to reach. The existing manual compact splicing module of the display module structure can lead the PCB and the packaging adhesive to be close together, when the packaging adhesive expands with heat and contracts with cold, no space gap buffer exists, and the mutual extrusion failure among the display modules is caused; when utilizing the artifical intentional control display module assembly concatenation interval of current display module assembly structure, the problem that exists is that the interval gap of control is inhomogeneous, and the gap is very easily too wide to the display module assembly of this kind of little interval of COB-LED to the dark line appears, 45 jiaos bright line problems, artifical installation effectiveness also can greatly reduced simultaneously, improves product cost.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the utility model provides a pair of display module assembly and display screen can make the compact concatenation of PCB base plate prevent display module assembly back printing opacity, and encapsulation glue has certain clearance each other simultaneously, gives the buffer space of encapsulating glue material expend with heat and contract with cold for the gap concatenation is even between the display module assembly, improves artifical concatenation efficiency, reduces manufacturing cost, improves COB-LED display screen display quality.
The utility model provides an above-mentioned technical problem adopted technical scheme as follows:
according to an aspect of the embodiments of the present invention, there is provided a display module, which includes a PCB substrate, a driving chip, and an LED chip; one surface of the PCB substrate is a driving chip surface and is used for assembling a driving chip; the other surface of the PCB substrate is an LED chip surface for assembling the LED chip;
packaging glue is arranged on the LED chip surface of the PCB substrate;
arranging an avoiding space of the packaging adhesive in the display module, wherein the height of the avoiding space is more than or equal to the thickness of the packaging adhesive and less than or equal to the total thickness of the packaging adhesive and the PCB substrate;
when the display module is spliced, the interval between the packaging glue and the packaging glue is smaller than the distance between the LED chips, and the maximum distance from the side edge of the packaging glue to the edge of the PCB substrate is smaller than or equal to the interval between the packaging glue and the packaging glue.
In one possible design, the edge of the encapsulation adhesive does not coincide with any of the four edges of the PCB substrate.
In one possible design, the package adhesive has one or two edges coinciding with one or two adjacent edges of the four edges of the PCB substrate.
In one possible design, the length of the four sides formed by the length and the width of the packaging adhesive is smaller than the length of the four sides of the PCB substrate.
In one possible design, the edge of the packaging adhesive is provided with a bevel, and the bevel is transitionally connected to the edge of the PCB substrate.
In one possible design, the distance from the edge of the packaging adhesive to the edge of the PCB substrate is less than the distance between two adjacent LED chips.
According to another aspect of the embodiments of the present invention, there is provided a display screen, wherein the display screen comprises a plurality of display modules which are spliced together; when the display modules are spliced, the two adjacent display modules are in direct contact with the side faces of the PCB substrates, the packaging glue at the edges of the PCB substrates of the two adjacent display modules has a packaging glue interval, and the distance between the two adjacent LED chips at the edges of the PCB substrates of the two display modules after splicing and packaging glue is equal to the distance between the two adjacent LED chips in the same display module packaging glue.
In one possible design, when the edge of the packaging adhesive is not overlapped with any one of the four edges of the PCB substrate, the side faces of the PCB substrates of two adjacent display modules are directly and compactly connected, the packaging adhesives at the edges of the PCB substrates of two adjacent display modules are spaced by the packaging adhesive, and the spacing of the packaging adhesive is equal to the sum of the distances from the packaging adhesive to the two edges of the same PCB substrate in the same direction.
In one possible design, when one or two edges of the four edges of the packaging adhesive coincide with one adjacent edge or two adjacent edges of the four edges of the PCB substrate, the side faces of the PCB substrates of two adjacent display modules are directly and compactly connected, the packaging adhesives of the PCB substrate edges of the two display modules are spaced by the packaging adhesive, and the spacing of the packaging adhesive is equal to the sum of the distance from the packaging adhesive to the edge of the PCB substrate or the distance from the machined packaging adhesive to the edge of the two same-direction PCB substrates.
In a possible design, when the edge of the packaging adhesive is provided with an inclined plane for transitionally linking to the edge of the PCB substrate, the side faces of the PCB substrates of two adjacent display modules are directly and compactly connected, the side faces of the packaging adhesive of the two display modules are not in surface contact with each other, and the packaging adhesive interval is equal to the sum of the distances from the packaging adhesive to the two PCB substrate edges in the same direction of the PCB substrate.
Compared with the prior art, the embodiment of the utility model provides a display module and display screen, the display module includes PCB base plate, driver chip, LED chip; one surface of the PCB substrate is a driving chip surface and is used for assembling a driving chip; the other surface of the PCB substrate is an LED chip surface for assembling the LED chip; packaging glue is arranged on the LED chip surface of the PCB substrate; arranging an avoiding space of the packaging adhesive in the display module, wherein the height of the avoiding space is more than or equal to the thickness of the packaging adhesive and less than or equal to the total thickness of the packaging adhesive and the PCB substrate; when the display module is spliced, the interval between the packaging glue and the packaging glue is smaller than the distance between the LED chips, and the maximum distance from the side edge of the packaging glue to the edge of the PCB substrate is smaller than or equal to the interval between the packaging glue and the packaging glue. Through the embodiment of the utility model, a layer of packaging adhesive is packaged on the LED chip surface of the PCB substrate, the length of the four sides formed by the length and the width of the packaging adhesive is smaller than the length of the four sides of the PCB substrate, the display module is provided with the avoiding space of the packaging adhesive, the height of the avoiding space is more than or equal to the thickness of the packaging adhesive and less than or equal to the total thickness of the packaging adhesive and the PCB substrate, the interval between the packaging adhesive is less than the interval between the LED chips when the display module is spliced, and the distance between the side edge of the packaging adhesive and the edge of the PCB substrate is less than or equal to the interval between the packaging adhesive, thereby the compact splicing of the PCB substrate can prevent the back of the display module from transmitting light, meanwhile, the packaging adhesives have certain gaps, the buffer space for the expansion caused by heat and the contraction, the display module from losing efficacy or bringing potential reliability hidden danger caused by the mutual extrusion caused by the expansion caused by the heat and the contraction, and the problem of dark lines and bright lines at 45 degrees caused by the too wide gap of the display module can be eliminated simultaneously, the gap splicing among the display modules can be uniform under the existing processing precision, the uniform consistency of the gap and the manual splicing efficiency are improved, the manufacturing cost is reduced, and the display quality of the COB-LED display screen is improved.
Drawings
Fig. 1 is a schematic structural diagram of a conventional display module spliced display screen.
Fig. 2 is a schematic structural diagram of another display module tiled display screen in the prior art.
Fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a display module according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a display module according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a display screen according to an embodiment of the present invention.
Fig. 7 is a schematic cross-sectional view of the display panel of fig. 6.
Fig. 8 is a schematic structural diagram of a display screen according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of a display screen according to an embodiment of the present invention.
Fig. 10 is a schematic cross-sectional view of the display panel of fig. 8 and 9.
Fig. 11 is a schematic structural diagram of a display screen according to an embodiment of the present invention.
Fig. 12 is a schematic cross-sectional view of the display panel of fig. 11.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the following description, suffixes such as "module", "part", or "unit" used to denote elements are used only for the convenience of description of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In one embodiment, as shown in fig. 3, the present invention provides a display module 100, which includes a PCB substrate 10, a driving chip 20, and an LED chip 30; one surface of the PCB substrate 10 is a driving chip surface 11 for assembling a driving chip 20; the other surface of the PCB substrate 10 is an LED chip surface 12 for assembling an LED chip 30;
packaging adhesive 40 is packaged on the LED chip surface 12 of the PCB substrate 10;
arranging an avoiding space 41 of the packaging adhesive 40 in the display module, wherein the height k of the avoiding space 41 is more than or equal to the thickness i of the packaging adhesive 40 and less than or equal to the total thickness of the packaging adhesive 40 and the PCB substrate 10, namely, i is less than or equal to k and less than or equal to (i + j); when the display module is spliced, the interval f between the packaging glue of the adjacent packaging glue is smaller than the distance h between the LED chips 30, and the maximum distance m from the side edge of the packaging glue 40 to the side edge of the PCB substrate 10 is smaller than or equal to the interval f between the packaging glue. When the display modules are spliced, the interval f between the two adjacent display modules is the maximum interval distance between the two packaging adhesives 40 on the edge of the PCB substrate 10 in direct contact with the adjacent display modules. As indicated by the encapsulant spacing f in fig. 7.
In the embodiment, the packaging glue is packaged on the surface of the LED chip of the PCB substrate, the display module is provided with an avoiding space of the packaging glue, the height of the avoiding space is more than or equal to the thickness of the packaging glue and less than or equal to the total thickness of the packaging glue and the PCB substrate, the packaging glue interval of the adjacent packaging glue is less than the LED chip interval when the display module is spliced, and the maximum distance from the side edge of the packaging glue to the edge of the PCB substrate is less than or equal to the packaging glue interval, so that the PCB substrate can be compactly spliced to prevent the back surface of the display module from light transmission, meanwhile, the packaging glue has a certain gap, a buffer space for expansion with heat and contraction with cold is provided for the packaging glue material, the display module is prevented from losing efficacy or bringing potential reliability hidden troubles due to mutual extrusion caused by expansion with cold with heat, the problems of dark lines and bright lines at 45-degree angles caused by too wide gaps of the display module are eliminated, and the gaps between the display modules can be spliced uniformly under the existing processing precision, the uniformity of gaps and the manual splicing efficiency are improved, the manufacturing cost is reduced, and the display quality of the COB-LED display screen is improved.
In one embodiment, as shown in fig. 3, in the structure of the display module, the lengths of four sides of the encapsulation adhesive 40 are all smaller than the lengths of four sides of the PCB substrate 10, and the edge of the encapsulation adhesive 40 is not overlapped with any one of the four sides of the PCB substrate 10.
Preferably, the lengths of the four sides of the packaging adhesive 40 can be realized by CNC means or design of a molding jig.
In one embodiment, as shown in fig. 4, in the structure of the display module, the lengths of the four sides of the encapsulation adhesive 40 are all smaller than the lengths of the four sides of the PCB substrate 10, and one or two of the four sides of the encapsulation adhesive 40 coincide with one or two adjacent sides of the four sides of the PCB substrate 10.
Preferably, the lengths of the four sides of the packaging adhesive 40 can be realized by CNC means or design of a molding jig.
In one embodiment, as shown in fig. 5, in the structure of the display module, the edge of the encapsulation adhesive 40 is provided with a slope, and is transitionally engaged with the edge of the PCB substrate 10.
Preferably, the lengths and the inclined planes of the four edges of the packaging adhesive 40 can be realized by cutting means such as laser cutting or designing a mold pressing jig.
Preferably, the distance from the edge of the packaging adhesive 40 to the edge of the PCB substrate 10 is less than the distance between two adjacent LED chips.
In an embodiment, as shown in fig. 6 to 12, the present invention provides a display screen, wherein the display screen 200 is formed by splicing a plurality of display modules 100 according to any of the above embodiments; when the display module 100 is spliced, the two adjacent display module 100 PCB substrate sides are in direct contact, a certain packaging adhesive interval is reserved between the packaging adhesives at the PCB substrate edges of the two adjacent display module 100, and the distance between the two adjacent LED chips at the PCB substrate edges of the two display module 100 after splicing packaging adhesive is equal to the distance between the two adjacent LED chips in the same display module 100 packaging adhesive.
In this embodiment, the display screen is formed by splicing a plurality of display modules, when the display modules are spliced, the side surfaces of the PCB substrates of two adjacent display modules are in direct contact, the packaging glue at the edges of the PCB substrates of two adjacent display modules have a certain packaging glue interval, and the distance between two adjacent LED chips at the edges of the PCB substrates of two display modules after splicing the packaging glue is equal to the distance between two adjacent LED chips in the packaging glue of the same display module; in the display module, a layer of packaging glue is packaged on the surface of an LED chip of a PCB substrate, the display module is provided with an avoidance space of the packaging glue, the height of the avoidance space is more than or equal to the thickness of the packaging glue and less than or equal to the total thickness of the packaging glue and the PCB substrate, the interval between the packaging glue is less than the interval between the LED chips when the display module is spliced, and the distance between the side edge of the packaging glue and the edge of the PCB substrate is less than or equal to the interval between the packaging glue, so that the PCB substrate can be compactly spliced to prevent the back of the display module from transmitting light, meanwhile, the packaging glue has a certain gap between each other, the packaging glue material is provided with a buffer space for expansion with heat and contraction with cold, the display module failure or potential reliability hidden trouble caused by mutual extrusion of the packaging glue due to expansion with heat and contraction with cold is avoided, simultaneously, the problems of dark lines and bright lines at an angle of 45 degrees caused by too wide gap between the display modules are eliminated, and the gap splicing among the display modules is uniform under the existing processing precision, the uniformity of gaps and the manual splicing efficiency are improved, the manufacturing cost is reduced, and the display quality of the COB-LED display screen is improved.
In one embodiment, as shown in fig. 6 and 7, in the structure of the display module 100, the lengths of the four sides of the encapsulation adhesive 40 are all smaller than the lengths of the four sides of the PCB substrate 10, and the edge of the encapsulation adhesive 40 is not overlapped with any one of the four sides of the PCB substrate 10. When the display screen 200 is assembled by the display modules 100, the lateral sides of the PCB substrates 10 of two adjacent display modules 100 are directly and compactly connected. When two adjacent display module assemblies are spliced, certain packaging adhesive interval f is reserved between the packaging adhesives 40 on the edges of the PCB substrates 10 of the two adjacent display module assemblies, the packaging adhesive interval f is equal to the sum of the distance from the packaging adhesive 40 to the two edges of the same PCB substrate 10 in the same direction, and the distance between the two adjacent LED chips 30 on the edges of the PCB substrates 10 of the two display module assemblies after the packaging adhesive 40 is spliced is equal to the distance between the two adjacent LED chips 40 in the same display module assembly packaging adhesive 40.
In an embodiment, as shown in fig. 8 to 10, in the structure of the display module 100, the lengths of the four sides of the encapsulation adhesive 40 are all smaller than the lengths of the four sides of the PCB substrate 10, and one or two adjacent sides of the four sides of the encapsulation adhesive 40 coincide with the four sides of the PCB substrate 10. As shown in fig. 8, one adjacent side of the four sides of the encapsulation adhesive 40 coincides with the four sides of the PCB substrate 10, and as shown in fig. 9, two adjacent sides of the four sides of the encapsulation adhesive 40 coincides with the four sides of the PCB substrate 10.
When the display screen 200 is assembled by the display modules 100, the lateral sides of the PCB substrates 10 of two adjacent display modules 100 are directly and compactly connected. When two adjacent display module assemblies are spliced, certain packaging adhesive interval f is reserved between the packaging adhesives 40 on the edges of the PCB substrates 10 of the two adjacent display module assemblies, the packaging adhesive interval f is equal to the sum of the distance from the packaging adhesives to the edges of the PCB substrates 10 or the distance from the packaging adhesives 40 to the edges of the two same-direction PCB substrates 10, and the distance between the two adjacent LED chips 30 on the edges of the PCB substrates 10 of the two display module assemblies after the packaging adhesives 40 are spliced is equal to the distance between the two adjacent LED chips 30 in the same display module assembly packaging adhesive 40.
In one embodiment, as shown in fig. 11 and 12, in the structure of the display module 100, the edge of the encapsulation adhesive 40 is provided with a bevel that is excessively engaged with the edge of the PCB substrate 10. When the display screen 200 is assembled by the display modules 100, the lateral sides of the PCB substrates 10 of two adjacent display modules 100 are directly and compactly connected. When two adjacent display module assembly splices, the encapsulation of two adjacent display module assembly is glued 40 sides and is not the face contact each other, and has certain encapsulation and glue interval f, and this encapsulation is glued interval f and is equal to the distance between the inclined plane top of the adjacent encapsulation of adjacent PCB base plate 10 side contact department 40, and splices two adjacent LED chips 30's on two display module assembly's PCB base plate 10 sides behind the encapsulation glue 40 interval equal to two adjacent LED chips 30's in same display module assembly encapsulation glue 40.
It should be noted that the display screen embodiment and the display module embodiment belong to the same concept, and specific implementation processes thereof are described in detail in the display module embodiment, and technical features in the display module embodiment are correspondingly applicable in the display screen embodiment, which is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiment numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. A display module is characterized by comprising a PCB substrate, a driving chip and an LED chip; one surface of the PCB substrate is a driving chip surface and is used for assembling a driving chip; the other surface of the PCB substrate is an LED chip surface for assembling the LED chip;
packaging glue is arranged on the LED chip surface of the PCB substrate;
arranging an avoiding space of the packaging adhesive in the display module, wherein the height of the avoiding space is more than or equal to the thickness of the packaging adhesive and less than or equal to the total thickness of the packaging adhesive and the PCB substrate;
when the display module is spliced, the interval between the packaging glue and the packaging glue is smaller than the distance between the LED chips, and the maximum distance from the side edge of the packaging glue to the edge of the PCB substrate is smaller than or equal to the interval between the packaging glue and the packaging glue.
2. The display module of claim 1, wherein an edge of the encapsulant does not coincide with any of the four sides of the PCB substrate.
3. The display module of claim 1, wherein the encapsulation adhesive has one or two edges that coincide with one or two adjacent edges of the four edges of the PCB substrate.
4. The display module according to claim 2 or 3, wherein the length of the four sides formed by the length and the width of the encapsulation adhesive is smaller than the length of the four sides of the PCB substrate.
5. The display module of claim 1, wherein the edge of the encapsulant is beveled to transition to the edge of the PCB substrate.
6. The display module of claim 1, wherein the distance from the edge of the packaging adhesive to the edge of the PCB substrate is less than the distance between two adjacent LED chips.
7. A display screen is characterized in that the display screen comprises a plurality of display modules according to any one of claims 1 to 6 which are spliced; when the display modules are spliced, the two adjacent display modules are in direct contact with the side faces of the PCB substrates, the packaging glue at the edges of the PCB substrates of the two adjacent display modules has a packaging glue interval, and the distance between the two adjacent LED chips at the edges of the PCB substrates of the two display modules after splicing and packaging glue is equal to the distance between the two adjacent LED chips in the same display module packaging glue.
8. The display screen of claim 7, wherein when the edge of the packaging adhesive does not coincide with any of the four edges of the PCB substrate, the side faces of the PCB substrates of two adjacent display modules are directly and compactly connected, the packaging adhesives of the edges of the PCB substrates of two adjacent display modules are spaced by a packaging adhesive interval, and the packaging adhesive interval is equal to the sum of the distances from the packaging adhesive to the two edges of the same PCB substrate in the same direction.
9. The display screen of claim 7, wherein when one or two of the four edges of the packaging adhesive coincide with one or two adjacent edges of the four edges of the PCB substrate, the side faces of the PCB substrates of two adjacent display modules are directly and compactly connected, the packaging adhesives of the PCB substrate edges of the two display modules are spaced by a packaging adhesive interval, and the packaging adhesive interval is equal to the sum of the distance from the packaging adhesive to the PCB substrate edge or the distance from the machined packaging adhesive to the two substrate edges of the same PCB substrate in the same direction.
10. A display screen according to claim 7, wherein when the edge of the packaging adhesive is provided with an inclined surface for transitionally connecting with the edge of the PCB substrate, the side surfaces of the PCB substrate of two adjacent display modules are directly and compactly connected, the side surfaces of the packaging adhesive of the two display modules are not in surface contact with each other, and the packaging adhesive interval is equal to the sum of the distances from the packaging adhesive to the two PCB substrate edges in the same direction of the PCB substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120315696.2U CN214253720U (en) | 2021-02-04 | 2021-02-04 | Display module and display screen |
| PCT/CN2022/073536 WO2022166657A1 (en) | 2021-02-04 | 2022-01-24 | Display module and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120315696.2U CN214253720U (en) | 2021-02-04 | 2021-02-04 | Display module and display screen |
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| CN214253720U true CN214253720U (en) | 2021-09-21 |
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| CN202120315696.2U Active CN214253720U (en) | 2021-02-04 | 2021-02-04 | Display module and display screen |
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| WO (1) | WO2022166657A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022166657A1 (en) * | 2021-02-04 | 2022-08-11 | 深圳市洲明科技股份有限公司 | Display module and display screen |
| WO2023051823A1 (en) * | 2021-09-30 | 2023-04-06 | 深圳市聚飞光电股份有限公司 | Display module and manufacturing method therefor |
| WO2023226033A1 (en) * | 2022-05-27 | 2023-11-30 | 京东方科技集团股份有限公司 | Display substrate, mold assembly, tiled display module and display device |
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| US7834365B2 (en) * | 2007-09-12 | 2010-11-16 | Harvatek Corporation | LED chip package structure with high-efficiency light-emitting effect and method of packing the same |
| KR20150095430A (en) * | 2014-02-13 | 2015-08-21 | 삼성전자주식회사 | Light emitting diode package and light emitting device using the same |
| TWI721308B (en) * | 2018-08-17 | 2021-03-11 | 英屬開曼群島商錼創科技股份有限公司 | Micro-led display device |
| CN212010966U (en) * | 2020-06-02 | 2020-11-24 | 深圳市洲明科技股份有限公司 | Display module and LED display screen |
| CN111697122A (en) * | 2020-07-13 | 2020-09-22 | 东莞市中麒光电技术有限公司 | Display module and manufacturing method thereof, LED display module and LED display screen |
| CN214253720U (en) * | 2021-02-04 | 2021-09-21 | 深圳市洲明科技股份有限公司 | Display module and display screen |
-
2021
- 2021-02-04 CN CN202120315696.2U patent/CN214253720U/en active Active
-
2022
- 2022-01-24 WO PCT/CN2022/073536 patent/WO2022166657A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022166657A1 (en) * | 2021-02-04 | 2022-08-11 | 深圳市洲明科技股份有限公司 | Display module and display screen |
| WO2023051823A1 (en) * | 2021-09-30 | 2023-04-06 | 深圳市聚飞光电股份有限公司 | Display module and manufacturing method therefor |
| WO2023226033A1 (en) * | 2022-05-27 | 2023-11-30 | 京东方科技集团股份有限公司 | Display substrate, mold assembly, tiled display module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022166657A1 (en) | 2022-08-11 |
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